FAIRCHILD H11D2M

H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M
High Voltage Phototransistor Optocouplers
tm
Features
General Description
■ High voltage:
The H11DXM, 4N38M and MOC8204M are phototransistor-type optically coupled optoisolators. A gallium
arsenide infrared emitting diode is coupled with a high
voltage NPN silicon phototransistor. The device is supplied in a standard plastic six-pin dual-in-line package.
– MOC8204M, BVCER = 400V
– H11D1M, H11D2M, BVCER = 300V
– H11D3M, BVCER = 200V
■ High isolation voltage:
– 7500 VAC peak, 1 second
■ Underwriters Laboratory (UL) recognized
File # E90700, Volume 2
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
Schematic
ANODE 1
CATHODE 2
N/C 3
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
6 BASE
5 COLLECTOR
4 EMITTER
www.fairchildsemi.com
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
September 2007
Symbol
Parameter
Device
Value
Units
TOTAL DEVICE
TSTG
Storage Temperature
All
-55 to +150
°C
TOPR
Operating Temperature
All
-40 to +100
°C
Lead Solder Temperature (Wave Solder)
All
260 for 10 sec
°C
Total Device Power Dissipation @ TA = 25°C
All
260
mW
3.5
mW/°C
TSOL
PD
Derate Above 25°C
EMITTER
IF
Forward DC Current(1)
All
80
mA
VR
Reverse Input Voltage(1)
All
6.0
V
Forward Current – Peak (1µs pulse, 300pps)(1)
All
3.0
A
LED Power Dissipation @ TA = 25°C(1)
All
IF(pk)
PD
Derate Above 25°C
150
mW
1.41
mW/°C
DETECTOR
PD
Power Dissipation @ TA = 25°C
All
300
mW
4.0
mW/°C
MOC8204M
400
V
H11D1M, H11D2M
300
H11D3M
200
4N38M
80
MOC8204M
400
H11D1M, H11D2M
300
H11D3M
200
4N38M
80
H11D1M, H11D2M,
H11D3M,
MOC8204M
7
V
All
100
mA
Derate linearly above 25°C
VCER
VCBO
VECO
IC
Collector to Emitter Voltage(1)
Collector
Base Voltage(1)
Emitter to
Collector Voltage(1)
Collector Current (Continuous)
V
Note:
1. Parameters meet or exceed JEDEC registered data (for 4N38M only).
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
2
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Individual Component Characteristics
Symbol
Characteristic
Test Conditions
Device
Min.
Typ.*
Max.
Unit
All
1.15
1.5
All
-1.8
mV/°C
25
V
50
pF
65
pF
EMITTER
VF
Forward Voltage(2)
∆VF
∆TA
Forward Voltage
Temp. Coefficient
BVR
Reverse Breakdown
Voltage
IR = 10µA
All
CJ
Junction Capacitance
VF = 0V, f = 1MHz
All
IF = 10mA
6
VF = 1V, f = 1MHz
IR
Reverse Leakage
Current(2)
VR = 6V
All
0.05
10
V
µA
DETECTOR
BVCER
Breakdown Voltage
Collector to Emitter(2)
BVCEO
BVCBO
RBE = 1MΩ, IC = 1.0mA, IF = 0
MOC8204M
400
H11D1M/2M
300
H11D3M
200
No RBE, IC = 1.0mA
Collector to Base(2)
IC = 100µA, IF = 0
4N38M
80
MOC8204M
400
H11D1M/2M
300
H11D3M
200
4N38M
80
BVEBO
Emitter to Base
IE = 100µA, IF = 0
4N38M
7
BVECO
Emitter to Collector
IE = 100µA, IF = 0
All
7
Leakage Current
Collector to Emitter(2)
(RBE = 1MΩ)
VCE = 300V, IF = 0, TA = 25°C
ICER
V
V
V
10
MOC8204M
VCE = 300V, IF = 0, TA = 100°C
VCE = 200V, IF = 0, TA = 25°C
H11D1M/2M
VCE = 200V, IF = 0, TA = 100°C
VCE = 100V, IF = 0, TA = 25°C
H11D3M
VCE = 100V, IF = 0, TA = 100°C
ICEO
V
100
nA
250
µA
100
nA
250
µA
100
nA
250
µA
50
nA
4N38M
No RBE, VCE = 60V, IF = 0,
TA = 25°C
Transfer Characteristics (TA = 25°C Unless otherwise specified.)
Symbol
Characteristics
Test Conditions
Device
Min.
H11D1M/2M/3M,
MOC8204M
2 (20)
2 (20)
Typ.*
Max.
Units
EMITTER
CTR
VCE(SAT)
Current Transfer
Ratio, Collector to
Emitter
IF = 10mA, VCE = 10V,
RBE = 1MΩ
IF = 10mA, VCE = 10V
4N38M
Saturation Voltage(2)
IF = 10mA, IC = 0.5mA,
RBE = 1MΩ
H11D1M/2M/3M,
MOC8204M
IF = 20mA, IC = 4mA
mA (%)
0.1
4N38M
0.40
V
1.0
SWITCHING TIMES
tON
Non-Saturated
Turn-on Time
tOFF
Turn-off Time
VCE = 10V, ICE = 2mA,
RL = 100Ω
All
5
µs
All
5
µs
*All Typical values at TA = 25°C
Note:
2. Parameters meet or exceed JEDEC registered data (for 4N38M only).
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
3
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Electrical Characteristics (TA = 25°C unless otherwise specified.)
Isolation Characteristics
Symbol
VISO
Characteristic
Isolation Voltage
Test Conditions
f = 60Hz, t = 1 sec.
Device
Min.
All
7500
11
RISO
Isolation Resistance
VI-O = 500 VDC
All
CISO
Isolation Capacitance
f = 1MHz
All
10
Typ.*
Max.
Units
VACPEAK
Ω
0.2
pF
*All Typical values at TA = 25°C
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
4
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
DC Electrical Characteristics (TA = 25°C unless otherwise specified.) (Continued)
NORMALIZED ICER - OUTPUT CURRENT
1.8
VF - FORWARD VOLTAGE (V)
1.7
1.6
1.5
1.4
TA = 55˚C
1.3
TA = 25˚C
1.2
1.1
TA = 100˚C
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106 Ω
TA = 25˚C
10
IF = 50 mA
IF = 10 mA
1
IF = 5 mA
0.1
0.01
1.0
1
10
0.1
100
IF - LED FORWARDCURRENT (mA)
1
10
100
VCE - COLLECTOR VOLTAGE (V)
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized Output Characteristics
NORMALIZED ICER - OUTPUT CURRENT
NORMALIZED ICER - OUTPUT CURRENT
10
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106 Ω
TA = 25˚C
1
0.1
0.01
IF = 20 mA
IF = 10 mA
1
IF = 5 mA
0.1
-60
10
-40
-20
0
20
40
60
80
IF - LED INPUT CURRENT (mA)
TA - AMBIENT TEMPERATURE (˚C)
Fig. 3 Normalized Output Current vs. LED Input Current
Fig. 4 Normalized Output Current vs. Temperature
10000
NORMALIZED ICBO - COLLECTOR-BASE CURRENT
NORMALIZED ICER - DARK CURRENT
1
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106 Ω
TA = 25˚C
Normalized to:
VCE = 100 V
RBE = 106 Ω
TA = 25˚C
1000
VCE = 300 V
100
VCE = 100 V
VCE = 50 V
10
1
0.1
10
20
30
40
50
60
70
80
90
100
110
10
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106 Ω
TA = 25˚C
9
8
IF = 50 mA
7
6
5
4
3
2
IF = 10 mA
1
0
-60
IF = 5 mA
-40
-20
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE (˚C)
TA - AMBIENT TEMPERATURE (˚C)
Fig. 5 Normalized Dark Current vs. Ambient Temperature
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
100
Fig. 6 Normalized Collector-Base Current vs. Temperature
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5
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Typical Performance Curves
Through Hole
Surface Mount
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.20)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.100 [2.54]
15°
0.4" Lead Spacing
0.035 (0.88)
0.006 (0.16)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
0.070 (1.78)
0.060 (1.52)
0.260 (6.60)
0.240 (6.10)
0.425 (10.79)
0.070 (1.77)
0.040 (1.02)
0.100 (2.54)
0.305 (7.75)
0.014 (0.36)
0.010 (0.25)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.012 (0.30)
0.008 (0.21)
0.100 [2.54]
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
6
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Package Dimensions
Option
Order Entry Identifier
(Example)
No option
H11D1M
S
H11D1SM
SR2
H11D1SR2M
T
H11D1TM
0.4" Lead Spacing
V
H11D1VM
VDE 0884
TV
H11D1TVM
VDE 0884, 0.4" Lead Spacing
SV
H11D1SVM
VDE 0884, Surface Mount
SR2V
H11D1SR2VM
Description
Standard Through Hole Device
Surface Mount Lead Bend
Surface Mount; Tape and Reel
VDE 0884, Surface Mount, Tape and Reel
Marking Information
1
V
3
H11D1
2
X YY Q
6
4
5
Definitions
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘7’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
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H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Ordering Information
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
4.0 ± 0.1
0.30 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
User Direction of Feed
Reflow Profile
300
280
260
240
220
200
180
160
°C 140
120
100
80
60
40
20
0
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
1.822°C/Sec Ramp up rate
33 Sec
0
60
120
180
270
360
Time (s)
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
8
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
Carrier Tape Specifications
ACEx®
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Current Transfer Logic™
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®
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Programmable Active Droop™
QFET®
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
Green FPS™
Green FPS™ e-Series™
GTO™
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IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP-SPM™
Power220®
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The Power Franchise®
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TinyBuck™
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VCX™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS
PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support,
device, or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative or In Design
This datasheet contains the design specifications for product
development. Specifications may change in any manner without notice.
Definition
Preliminary
First Production
This datasheet contains preliminary data; supplementary data will be
published at a later date. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild Semiconductor
reserves the right to make changes at any time without notice to improve
design.
Obsolete
Not In Production
This datasheet contains specifications on a product that has been
discontinued by Fairchild Semiconductor. The datasheet is printed for
reference information only.
Rev. I31
©2000 Fairchild Semiconductor Corporation
H11DXM, 4N38M, MOC8204M Rev. 1.0.2
www.fairchildsemi.com
9
H11D1M, H11D2M, H11D3M, 4N38M, MOC8204M High Voltage Phototransistor Optocouplers
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