TSC B0530WSRRG

B0530WS
200mW, Low V F SMD Schottky Barrier Diode
Small Signal Diode
SOD-323F
B
Features
C
A
—Fast switching device(Trr<4.0nS)
—Surface device type mounting
D
—Moisture sensitivity level 1
—Matte Tin(Sn) lead finish with Nickel(Ni) underplate
E
—Pb free version and RoHS compliant
—Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
F
Mechanical Data
Unit (mm)
Dimensions
—Case : Flat lead SOD-323 small outline plastic package
Unit (inch)
Min
Max
—Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
A
1.15
1.35
0.045 0.053
B
2.30
2.70
0.091
0.106
—High temperature soldering guaranteed: 260°C/10s
C
0.25
0.40
0.010
0.016
—Polarity : Indicated by cathode band
D
1.60
1.80
0.063 0.071
—Weight : 4.85±0.5 mg
E
0.80
1.00
0.031 0.039
—Marking Code : B3
F
0.05
0.20
0.002 0.008
Ordering Information
Packing
Marking
3K / 7" Reel
B3
SOD-323F B0530WS RRG
3K / 7" Reel
B3
Part No.
Max
Pin Configuration
SOD-323F B0530WS RR
Package
Min
Suggested PAD Layout
0.63
0.025
1.60
0.83
0.033
0.063
2.86
0.113
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Symbol
Value
Units
PD
200
mW
Power Dissipation
VRRM
30
V
IO
500
mA
IFSM
5.0
A
RθJA
426
°C/W
TJ, TSTG
-65 to + 125
°C
Repetitive Peak Reverse Voltage
Mean Forward Current
Non-Repetitive Peak Forward Surge Current
Pulse Width= 8.3 mS
( Singal Half -wave )
Thermal Resistance (Junction to Ambient) (Note )
Junction and Storage Temperature Range
Notes:1. Valid provided that electrodes are kept at ambient temperature
Version :F10
B0530WS
200mW, Low VF SMD Schottky Barrier Diode
Small Signal Diode
Electrical Characteristics
Type Number
Reverse Breakdown Voltage
IR= 500uA
IF= 100mA
IF= 500mA
VR= 15V
VR= 20V
VR= 30V
f=1.0MHz
VR=0,
Forward Voltage
Reverse Leakage Current
Junction Capacitance
Symbol
V(BR)
VF
Min
30
-
IR
-
CJ
-
Max
0.36
0.47
80
100
500
58.0
Units
V
Symbol
A
B
C
d
D
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
1.7 ± 0.10
3.73 ± 0.10
1.68 ±0.10
1.5 ± 0.1
178 ± 1
55 Min
13.0 ± 0.20
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.05
0.23 ± 0.05
8.00 ±0.20
14.4 Max
V
μA
pF
Tape & Reel specification
TSC label
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
P0
d
P1
T
E
A
F
C
W
B
Item
Carrier width
Carrier length
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
W1
D
D2
D1
Version : F10
B0530WS
200mW, Low VF SMD Schottky Barrier Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 2 Forward Current Derating Curve
FIG 1 Typical Forward Characteristics
1
Io:Mean Forward Current (A)
Instantaneous Forward Current (A)
10
0.75
1
0.1
0.5
0.25
0.01
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
0
25
50
Instantanceous Forward Voltage (V)
FIG 3 Admissible Power Dissipation Curve
100
125
150
FIG 4 Typical Junction Capacitance
250
70
60
Junction Capacitance (pF)
Power Dissipation (mW)
75
Terminal Temperature (°C)
200
50
150
40
30
100
20
50
10
Reverse Voltage (V)
0
0
0
25
50
75
100
125
150
Ambient Temperature (°C)
0
5
10
15
20
25
Reverse Voltage (V)
FIG 5 Typical Reverse Characteristics
Reverse Current (mA)
100
10
1
0.1
0.01
0
10
20
30
Reverse Voltage (V)
Version : F10