SEMTECH RCLAMP0544M.TBT

RClamp0544M
PROTECTION PRODUCTS - RailClamp
Description
RailClamp
ESD Protection for HDMI Interfaces
PRELIMINARY
Features
RailClamps are ultra low capacitance TVS arrays
designed to protect high speed data interfaces. This
series has been specifically designed to protect sensitive components which are connected to high-speed
data and transmission lines from overvoltage caused
by ESD (electrostatic discharge), CDE (Cable Discharge
Events), and EFT (electrical fast transients).
The RClampTM0544M has a typical capacitance of only
0.30pF. This means it can be used on circuits operating
in excess of 2GHz without signal attenuation. They may
be used to meet the ESD immunity requirements of IEC
61000-4-2, Level 4 (±15kV air, ±8kV contact discharge).
These devices are in a MSOP 10L package and feature a
lead-free, matte tin finish. They are compatible with both
lead free and SnPb assembly techniques. They are designed for easy PCB layout by allowing the traces to run
straight through the device. The combination of small
size, low capacitance, and high level of ESD protection
makes them a flexible solution for protecting high-speed
HDMI and DVI video interfaces.
‹ ESD protection for high-speed data lines to
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IEC 61000-4-2 (ESD) ±18kV (air), ±12kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20µs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Array of surge rated diodes with internal TVS Diode
Small package saves board space
Protects four I/O lines and one Vcc line
Low capacitance: 0.3pF typical (I/O to I/O)
Low clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
Mechanical Characteristics
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JEDEC MSOP 10L package
Molding compound flammability rating: UL 94V-0
Marking : Marking code and date code
Packaging : Tape and Reel per EIA 481
Lead Finish: Matte Tin
RoHS/WEEE Compliant
Applications
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Circuit Diagram
Schematic & PIN Configuration
Pin 8
Pin 1
High Definition Multi-Media Interface (HDMI)
Digital Visual Interface (DVI)
10/100/1000 Ethernet
Monitors and Flat Panel Displays
Notebook Computers
Set Top Box
Projection TV
Pin 2
Pin 4
Pin 5
Line 1 1
NC
Line 2
NC
GND
Vcc
Line 3
NC
Line 4
NC
Pin 3
MSOP-10L (Top View)
Revision 01/19/2006
1
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Ppk
125
Watts
Peak Pulse Current (tp = 8/20µs)
IPP
5
A
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
VESD
18
12
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Pin 3 to 8
Reverse Breakdown Voltage
VBR
It = 1mA
Pin 3 to 8
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
Pin 3 to 8
1
µA
Clamping Voltage
VC
IPP = 1A, tp = 8/20µs
Any I/O pin to ground
15
V
Clamping Voltage
VC
IPP = 5A, tp = 8/20µs
Any I/O pin to ground
20
V
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Between I/O pins
0.30
0.7
pF
Junction Capacitance
Cj
VR = 0V, f = 1MHz
Any I/O pin to ground
0.70
0.9
pF
 2006 Semtech Corp.
2
Minimum
Typical
Maximum
Units
5
V
6
V
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
90
% of Rated Power or IPP
Peak Pulse Power - PPP (kW)
100
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
Pulse Waveform
Percent of I
PP
80
16
Clamping Voltage -VC (V)
90
e-t
50
40
td = IPP/2
30
100
125
150
18
Waveform
Parameters:
tr = 8µs
td = 20µs
100
60
75
Clamping Voltage vs. Peak Pulse Current
110
70
50
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
Line to Line
14
12
Line to Gnd
10
8
6
Waveform
Parameters:
tr = 8µs
td = 20µs
4
20
2
10
0
0
0
5
10
15
20
25
0
30
1
2
3
4
5
6
Peak Pulse Current - IPP (A)
Time (µs)
Normalized Capacitance vs. Reverse Voltage
Forward Voltage vs. Forward Current
1.5
3.5
2.5
CJ(VR) / CJ(VR=0)
Forward Voltage (V)
3
2
1.5
1
Waveform
Parameters:
tr = 8µs
td = 20µs
0.5
1
Line to Line
Line to Ground
0.5
0
f = 1 MHz
0
1
2
3
4
5
6
0
7
0
Peak Pulse Current (A)
 2006 Semtech Corp.
3
1
2
3
Reverse Voltage - VR (V)
4
5
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Insertion Loss S21 - I/O to GND
Insertion Loss S21 - I/O to I/O
CH1 S21
LOG
CH1 S21
6 dB / REF 0 dB
1
2: -0.3488 dB
1.8 GHz
2: -0.6477 dB
1.8 GHz
3: -0.9874 dB
2.5 GHz
3: -1.8073 dB
2.5 GHz
-6 dB
-12 dB
-12 dB
-18 dB
-18 dB
-24 dB
-24 dB
-30 dB
-30 dB
1
MHz
10
MHz
100
MHz
-36 dB
3
1
GHz GHz
STOP 3000. 000000 MHz
START . 030 MHz
3
0 dB
1
2
-6 dB
-36 dB
6 dB / REF 0 dB
1: -0.1873 dB
900 MHz
3
0 dB
LOG
1: 0.1044 dB
900 MHz
1
MHz
START . 030 MHz
10
MHz
100
MHz
2
3
1
GHz GHz
STOP 3000. 000000 MHz
Analog Cross Talk
CH1 S21
LOG
20 dB /REF 0 dB
START . 030 MHz
 2006 Semtech Corp.
STOP 3000. 000000 MHz
4
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Four
High-Speed Data Lines
Figure 1. Flow through Layout for two Line Pairs
The RClamp0544M TVS is designed to protect four data
lines from transient over-voltages by clamping them to a
fixed reference. When the voltage on the protected line
exceeds the reference voltage (plus diode VF) the steering
diodes are forward biased, conducting the transient
current away from the sensitive circuitry.
Line 1
Line 2
Gnd
Line 3
Line 4
Flow Through Layout
The RClamp0544M is designed for have ease of PCB
layout by allowing the traces to run straight through the
device. Figure 1 shows the proper way to design the PCB
board trace in order to use the flow through layout for
two line pairs. The solid line represents the PCB trace.
Note that the PCB traces are used to connect the pin
pairs for each line (pin 1 to pin 10, pin 2 to pin 9, pin 4
to pin 7, pin 5 to pin 6). For example, line 1 enters at
pin 1 and exits at Pin 10 and the PCB trace connects pin
1 and 10 together. This is true for lines 2, 3, and 4.
Ground is connected at pin 3. This pin should be
connected directly to a ground plane on the board for
best results. The path length is kept as short as
possible to minimize parasitic inductance.
Line 1
Line 2
NC
Line 3
Line 4
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish is
composed of 100% tin solder with large grains. Since
the solder volume on the leads is small compared to the
solder paste volume that is placed on the land pattern of
the PCB, the reflow profile will be determined by the
requirements of the solder paste. Therefore, these
devices are compatible with both lead-free and SnPb
assembly techniques. In addition, unlike other lead-free
compositions, matte tin does not have any added alloys
that can cause degradation of the solder joint.
Circuit Board Layout Recommendations for Suppression of ESD.
Good circuit board layout is critical for the suppression of
ESD induced transients. The following guidelines are
recommended:
z Place the device near the input terminals or connectors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
 2006 Semtech Corp.
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Applications Information (continued)
ESD Protection With RailClamps
RailClamps are optimized for ESD protection using the
rail-to-rail topology. Along with good board layout, these
devices virtually eliminate the disadvantages of using
discrete components to implement this topology. ConPIN
sider Descriptions
the situation shown in Figure 4 where discrete
diodes or diode arrays are configured for rail-to-rail
protection on a high speed line. During positive duration
ESD events, the top diode will be forward biased when
the voltage on the protected line exceeds the reference
voltage plus the VF drop of the diode. For negative
events, the bottom diode will be biased when the voltage
exceeds the VF of the diode. At first approximation, the
clamping voltage due to the characteristics of the protection diodes is given by:
VC = VCC + VF
VC = -VF
Figure 4 - “RailTo-Rail” Pr
o tection TTopology
opology
“Rail-T
Pro
(First Approximation)
(for positive duration pulses)
(for negative duration pulses)
However, for fast rise time transient events, the effects of
parasitic inductance must also be considered as shown
in Figure 5. Therefore, the actual clamping voltage seen
by the protected circuit will be:
Figure 5 - The Effects of Parasitic Inductance
When Using Discrete Components to Implement
RailTo-Rail Pr
o t ection
Rail-T
Pro
VC = VCC + VF + LP diESD/dt (for positive duration pulses)
VC = -VF - LG diESD/dt
(for negative duration pulses)
ESD current reaches a peak amplitude of 30A in 1ns for
a level 4 ESD contact discharge per IEC 61000-4-2.
Therefore, the voltage overshoot due to 1nH of series
inductance is:
V = LP diESD/dt = 1X10-9 (30 / 1X10-9) = 30V
Example:
Consider a VCC = 5V, a typical VF of 30V (at 30A) for the
steering diode and a series trace inductance of 10nH.
The clamping voltage seen by the protected IC for a
positive 8kV (30A) ESD pulse will be:
Figure 6 - RailTo-Rail Pr
otection Using
Rail-T
Pro
RailClam
p TTV
V S Arra
ys
RailClamp
Arrays
dissipation capability of the discrete diode will be exceeded, thus destroying the device.
VC = 5V + 30V + (10nH X 30V/nH) = 335V
The RailClamp is designed to overcome the inherent
disadvantages of using discrete signal diodes for ESD
suppression. The RailClamp’s integrated TVS diode
helps to mitigate the effects of parasitic inductance in
the power supply connection. During an ESD event, the
current will be directed through the integrated TVS diode
to ground. The maximum voltage seen by the protected
IC due to this path will be the clamping voltage of the
device.
This does not take into account that the ESD current is
directed into the supply rail, potentially damaging any
components that are attached to that rail. Also note
that it is not uncommon for the VF of discrete diodes to
exceed the damage threshold of the protected IC. This is
due to the relatively small junction area of typical discrete components. It is also possible that the power
 2006 Semtech Corp.
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Applications Information (continued)
The HDMI Compliance Test Specification (CTS) requires
sink (receiver) ports maintain a differential impedance
of 100 Ohms +/- 15%. The measurement is taken
using a Time Domain Reflectometry (TDR) method that
utilizes a pulse with a risetime <= 200ps.
ESD protection devices have an inherent junction
capacitance. Even a small amount of added capacitance on an HDMI port will cause the impedance of
the differential pair to drop. As such, some form of
compensation to the layout will be required to bring
the differential pairs back within the required 100
Ohm +/- 15% range. The higher the added capacitance, the more extreme the modifications will need to
be. If the added capacitance is too high, compensation may not even be possible. The RClamp0544M
presents <1pF capacitance between the pairs while
being rated to handle >8kV ESD contact discharges
(>15kV air discharge) as outlined in IEC 61000-4-2.
As such, it is possible to make minor adjustments to
the board layout parameters to compensate for the
added capacitance of the RClamp0544M. Figure 7
shows how to implement the RClamp0544M in an
HDMI application (transmitter and receiver). Figure 8
shows impedance test results using a Semtech evaluation board with layout compensation. As shown, the
device meets the HDMI CTS impedance requirements.
B
A
X-axis
Y-axis
A
1.640
99.3
C
B
1.796
105.3
C
1.953
98.7
(nsec)
(Ohm)
Figure 8 - TDR Measurement using Semtech
Evaluation Board
1
1
1
1
Figure 7 - HDMI High Speed Signal Protection Application Diagram
 2006 Semtech Corp.
7
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
RClamp0544M
Data 2+
Data 2Data 1+
Data 1Data 0+
Data 0-
1
To LVDS
1
Clk+
Clk-
NDC7002N
or
UPA672T
RClamp0544M
LV Supply
Rpu
CEC
SCL
SDA
Gnd
5VPower
HP Detect
DSCL
DSDA
Rpu
LV Supply
RClamp0504F
Figure 9 - HDMI Protection for High and Low speed signals
 2006 Semtech Corp.
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Applications Information Spice Model
RClamp0544M Spice Model & Parameters
I/O Line
nH
Figure 9 - RClamp0544M Spice Model
Table 1 - RClamp0544M Spice Parameters
 2006 Semtech Corp.
Parameter
Unit
D1 (LCRD)
D2 (LCRD)
D3 (TVS)
IS
Amp
4.01E-18
4.01E-18
3.39E-15
BV
Volt
180
20
7.66
VJ
Volt
0.68
0.67
0.61
RS
Ohm
0.38
0.548
0.637
IBV
Amp
1E-3
1E-3
1E-3
CJO
Farad
0.7E-12
0.7E-12
190E-12
TT
sec
2.541E-9
2.541E-9
2.541E-9
M
--
0.01
0.01
0.23
N
--
1.1
1.1
1.1
EG
eV
1.11
1.11
1.11
9
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing --MSOP
SO-8 10L
Outline
e
A
DIM
D
N
SIDE VIEW
2X E/2
H
12
c
GAGE
PLANE
B
0.25
L
(L1)
D
DETAIL
aaa C
SEATING
PLANE
A2
C
A
A1
A2
b
c
D
E1
E
e
L
L1
N
01
aaa
bbb
ccc
A
E
E1
PIN 1
INDICATOR
ccc C
2X N/2 TIPS
SEE DETAIL
01
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.043
.000
.006
.030
.037
.007
.011
.003
.009
.114 .118 .122
.114 .118 .122
.193 BSC
.020 BSC
.016 .024 .032
(.037)
10
0°
8°
.004
.003
.010
1.10
0.00
0.15
0.75
0.95
0.17
0.27
0.08
0.23
2.90 3.00 3.10
2.90 3.00 3.10
4.90 BSC
0.50 BSC
0.40 0.60 0.80
(.95)
10
0°
8°
0.10
0.08
0.25
A
A
A1
bxN
bbb
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-187, VARIATION BA.
Land Pattern - MSOP 10L
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
INCHES
MILLIMETERS
(.161)
.098
.020
.011
.063
.224
(4.10)
2.50
0.50
0.30
1.60
5.70
P
NOTES:
1.
 2006 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
10
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RClamp0544M
PRELIMINARY
PROTECTION PRODUCTS
Marking Codes
544M
XXXX
* XXXX = Date Code
** Dot indicates Pin 1
Ordering Information
Part Number
Lead
Finish
Qty per
Reel
Reel
Size
RClamp0544M.TBT
Matte Sn
500
7 Inch
Note: Lead finish is lead-free matte tin.
RailClamp and RClamp are marks of Semtech Corporation.
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2006 Semtech Corp.
11
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