TI AM26C31MFKB

SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
D Meets or Exceeds the Requirements of
D
D
D
D
D
D
D
TIA/EIA-422-B and ITU Recommendation
V.11
Low Power, ICC = 100 µA Typ
Operates From a Single 5-V Supply
High Speed, tPLH = tPHL = 7 ns Typ
Low Pulse Distortion, tsk(p) = 0.5 ns Typ
High Output Impedance in Power-Off
Conditions
Improved Replacement for AM26LS31
Available in Q-Temp Automotive
− High-Reliability Automotive Applications
− Configuration Control/Print Support
− Qualification to Automotive Standards
AM26C31M . . . J OR W PACKAGE
AM26C31Q . . . D PACKAGE
AM26C31C . . . D, DB, N, OR NS PACKAGE
AM26C31I . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
1A
1Y
1Z
G
2Z
2Y
2A
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4A
4Y
4Z
G
3Z
3Y
3A
AM26C31M . . . FK PACKAGE
(TOP VIEW)
1Y
1A
NC
VCC
4A
description/ordering information
1Z
G
NC
2Z
2Y
4
3
2 1 20 19
18
5
17
6
16
7
15
8
9 10 11 12 13
14
4Y
4Z
NC
G
3Z
2A
GND
NC
3A
3Y
The AM26C31 is a differential line driver with
complementary outputs, designed to meet the
requirements of TIA/EIA-422-B and ITU (formerly
CCITT). The 3-state outputs have high-current
capability for driving balanced lines, such as
twisted-pair or parallel-wire transmission lines,
and they provide the high-impedance state in the
power-off condition. The enable functions are
common to all four drivers and offer the choice of
an active-high (G) or active-low (G) enable input.
BiCMOS circuitry reduces power consumption
without sacrificing speed.
NC − No internal connection
The AM26C31C is characterized for operation from 0°C to 70°C, the AM26C31I is characterized for operation
from −40°C to 85°C, the AM26C31Q is characterized for operation over the automotive temperature range of
−40°C to 125°C, and the AM26C31M is characterized for operation over the full military temperature range of
−55°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
! "#$ %!&
% "! "! '! ! !( !
%% )*& % "!+ %! !!$* $%!
!+ $$ "!!&
"% "$ ,,-../ $$ "!! ! !!%
$! '!)! !%& $$ '! "%/ "%
"!+ %! !!$* $%! !+ $$ "!!&
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
description/ordering information (continued)
ORDERING INFORMATION
PDIP (N)
0°C
0
C to 70
70°C
C
−40°C to 125°C
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
AM26C31CN
Tube of 40
AM26C31CD
Reel of 2500
AM26C31CDR
SOP (NS)
Reel of 2000
AM26C31CNSR
26C31
SSOP (DB)
Reel of 2000
AM26C31CDBR
26C31
PDIP (N)
Tube of 25
AM26C31IN
AM26C31IN
Tube of 40
AM26C31ID
Reel of 2500
AM26C31IDR
SOP (NS)
Reel of 2000
AM26C31INSR
26C31
SSOP (DB)
Reel of 2000
AM26C31IDBR
26C31
TSSOP (PW)
Tube of 90
AM26C31IPW
26C31I
Tube of 40
AM26C31QD
Reel of 2500
AM26C31QDR
CDIP (J)
Tube of 25
AM26C31MJ
AM26C31MJ
CFP (W)
Tube of 150
AM26C31MW
AM26C31MW
SOIC (D)
SOIC (D)
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC (D)
AM26C31CN
AM26C31C
AM26C31C
AM26C31QD
LCCC (FK)
Tube of 55
AM26C31MFK
AM26C31MFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each driver)
ENABLES
OUTPUTS
G
G
Y
H
H
X
H
L
L
H
X
L
H
H
X
L
H
L
L
X
L
L
H
X
L
H
Z
Z
INPUT
A
Z
H = High level, L = Low level, X = Irrelevant,
Z = High impedance (off)
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
logic diagram (positive logic)
G
G
1A
2A
3A
4A
4
12
1
2
3
7
9
15
6
5
10
11
14
13
1Y
1Z
2Y
2Z
3Y
3Z
4Y
4Z
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
schematics of inputs and outputs
EQUIVALENT OF EACH INPUT
TYPICAL OF ALL OUTPUTS
VCC
VCC
Input
Output
GND
GND
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Differential input voltage range, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 14 V
Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input or output clamp current, IIK or IOK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±150 mA
VCC current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
GND current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −200 mA
Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential output voltage (VOD), are with respect to the network ground terminal.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
4.5
MAX
5
5.5
UNIT
VCC
VID
Supply voltage
VIH
VIL
High-level input voltage
Low-level input voltage
0.8
V
IOH
IOL
High-level output current
−20
mA
20
mA
±7
Differential input voltage
Low-level output current
TA
Operating free-air temperature
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
V
2
AM26C31C
4
NOM
V
0
70
AM26C31I
−40
85
AM26C31Q
−40
125
AM26C31M
−55
125
°C
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VOL
High-level output voltage
Low-level output voltage
IO = −20 mA
IO = 20 mA
|VOD|
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
∆|VOD|
Change in magnitude of differential output voltage‡
RL = 100 Ω,
See Figure 1
VOC
∆|VOC|
Common-mode output voltage
RL = 100 Ω,
Change in magnitude of common-mode output voltage‡
RL = 100 Ω,
II
Input current
VI = VCC or GND
VO = 6 V
VCC = 0
VO = −0.25 V
VO = 0
IO(off)
Driver output current with power off
IOS
Driver output short-circuit current
IOZ
High-impedance off-state output current
AM26C31C
AM26C31I
MIN
TYP†
2.4
3.4
0.2
2
Quiescent supply current
0.4
V
V
±0.4
V
See Figure 1
3
V
See Figure 1
±0.4
V
±1
µA
100
−100
−30
−150
VO = 2.5 V
VO = 0.5 V
IO = 0
V
3.1
20
−20
VI = 0 V or 5 V
ICC
UNIT
MAX
VI = 2.4 V
or 0.5 V,
See Note 4
1.5
A
µA
mA
µA
A
100
µA
3
mA
Ci
Input capacitance
6
pF
† All typical values are at VCC = 5 V and TA = 25°C.
‡ ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low
level.
NOTE 4: This parameter is measured per input. All other inputs are at 0 or 5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
AM26C31C
AM26C31I
UNIT
MIN
TYP†
MAX
tPLH
tPHL
Propagation delay time, low- to high-level output
S1 is open,
See Figure 2
3
7
12
ns
Propagation delay time, high- to low-level output
S1 is open,
See Figure 2
3
7
12
ns
tsk(p)
Pulse skew time (|tPLH − tPHL|)
S1 is open,
See Figure 2
0.5
4
ns
tr(OD), tf(OD)
tPZH
Differential output rise and fall times
S1 is open,
See Figure 3
5
10
ns
Output enable time to high level
S1 is closed,
See Figure 4
10
19
ns
tPZL
tPHZ
Output enable time to low level
S1 is closed,
See Figure 4
10
19
ns
Output disable time from high level
S1 is closed,
See Figure 4
7
16
ns
tPLZ
Output disable time from low level
S1 is closed,
See Figure 4
7
16
ns
Cpd
Power dissipation capacitance (each driver)
(see Note 5)
S1 is open,
See Figure 2
170
pF
† All typical values are at VCC = 5 V and TA = 25°C.
NOTE 5: Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VOH
VOL
High-level output voltage
Low-level output voltage
IO = −20 mA
IO = 20 mA
|VOD|
Differential output voltage magnitude
RL = 100 Ω,
See Figure 1
∆|VOD|
Change in magnitude of differential output voltage‡
RL = 100 Ω,
See Figure 1
VOC
∆|VOC|
Common-mode output voltage
RL = 100 Ω,
Change in magnitude of common-mode output voltage‡
RL = 100 Ω,
II
Input current
VI = VCC or GND
VO = 6 V
VCC = 0
VO = −0.25 V
VO = 0
IO(off)
Driver output current with power off
IOS
Driver output short-circuit current
IOZ
High-impedance off-state output current
Quiescent supply current
MIN
TYP†
2.2
3.4
0.2
2
V
0.4
V
V
±0.4
V
See Figure 1
3
V
See Figure 1
±0.4
V
±1
µA
100
−100
−170
20
−20
VI = 0 V or 5 V
VI = 2.4 V
or 0.5 V,
See Note 4
IO = 0
UNIT
MAX
3.1
VO = 2.5 V
VO = 0.5 V
IO = 0
ICC
AM26C31Q
AM26C31M
A
µA
mA
µA
A
100
µA
3.2
mA
Ci
Input capacitance
6
pF
† All typical values are at VCC = 5 V and TA = 25°C.
‡ ∆|VOD| and ∆|VOC| are the changes in magnitude of VOD and VOC, respectively, that occur when the input is changed from a high level to a low
level.
NOTE 4: This parameter is measured per input. All other inputs are at 0 V or 5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
AM26C31Q
AM26C31M
MIN
MAX
tPLH
tPHL
Propagation delay time, low- to high-level output
S1 is open,
See Figure 2
7
12
ns
Propagation delay time, high- to low-level output
S1 is open,
See Figure 2
6.5
12
ns
tsk(p)
Pulse skew time (|tPLH − tPHL|)
S1 is open,
See Figure 2
0.5
4
ns
tr(OD), tf(OD)
tPZH
Differential output rise and fall times
S1 is open,
See Figure 3
5
12
ns
Output enable time to high level
S1 is closed,
See Figure 4
10
19
ns
tPZL
tPHZ
Output enable time to low level
S1 is closed,
See Figure 4
10
19
ns
Output disable time from high level
S1 is closed,
See Figure 4
7
16
ns
tPLZ
Output disable time from low level
S1 is closed,
See Figure 4
7
16
ns
Cpd
Power dissipation capacitance (each driver)
(see Note 5)
S1 is open,
See Figure 2
100
† All typical values are at VCC = 5 V and TA = 25°C.
NOTE 5: Cpd is used to estimate the switching losses according to PD = Cpd × VCC2 × f, where f is the switching frequency.
6
UNIT
TYP†
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
pF
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
RL/2
VOD2
RL/2
VOC
Figure 1. Differential and Common-Mode Output Voltages
C2 = 40 pF
Input
RL/2
C1 =
40 pF
500 Ω
1.5 V
S1
C3 = 40 pF
RL/2
See Note A
TEST CIRCUIT
3V
1.3 V
0V
Input A
(see Note B)
tPLH
Output Y
50%
tPHL
50%
1.3 V
tsk(p)
Output Z
50%
tsk(p)
50%
1.3 V
tPHL
tPLH
NOTES: A. C1, C2, and C3 include probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns.
Figure 2. Propagation Delay Time and Skew Waveforms and Test Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
C2 = 40 pF
Input
RL/2
C1 =
40 pF
500 Ω
1.5 V
S1
C3 = 40 pF
RL/2
See Note A
TEST CIRCUIT
3V
Input A
(see Note B)
Differential
Output
0V
90%
90%
10%
10%
tr(OD)
tf(OD)
VOLTAGE WAVEFORMS
NOTES: A. C1, C2, and C3 include probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, and tr, tf ≤ 6 ns.
Figure 3. Differential-Output Rise- and Fall-Time Waveforms and Test Circuit
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
Output
C2 =
40 pF
0V
3V
Enable Inputs
(see Note B)
Input A
C1 =
40 pF
C3 =
40 pF
G
G
50 Ω
500 Ω
1.5 V
S1
50 Ω
Output
See Note A
TEST CIRCUIT
Enable G Input
(see Note C)
3V
1.3 V
1.3 V
Enable G Input
0V
1.5 V
Output WIth
0 V to A Input
VOL + 0.3 V
0.8 V
VOL
tPLZ
tPZL
VOH
Output WIth
3 V to A Input
VOH − 0.3 V
2V
1.5 V
tPHZ
tPZH
VOLTAGE WAVEFORMS
NOTES: A. C1, C2, and C3 includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, duty cycle ≤ 50%, tr < 6 ns, and
tf < 6 ns.
C. Each enable is tested separately.
Figure 4. Output Enable- and Disable-Time Waveforms and Test Circuit
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLLS103K − DECEMBER 1990 − REVISED SEPTEMBER 2004
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SWITCHING FREQUENCY
300
IIDD
CC − Supply Current − mA
250
ÁÁ
ÁÁ
200
150
100
VCC = 5 V
TA = 25°C
See Figure 2
S1 Open
All Four Channels Switching Simultaneously
N Package
50
0
0
5
10
15
20
25
30
f − Switching Frequency − MHz
Figure 5
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
35
40
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9163901Q2A
ACTIVE
LCCC
FK
20
1
None
5962-9163901QEA
ACTIVE
CDIP
J
16
1
None
POST-PLATE Level-NC-NC-NC
5962-9163901QFA
ACTIVE
CFP
W
16
1
AM26C31CD
ACTIVE
SOIC
D
16
40
AM26C31CDBLE
OBSOLETE
SSOP
DB
16
None
Call TI
AM26C31CDBR
ACTIVE
SSOP
DB
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
AM26C31CDR
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
AM26C31CN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
AM26C31CNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
AM26C31ID
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
AM26C31IDBLE
OBSOLETE
SSOP
DB
16
None
Call TI
AM26C31IDBR
ACTIVE
SSOP
DB
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
AM26C31IDR
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
AM26C31IN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
AM26C31INSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
AM26C31IPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
AM26C31MFKB
ACTIVE
LCCC
FK
20
1
None
AM26C31MJB
ACTIVE
CDIP
J
16
1
None
AM26C31MWB
ACTIVE
CFP
W
16
1
AM26C31QD
ACTIVE
SOIC
D
16
40
AM26C31QDR
ACTIVE
SOIC
D
16
2500
A42 SNPB
Level-NC-NC-NC
None
A42 SNPB
Level-NC-NC-NC
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR
Call TI
Call TI
POST-PLATE Level-NC-NC-NC
A42 SNPB
Level-NC-NC-NC
None
A42 SNPB
Level-NC-NC-NC
None
CU NIPDAU
Level-1-220C-UNLIM
None
CU NIPDAU
Level-1-220C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2005
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated