PSMN006-20K TrenchMOS™ ultra low level FET Rev. 01 — 30 May 2002 Product data 1. Description SiliconMAX™ products use the latest Philips TrenchMOS™ technology to achieve the lowest possible on-state resistance in a SOT96-1 (SO8) package. Product availability: PSMN006-20K in SOT96-1 (SO8). 2. Features ■ Very low on-state resistance ■ Very low threshold ■ TrenchMOS™ technology. 3. Applications ■ DC to DC converter ■ Computer motherboards ■ Switch mode power supplies. 4. Pinning information Table 1: Pinning - SOT96-1, simplified outline and symbol Pin Description 1,2,3 source (s) 4 gate (g) 5,6,7,8 drain (d) Simplified outline 8 5 1 4 Symbol d g Top view MBK187 SOT96-1 (SO8) MBB076 s PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 5. Quick reference data Table 2: Quick reference data Symbol Parameter Conditions Typ Max Unit VDS drain-source voltage (DC) 25 °C ≤ Tj ≤ 150 °C - 20 V ID drain current (DC) Tsp = 25 °C; VGS = 4.5 V - 32 A Ptot total power dissipation Tsp = 25 °C - 8.3 W Tj junction temperature - 150 °C RDSon drain-source on-state resistance VGS = 4.5 V; ID = 5 A; Tj = 25 °C 4.2 5 mΩ VGS = 2.5 V; ID = 5 A; Tj = 25 °C 4.8 5.7 mΩ VGS = 1.8 V; ID = 5 A; Tj = 25 °C 5.7 8.2 mΩ 6. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage (DC) 25 °C ≤ Tj ≤ 150 °C - 20 V ID drain current (DC) Tsp = 25 °C; VGS = 4.5 V; Figure 2 and 3 - 32 A VGS gate-source voltage - ±10 V IDM peak drain current Tsp = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 - 60 A Ptot total power dissipation Tsp = 25 °C; Figure 1 - 8.3 W Tstg storage temperature - 150 °C Tj operating junction temperature −55 +150 °C Source-drain diode IS source (diode forward) current (DC) Tsp = 25 °C - 7.5 A ISM peak source (diode forward) current Tsp = 25 °C; pulsed; tp ≤ 10 µs - 30 A © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 2 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 03aa17 120 03aa25 120 Ider (%) Pder (%) 80 80 40 40 0 0 0 50 100 150 Tsp (°C) 200 P tot P der = ----------------------- × 100% P ° 0 50 100 150 200 Tsp (°C) ID I der = ------------------- × 100% I ° tot ( 25 C ) D ( 25 C ) Fig 1. Normalized total power dissipation as a function of solder point temperature. Fig 2. Normalized continuous drain current as a function of solder point temperature. 03ai63 102 Limit RDSon = VDS / ID tp = 10 µs ID (A) 1 ms 10 10 ms DC 100 ms 1 10-1 10-1 1 102 10 VDS (V) Tsp = 25 °C; IDM is single pulse. Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 3 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 7. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit thermal resistance from junction to solder point mounted on a metal clad board; Figure 4 - Rth(j-sp) - 15 K/W 7.1 Transient thermal impedance 03ai62 102 Zth(j-sp) (K/W) 10 δ = 0.5 0.2 0.1 1 0.05 δ= P tp T 0.02 10-1 10-4 10-3 t tp single pulse T 10-2 10-1 1 10 tp (s) 102 Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 4 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 8. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ID = 250 µA; VGS = 0 V 20 - - V Tj = 25 °C 0.4 0.7 - V Tj = 150 °C 0.15 - - V Tj = 25 °C - 0.05 1 µA Tj = 150 °C - - 0.5 mA VGS = ±8 V; VDS = 0 V - 10 100 nA Static characteristics V(BR)DSS drain-source breakdown voltage VGS(th) IDSS gate-source threshold voltage drain-source leakage current IGSS gate-source leakage current RDSon drain-source on-state resistance ID = 1 mA; VDS = VGS; Figure 9 VDS = 20 V; VGS = 0 V VGS = 4.5 V; ID = 5 A; Figure 7 and 8 - 4.2 5 mΩ VGS = 2.5 V; ID = 5 A; Figure 7 and 8 - 4.8 5.7 mΩ VGS = 1.8 V; ID = 5 A; Figure 8 - 5.7 8.2 mΩ Dynamic characteristics gfs forward transconductance VDS = 15 V; ID = 10 A - 25 - S Qg(tot) total gate charge ID = 30 A; VDD = 10 V; VGS = 2.5 V; Figure 13 - 32 - nC Qgs gate-source charge - 10 - nC Qgd gate-drain (Miller) charge - 13.2 - nC Ciss input capacitance - 4350 - pF Coss output capacitance - 825 - pF Crss reverse transfer capacitance - 550 - pF td(on) turn-on delay time - 65 - ns VGS = 0 V; VDS = 20 V; f = 1 MHz; Figure 11 VDD = 10 V; RL = 10 Ω; VGS = 4.5 V; RG = 6 Ω tr rise time - 32 - ns td(off) turn-off delay time - 190 - ns tf fall time - 90 - ns Source-drain diode VSD source-drain (diode forward) voltage IS = 3 A; VGS = 0 V; Figure 12 trr reverse recovery time Qr recovery charge IS = 10 A; dIS/dt = −70 A/µs; VGS = 0 V 0.75 1.3 V 47 - ns - 17 - nC © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data - Rev. 01 — 30 May 2002 5 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 03ai64 30 03ai66 30 4.5 V 2.5 V 2 V VDS > ID x RDSon 1.5 V ID (A) ID (A) 20 20 1.3 V 10 10 Tj = 150 °C 1.1 V 25 °C VGS = 1 V 0 0 0 0.05 0.1 0.15 VDS (V) 0.2 Tj = 25 °C 0 0.8 1.2 VGS (V) 1.6 Tj = 25 °C and 150 °C; VDS > ID x RDSon Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values. Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values. 03ai65 10 03af18 2 Tj = 25 °C RDSon 0.4 a (mΩ) 8 1.5 VGS = 1.5 V 6 2V 2.5 V 4.5 V 4 1 0.5 2 0 0 0 10 20 ID (A) 30 Tj = 25 °C -60 60 120 Tj (°C) 180 R DSon a = ---------------------------R DSon ( 25 °C ) Fig 7. Drain-source on-state resistance as a function of drain current; typical values. Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data 0 Rev. 01 — 30 May 2002 6 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 03ai71 1 03ai70 10-1 VGS(th) ID (A) 10-2 (V) 0.8 typ 10-3 0.6 min min 0.4 10-4 0.2 10-5 0 10-6 -80 0 80 Tj (°C) 160 0 0.2 0.4 typ 0.6 0.8 1 VGS (V) Tj = 25 °C; VDS = 5 V ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature. Fig 10. Sub-threshold drain current as a function of gate-source voltage. 03ai68 104 Ciss C (pF) 103 Coss Crss 102 10-1 1 10 VDS (V) 102 VGS = 0 V; f = 1 MHz Fig 11. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 7 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 03ai67 30 03ai69 5 VGS = 0 V VGS IS (A) VDD = 10 V (V) 4 ID = 30 A Tj = 25 °C 20 3 2 10 25 °C Tj = 150 °C 1 0 0 0 0.2 0.4 0.6 0.8 1 VSD (V) 0 Tj = 25 °C and 150 °C; VGS = 0 V 40 60 QG (nC) 80 ID = 30 A; VDD = 10 V Fig 12. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values. Fig 13. Gate-source voltage as a function of gate charge; typical values. © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data 20 Rev. 01 — 30 May 2002 8 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 9. Package outline SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 θ o 8 0o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03 MS-012 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 Fig 14. SOT96-1 (SO8). © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 9 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 10. Revision history Table 6: Revision history Rev Date 01 20020530 CPCN Description - Product data (9397 750 09631) © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Product data Rev. 01 — 30 May 2002 10 of 12 PSMN006-20K Philips Semiconductors TrenchMOS™ ultra low level FET 11. Data sheet status Data sheet status[1] Product status[2] Definition Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 12. Definitions 13. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 14. Trademarks TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V. SiliconMAX — is a trademark of Koninklijke Philips Electronics N.V. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2002. All rights reserved. 9397 750 09631 Rev. 01 — 30 May 2002 11 of 12 Philips Semiconductors PSMN006-20K TrenchMOS™ ultra low level FET Contents 1 2 3 4 5 6 7 7.1 8 9 10 11 12 13 14 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 © Koninklijke Philips Electronics N.V. 2002. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 30 May 2002 Document order number: 9397 750 09631