SEMTECH SRDA3.3-6

SRDA3.3-6 & SRDA05-6
RailClampÒ
Low Capacitance TVS Diode Array
PROTECTION PRODUCTS
Description
Features
RailClamps are surge rated diode arrays designed to
protect high speed data interfaces. The SR series has
been specifically designed to protect sensitive components which are connected to data and transmission
lines from overvoltage caused by ESD (electrostatic
discharge), EFT (electrical fast transients), and lightning.
The unique design of the SRDA series devices incorporates surge rated, low capacitance steering diodes and
a TVS diode in a single package. During transient
conditions, the steering diodes direct the transient to
either the positive side of the power supply line or to
ground. The internal TVS diode prevents over-voltage
on the power line, protecting any downstream components.
The low capacitance array configuration allows the user
to protect two high-speed data or transmission lines.
The low inductance construction minimizes voltage
overshoot during high current surges.
u Transient protection for high-speed data lines to
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IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20µs)
Array of surge rated diodes with internal TVS diode
Protects six I/O lines & power supply line
Low capacitance (<15pF) for high-speed interfaces
Low operating & clamping voltages
Solid-state technology
Mechanical Characteristics
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JEDEC SO-8 package
UL 497B listed
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Applications
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Circuit Diagram
USB Power & Data Line Protection
T1/E1 secondary IC Side Protection
Token Ring
HDSL, IDSL secondary IC Side Protection
Video Line Protection
Microcontroller Input Protection
Base stations
I2C Bus Protection
Schematic & PIN Configuration
I/O 1 1
8 GND
I/O 2 2
7 I/O 6
+V REF 3
6 I/O 5
I/O 3 4
5 I/O 4
S0-8 (Top View)
Revision 9/2000
1
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbo l
Value
Units
Peak Pulse Pow er (tp = 8/20µs)
Pp k
500
Watts
Peak Pulse Current (tp = 8/20µs)
I PP
25
A
Peak Forw ard Voltage (IF = 1A, tp =8/20µs)
V FP
1.5
V
Lead Soldering Temp erature
TL
260 (10 sec.)
°C
Op erating Temp erature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temp erature
Electrical Characteristics
SR DA3.3-6
Par ame te r
Reverse Stand -Off Voltage
Symbo l
Co nd itio ns
Minimum
Typ ical
VRWM
Maximum
Units
3.3
V
Punch -Th rough Voltage
V PT
IPT = 2µ A
3.5
V
Snap -Back Voltage
VSB
ISB = 50mA
2.8
V
Reverse Leakage Current
IR
V RWM = 3.3V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 1A , tp = 8/20µ s
5.3
V
Clamp ing Voltage
VC
IPP = 10A , tp = 8/20µ s
10
V
Clamp ing Voltage
VC
IPP = 25A , tp = 8/20µ s
15
V
Junction Cap acitance
Cj
Betw een I/O p ins and
Gnd
V R = 0V, f = 1MHz
8
15
pF
Betw een I/O p ins
V R = 0V, f = 1MHz
4
pF
Note:
(1) The SRDA3.3-6 is constructed using Semtech’s proprietary EPD process technology. See applications section for
more information.
ã 2000 Semtech Corp.
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Electrical Characteristics (continued)
SR DA05-6
Par ame te r
Symbo l
Co nd itio ns
Minimum
Typ ical
Maximum
Units
5
V
Reverse Stand-Off Voltage
VRWM
Reverse Breakdow n Voltage
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
10
µA
Clamp ing Voltage
VC
IPP = 1A, tp = 8/20µs
9.8
V
Clamp ing Voltage
VC
IPP = 10A, tp = 8/20µs
12
V
Clamp ing Voltage
VC
IPP = 25A, tp = 8/20µs
20
V
Junction Cap acitance
Cj
Betw een I/O p ins and
Gnd
V R = 0V, f = 1MHz
8
15
pF
Betw een I/O p ins
V R = 0V, f = 1MHz
4
ã 2000 Semtech Corp.
3
6
V
pF
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
10
110
% of Rated Power or IPP
Peak Pulse Power - P PP (kW)
100
1
0.1
90
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
0
1000
25
50
Pulse Waveform
125
150
18
Waveform
Parameters:
tr = 8µs
td = 20µs
90
80
70
e
60
16
Clamping Voltage - VC (V)
100
Percent of IPP
100
Clamping Voltage vs. Peak Pulse Current
110
-t
50
40
td = IPP/2
30
20
SRDA05-6
14
12
SRDA3.3-6
10
8
6
Waveform
Parameters:
tr = 8µs
td = 20µs
4
2
10
0
0
0
5
10
15
20
25
30
0
5
10
15
20
25
30
35
Peak Pulse Current - IPP (A)
Time (µs)
Variation of Capacitance vs. Reverse Voltage
Forward Voltage vs. Forward Current
0
10
I/O to GND
f = 1MHz
9
Forward Voltage - V F (V)
-2
% Change in Capacitance
75
Ambient Temperature - TA (oC)
Pulse Duration - tp (µs)
-4
-6
-8
-10
8
7
6
5
4
3
Waveform
Parameters:
tr = 8µs
td = 20µs
2
-12
1
-14
0
0
1
2
3
4
5
6
0
Reverse Voltage (V)
ã 2000 Semtech Corp.
5
10
15
20
25
30
35
40
45
50
Forward Current - IF (A)
4
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Applications Information
Data Line and Power Supply Protection Using Vcc as
reference
Device Connection Options for Protection of Six HighSpeed Lines
The SRDA TVS is designed to protect four data lines
from transient overvoltages by clamping them to a
fixed reference. When the voltage on the protected
line exceeds the reference voltage (plus diode VF) the
steering diodes are forward biased, conducting the
transient current away from the sensitive circuitry.
Data lines are connected at pins 1, 2, 4, 5, 6 and 7.
The negative reference is connected at pin 8. These
pins should be connected directly to a ground plane on
the board for best results. The path length is kept as
short as possible to minimize parasitic inductance.
The positive reference is connected at pins 2 and 3.
The options for connecting the positive reference are
as follows:
Data Line Protection with Bias and Power Supply
Isolation Resistor
1. To protect data lines and the power line, connect
pin 3 directly to the positive supply rail (VCC). In this
configuration the data lines are referenced to the
supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
2. The SRDA can be isolated from the power supply by
adding a series resistor between pin 3 and VCC. A
value of 10kW is recommended. The internal TVS
and steering diodes remain biased, providing the
advantage of lower capacitance.
3. In applications where no positive supply reference
is available, or complete supply isolation is desired,
the internal TVS may be used as the reference. In
this case, pin 3 is not connected. The steering
diodes will begin to conduct when the voltage on
the protected line exceeds the working voltage of
the TVS (plus one diode drop).
Data Line Protection Using Internal TVS Diode as
Reference
ESD Protection With RailClamps
RailClamps are optimized for ESD protection using the
rail-to-rail topology. Along with good board layout,
these devices virtually eliminate the disadvantages of
using discrete components to implement this topology.
Consider the situation shown in Figure 1 where discrete diodes or diode arrays are configured for rail-torail protection on a high speed line. During positive
duration ESD events, the top diode will be forward
biased when the voltage on the protected line exceeds
the reference voltage plus the V drop of the diode.
F
For negative events, the bottom diode will be biased
when the voltage exceeds the V of the diode. At first
F
ã 2000 Semtech Corp.
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Applications Information (continued)
approximation, the clamping voltage due to the characteristics of the protection diodes is given by:
V =V +V
C
CC
F
(for positive duration pulses)
= Descriptions
-V
(for negative duration pulses)
V
PIN
C
F
However, for fast rise time transient events, the
effects of parasitic inductance must also be considered as shown in Figure 2. Therefore, the actual
clamping voltage seen by the protected circuit will be:
V = V + V + L di
C
CC
F
V = -V - L di
C
F
G
P
/dt
ESD
/dt (for positive duration pulses)
ESD
Figure 1 - “Rail-To-Rail” Protection Topology
(First Approximation)
(for negative duration pulses)
ESD current reaches a peak amplitude of 30A in 1ns
for a level 4 ESD contact discharge per IEC 1000-4-2.
Therefore, the voltage overshoot due to 1nH of series
inductance is:
V = L di
P
/dt = 1X10-9 (30 / 1X10-9) = 30V
ESD
Example:
Consider a V = 5V, a typical V of 30V (at 30A) for the
CC
F
steering diode and a series trace inductance of 10nH.
The clamping voltage seen by the protected IC for a
positive 8kV (30A) ESD pulse will be:
Figure 2 - The Effects of Parasitic Inductance When
Using Discrete Components to Implement Rail-To-Rail
Protection
V = 5V + 30V + (10nH X 30V/nH) = 335V
C
This does not take into account that the ESD current is
directed into the supply rail, potentially damaging any
components that are attached to that rail. Also note
the high V of the discrete diode. It is not uncommon
F
for the V of discrete diodes to exceed the damage
F
threshold of the protected IC. This is due to the
relatively small junction area of typical discrete components. It is also possible that the power dissipation
capability of the discrete diode will be exceeded, thus
destroying the device.
The RailClamp is designed to overcome the inherent
disadvantages of using discrete signal diodes for ESD
suppression. The RailClamp’s integrated TVS diode
helps to mitigate the effects of parasitic inductance in
the power supply connection. During an ESD event,
ã 2000 Semtech Corp.
Figure 3 - Rail-To-Rail Protection Using
RailClamp TVS Arrays
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Applications Information (continued)
the current will be directed through the integrated TVS
diode to ground. The total clamping voltage seen by
the protected IC due to this path will be:
the EPD technology, the SRDA3.3-6 can effectively
operate at 3.3V while maintaining excellent electrical
characteristics.
V =V
The IV characteristic curve of the EPD device is shown
in Figure 4. The device represents a high impedance
to the circuit up to the working voltage (VRWM). During a
transient event, the device will begin to conduct as it is
biased in the reverse direction. When the punchthrough voltage (VPT) is exceeded, the device enters a
low impedance state, diverting the transient current
away from the protected circuit. When the device is
conducting current, it will exhibit a slight “snap-back” or
negative resistance characteristic due to its structure.
This must be considered when connecting the device
to a power supply rail. To return to a non-conducting
state, the current through the device must fall below
the snap-back current (approximately < 50mA) to allow
it to travel back through the negative resistance
region. If this is a concern, a 10kW current limiting
resistor can be placed between the supply rail and the
positive reference pin to prevent device latch-up.
C
F(RailClamp)
+V
TVS
This is given in the data sheet as the rated clamping
voltage of the device. For an SRDA05-6 the typical
clamping voltage is <16V at I =30A. The diodes
PP
internal to the RailClamp are low capacitance, fast
switching devices that are rated to handle high transient currents and maintain excellent forward voltage
characteristics.
Using the RailClamp does not negate the need for good
board layout. All other inductive paths must be considered. The connection between the positive supply and
the SRDA and from the ground plane to the SRDA
must be kept as short as possible. The path between
the SRDA and the protected line must also be minimized. The protected lines should be routed directly to
the SRDA. Placement of the SRDA on the PC board is
also critical for effective ESD protection. The device
should be placed as close as possible to the input
connector. The reason for this is twofold. First,
inductance resists change in current flow. If a significant inductance exists between the connector and the
TVS, the ESD current will be directed elsewhere (lower
resistance path) in the system. Second, the effects of
radiated emissions and transient coupling can cause
upset to other areas of the board even if there is no
direct path to the connector. By placing the TVS close
to the connector it will divert the ESD current immediately and absorb the ESD energy before it can be
coupled into nearby traces.
RailClamp is a registered trademark of Semtech corporation
,PP
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9%55
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95:0
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(Reference Semtech application note SI99-01 for
further information on board layout)
SRDA3.3-6 EPD TVS Characteristics
The internal TVS of the SRDA3.3-4 is constructed using
Semtech’s proprietary EPD technology. The structure
of the EPD TVS is vastly different from the traditional
pn-junction devices that are internal to the SRDA05-6.
At voltages below 5V, high leakage current and junction
capacitance render conventional avalanche technology
impractical for most applications. However, by utilizing
ã 2000 Semtech Corp.
Figure 4 - EPD TVS IV Characteristic Curve
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Typical Applications
Video Line Protection
ã 2000 Semtech Corp.
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Outline Drawing - SO-8
Notes:
(1) Controlling dimension: Inch (unless otherwise specified).
Land Pattern - SO-8
ã 2000 Semtech Corp.
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SRDA3.3-6 & SRDA05-6
PROTECTION PRODUCTS
Ordering Information
Par t Numbe r
Wo r king
Vo ltage
Qty p e r
Reel
R e e l Size
SRDA 3.3-6.TB
3.3V
500
7 Inch
SRDA 3.3-6.TE
3.3V
2500
13 Inch
SRDA 05-6.TB
5V
500
7 Inch
SRDA 05-6.TE
5V
2500
13 Inch
Note:
(1) No suffix indicates tube pack.
Contact Information
Semtech Corporation
Protection Products Division
652 Mitchell Rd., Newbury Park, CA 91320
Phone: (805)498-2111 FAX (805)498-3804
ã 2000 Semtech Corp.
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