TI CD74HCT132M96

[ /Title
(CD74
HC132
,
CD74
HCT13
2)
/Subject
(High
Speed
CMOS
Logic
Quad
2-Input
NAND
Schmit
CD54HC132, CD74HC132,
CD54HCT132, CD74HCT132
Data sheet acquired from Harris Semiconductor
SCHS145E
High-Speed CMOS Logic
Quad 2-Input NAND Schmitt Trigger
August 1997 - Revised March 2004
Features
Description
• Unlimited Input Rise and Fall Times
The ’HC132 and ’HCT132 each contain four 2-input NAND
Schmitt Triggers in one package. This logic device utilizes
silicon gate CMOS technology to achieve operating speeds
similar to LSTTL gates with the low power consumption of
standard CMOS integrated circuits. All devices have the
ability to drive 10 LSTTL loads. The HCT logic family is
functionally pin compatible with the standard LS logic family.
• Exceptionally High Noise Immunity
• Typical Propagation Delay: 10ns at VCC = 5V,
CL = 15pF, TA = 25oC
• Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
• Wide Operating Temperature Range . . . -55oC to 125oC
PART NUMBER
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 37%, NIH = 51% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH
TEMP. RANGE
(oC)
PACKAGE
CD54HC132F3A
-55 to 125
14 Ld CERDIP
CD54HCT132F3A
-55 to 125
14 Ld CERDIP
CD74HC132E
-55 to 125
14 Ld PDIP
CD74HC132M
-55 to 125
14 Ld SOIC
CD74HC132MT
-55 to 125
14 Ld SOIC
CD74HC132M96
-55 to 125
14 Ld SOIC
CD74HCT132E
-55 to 125
14 Ld PDIP
CD74HCT132M
-55 to 125
14 Ld SOIC
CD74HCT132MT
-55 to 125
14 Ld SOIC
CD74HCT132M96
-55 to 125
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
Pinout
CD54HC132, CD54HCT132
(CERDIP)
CD74HC132, CD74HCT132
(PDIP, SOIC)
TOP VIEW
1A 1
14 VCC
1B 2
13 4B
1Y 3
12 4A
2A 4
11 4Y
2B 5
10 3B
2Y 6
9 3A
GND 7
8 3Y
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
© 2004, Texas Instruments Incorporated
1
CD54HC132, CD74HC132, CD54HCT132, CD74HCT132
Functional Diagram
1
14
2
13
1A
4B
1B
1Y
2A
2B
2Y
GND
VCC
3
12
4
11
5
10
6
9
7
8
4A
4Y
3B
3A
3Y
TRUTH TABLE
INPUTS
OUTPUT
nA
nB
nY
L
L
H
L
H
H
H
L
H
H
H
L
H = High Voltage Level, L = Low Voltage Level
Logic Symbol
nA
nY
nB
2
CD54HC132, CD74HC132, CD54HCT132, CD74HCT132
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
80
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
86
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
SYMBOL
VI (V)
VT+
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
0.7
-
1.5
0.7
1.5
0.7
1.5
V
4.5
1.7
-
3.15
1.7
3.15
1.7
3.15
V
6
2.1
-
4.2
2.1
4.2
2.1
4.2
V
2
0.3
-
1
0.3
1
0.3
1
V
4.5
0.9
-
2.2
0.9
2.2
0.9
2.2
V
6
1.2
-
3
1.2
3
1.2
3
V
2
0.2
-
1
0.2
1
0.2
1
V
4.5
0.4
-
1.4
0.4
1.4
0.4
1.4
V
6
0.6
-
1.6
0.6
1.6
0.6
1.6
V
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
HC TYPES
Input Switch Points
(Note 2)
V T-
-
-
-
VH
High Level Output
Voltage
CMOS Loads
VOH
VT+ or
V T-
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage
CMOS Loads
Low Level Output
Voltage
TTL Loads
VOL
VT+ or
V T-
3
CD54HC132, CD74HC132, CD54HCT132, CD74HCT132
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
PARAMETER
Input Leakage
Current
Quiescent Device
Current
SYMBOL
VI (V)
II
VCC or
GND
-
ICC
VCC or
GND
VT+
-
25oC
IO (mA) VCC (V)
-40oC TO 85oC
-55oC TO 125oC
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
6
-
-
±0.1
-
±1
-
±1
µA
0
6
-
-
2
-
20
-
40
µA
-
4.5
1.2
-
1.9
1.2
1.9
1.2
1.9
V
5.5
1.4
-
2.1
1.4
2.1
1.4
2.1
V
4.5
0.5
-
1.2
0.5
1.2
0.5
1.2
V
5.5
0.6
-
1.4
0.6
1.4
0.6
1.4
V
4.5
0.4
-
1.4
0.4
1.4
0.4
1.4
V
5.5
0.4
-
1.5
0.4
1.5
0.4
1.5
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
HCT TYPES
Input Switch Points
(Note 2)
V T-
VH
High Level Output
Voltage
CMOS Loads
-
-
-
VT+ or
V T-
High Level Output
Voltage
TTL Loads
Low Level Output
Voltage CMOS Loads
VOL
VT+ or
V T-
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
Quiescent Device
Current
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
-
-
II
VCC
and
GND
-
5.5
-
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
-
2
-
20
-
40
µA
∆ICC
(Note 3)
VCC
- 2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
µA
NOTES:
2. Hysteresis definition, characteristic and test setup see Test Circuits and Waveforms
3. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
4
CD54HC132, CD74HC132, CD54HCT132, CD74HCT132
HCT Input Loading Table
INPUT
UNIT LOADS
nA, nB
0.6
NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g. 360µA max at 25oC.
Switching Specifications Input tr, tf = 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
tPLH, tPHL
CL = 50pF
25oC
VCC
-40oC TO 85oC -55oC TO 125oC
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
2
-
-
125
-
156
-
188
ns
4.5
-
-
25
-
31
-
38
ns
6
-
-
21
-
27
-
32
ns
HC TYPES
Propagation Delay
A, B to Y (Figure 1)
Propagation Delay
A, B to Y
tTLH, tTHL
CL = 15pF
5
-
10
-
-
-
-
-
pF
Transition Times (Figure 1)
tTLH, tTHL
CL = 50pF
2
-
-
75
-
95
-
110
ns
4.5
-
-
15
-
19
-
22
ns
6
-
-
13
-
16
-
19
ns
Input Capacitance
Power Dissipation Capacitance
(Notes 4, 5)
CI
-
-
-
-
10
-
10
-
10
pF
CPD
-
5
-
30
-
-
-
-
-
pF
HCT TYPES
Propagation Delay
A, B to Y
(Figure 2)
tPHL, tPHL
CL = 50pF
4.5
-
-
33
-
41
-
50
ns
Propagation Delay
A, B to Y
tPLH, tPHL
CL = 15pF
5
-
13
-
-
-
-
-
pF
Transition Times (Figure 2)
tTLH, tTHL
CL = 50pF
4.5
-
-
15
-
19
-
22
ns
Input Capacitance
Power Dissipation Capacitance
(Notes 4, 5)
CI
-
-
-
-
10
-
10
-
10
pF
CPD
-
5
-
30
-
-
-
-
-
pF
NOTES:
4. CPD is used to determine the dynamic power consumption, per gate.
5. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage.
5
CD54HC132, CD74HC132, CD54HCT132, CD74HCT132
Test Circuits and Waveforms
tr = 6ns
tf = 6ns
90%
50%
10%
INPUT
GND
tTLH
GND
tTHL
90%
50%
10%
INVERTING
OUTPUT
3V
2.7V
1.3V
0.3V
INPUT
tTHL
tPHL
tf = 6ns
tr = 6ns
VCC
tTLH
90%
1.3V
10%
INVERTING
OUTPUT
tPHL
tPLH
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
tPLH
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
VH
VO
+
VH = V T - V T
Vl
VT
+
VT
+
VT
VT
VCC
Vl
VH
GND
VCC
VCC
VO
GND
Vl
VO
FIGURE 3. HYSTERESIS DEFINITION, CHARACTERISTIC, AND TEST SET-UP
6
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2004, Texas Instruments Incorporated