C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts Model C33xx is a 1.544MHz to 156.250MHz HCMOS Clock Oscillator operating at 3.3Volts. The oscillator utilizes Fundamental or High Q Third Overtone crystal design providing very low Jitter and Phase Noise. No Sub-Harmonics are present in the Output Signal. 5x7mm SMD Applications: Digital Video SONET/SDH/DWDM Storage Area Networks Broadband Access Ethernet, Gigabit Ethernet Rev.: G Date: 03-06-08 C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts Frequency Range: 1.544 to 156.250Mhz Temperature Range: (standard) (Option M) (Option E) 0°C to +70°C -20°C to +70°C -40°C to +85°C Storage: Input Voltage: Input Current: (1.544~34.00MHz) (35.00~50.00MHz) (51.00~69.00MHz) (70.00~156.25MHz) Standby Current: -55°C to 120°C 3.3V ± 0.3V 18mA Max 25mA Max 30mA Max 45mA Max 3uA Typ., 10uA Max Output: Symmetry: Rise/Fall Time: (1.54~10.00MHz) (10.10~30.00MHz) (30.10~50.00MHz) (50.10~80.00MHz) (80.10~156.25MHz) HCMOS 45/55% Max @ 50%Vdd Logic: Disable Time Start-up Time Load: Jitter RMS: 12KHz~80MHz “0”= 10% Vdd Max “1”= 90% Vdd Min. 200nSec Max 1mSec Typ., 2mSec Max 30pF Max, >125MHz 15pF Max Sub-harmonics: None Frequency Stability Options(ppm): Aging: ±20, ±25, ±50, ±100 5nsec Max @ 20% to 80% Vdd 4nsec Max @ 20% to 80% Vdd 3nsec Max @ 20% to 80% Vdd 2.5nsec Max @ 20% to 80% Vdd 2nsec Max @ 20% to 80% Vdd 0.5psec Typ., 1psec Max <3ppm 1st/yr, <1ppm every year thereafter PART NUMBER GUIDE Example: C3392-44.736MHz Intermediate Temp: CM3392-44.736MHz Extended Temp: CE3392-44.736MHz C = 0°C to 70°C CM = -20°C to 70°C CE = -40°C to 85°C Part Number Stability C3390 ±100ppm C3392 ±50ppm C3391 ±25ppm C3398 ±20ppm Rev.: G Date: 03-06-08 C33xx 5x7mm SMD HCMOS Clock Oscillator 3.3 Volts OUT mA M pin 3 pin 4 Vdd PWR Supply Bypass Cap. VM O/P Load incl Probe Cl OUT OSC. GND pin 2 pin 1 High Impedance GND or "LOW" Shock: Solderability: Vibration: Solvent Resistance: Resistance to Soldering Heat: MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2003 MIL-STD-883, Method 2007, Condition A MIL-STD-202, Method 215 MIL-STD-202, Method 210, Condition I or J RECOMMENDED REFLOW SOLDERING PROFILE Ramp-Up 3°C/Sec Max. 260°C 217°C 200°C 150°C Environmental: Preheat 180 Secs. Max. 8 Minutes Max. Thermal Shock: MIL-STD-883, Method 1011, Condition A Moisture Resistance: MIL-STD-883, Method 1004 NOTE: Reflow Profile with 240°C peak also acceptable. 0.075 (1.80) 0.204 (5.02) 0.055 Typ. (1.40 Typ.) #4 #3 0.200 ±0.005 (5.08 ±0.13) Pin #1 State Output State “1” level 0.7*Vcc Min SUGGESTED PAD LAYOUT 0.045 ±0.008 (1.14 ±0.20) “0” level 0.3*Vcc Max Pad 0.071 SQ (1.80) #2 Tri-State Function Open or N/C Denotes pad 1 XXX=Date Code XX=Lot Code #1 90 Secs. Max. 260°C for 10 Secs. Max. 0.283 (7.20) P/N XXX Frequency XX Critical Temperature Zone Ramp-Down 6°C/Sec. TEMPERATURE Mechanical: Oscillation OPEN or "HIGH" 0.165 (4.19) Active Active High Z Connection 1 Enable/Disable 2 GND 3 Out 4 Vcc 0.200 (5.08) 0.01uF Bypass Capacitor Recommended Rev.: G Date: 03-06-08