TI SI3016-KS

TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
D Provides Two-Chip Modem Solution
D Data Rates from 300 bps to 56 Kbps
D Data Modulation Standards
D
V.90, V.34, V.32bis, V.32, V.22bis, V.22, V.23,
V.21 and V.23 Reversible (Minitel), Bell 212,
Bell 103
FAX Capabilities
− ITU−T V.17, V.29, V.27ter Modulations
− TIA/EIA 578 Class 1 Interface
D V.42 or MNP Class 3 and 4 Error Control
D Applications
−
−
−
−
−
D
and V.42bis Compression
D Caller ID
D Field-Proven Modem Algorithms Give
D
D
D
D
D
D
Highest Performance, Reliability, and
Compatibility
Non-Volatile EEPROM Configuration
Storage
Worldwide Telecom Approvals
Parallel Phone Support Including Parallel
Phone Detection
Parallel Phone Exclusion Relay Control
Protected Against Surge and Overvoltage
on the Telephone Line
Parallel Host Port Interface Supports a
Variety of Industry Standard Busses
D Integral Serial Interface (UART)
D Autobaud on Serial DTE Interface
D State-of-the-Art Integrated Transformerless
D
D
Silicon DAA for Phone Line Interconnection
40K x 16-Bit Dual-Access On-Chip RAM
128K x 16-Bit On-Chip ROM
D
D
D
D
Embedded Systems
Set-Top Boxes
Gaming Consoles
Internet Appliances
Portable Devices
(PDAs, Digital Cameras)
− Remote Data Collection, Point-of-Sale
− Meter Reading, Utility Monitoring
On-Chip Peripherals
− Software-Programmable Wait-State
Generator and Programmable Bank
Switching
− On-Chip Phase-Locked Loop (PLL) Clock
Generator With Internal Oscillator or
External Clock Source
− Two Multichannel Buffered Serial Ports
(McBSPs)
− Enhanced 8-Bit Parallel Host-Port
Interface (HPI8)
Power Consumption Control With IDLE1,
IDLE2, and IDLE3 Instructions With
Power-Down Modes
On-Chip Scan-Based Emulation Logic,
IEEE Std 1149.1† (JTAG) Boundary Scan
Logic
8.5-ns Single-Cycle Fixed-Point Instruction
Execution Time (117.96 MIPS) or 17-ns
Instruction Execution Time (58.98 MIPS) for
3.3-V Power Supply (1.5-V Core)
Available in a 144-Pin Plastic Low-Profile
Quad Flatpack (LQFP) (PGE Suffix) and a
144-Pin Ball Grid Array (BGA) (GGU Suffix)
description
The TMS320C54V90 is used to implement a full-featured, high-performance modem technology, intended for
use in embedded systems and similar applications. This highly integrated solution implements a complete
modem using only two chips: the TMS320C54V90 DSP with on-chip RAM and ROM, and the Si3016 line-side
DAA.
The modem can connect to a host system serially (RS-232 functionality), or as an 8-bit peripheral to the
processor in a host system. The TMS320C54V90 uses a standard Digital Signal Processor (DSP) and
proprietary firmware to perform all the modem signal processing, the V.42/V.42bis compression, and AT
commands interpretation for modem control functions.
.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Note: Human Body Model ESD test performance for this product was demonstrated to be ±1.5 kV during product qualification. Industry standard
test method used was IEA/JESD22-A114. Adherence to ESD handling precautionary procedures is advised at all times.
All trademarks are the property of their respective owners.
†
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
1
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
description (continued)
The TMS320C54V90 also uses the latest silicon DAA technology. This technology does not require a
transformer and results in lower cost, lower power, and a smaller area for the DAA function.
For serial interface applications, an integrated UART implements the serial interface with no additional
hardware.
part numbers
The following orderable part numbers apply to the TMS320C54V90 device:
D
D
D
D
TMS320C54V90BPGE − Selects QFP-packaged DSP
TMS320C54V90BGGU − Selects BGA-packaged DSP
Si3016−KS − Selects DAA shipped in tubes
Si3016−KSR − Selects DAA shipped in tape and reel
TABLE OF CONTENTS
Result Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Connecting HPI Interface to ISA Bus . . . . . . . . . . . . . . . . .
TMS320C54V90 Schematic . . . . . . . . . . . . . . . . . . . . . . . . .
General DAA Layout Guidelines . . . . . . . . . . . . . . . . . . . . .
Additional TMS320C54V90-to-Si3016
Layout Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Enhanced Overvoltage Protection . . . . . . . . . . . . . . . . . . . .
Special Telephone Interface Considerations . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . .
Recommended Operating Conditions . . . . . . . . . . . . . . . . .
Electrical Characteristics Over Recommended Operating
Case Temperature Range . . . . . . . . . . . . . . . . . . . . . .
Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .
HPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Descriptions: Si3016 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Clock Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Serial and Parallel Interface Modes . . . . . . . . . . . . . . . . . . 14
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Host Port Interface (HPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
AT Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
S-Registers/Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
46
54
56
61
70
72
73
77
77
78
79
80
83
REVISION HISTORY
2
REVISION
DATE
PRODUCT STATUS
*
July 2001
Advance Information
Original
A
September 2001
Advance Information
Changed the DAAEN signal to a true low, DAAEN. Added Schottky
diode (D6) schematic diagram and BOM. Changed name of core
and I/O power supplies. Added DAA power supply description.
B
October 2002
Advance Information
Updated schematic diagrams, electrical characteristics, and
recommended operating conditions.
C
March 2003
Production Data
Updated AT command tables, schematic diagrams, electrical
characteristics, and recommended operating conditions.
D
April 2003
Production Data
Updated AT command tables.
E
June 2003
Production Data
Revised orderable part numbers on page 2. Revised Table 2 and
Figure 22.
POST OFFICE BOX 1443
HIGHLIGHTS
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
REVISION HISTORY (Continued)
REVISION
DATE
F
PRODUCT STATUS
HIGHLIGHTS
Production Data
Revised orderable part numbers on page 2. Revised Table 2,
Table 14, Table 15, Table 19, Table 23, and Table 24. Revised
“country code setting” section on page 45. Revised schematic
diagrams on page 56 and page 57. Updated Figure 22. Changed
“operating case temperature range” from “−40_C to 100_C” to “0_C
to 100_C” in “absolute maximum ratings” section. Updated TC, VIH,
and VIL in “recommended operating conditions” table.
October 2003
109
111
110
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
75
35
74
36
73
A18
A17
VSS
A16
D5
D4
D3
D2
D1
D0
RS
X2/CLKIN
X1
HD3
CLKOUT
VSS
HPIENA
CVDD
VSS
TMS
TCK
TRST
TDI
TDO
EMU1/OFF
EMU0
TOUT
HD2
HPI16
CLKMD3
CLKMD2
CLKMD1
VSS
DVDD
C1A5V
C1A
VSS
TX
HCNTL0
VSS
BCLKR0
BCLKR1
BFSR0
BFSR1
BDR0
HCNTL1
BDR1
BCLKX0
BCLKX1
VSS
HINT/TOUT1
CVDD
BFSX0
BFSX1
HRDY
DV DD
V SS
HD0
BDX0
BDX1
IACK
HBIL
NMI
INT0
INT1
INT2
INT3
CVDD
HD1
VSS
RX
VSS
72
76
34
71
77
33
70
78
32
69
79
31
68
80
30
67
81
29
66
82
28
65
83
27
64
84
26
63
85
25
62
86
24
61
87
23
60
88
22
59
89
21
58
90
20
57
91
19
56
92
18
55
93
17
54
94
16
53
95
15
52
96
14
51
97
13
50
98
12
49
99
11
48
100
10
47
101
9
46
102
8
45
103
7
44
104
6
43
105
5
42
106
4
41
3
40
107
39
108
2
38
1
37
VSS
A22
VSS
DVDD
A10
HD7
A11
A12
A13
A14
A15
CVDD
HAS
VSS
VSS
CVDD
HCS
HR/W
READY
PS
DS
IS
R/W
MSTRB
IOSTRB
MSC
XF
HOLDA
IAQ
HOLD
BIO
MP/MC
DVDD
VSS
DAAEN
BFSRX2
143
144
VSS
A21
CV DD
A9
A8
A7
A6
A5
A4
HD6
A3
A2
A1
A0
DVDD
HDS2
VSS
HDS1
VSS
CVDD
HD5
D15
D14
D13
HD4
D12
D11
D10
D9
D8
D7
D6
DV DD
VSS
A20
A19
PGE PACKAGE†
(TOP VIEW)
†
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the
core CPU.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
3
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
GGU PACKAGE
(BOTTOM VIEW)
13 12 11 10 9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
The pin assignments table to follow lists each signal name and BGA ball number for the TMS320C54V90
(144-pin BGA) package which is footprint compatible with the TMS320VC5402.
4
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Pin Assignments for the TMS320C54V90GGU (144-Pin BGA) Package†
†
SIGNAL
QUADRANT 1
BGA BALL #
SIGNAL
QUADRANT 2
BGA BALL #
SIGNAL
QUADRANT 3
BGA BALL #
SIGNAL
QUADRANT 4
BGA BALL #
VSS
A1
C1A
N13
VSS
N1
A19
A13
A22
B1
C1A5V
M13
TX
N2
A20
A12
VSS
C2
DVDD
L12
HCNTL0
M3
VSS
B11
DVDD
C1
VSS
L13
VSS
N3
DVDD
A11
A10
D4
CLKMD1
K10
BCLKR0
K4
D6
D10
HD7
D3
CLKMD2
K11
BCLKR1
L4
D7
C10
A11
D2
CLKMD3
K12
BFSR0
M4
D8
B10
A12
D1
HPI16
K13
BFSR1
N4
D9
A10
A13
E4
HD2
J10
BDR0
K5
D10
D9
A14
E3
TOUT
J11
HCNTL1
L5
D11
C9
A15
E2
EMU0
J12
BDR1
M5
D12
B9
CVDD
E1
EMU1/OFF
J13
BCLKX0
N5
HD4
A9
HAS
F4
TDO
H10
BCLKX1
K6
D13
D8
VSS
F3
TDI
H11
VSS
L6
D14
C8
VSS
F2
TRST
H12
HINT/TOUT1
M6
D15
B8
CVDD
F1
TCK
H13
CVDD
N6
HD5
A8
HCS
G2
TMS
G12
BFSX0
M7
CVDD
B7
HR/W
G1
VSS
G13
BFSX1
N7
VSS
A7
READY
G3
CVDD
G11
HRDY
L7
HDS1
C7
PS
G4
HPIENA
G10
DVDD
K7
VSS
D7
DS
H1
VSS
F13
VSS
N8
HDS2
A6
IS
H2
CLKOUT
F12
HD0
M8
DVDD
B6
R/W
H3
HD3
F11
BDX0
L8
A0
C6
MSTRB
H4
X1
F10
BDX1
K8
A1
D6
IOSTRB
J1
X2/CLKIN
E13
IACK
N9
A2
A5
MSC
J2
RS
E12
HBIL
M9
A3
B5
XF
J3
D0
E11
NMI
L9
HD6
C5
HOLDA
J4
D1
E10
INT0
K9
A4
D5
IAQ
K1
D2
D13
INT1
N10
A5
A4
HOLD
K2
D3
D12
INT2
M10
A6
B4
BIO
K3
D4
D11
INT3
L10
A7
C4
MP/MC
L1
D5
C13
CVDD
N11
A8
A3
DVDD
L2
A16
C12
HD1
M11
A9
B3
VSS
L3
VSS
C11
VSS
L11
CVDD
C3
DAAEN
M1
A17
B13
RX
N12
A21
A2
BFSRX2
M2
A18
B12
VSS
M12
VSS
B2
DVDD is the power supply for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the
core CPU.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
5
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 Terminal Functions
TERMINAL
NAME
I/O†
DESCRIPTION
EXTERNAL MEMORY INTERFACE PINS
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
(MSB)
O/Z
(LSB)
(MSB)
I/O/Z
(LSB)
Parallel address bus A22 (MSB) through A0 (LSB). The lower sixteen address pins—A0 to A15—are
multiplexed to address all external memory (program, data) or I/O, while the upper seven address
pins—A22 to A16—are only used to address external program space. These pins are placed in the
high-impedance state when the hold mode is enabled, or when OFF is low.
A15
A14
A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
(MSB)
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
(MSB)
I
These pins can be used to address internal memory via the HPI when the HPI16 pin
is high.
(LSB)
I/O
Parallel data bus D15 (MSB) through D0 (LSB). The sixteen data pins, D0 to D15,
are multiplexed to transfer data between the core CPU and external data/program
memory, I/O devices, or HPI in 16-bit mode. The data bus is placed in the
high-impedance state when not outputting or when RS or HOLD is asserted. The
data bus also goes into the high-impedance state when OFF is low.
The data bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias
resistors on unused pins. When the data bus is not being driven by the DSP, the
bus holders keep the pins at the logic level that was most recently driven. The data
bus holders of the DSP are disabled at reset, and can be enabled/disabled via the
BH bit of the BSCR.
(LSB)
INITIALIZATION, INTERRUPT, AND RESET PINS
†
6
IACK
O/Z
Interrupt acknowledge signal. IACK Indicates receipt of an interrupt and that the program counter is fetching
the interrupt vector location designated by A15–0. IACK also goes into the high-impedance state when OFF
is low.
INT0
INT1
INT2
INT3
I
External user interrupt inputs. INT0−3 are prioritized and maskable via the interrupt mask register and
interrupt mode bit. The status of these pins can be polled by way of the interrupt flag register.
NMI
I
Nonmaskable interrupt. NMI is an external interrupt that cannot be masked by way of the INTM or the IMR.
When NMI is activated, the processor traps to the appropriate vector location.
I = Input, O = Output, Z = High-impedance, S = Supply
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 Terminal Functions (Continued)
TERMINAL
NAME
I/O†
DESCRIPTION
RS
I
Reset input. RS causes the DSP to terminate execution and causes a re-initialization of the CPU and
peripherals. When RS is brought to a high level, execution begins at location 0FF80h of program memory.
RS affects various registers and status bits.
MP/MC
I
Microprocessor/microcomputer mode select pin. If active low at reset, microcomputer mode is selected,
and the internal program ROM is mapped into the upper 16K words of program memory space. If the pin is
driven high during reset, microprocessor mode is selected, and the on-chip ROM is removed from program
space. This pin is only sampled at reset, and the MP/MC bit of the PMST register can override the mode
that is selected at reset.
BIO
I
Branch control input. A branch can be conditionally executed when BIO is active. If low, the processor
executes the conditional instruction. The BIO condition is sampled during the decode phase of the pipeline
for XC instruction, and all other instructions sample BIO during the read phase of the pipeline.
XF
O/Z
External flag output (latched software-programmable signal). XF is set high by the SSBX XF instruction, set
low by RSBX XF instruction or by loading ST1. XF is used for signaling other processors in multiprocessor
configurations or as a general-purpose output pin. XF goes into the high-impedance state when OFF is low,
and is set high at reset.
DS
PS
IS
O/Z
Data, program, and I/O space select signals. DS, PS, and IS are always high unless driven low for
accessing a particular external memory space. Active period corresponds to valid address information.
Placed into a high-impedance state in hold mode. DS, PS, and IS also go into the high-impedance state
when OFF is low.
MSTRB
O/Z
Memory strobe signal. MSTRB is always high unless low-level asserted to indicate an external bus access
to data or program memory. Placed in high-impedance state in hold mode. MSTRB also goes into the
high-impedance state when OFF is low.
READY
I
INITIALIZATION, INTERRUPT, AND RESET PINS (CONTINUED)
MULTIPROCESSING AND GENERAL-PURPOSE PINS
MEMORY CONTROL PINS
R/W
O/Z
Read/write signal. R/W indicates transfer direction during communication to an external device. Normally in
read mode (high), unless asserted low when the DSP performs a write operation. Placed in high-impedance
state in hold mode. R/W also goes into the high-impedance state when OFF is low.
IOSTRB
O/Z
I/O strobe signal. IOSTRB is always high unless low level asserted to indicate an external bus access to an
I/O device. Placed in high-impedance state in hold mode. IOSTRB also goes into the high-impedance state
when OFF is low.
HOLD
†
Data ready input. READY indicates that an external device is prepared for a bus transaction to be
completed. If the device is not ready (READY is low), the processor waits one cycle and checks READY
again. Note that the processor performs ready detection if at least two software wait states are
programmed. The READY signal is not sampled until the completion of the software wait states.
I
Hold input. HOLD is asserted to request control of the address, data, and control lines. When
acknowledged by the C54x, these lines go into high-impedance state.
HOLDA
O/Z
Hold acknowledge signal. HOLDA indicates that the DSP is in a hold state and that the address, data, and
control lines are in a high-impedance state, allowing the external memory interface to be accessed by other
devices. HOLDA also goes into the high-impedance state when is OFF low.
MSC
O/Z
Microstate complete. MSC indicates completion of all software wait states. When two or more software wait
states are enabled, the MSC pin goes active at the beginning of the first software wait state, and goes
inactive (high) at the beginning of the last software wait state. If connected to the ready input, MSC forces
one external wait state after the last internal wait state is completed. MSC also goes into the high
impedance state when OFF is low.
IAQ
O/Z
Instruction acquisition signal. IAQ is asserted (active low) when there is an instruction address on the
address bus and goes into the high-impedance state when OFF is low.
I = Input, O = Output, Z = High-impedance, S = Supply
POST OFFICE BOX 1443
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7
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 Terminal Functions (Continued)
TERMINAL
NAME
I/O†
DESCRIPTION
CLKOUT
O/Z
Master clock output signal. CLKOUT cycles at the machine-cycle rate of the CPU. The internal machine
cycle is bounded by the rising edges of this signal. CLKOUT also goes into the high-impedance state when
OFF is low.
CLKMD1
CLKMD2
CLKMD3
I
Clock mode external/internal input signals. CLKMD1−CLKMD3 allows you to select and configure different
clock modes such as crystal, external clock, various PLL factors.
X2/CLKIN
I
Input pin to internal oscillator from the crystal. If the internal oscillator is not being used, an external clock
source can be applied to this pin. The internal machine cycle time is determined by the clock operating
mode pins (CLKMD1, CLKMD2 and CLKMD3).
X1
O
Output pin from the internal oscillator for the crystal. If the internal oscillator is not used, X1 should be left
unconnected. X1 does not go into the high-impedance state when OFF is low.
TOUT
O
Timer output. TOUT signals a pulse when the on-chip timer counts down past zero. The pulse is a CLKOUT
cycle wide. TOUT also goes into the high-impedance state when OFF is low.
TOUT1
I/O/Z
Timer1 output. TOUT1 signals a pulse when the on-chip timer1 counts down past zero. The pulse is a
CLKOUT cycle wide. The TOUT1 output is multiplexed with the HINT pin of the HPI, and TOUT1 is only
available when the HPI is disabled.
BCLKR0
BCLKR1
I/O/Z
Receive clock input. CLKR serves as the serial shift clock for the buffered serial port receiver. BCLKRX2 is
McBSP2 transmit AND receive clock. This pin is optionally bondable as C1A (see DAA section).
OSCILLATOR/TIMER PINS
MULTICHANNEL BUFFERED SERIAL PORT PINS
BDR0
BDR1
I
Serial data receive input.
BFSR0
BFSR1
BFSRX2
I/O/Z
Frame synchronization pulse for receive input. The FSR pulse initiates the receive data process over DR.
BCLKX0
BCLKX1
I/O/Z
Transmit clock. CLKX serves as the serial shift clock for the buffered serial port transmitter. The CLKX pins
are configured as inputs after reset. CLKX goes into the high-impedance state when OFF is low.
BDX0
BDX1
O/Z
Serial data transmit output. DX is placed in the high-impedance state when not transmitting, when RS is
asserted or when OFF is low.
BFSX0
BFSX1
I/O/Z
Frame synchronization pulse for transmit output. The FSX pulse initiates the transmit data process over
DX. The FSX pins are configured as inputs after reset. FSX goes into the high-impedance state when OFF
is low.
BFSRX2 is McBSP2 transit AND receive frame sync
INTEGRATED DAA
C1A
I/O
DAA I/O connection.
C1A5V
S
Dedicated 5.0-V power supply for I/O pin C1A.
DAAEN
I
DAA Enable Input. Enables the DAA when low.
TX
O
UART asynchronous serial transmit data output.
RX
I
UART asynchronous serial receive data input.
UART
†
8
I = Input, O = Output, Z = High-impedance, S = Supply
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 Terminal Functions (Continued)
TERMINAL
NAME
I/O†
DESCRIPTION
HOST PORT INTERFACE PINS
A0−A15
I
D0−D15
I/O
These pins can be used to address internal memory via the HPI when the HPI16 pin is HIGH.
These pins can be used to read/write internal memory via the HPI when the HPI16 pin is high. The sixteen
data pins, D0 to D15, are multiplexed to transfer data between the core CPU and external data/program
memory, I/O devices, or HPI in 16-bit mode. The data bus is placed in the high-impedance state when not
outputting or when RS or HOLD is asserted. The data bus also goes into the high-impedance state when
OFF is low.
The data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins.
The bus holders also eliminate the need for external bias resistors on unused pins. When the data bus is
not being driven by the DSP, the bus holders keep the pins at the logic level that was most recently driven.
The data bus holders of the DSP are disabled at reset, and can be enabled/disabled via the BH bit of the
BSCR.
HD0−HD7
†
I/O/Z
Parallel bidirectional data bus. These pins can also be used as general-purpose I/O pins when the HPI16 pin
is high. HD0−HD7 is placed in the high-impedance state when not outputting data or when OFF is low. The
HPI data bus includes bus holders to reduce the static power dissipation caused by floating, unused pins.
When the HPI data bus is not being driven by the DSP, the bus holders keep the pins at the logic level that
was most recently driven. The HPI data bus holders are disabled at reset, and can be enabled/disabled via
the HBH bit of the BSCR.
HCNTL0
HCNTL1
I
Control inputs. These inputs select a host access to one of the three HPI registers. (Pullup only enabled when
HPIENA=0, HPI16=1)
HBIL
I
Byte identification input. Identifies first or second byte of transfer. (Pullup only enabled when HPIENA=0,
invalid when HPI16=1)
HCS
I
Chip select input. This pin is the select input for the HPI, and must be driven low during accesses. (Pullup
only enabled when HPIENA=0, or HPI16=1)
HDS1
HDS2
I
Data strobe inputs. These pins are driven by the host read and write strobes to control transfers. (Pullup
only enabled when HPIENA=0)
HAS
I
Address strobe input. Address strobe input. Hosts with multiplexed address and data pins require this input,
to latch the address in the HPIA register. (Pullup only enabled when HPIENA=0)
HR/W
I
Read/write input. This input controls the direction of an HPI transfer. (Pullup only enabled when HPIENA=0)
HRDY
O/Z
Ready output. The ready output informs the host when the HPI is ready for the next transfer. HRDY goes into
the high-impedance state when OFF is low.
HINT
O/Z
Interrupt output. This output is used to interrupt the host. When the DSP is in reset, this signal is driven
high. HINT can also be used for timer 1 output (TOUT1), when the HPI is disabled. The signal goes into the
high-impedance state when OFF is low. (invalid when HPI16=1)
HPIENA
I
HPI enable input. This pin must be driven high during reset to enable the HPI. An internal pulldown resistor
is always active and the HPIENA pin is sampled on the rising edge of RS. If HPIENA is left open or driven low
during reset, the HPI module is disabled. Once the HPI is disabled, the HPIENA pin has no effect until the DSP
is reset.
HPI16
I
HPI 16-bit Select Pin. HPI16=1 selects the non-multiplexed mode. The non-multiplexed mode allows hosts
with separate address/data buses to access the HPI address range via the 16 address pins A0–A15. 16-bit
Data is also accessible through pins D0–D15. HOST-to-DSP and DSP-to-HOST interrupts are not supported.
There are no HPIC and HPIA registers in the non-multiplexed mode since there are HCNTRL0,1 signals
available. Internally pulled low.
I = Input, O = Output, Z = High-impedance, S = Supply
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 Terminal Functions (Continued)
TERMINAL
NAME
I/O†
DESCRIPTION
SUPPLY PINS
†
CVDD
S
+VDD. Dedicated 1.5-V power supply for the core CPU.
DVDD
S
+VDD. Dedicated 3.3-V power supply for I/O pins.
VSS
S
Ground.
TCK
I
IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The
changes on test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction
register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur
on the falling edge of TCK.
TDI
I
IEEE standard 1149.1 test data input, pin with internal pullup device. TDI is clocked into the selected register
(instruction or data) on a rising edge of TCK.
TDO
O/Z
IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted
out of TDO on the falling edge of TCK. TDO is in the high-impedance state except when scanning of data is
in progress. TDO also goes into the high-impedance state when OFF is low.
TMS
I
IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial control input is clocked into
the test access port (TAP) controller on the rising edge of TCK.
TRST
I
IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1 scan system control of
the operations of the device. If TRST is not connected or driven low, the device operates in its functional
mode, and the IEEE standard 1149.1 signals are ignored. Pin with internal pulldown device.
EMU0
I/O/Z
Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF condition. When TRST
is driven high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by
way of IEEE standard 1149.1 scan system.
EMU1/OFF
I/O/Z
Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as an interrupt to or from
the emulator system and is defined as input/output via IEEE standard 1149.1 scan system. When TRST is
driven low, EMU1/OFF is configured as OFF. The EMU1/OFF signal, when active low, puts all output
drivers into the high-impedance state. Note that OFF is used exclusively for testing and emulation purposes
(not for multiprocessing applications). Thus, for the OFF feature, the following conditions apply: TRST=low,
EMU0=high, EMU1/OFF = low
I = Input, O = Output, Z = High-impedance, S = Supply
10
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
pin descriptions: Si3016
QE2
DCT
IGND
C1B
RNG1
RNG2
QB
QE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
FILT2
FILT
RX
REXT
REXT2
REF
VREG2
VREG
Table 1. Si3016 Pin Descriptions
PIN #
PIN NAME
DESCRIPTION
1
QE2
TRANSISTOR EMITTER 2.
Connects to the emitter of Q4.
2
DCT
DC TERMINATION.
Provides DC termination to the telephone network.
3
IGND
ISOLATED GROUND.
Connects to ground on the line-side interface. Also connects to capacitor C2.
4
C1B
ISOLATION CAPACITOR 1B.
Connects to one side of isolation capacitor C1. Used to communicate with the system-side module.
5
RNG1
RING 1.
Connects through a capacitor to the TIP lead of the telephone line. Provides the ring and caller ID
signals to the Si3016.
6
RNG2
RING 2.
Connects through a capacitor to the RING lead of the telephone line. Provides the ring and caller ID
signals to the Si3016.
7
QB
TRANSISTOR BASE.
Connects to the base of transistor Q3. Used to go on/off-hook.
8
QE
TRANSISTOR EMITTER.
Connects to the emitter of transistor Q3. Used to go on/off-hook.
9
VREG
Voltage Regulator.
Connects to an external capacitor to provide bypassing for an internal power supply.
10
VREG2
Voltage Regulator 2.
Connects to an external capacitor to provide bypassing for an internal power supply.
11
REF
12
REXT2
EXTERNAL RESISTOR 2.
Sets the complex AC termination impedance.
13
REXT
EXTERNAL RESISTOR.
Sets the real AC termination impedance.
14
RX
15
FILT
FILTER.
Provides filtering for the DC termination circuits.
16
FILT2
FILTER 2.
Provides filtering for the bias circuits.
REFERENCE.
Connects to an external resistor to provide a high accuracy reference current.
RECEIVE INPUT.
Serves as the receive side input from the telephone network.
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
functional description
TMS320C54V90 DSP and memory
The DSP is a 16-bit processor operating at up to 117 MIPS. It has 40K x 16 RAM and 128K x 16 program ROM
on-chip. This provides complete “controller-based” modem functionality with no external memory.
The DSP firmware implements all the modem signal processing, V.42 error correction, V.42bis compression,
AT command parser, and modem controller functions.
block diagram
Host Serial Transmit Data
Host Serial Receive Data
HD0−HD7
HCNTL0
HCNTL1
HBIL
TMS320C54V90
DSP and
Memory
HCS
HDS1
HDS2
Si3016
Silicon
DAA
HAS
HR/W
TIP
RING
HRDY
HINT
PAR/SER (HPIENA)
RS
Figure 1. TMS320C54V90 Modem Block Diagram
Si3016 silicon DAA
The DAA block provides all the functions associated with the telephone line interface and the analog front end,
including:
D
D
D
D
D
D
12
D
D
D
D
D
On-hook/off-hook control
DC termination
AC termination
Ring detect
Dielectric isolation
Surge protection
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Loop current monitor
2-wire/4-wire hybrid
Receive and Transmit filters
D/A and A/D converters
On-hook loop voltage sensing (optional)
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Si3016 silicon DAA (continued)
Certain characteristics of the DAA, such as DC and AC termination, are programmable to meet the requirements
of different countries/administrations. Normally, these details are invisible to the user, and the proper
characteristics are selected using an AT command and a country code.
Likewise, call origination, dialing, automatic answering, etc. are controlled by AT commands, and the
TMS320C54V90 firmware controls the details of DAA functions.
The interface between the DSP and the DAA carries both Transmit and Receive line signals as digitized
samples, as well as control information for the DAA.
mode selection
The CLKMD inputs select various initial conditions for the clocking system and PLLs at power-up. The
TMS320C54V90 also uses these inputs to select various operating modes. Use of any of the “reserved”
combinations may prevent proper operation of the modem (for example, by disabling the crystal oscillator).
Table 2. Mode Selection with CLKMD pins
MODE
CLKMD1
CLKMD2
CLKMD3
CONFIGURATION
UART MODE
0
0
0
0
reserved
−
1
0
0
1
reserved
−
2
0
1
0
Normal Mode, 58 MIPS
115.2 Kbps
3
0
1
1
reserved
−
4
1
0
0
reserved
−
5
1
0
1
Normal mode, 117 MIPS
Autobaud
6
1
1
0
reserved
−
7
1
1
1
Normal mode, 58 MIPS
Autobaud
clock considerations
The modem reference design includes a crystal from which clocks are derived for the DSP and the DAA. In the
standard configuration, the oscillator frequency (or optionally the CLKIN input frequency) is 14.7456 MHz ±
50 ppm. The DSP’s internal PLL multiplies this either by four or by eight (depending on the CLKMD input
selection) yielding either 58.9824 MHz or 117.9648 MHz clocking internal to the DSP. The DSP’s external clock
output, CLKOUT, is preset to one quarter of the internal DSP clock, and therefore will either be 14.7456 MHz
or 29.4912 MHz depending on which internal clock frequency is selected.
power requirements
The TMS320C54V90 requires 3.3V for the DSP I/Os and the DAA, 1.5 V for the DSP core, and 5 V for the
capacitively-coupled interface between the DSP and DAA. The method of deriving these different voltages will
depend on what power is available in the host system, cost, and efficiency considerations.
The reference design assumes that an active low power-on reset signal at 3.3-V logic levels is available from
the host system.
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
serial and parallel interface modes
The TMS320C54V90 modem can interface with the host system either serially, via an RS-232 connection, or
in parallel, via the HPI.
The selection between these two types of interfaces is made using the PAR/SER (HPIENA) input pin.
For either interface, the same set of pins are used, but with different functionality.
Table 3 shows the functionality of the modem host interface pins in both the serial and parallel interface modes.
Details of the operation of both these types of host interface are presented in the following sections of this
document.
Table 3. I/O Definition for Serial and Parallel Modes
†
SIGNAL NAME
FUNCTION IN PARALLEL MODE
(HPIENA=3.3 V)
FUNCTION IN SERIAL MODE
(HPIENA=0 V)
UARTRX
Not Used
TXD (Serial Transmit Data)
UARTTX
Not Used
RXD (Serial Receive Data)
HD0
Host Port Data Bus bit 0
DTR (Data Terminal Ready)
HD1
Host Port Data Bus bit 1
RTS (Request to Send)
HD2
Host Port Data Bus bit 2
CTS (Clear to Send)
HD3
Host Port Data Bus bit 3
DSR (Data Set Ready)
HD4
Host Port Data Bus bit 4
DCD (Data Carrier Detect)
HD5
Host Port Data Bus bit 5
RI (Ring Indication)
HD6
Host Port Data Bus bit 6
MUTE† (Speaker Mute)
HD7
Host Port Data Bus bit 7
OH (Off-Hook)
HCNTL0
Host Port Control 0
Not Used
HCNTL1
Host Port Control 1
Not Used
HBIL
Byte Order Identifier
Not Used
HCS
Chip Select
Not Used
HDS1
Data Strobe 1
Not Used
HDS2
Data Strobe 2
Not Used
HAS
Address Strobe
Not Used
HR/W
Read/Write
Not Used
HRDY
Host Port Ready
Not Used
HINT
Host Port Interrupt
Not Used
Functional, but included for expansion only since speaker interface not provided.
serial interface
If the PAR/SER input is held low when RS is released, the modem will operate with a serial interface instead
of a parallel interface. The HD0-7 pins become general purpose I/O pins and are used for EIA-232 control
signals as shown in Table 3. The serial data is carried on SERIAL TRANSMIT DATA and SERIAL RECEIVE
DATA. These signals are at 3.3V logic levels, and the polarity is correct for inverting EIA-232 drivers and
receivers.
14
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
serial interface (continued)
The serial interfaced is implemented with an on-chip UART. By default at power-up, the serial interface is
ilitialized to automatically detect and configure itself to the data rate used by the host (autobaud). Data rates
from 300 bits per second to 230400 bits per second are supported. The character format is 10 bit, i.e., 1 start,
8 data, and 1 stop bit. Both RTS/CTS and XON/XOFF flow control are supported.
host port interface (HPI)
The host port interface (HPI) is an 8-bit parallel port used to interface a host processor to the DSP. Information
is exchanged between the DSP and the host processor through a 2K-word block of on-chip memory that is
accessible by both the host and the DSP. The DSP has access to the HPI control register (HPIC) and the host
can address the HPI memory through the HPI address register (HPIA).
Both the host and the DSP have access to the on-chip RAM at all times and host accesses are always
synchronized to the DSP clock. If the host and the DSP contend for access to the same location, the host has
priority, and the DSP waits for one HPI cycle.
HPI
Control
Register
8
HD(0-7)
8
16
16
DSP Data
MUX
16
DSP Address
MUX
Address Register
Data
Interface
Control
Signals
Address
HPI Memory Block
HPI
Control
Logic
Figure 2. Host Processor Interface Block Diagram
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
host port interface (HPI) (continued)
The HPI interface consists of an 8-bit bidirectional data bus and various control signals. Data transfers of 16-bit
words occur as two consecutive bytes with a dedicated pin (HBIL) indicating whether the high or low byte is being
transmitted. Two control pins, HCNTL1 and HCNTL0, control host access to the HPIA, HPI data (with an optional
automatic address increment), or the HPIC. The host can interrupt the DSP device by writing to HPIC. The DSP
device can interrupt the host with a dedicated HINT pin that the host can acknowledge and clear.
The HPI control logic has two data strobes, HDS1 and HDS2, a read/write strobe HR/W, and an address strobe
HAS, to enable a glueless interface to a variety of industry-standard host devices. The HPI is interfaced easily
to hosts with multiplexed address/data bus, separate address and data buses, one data strobe and a read/write
strobe, or two separate strobes for read and write. The HPI supports high-speed back-to-back accesses.
The HPI can handle one byte every five DSP device periods-that is, 64 Mbps with a 40-MIPS DSP, or 160 Mbps
with a 100-MIPS DSP. The HPI is designed so that the host can take advantage of this high bandwidth and run
at frequencies up to (f * n)/5, where n is the number of host cycles for an external access and f is the DSP device
frequency.
basic host port interface functional description
The external HPI consists of the 8-bit HPI data bus and control signals that configure and control the interface.
The interface can connect to a variety of host devices with little or no additional logic. Figure 3 shows a simplified
diagram of a connection between the HPI and a host device. The 8-bit data bus (HD0-HD7) exchanges
information with the host. Because of the 16-bit word structure of the DSP, all transfers with a host must consist
of two consecutive bytes. The dedicated HBIL pin indicates whether the first or second byte is being transferred.
An internal control register bit determines whether the first or second byte is placed into the most significant byte
of a 16-bit word. The host must not break the first byte/second byte (HBIL low/high) sequence of an ongoing
HPI access. If this sequence is broken, data can be lost, and unpredictable operation can result.
The two control inputs (HCNTL0 and HCNTL1) indicate which internal HPI register is being accessed and the
type of access to the register. These inputs, along with HBIL, are commonly driven by host address bus bits or
a function of these bits. Using the HCNTL0/1 inputs, the host can specify an access to the HPI control (HPIC)
register, the HPI address (HPIA) register (which serves as the pointer into HPI memory), or HPI data (HPID)
register. The HPID register can also be accessed with an optional automatic address increment.
The autoincrement feature provides a convenient way of reading or writing to subsequent word locations. In
autoincrement mode, a data read causes a postincrement of the HPIA, and a data write causes a preincrement
of the HPIA. By writing to the HPIC, the host can interrupt the DSP CPU, and the HINT output can be used by
the DSP to interrupt the host. The host can also acknowledge and clear HINT by writing to the HPIC.
16
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
basic host port interface functional description (continued)
Data
HD0−HD7
HCNTL0/1 (Address)
Address
HBIL (1st/2nd Byte)
Read/Write
HR/W
Data strobe
HDS1
HDS2
HCS
Sampled by
Internal Strobe
or HAS
Internal Strobe
(Controls Transfer)
HAS
Address Latch Enable
(if used)
HRDY
Ready
HINT
Interrupt In
Figure 3. Generic System Block Diagram
Table 4 summarizes the three registers that the HPI utilizes for communication between the host device and
the DSP CPU and their functions.
Table 4. HPI Registers Description
NAME
DESCRIPTION
HPIA
Directly accessible only by the host. Contains the address in the HPI memory at which the current access occurs.
HPIC
HPI control register. Directly accessible by either the host or by the DSP. Contains control and status bits for HPI
operations.
HPID
HPI data register. Directly accessible only by the host. Contains the data that was read from the HPI memory if the
current access is a read, or the data that will be written to HPI memory if the current access is a write.
The HPI ready pin (HRDY) allows insertion of wait states for hosts that support a ready input to allow deferred
completion of access cycles and have faster cycle times than the HPI can accept due to DSP operating clock
rates. If HRDY, when used directly from the DSP, does not meet host timing requirements, the signal can be
resynchronized using external logic if necessary. HRDY is useful when the DSP operating frequency is variable,
or when the host is capable of accessing at a faster rate than the maximum shared-access mode access rate.
In both cases, the HRDY pin provides a convenient way to automatically (no software handshake needed)
adjust the host access rate to a faster DSP clock rate.
All of these features combined allow the HPI to provide a flexible and efficient interface to a wide variety of
industry-standard host devices. Also, the simplicity of the HPI interface greatly simplifies data transfers both
from the host and the DSP sides of the interface. Once the interface is configured, data transfers are made with
a minimum of overhead at a maximum speed.
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
details of host port interface operation
This subsection includes a detailed description of each HPI external interface pin function, as well as
descriptions of the register and control bit functions. Logical interface timings and initialization and read/write
sequences are discussed in the Host Read/Write Access to HPI section.
The external HPI interface signals implement a flexible interface to a variety of types of host devices. Devices
with single or multiple data strobes and with or without address latch enable (ALE) signals can easily be
connected to the HPI.
HPI signal names and functions
Table 5 describes the function HPI external interface pins in detail.
Table 5. HPI Signal Names and Functions
†
18
HPI PIN
HOST PIN
STATE†
SIGNAL FUNCTION
HAS
Address latch enable
(ALE) or Address strobe
or unused (tied high)
I
Address strobe input. Hosts with a multiplexed address and data bus
connect HAS to their ALE pin or equivalent. HBIL, HCNTL0/1, and
HR/W are then latched on HAS falling edge. When used, HAS must
precede the later of HCS, HDS1, or HDS2 (see detailed HPI timing
specifications on page 80). Hosts with separate address and data bus
can connect HAS to a logic-1 level. In this case, HBIL, HCNTL0/1, and
HR/W are latched by the later of HDS1, HDS2, or HCS falling edge
while HAS stays inactive (high).
HBIL
Address or control lines
I
Byte identification input. Identifies first or second byte of transfer (but
not most significant or least significant - this is specified by the BOB bit
in the HPIC register, described later in this section). HBIL is low for the
first byte and high for the second byte.
HCNTL0
HCNTL1
Address or control lines
I
Host control inputs. Selects a host access to the HPIA register, the HPI
data latches (with optional address increment), or the HPIC register.
HCS
Address or control lines
I
Chip select. Serves as the enable input for the HPI and must be low
during an access but may stay low between accesses. HCS normally
precedes HDS1 and HDS2, but this signal also samples HCNTL0/1,
HR/W, and HBIL if HAS is not used and HDS1 or HDS2 are already low
(this is explained in further detail later in this subsection). Figure 4
shows the equivalent circuit of the HCS, HDS1 and HDS2 inputs.
HD0-HD7
Data bus
I/O/Z
HDS1
HDS2
Read strobe and
write strobe or
data strobe
I
HINT
Host interrupt input
O/Z
Parallel bidirectional 3-state data bus. HD7 (MSB) through HD0 (LSB)
are placed in the high-impedance state when not outputting
(HDS | HCS = 1).
Data strobe inputs. Control transfer of data during host access cycles.
Also, when HAS is not used, used to sample HBIL, HCNTL0/1, and
HR/W when HCS is already low (which is the case in normal operation).
Hosts with separate read and write strobes connect those strobes to
either HDS1 or HDS2. Hosts with a single data strobe connect it to
either HDS1 or HDS2, connecting the unused pin high. Regardless of
HDS connections, HR/W is still required to determine direction of
transfer. Because HDS1 and HDS2 are internally exclusive-NORed,
hosts with a high true data strobe can connect this to one of the HDS
inputs with the other HDS input connected low. Figure 4 shows the
equivalent circuit of the HDS1, HDS2, and HCS inputs.
Host interrupt output. Controlled by the HINT bit in the HPIC. Driven
high when the DSP is being reset.
I = Input, O = Output, Z = High Impedance
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HPI signal names and functions (continued)
Table 5. HPI Signal Names and Functions (Continued)
†
HPI PIN
HOST PIN
STATE†
SIGNAL FUNCTION
HRDY
Asynchronous ready
O/Z
HPI ready output. When high, indicates that the HPI is ready for a
transfer to be performed. When low, indicates that the HPI is busy
completing the internal portion of the previous transaction. HCS enables
HRDY; that is, HRDY is always high when HCS is high.
HR/W
Read/Write strobe,
address line, or
multiplexed address/data
I
Read/write input. Hosts must drive HR/W high to read HPI and low to
write HPI. Hosts without a read/write strobe can use an address line for
this function.
I = Input, O = Output, Z = High Impedance
The HCS input serves primarily as the enable input for the HPI, and the HDS1 and HDS2 signals control the
HPI data transfer; however, the logic with which these inputs are implemented allows their functions to be
interchanged if desired. If HCS is used in place of HDS1 and HDS2 to control HPI access cycles, HRDY
operation is affected (since HCS enables HRDY and HRDY is always high when HCS is high). The equivalent
circuit for these inputs is shown in Figure 4. The figure shows that the internal strobe signal that samples the
HCNTL0/1, HBIL, and HR/W inputs (when HAS is not used) is derived from all three of the input signals, as the
logic illustrates. Therefore, the latest of HDS1, HDS2, or HCS is the one which actually controls sampling of the
HCNTL0/1, HBIL, and HR/W inputs. Because HDS1 and HDS2 are exclusive-NORed, both these inputs being
low does not constitute an enabled condition.
HDS1
HDS2
Internal Strobe
HCS
Figure 4. Select Input Logic
When using the HAS input to sample HCNTL0/1, HBIL, and HR/W, this allows these signals to be removed
earlier in an access cycle, therefore allowing more time to switch bus states from address to data information,
facilitating interface to multiplexed address and data type buses. In this type of system, an ALE signal is often
provided and would normally be the signal connected to HAS.
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HPI signal names and functions (continued)
The two control pins (HCNTL0 and HCNTL1) indicate which internal HPI register is being accessed and the type
of access to the register. The states of these two pins select access to the HPI address (HPIA), HPI data (HPID),
or HPI control (HPIC) registers. The HPIA register serves as the pointer into HPI memory, the HPIC contains
control and status bits for the transfers, and the HPID contains the actual data transferred. Additionally, the HPID
register can be accessed with an optional automatic address increment. Table 6 describes the HCNTL0/1 bit
functions.
On the DSP, HPI memory is a 2K 16-bit word block of dual-access RAM. From the host interface, the 2K-word
block of HPI memory can conveniently be accessed at addresses 0 through 7FFh; however, the memory can
also be accessed by the host starting with any HPIA values with the 11 LSBs equal to 0. For example, the first
word of the HPI memory block can be accessed by the host with any of the following HPIA values: 0000h,
0800h,1000h,1800h, ... F800h.
Table 6. HPI Input Control Signals Function Selection Descriptions
HCNTL1
HCNTL0
0
0
Host can read or write the HPI control register, HPIC.
0
1
Host can read or write the HPI data latches. HPIA is automatically postincremented each time
a read is performed and preincremented each time a write is performed.
1
0
Host can read or write the address register, HPIA. This register points to the HPI memory.
1
1
Host can read or write the HPI data latches. HPIA is not affected.
The HPI autoincrement feature provides a convenient way of accessing consecutive word locations in HPI
memory. In the autoincrement mode, a data read causes a postincrement of the HPIA, and a data write causes
a preincrement of the HPIA. Therefore, if a write is to be made to the first word of HPI memory with the increment
option, due to the preincrement nature of the write operation, the HPIA should first be loaded with any of the
following values: 07FFh, 0FFFh, 17FFh, ... FFFFh. The HPIA is a 16-bit register and all 16 bits can be written
to or read from, although with a 2K-word HPI memory implementation, only the 11 LSBs of the HPIA are required
to address the HPI memory. The HPIA increment and decrement affect all 16 bits of this register.
HPI control register bits and function
Four bits control HPI operation. These bits are BOB (which selects first or second byte as most significant),
SMOD (which selects host or shared-access mode), and DSPINT and HINT (which can be used to generate
DSP and host interrupts, respectively) and are located in the HPI control register (HPIC). A detailed description
of the HPIC bit functions is presented in Table 7.
Because the host interface always performs transfers with 8-bit bytes and the control register is normally the
first register accessed to set configuration bits and initialize the interface, the HPIC is organized on the host side
as a 16-bit register with the same high and low byte contents (although access to certain bits is limited, as
described previously) and with the upper bits unused on the DSP side. The control/status bits are located in the
least significant four bits. The host accesses the HPIC register with the appropriate selection of HCNTL0/1, as
described previously, and two consecutive byte accesses to the 8-bit HPI data bus. When the host writes to
HPIC, both the first and second byte written must be the same value.
The layout of the HPIC bits is shown in Figure 5 through Figure 8. In the tables for read operations, if 0 is
specified, this value is always read; if X is specified, an unknown value is read. For write operations, if X is
specified, any value can be written. On a host write, both bytes must be identical. Note that bits 4−7 and 12−15
on the host side and bits 4−15 on the DSP side are reserved for future expansion.
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HPI control register bits and function (continued)
Table 7. HPI Control Register (HPIC) Bit Descriptions
BIT
HOST ACCESS
DSP ACCESS
DESCRIPTION
BOB
Read/Write
--
If BOB = 1, first byte is least significant. If BOB = 0, first byte is most
significant. BOB affects both data and address transfers. Only the host can
modify this bit and it is not visible to the DSP. BOB must be initialized before
the first data or address register access.
SMOD
Read
Read/Write
DSPINT
Write
--
The host processor-to-DSP interrupt. This bit can be written only by the host
and is not readable by the host or the DSP. When the host writes a 1 to this
bit, an interrupt is generated to the DSP. Writing a 0 to this bit has no effect.
Always read as 0. When the host writes to HPIC, both bytes must write the
same value.
HINT
Read/Write
Read/Write
This bit determines the state of the DSP HINT output, which can be used to
generate an interrupt to the host. HINT = 0 upon reset, which causes the
external HINT output to be inactive (high). The HINT bit can be set only by
the DSP and can be cleared only by the host. The DSP writes a 1 to HINT,
causing the HINT pin to go low. The HINT bit is read by the host or the DSP
as a 0 when the external HINT pin is inactive (high) and as a 1 when the
HINT pin is active (low). For the host to clear the interrupt, however, it must
write a 1 to HINT. Writing a 0 to the HINT bit by either the host or the DSP
has no effect.
If SMOD = 1, shared-access mode (SAM) is enabled: the HPI memory can
be accessed by the DSP. (This is the only mode used in the TM-100
application. SMOD = 0 during reset; SMOD = 1 after reset. SMOD can be
modified only by the DSP but can be read by both the DSP and the host.
15–12
11
10
9
8
7–4
3
2
1
0
X
HINT
0
SMOD
BOB
X
HINT
0
SMOD
BOB
LEGEND: X = Unknown value is read.
Figure 5. HPIC Diagram - Host Reads from HPIC
15–12
11
10
9
8
7–4
3
2
1
0
X
HINT
DSPINT
X
BOB
X
HINT
DSPINT
X
BOB
LEGEND: X = Any value can be written.
Figure 6. HPIC Diagram - Host Writes to HPIC
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HPI control register bits and function (continued)
15–4
3
2
1
0
X
HINT
0
SMOD
0
LEGEND: X = Unknown value is read.
Figure 7. HPIC Diagram - DSP Reads from HPIC
15–4
3
2
1
0
X
HINT
X
SMOD
X
LEGEND: X = Any value can be written.
Figure 8. HPIC Diagram - DSP Writes to HPIC
Because the DSP can write to the SMOD and HINT bits, and these bits are read twice on the host interface side,
the first and second byte reads by the host may yield different data if the DSP changes the state of one or both
of these bits in between the two read operations. The characteristics of host and DSP HPIC read/write cycles
are summarized in Table 8.
Table 8. DSP HPIC Read/Write Cycles
DEVICE
READ
WRITE
Host
2 bytes
2 bytes (Both bytes must be equal)
DSP
16 bits
16 bits
host read/write access to HPI
The host begins HPI accesses by performing the external interface portion of the cycle; that is, initializing first
the HPIC register, then the HPIA register, and then writing data to or reading data from the HPID register. Writing
to HPIA or HPID initiates an internal cycle that transfers the desired data between the HPID and the dedicated
internal HPI memory. Because this process requires several DSP cycles, each time an HPI access is made,
data written to the HPID is not written to the HPI memory until after the host access cycle, and the data read
from the HPID is the data from the previous cycle. Therefore, when reading, the data obtained is the data from
the location specified in the previous access, and the current access serves as the initiation of the next cycle.
A similar sequence occurs for a write operation: the data written to HPID is not written to HPI memory until after
the external cycle is completed. If an HPID read operation immediately follows an HPID write operation, the
same data (the data written) is read.
The autoincrement feature available for HPIA results in sequential accesses to HPI memory by the host being
extremely efficient. During random (nonsequential) transfers or sequential accesses with a significant amount
of time between them, it is possible that the DSP may have changed the contents of the location being accessed
between a host read and the previous host data read/write or HPIA write access, because of the prefetch nature
of internal HPI operation. If this occurs, data different from the current memory contents may be read. Therefore,
in cases where this is of concern in a system, two reads from the same address or an address write prior to the
read access can be made to ensure that the most recent data is read.
When the host performs an external access to the HPI, there are two distinctly different types of cycles that can
occur: those for which wait states are generated (the HRDY signal is active) and those without wait states.
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host read/write access to HPI (continued)
For accesses utilizing the HRDY signal, during the time when the internal portion of the transfer is being
performed (either for a read or a write), HRDY is low, indicating that another transfer cannot yet be initiated. Once
the internal cycle is completed and another external cycle can begin, HRDY is driven high by the HPI. This
occurs after a fixed delay following a cycle initiation (refer to the DSP data sheet for detailed timing information
for HPI external interface timings). Therefore, unless back-to-back cycles are being performed, HRDY is
normally high when the first byte of a cycle is transferred. The external HPI cycle using HRDY is shown in the
timing diagram in Figure 9.
In a typical external access, as shown in Figure 9, the cycle begins with the host driving HCNTL0/1, HR/W, HBIL,
and HCS, indicating specifically what type of transfer is to occur and whether the cycle is to be read or a write.
Then the host asserts the HAS signal (if used) followed by one of the data strobe signals. If HRDY is not already
high, it goes high when the previous internal cycle is complete, allowing data to be transferred, and the control
signals are deasserted. Following the external HPI cycle, HRDY goes low and stays low for a period of
approximately five CLKOUT cycles (refer to the DSP data sheet for HPI timing information) while the DSP
completes the internal HPI memory access, and then HRDY is driven high again. Note, however, HRDY is
always high when HCS is high.
As mentioned previously, SAM accesses generally utilize the HRDY signal. The exception to the HRDY-based
interface timings when in SAM occurs when reading HPIC or HPIA or writing to HPIC (except when writing 1
to either DSPINT or HINT). In these cases, HRDY stays high; for all other SAM accesses, HRDY is active.
Byte 1
HCNTL0/1
HR/W
Byte 2
Valid
Valid
HBIL
HCS
HAS
(if used)
HDS1,
HDS2
HD
Read
HD
Write
HRDY
ÁÁ
ÁÁ Á
Á
Á
Á
Á
Á
Valid
Valid
Á
Á ÁÁ
ÁÁ
Valid
Á
Á
Á
Á
Valid
Figure 9. HPI Timing Diagram
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host read/write access to HPI (continued)
Table 9. Wait-State Generation Conditions
WAIT STATE GENERATED
REGISTER
READS
WRITES
HPIC
No
1 to DSPINT/HINT - Yes
All other cycles - No
HPIA
No
Yes
HPID
Yes
Yes
example access sequences
A complete host access cycle always involves two bytes, the first with HBIL low, and the second with HBIL high.
This 2-byte sequence must be followed regardless of the type of host access (HPIA, HPIC, or data access) and
the host must not break the first byte/second byte (HBIL low/high) sequence of an ongoing HPI access. If this
sequence is broken, data may be lost, and unpredictable operation may result.
Before accessing data, the host must first initialize HPIC, in particular the BOB bit, and then HPIA (in this order,
because BOB affects the HPIA access). After initializing BOB, the host can then write to HPIA with the correct
byte alignment. On an HPI memory read operation, after completion of the HPIA write, the HPI memory is read
and the contents at the given address are transferred to the two 8-bit data latches, the first byte data latch and
the second byte data latch. Table 10 illustrates the sequence involved in initializing BOB and HPIA for an HPI
memory read. In this example, BOB is set to 0 and a read is requested of the first HPI memory location (in this
case 1000h), which contains FFFEh.
Table 10. Initialization of BOB and FPIA
EVENT
HD
HR/W
HCNTL1/0
HBIL
HPIC
HPIA
LATCH1
LATCH2
Host writes HPIC, 1st byte
00
0
00
0
00xx
xxxx
xxxx
xxxx
Host writes HPIC, 2nd byte
00
0
00
1
0000
xxxx
xxxx
xxxx
Host writes HPIA, 1st byte
10
0
10
0
0000
10xx
xxxx
xxxx
Host writes HPIA, 2nd byte
00
0
10
1
1000
xxxx
1000
FF
Internal HPI RAM read complete
FE
In the cycle shown in Table 10, BOB and HPIA are initialized, and by loading HPIA, an internal HPI memory
access is initiated. The last line of Table 10 shows the condition of the HPI after the internal RAM read is
complete; that is, after some delay following the end of the host write of the second byte to HPIA, the read is
completed and the data has been placed in the upper and lower byte data latches. For the host to actually
retrieve this data, it must perform an additional read of HPID. During this HPID read access, the contents of the
first byte data latch appears on the HD pins when HBIL is low and the content of the second byte data latch
appears on the HD pins when HBIL is high. Then the address is incremented if autoincrement is selected and
the memory is read again into the data latches. The sequence involved in this access is shown in Table 11.
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example access sequences (continued)
Table 11. Read Access to HPI with Autoincrement
EVENT
HD
HR/W
HCNTL1/0
HBIL
HPIC
HPIA
LATCH1
LATCH2
Host reads data, 1st byte
FF
1
01
0
0000
1000
FF
FE
Host reads data, 2nd byte
FE
1
01
1
0000
1000
FF
FE
1001
6A
BC
Internal HPI RAM read complete
In the access shown in Table 11, the data obtained from reading HPID is the data from the read initiated in the
previous cycle (the one shown in Table 10) and the access performed as shown in Table 11 also initiates a
further read, this time at location 1001h (because autoincrement was specified in this access by setting
HCNTL1/0 to 01). Also, when autoincrement is selected, the increment occurs with each 16-bit word transferred
(not with each byte); therefore, as shown in Table 11, the HPIA is incremented by only 1. The last line of Table 11
indicates that after the second internal RAM read is complete, the contents of location 1001h (6ABCh) has been
read and placed into the upper and lower byte data latches.
During a write access to the HPI, the first byte data latch is overwritten by the data coming from the host while
the HBIL pin is low, and the second byte data latch is overwritten by the data coming from the host while the
HBIL pin is high. At the end of this write access, the data in both data latches is transferred as a 16-bit word to
the HPI memory at the address specified by the HPIA register. The address is incremented prior to the memory
write because autoincrement is selected.
An HPI write access is illustrated in Table 12. In this example, after the internal portion of the write is completed,
location 1002h of HPI RAM contains 1234h. If a read of the same address follows this write, the same data just
written in the data latches (1234h) is read back.
Table 12. Write Access to HPI with Autoincrement
EVENT
HD
HR/W
HCNTL1/0
HBIL
HPIC
HPIA
LATCH1
LATCH2
Host writes data, 1st byte
12
0
01
0
0000
1002
12
FE
Host writes data, 2nd byte
34
0
01
1
0000
1002
12
34
1002
12
34
Internal HPI RAM write complete
host device using DSPINT to interrupt the DSP
A DSP interrupt is generated when the host writes a 1 to the DSPINT bit in HPIC. The host and the DSP always
read this bit as 0. A DSP write has no effect. Once a 1 is written to DSPINT by the host, a 0 need not be written
before another interrupt can be generated, and writing a 0 to this bit has no effect. The host should not write
a 1 to the DSPINT bit while writing to BOB or HINT, or an unwanted DSP interrupt is generated.
host port interface (DSP) using HINT to interrupt the host device
When the DSP writes a 1 to the HINT bit in HPIC, the HINT output is driven low; the HINT bit is read as a 1 by
the DSP or the host. The HINT signal can be used to interrupt the host device. The host device, after detecting
the HINT interrupt line, can acknowledge and clear the DSP interrupt and the HINT bit by writing a 1 to the HINT
bit. The HINT bit is cleared and then read as a 0 by the DSP or the host, and the HINT pin is driven high. If the
DSP or the host writes a 0, the HINT bit remains unchanged.
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using the HPI in the TMS320C54V90 application
The previous section has described the operation of the generic HPI. This section will describe the specific
memory map and protocol used in the TMS320C54V90 application.
This section uses the standard modem convention for referring to transmit and receive data:
D “Transmit data” is data to be transmitted on the phone line. Thus, transmit data passes from the host
processor to the TMS320C54V90 DSP and is a write to the HPI.
D “Receive data” is data received from the phone line. Thus, receive data passes from the TMS320C54V90
DSP to the host processor and is a read from the HPI.
The data structure in the shared HPI memory consists of circular buffers for transmit and receive data, and
control/status registers. Two mechanisms are provided to facilitate control and access of data in the transmit
and receive circular buffers: transmit and receive circular buffer address pointers for the two circular buffers,
and a data valid flag in the upper data byte of each word in the two buffers. The transmit and receive buffer
pointers point to the current location in the buffer for data transfer. Circular buffer locations are accessed in an
ascending (numerically increasing) address order.
The data valid flag for each word in the two buffers indicates whether the data in the lower byte of the word is
valid or invalid/empty. Proper buffer management must be used to prevent both underflow and overflow, since
the data source could be faster or slower than the data sink (in either direction). This is discussed in detail later
in this section.
Control registers for the transmit and receive directions contain control and status bits, including bits
corresponding to the EIA-RS232 control signals. The control register bits are positive-true, i.e.,
a 1 = EIA-RS232 “on”.
The embedded valid data flags allow for flow control locally across the HPI interface, while the RTS and CTS
control bits implement higher-level flow control in the same fashion as the corresponding signals on a serial
RS232 interface. On the host interface side, the state of RTS must be driven, and the state of CTS must be
monitored by the host, and the host must respond appropriately
Table 13 shows the HPI memory map, and Figure 10 and Figure 11 show the bit functions in the control
registers. As shown in Table 13, some registers have different functions during initialization vs. normal mode.
The HPI interface is usually in normal mode, unless a unique sequence is performed to place the interface into
initialization mode (see Initialization section).
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using the HPI in the TMS320C54V90 application (continued)
Table 13. HPI Memory Map†
DSP
ACCESS
1002h
W
R
Host Command Register
Revision Word 1
1003h
W
R
Host Acknowledge/Parameter Register
Host Acknowledge/Parameter Register
1004h
W
R
Transmit Control Register
Revision Word 2
1005h
W
R
Revision Word 3
1006h
W
R
Revision Month/Day
1007h
W
R
Revision Year
1008h
W
R
Host Type Identifier (0001)
1009h
W
R
Revision Word 4
1010h
R
W
DSP Receive Buffer Pointer
1011h
R
W
DSP Transmit Buffer Pointer
1012h
R
W
DSP Command Register
DSP Command Register
1013h
R
W
DSP Acknowledge/Parameter Register
DSP Acknowledge/Parameter Register
1015h
R
W
Receive Control Register
1000–1001h
Not used
R/W
R/W
R/W
R/W
1030–105Fh
1060h–106Fh
1070h–17FFh
INITIALIZATION MODE
Not used
1016–101F
1020h–102Fh
NORMAL MODE
Not used
100A–100Fh
†
FUNCTION
HOST
ACCESS
ADDRESS
16-word Transmit Data Buffer
Not used
16-word Receive Data Buffer
Not used for HPI. Should not be
accessed by Host. May be used for
other functions (general purpose
memory) by DSP.
The Read and Write access indicated in the table must be enforced by the software.
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using the HPI in the TMS320C54V90 application (continued)
15
X
1
0
DTR
RTS
LEGEND: X = Any value can be written.
Figure 10. Transmit Control Register
15
14
13
12
11
10
9
8
X
X
OFF_HOOK
X
RI
DCD
DSR
CTS
7
0
X
LEGEND: X = Unknown value is read.
Figure 11. Receive Control Register
data format
The transmit and receive circular buffers each consist of 16 16-bit words. (As described previously, each word
transfer requires two 8-bit transfers across the HPI interface.)
Only the lower byte of each word is used for data. The entire lower byte is treated as data. If the data format
is less than 8 bits, the data should be right-justified. For example, with 7-bit ASCII data, the MSB can be a parity
bit or can be forced to 1 or 0.
The upper byte of each word is used as a flag to indicate whether this word has valid data to transfer. Before
writing new data into the transmit data buffer, the host system must first read the current location of the buffer
to ensure that the previous data content has been read by the DSP. When the upper byte is 00h, the current
location is available for writing new data. When new data is written, the upper byte should be set to a non-zero
value such as 3Fh. For example, if the new data is the ASCII character “A”, 3F41h should be written into the
buffer. When that location is later read, both the upper and lower bytes will be set to 00h by the DSP.
Similarly, when the host system is reading the receive data buffer for new data, it should interpret the upper byte
as a “valid data” indicator. After reading the new data, the host system must write back 00h to both the upper
and lower bytes of the current receive data buffer location to clear it as an acknowledgement to the DSP that
the data has been read before advancing to the next buffer location.
As mentioned previously, both the transmit and receive buffer pointers and the valid data flags can be used to
control data transfers. The pointers used by the DSP to read and write the buffers can be accessed at locations
1011h and 1010h respectively, and circular buffer locations are accessed in an ascending (numerically
increasing) address order. However, because all access to the shared memory must be addressed indirectly
through the HPIA register, the valid data flag method is generally a more efficient way to control data transfers
than having read and write pointers that reside in the shared memory. Although the transmit and receive buffer
pointers will be updated by the DSP and will always contain the address of the current location in the buffer for
data transfer by the DSP, if the host simply reads these pointers once during initialization and then maintains
its own version of the pointers internally, significant overhead in HPI data transfers can be saved.
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data format (continued)
Note that when the host maintains its own version of the pointers internally, these versions of the circular buffer
pointers will often not be pointing to the same address as the DSP transmit and receive buffer pointers, since
the rate at which the host and the DSP transfer data to and from the transmit and receive buffers is often different.
For this reason, the valid data flag mechanism is extremely efficient, and even crucial in managing buffer data
transfers.
initialization
The following steps should be performed following a power-on Reset to initialize the HPI and resynchronize the
host with the DSP:
1. Write the value 0005h into HPI address 1002h (Host Command Register). This requests that the DSP place
the HPI interface in initialization mode.
2. Wait for the DSP to respond with the value of 1234h at HPI address 1012h (DSP Command Register). This
indicates that the DSP has placed the HPI interface in initialization mode.
3. Once the DSP has responded with 1234h, initialize the host’s internal copy of the data buffer pointers to
the values at addresses 1010h (DSP Current Receive Data Buffer Pointer) and 1011h (DSP Current
Transmit Data Buffer Pointer).
4. Write the following responses in the appropriate HPI addresses in the order as shown in Table 14.
5. Wait for the DSP to respond with the value of 0000h at HPI address 1012h (DSP Command Register).
6. Write the value 0000h at HPI addresses 1002h and 1003h to acknowledge a successful resynchronization.
7. Initialization and resynchronization are complete. The HPI interface now reenters normal mode. Although
it can be assumed that the DSP pointers are set to the first address of their respective buffers, it is suggested
that the host HPI driver use the values that were read from addresses 1010h (DSP Current Receive Data
Buffer Pointer) and 1011h (DSP Current Transmit Data Buffer Pointer).
NOTE: This sequence of operations can also be initiated at any time to resynchronize the interface.
Table 14. Initial Writes to HPI
ADDRESS
VALUE
FORMAT
1002h
Revision word 1
(BCD, decimal) range 0–9
1003h
Acknowledge response
Must be 5678h
1004h
Revision word 2
(BCD, decimal) range 0–9
1005h
Revision word 3
(BCD, decimal) range 0–9
1006h
Revision Month/Day
(BCD, decimal) High/Low bytes MM/DD
1007h
Revision Century/Year
(BCD, decimal) High/ Low bytes YYYY
1008h
Driver Identifier
Must be 0001h
1009h
Revision word 4
Must be 0002h
Revision Words 1–4, Month/Day, and Year, are provided so that the host can load information about its driver.
This information will be reported by the ATI4 command.
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initialization (continued)
After a power-on reset, the upper bytes of the circular buffers will be cleared to indicate that there is no data
in the buffers. The EIA-RS232 signals will be set to default values based on the default AT Commands (see AT
Commands section). The modem will be in the AT command mode. The EIA-RS232 signal status after power-on
reset is as follows:
CTS = on
DSR = off
DCD = off
RI = off
OFF_HOOK = off
RTS = ignored
DTR = ignored
data transfer protocol — transmit
It is recommended that the host maintain an internal pointer that represents the next buffer location that will
become available for an HPI write to ensure most efficient data transfers. Initially, this would be the beginning
of the buffer.
For a transmit operation, the current buffer location is read and the upper-byte flag is tested until it becomes
00h indicating that the location is available. Then the new data is written into the low byte and a non-zero value
such as 3Fh is written into the upper byte. The pointer is incremented and the process is repeated until all new
data are sent or a location is found where the upper-byte flag has not yet been cleared by the DSP. Encountering
an asserted upper-byte flag would indicate that the buffer has been filled up, and further data transfers must
wait until one or more buffer locations become empty.
Note that the host version of the buffer pointer will often not be pointing to the same address as the DSP buffer
pointers, since the rate at which the host and the DSP transfer data to and from the transmit and receive buffers
is often different.
The auto increment feature of the HPIA can be used to reduce the number of accesses to the HPIA. However,
the pointer in the host must be updated and kept consistent with the HPIA. Also, the HPIA needs to be restored
when switching between the Transmit Data Buffer and the Receive Data buffer.
data transfer protocol — receive
The receive data transfer is similar to the transmit data transfer with the roles reversed between the host and
the DSP.
When the DSP places data in a buffer location, it will set the upper byte flag to a non-zero value. It will test the
flag before writing to ensure that the location has been emptied by the host.
As with the transmit operation, it is recommended that the host maintain its own internal pointer indicating the
next empty buffer location. It reads that location and tests the upper byte until it detects the flag set. It will then
read the location and write back to that location with the upper and lower bytes cleared. This will repeat until
the host tests a location where the upper byte is cleared. Encountering a location with its upper byte cleared
would indicate that the end of valid data in the receive data buffer has been reached, and the host must wait
for additional data to be received. Note again that the host version of the buffer pointer will often not be pointing
to the same address as the DSP buffer pointers, since the rate at which the host and the DSP transfer data to
and from buffers is often different.
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HPI interrupt
Since the flag bits and control registers reflect the last operation completed by the DSP, and since the HPIA can
only be written by the host, it is possible for the host data transfers to be accomplished entirely asynchronously
on a polled basis. For greater efficiency however, an interrupt-driven mode is also provided as follows:
The DSP generates an interrupt by setting the HINT bit, which also asserts the HINT output signal. This can
be used either to generate a hardware interrupt on the host, or the host can poll the bit or HINT output signal
to determine when to service the HPI data transfers.
Three conditions can cause an interrupt:
1. More than eight locations in the receive data buffer have been filled by the DSP since the last interrupt.
2. More than eight locations in the transmit data buffer have been read by the DSP since the last interrupt.
3. The Buffer Flush timer (defined by S−Register 71) expires (default = 10 ms). This is to ensure that both
buffers are flushed in the case of low data activities (see S−Register description for additional information).
There are two modes of operation for the Buffer Flush timer:
D Free-running Mode – Selected by default, or by the AT command AT*Y254:W618A,0. In this mode, a HINT
interrupt is generated when a free-running periodic timer expires before condition 1) or 2) above occurs.
The period is programmable from 2 to 254 ms through S−Register 71. The default value is 10 ms.
D Data Triggered Mode – Selected by the AT command AT*Y254:W618A,1. In this mode, a HINT interrupt
is generated when neither condition 1) or 2) above is met, but at least one data character has been written
to or read from the buffers by the DSP within the defined timeout period. The period is programmable from
2 to 254 ms through S−Register 71. The default value is 10 ms. Note that the timer does not run when there
is no data in either buffer, and an interrupt will not be generated until at least one piece of data is transferred
and then the full timer period expires.
In either mode, the Buffer Flush timer is disabled when S−Register 71 is set to 255.
When using the HPI interrupt function to control data transfers, as with any other data transfer control
mechanism, it is the responsibility of the data source (the host processor in the case of transmit, and the DSP
in the case of receive) to prevent overflow by detecting that there are no more buffer locations with flags cleared,
and stopping the flow of data.
With flow control and compression, data rate across the HPI can be higher than the modem line rate and can
also be variable. The buffer management schemes discussed above will allow handling of the following data
transfer scenarios:
D
D
D
D
D
The recipient takes all data currently in the buffer
The recipient takes part of the data currently in the buffer
The source writes multiple blocks (up to the capacity of the buffer) before some or all is read
The buffer is full, cannot write any more
The buffer is empty, no new data for recipient
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AT commands
This section describes the modem AT (ATtention) command set, which is the primary mechanism through which
a host interacts with the modem.
The AT command protocol permits you to:
D
D
D
D
Obtain information from the modem
Configure the modem
Establish or terminate data communications
Test the modem
The tables presented later in this section describe the available AT commands and their format and function.
Later sections describe the modem’s response to these AT commands in detail to more easily facilitate host
interface to the modem.
In addition to the AT commands described in this section, several other mechanisms in the modem software
affect certain aspects of modem and AT command operation. In particular, operation of some AT commands
is affected by the contents of a group of registers called the S-Registers. The S-Register description section
should be consulted for an explanation of the available S-Registers, and their contents and access.
After Reset, the TMS320C54V90 is in AT command mode, and accepts commands from the serial port or from
the HPI Transmit Data buffer, depending on which interface is selected. Each command string (except A/) must
be preceded by the letters AT and followed by a carriage return or Enter. The A/ command, which doesn’t require
a carriage return or the AT-prefix, instructs the modem to repeat the last command string it received. Also, note
that the command prefix can be entered either as AT or at, but not At or aT.
The modem responds with an “OK” acknowledgement when commands are accepted. Otherwise, an “ERROR”
response is returned to the DTE when an invalid command or illegal parameters are detected. Some commands
such as ATA, ATD and ATO, are exceptions to this, and do not return an “OK” response. Instead the modem
either responds with a “CONNECT” message when a successful connection is made or a “NO CARRIER”, “NO
DIALTONE”, or “BUSY” message if the attempt failed.
Multiple commands can be assembled together into a single command string with the restriction that certain
“action” commands, such as ATA, ATD, ATO or ATH, must be placed at the end of a concatenated string,
otherwise the commands following them will be discarded. The AT command buffer can hold up to
50 characters.
New commands cannot be issued until a response to the previous command is received. In the case of no
response, wait a minimum of five seconds before entering another command.
Once the modem has successfully completed a handshake procedure and entered data mode, the AT
command parser is disabled. All subsequent characters flowing in from the DTE interface are assumed to be
“payload” data. If necessary, the DTE can re-invoke the AT command parser while online by sending a special
“escape” sequence. This escape sequence consists of three consecutive identical characters, which are
normally (the default value) defined to be the “+” character (so the escape sequence is “+++”). To be accepted
by the modem, the escape sequence must be sent with the proper guard time (as specified by the contents of
S-Register 12) before, during and after the 3-character sequence transmission. A valid escape sequence must
meet all of the following three conditions:
1. A period of no TXD activity equal to or greater than S12 (S-Register 12) before the first of the escape code
characters is received.
2. The time elapsed between reception of the first and the third escape code characters must be equal to or
less than S12.
3. A period of no TXD activity equal to or greater than S12 after the third escape code character is received.
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AT commands (continued)
Note that the specific character used for the escape sequence is defined by the contents of S2, and therefore,
if system requirements dictate, this character can be changed. This is, in fact, necessary sometimes if the
remote modem being used considers the +++ sequence to be a control sequence of its own. In this case, the
+++ sequence may cause the remote modem to disconnect. In order to facilitate a proper escape sequence,
the 54V90 modem escape sequence character can be changed, for example, to a minus sign (decimal 45) by
modifying the S2 contents. The escape sequence guard time specification may also be modified in the same
fashion by changing the contents of S12.
additional host interface considerations
The modem firmware supports X-ON/X-OFF and RTS-CTS flow control on both the serial and parallel HPI
interfaces. Additionally, because the HPI interface uses circular buffers, proper management of the read and
write data flags will inherently result in flow control.
Also, optionally, the TMS320C54V90 modem can use an external serial EEPROM to store various types of
initialized configuration and other information. Refer to the Non-volatile EEPROM Initialized Configuration
Storage description section for further information regarding the EEPROM feature.
If use of the external EEPROM feature is not desired, enhanced features such as stored configurations and
stored numbers may still be implemented directly by software on the host processor, with appropriate AT
commands sent on a per-call basis.
Table 15 through Table 21 describe the available AT commands. The tables are grouped as follows:
D
D
D
D
D
D
D
The basic AT commands
The extended AT& commands
The extended AT% commands
The extended AT\ commands
The extended AT+ commands
The extended AT* commands
The extended AT! commands
The default values indicated in Table 15 through Table 21 will be present after reset.
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Table 15. Basic AT Command Set
COMMAND
ACTION
$
Help screen- AT$ will list all basic AT commands.
A/
Repeat command.
Repeat last command.
A
Answer call.
Answer incoming call.
C1
Included for compatibility only, responds with “OK”.
Dn
Dial.
The dial command, followed by one or more dial command modifiers, manually dials a phone number:
! Flash hook switch for 1/2 second.
, Pause before continuing. Time is in S-Register 8.
; Return to AT command mode. Leaves modem off-hook.
@ Wait for quiet answer before continuing. Time is in S-Register 7.
P Pulse (rotary) dialing.
T Tone (DTMF) dialing.
W Wait for dial tone before continuing. Time is in S-Register 6.
*,#,A,B,C,D,0,1,2,3,4,5,6,7,8,9 (DTMF digits).
0,1,2,3,4,5,6,7,8,9 (pulse digits).
En
E0
E1
◊
Local DTE echo.
Disable.
Enable.
Hn
H0
H1
Hook switch.
Go on-hook (hang up modem).
Go off-hook.
In
I0
I1
I3
I4
I5
I6
I7
I8
I9
Identification and checksum.
Report product code.
Report calculated checksum.
Report firmware revision level.
Report DTE interface type.
Report country code.
Report basic connection information. (See ATI6 Command Response section.)
Report DAA type.
Report processor and clock frequency.
Report Solsis generation.
On
Go On-line (and enter data mode) from command mode. All but O0 from idle assume call already established.
Responds with a CONNECT message (as appropriate for optioning) immediately or once handshake is
completed. Mainly used for testing purposes.
Go on-line. Returns directly to data mode (without any handshaking or rate renegotiation), OR, from idle,
without a call already established, goes off-hook in originate mode, attempts to handshake, and enters data
mode if connection is established. This is typically used in direct line modem applications. In the idle case, no
response is given if connection cannot be established, and the host must be prepared to initiate an appropriate
recovery in this situation.
Go on-line and retrain, with a complete handshake, and then enter data mode. Responds NO CARRIER if
handshake fails.
Go on-line and perform a basic rate renegotiation (a subset of a complete handshake) and then enter data
mode. Responds NO CARRIER if connection cannot be established.
O0
O1
O2
P
Qn
Q0
Q1
Dialing type, Pulse (rotary) dial [vs. Tone dial]. See also T command.
◊
Response mode.
Enable.
Disable (enable quiet mode).
NOTE: ◊ = Indicates the default value
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Table 15. Basic AT Command Set (Continued)
COMMAND
Sn
Sn?
Sn=x
S$
T
S-Registers.
Output contents of S-Register n.
Set S-Register n to value x.
Help screen for S-registers.
Dialing type, Tone (DTMF) dial [vs. Pulse dial]. See also P command.
◊
Vn
V0
V1
Xn
X0
X1
X2
X3
X4
X5
Yn
Y0
Y1
Z
ACTION
◊
◊
◊
Select numeric or text response types to AT commands. Also see AT!Cn commands.
Select decimal ASCII numeric responses to AT commands. Only valid when used with AT!C1 (alternate
command response mode). Indeterminate otherwise. See Table 26 for values.
Select ASCII text responses to AT commands (default).
Call Progress Monitor (CPM).
Basic results; disable CPM.
Extended results; disable CPM.
Extended results and detect dial tone only.
Extended results and detect busy only.
Extended results, full CPM.
Extended results, full CPM and detect ringback.
Long space disconnect.
Disable.
Enable.
Retrieve/restore AT command settings previously stored in EEPROM with AT&W.
NOTE: ◊ = Indicates the default value
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EMBEDDED V.90 MODEM DSP
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Table 16. Extended AT& Command Set
COMMAND
ACTION
&$
Help screen lists all AT& commands.
&Cn
&C0
&C1
&C2
&C3
Carrier operation.
Force Carrier On.
Real mode (follows modem energy detection).
Force Carrier On; toggle Carrier on disconnect.
Carrier On after link established.
◊
&Dn
&D0
&D1
&D2
&D3
◊
Select modem response to DTR (Data Terminal Ready) on-to-off transition. Note that valid DTR on-to-off
transition time (valid loss of DTR) determined by S25 setting.
Ignore transition. Modem considers DTR always on (default).
Enter AT command mode from data mode. Responds OK.
Go on-hook (hang up). Responds NO CARRIER.
Same as &D2, but also recalls stored configuration from EEPROM if installed. This allows special setup for
one call with easy recovery to previous setup.
&F
Load factory defaults
&Gn
&G4
&G5
&G6
&G7
&G8
&G9
&G10
&G11
&G12
&G13
&G14
&G15
&G16
&G17
Maximum Line Connection Rate in V.34 mode.
Maximum DCE data rate is 2.4 Kbps.
Maximum DCE data rate is 4.8 Kbps.
Maximum DCE data rate is 7.2 Kbps.
Maximum DCE data rate is 9.6 Kbps.
Maximum DCE data rate is 12 Kbps.
Maximum DCE data rate is 14.4 Kbps.
Maximum DCE data rate is 16.8 Kbps.
Maximum DCE data rate is 19.2 Kbps.
Maximum DCE data rate is 21.6 Kbps.
Maximum DCE data rate is 24 Kbps.
Maximum DCE data rate is 26.4 Kbps.
Maximum DCE data rate is 28.8 Kbps.
Maximum DCE data rate is 31.2 Kbps.
Maximum DCE data rate is 33.6 Kbps.
&Hn
&H0
&H1
&H2
&H3
&H4
&H5
&H6
&H7
&H8
&H9
&H10
&H12
&K
&K0
&K1
&K2
&K3
&K4
◊
◊
◊
Switched network handshake mode.
V.90 multimode.
V.90/V.34.
V.34 multimode.
V.34 only.
V.32bis multimode.
V.32bis only.
V.22bis.
V.22.
Bell 212.
Bell 103.
V.21.
V.23.
Modem-to-DTE flow control.
Disable in both directions.
Use XON/XOFF from modem to DTE only.
Use CTS.
Use RTS/CTS.
Use XON/XOFF in both directions.
NOTE: ◊ = Indicates the default value
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Table 16. Extended AT& Command Set (Continued)
COMMAND
ACTION
&L
&L1
&L2
&L3
&L4
&L5
&L6
&L7
&L8
&L9
&L10
&L11
&L12
&L13
&L14
&L15
&L16
&L17
&L18
&L19
&L20
&L21
&L22
◊
&M0
◊
&P
&P0
&P1
◊
Pulse Dialing Rate
10 pps
20 pps (only allowed for Japan country code).
◊
DSR operation (Data Set Ready).
Force DSR On; toggle Off on disconnect.
Normal DSR operation.
DSR follows carrier detect.
Force DSR On.
&Sn
&S0
&S1
&S2
&S3
Maximum PCM rate (V.90)
28000
29333
30666
32000
33333
34666
36000
37333
38666
40000
41333
42666
44000
45333
46666
48000
49333
50666
52000
53333
54666
56000
Async mode.
Included for compatibility only, responds with “OK”.
&Tn
&T0
&T1
Test mode. (See also the %Dn command).
Cancel (terminate) test mode (after you have done +++ and wait for OK).
Initiate analog loopback test. AT&G11 should always be issued before AT&T1 to limit DCE data rate to
19.2Kbps for test result consistency.
&W
Stores the AT command configuration settings of key AT commands in serial EEPROM, if installed. Responds
OK if EEPROM installed and working correctly, or ERROR if not. Allows custom configuration (other than
defaults) to be defined, and returned to after specialized modifications are made for exception conditions.
Stored information is retrieved automatically after power-up, or with ATZ. See Non-Volatile EEPROM
Initialized Configuration Storage section for list of which command settings are stored.
NOTE: ◊ = Indicates the default value
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Table 17. Extended AT% Command Set
COMMAND
ACTION
%$
Help screen lists all AT% commands.
%Cn
%C0
%C1
◊
Data Compression.
Disable.
Enable in transmit and receive paths
◊
DSR operation in test mode. (See also the &Tn command).
Force DSR On during test mode
Force DSR Off during test mode.
%Dn
%D0
%D1
%In
%I0
%I1
%Kn
%K0
%K1
%On
%O0
%O1
%O2
%Vn
%V0
%V1
◊
◊
◊
Loop current monitor. Loop current is monitored in the off-hook state. If there is a significant change in loop
current, it is presumed that another device has gone off hook, and the modem will immediately disconnect,
and respond NO CARRIER. See also %V command.
Disable.
Enable.
Character abort.
2-second delay to character abort.
Disable.
Answer mode.
Answer mode if ringing.
Force to answer mode.
Automatic answer in originate mode.
%V2
Check loop voltage before dialing. See also %I command.
Disable (default)
Enable using a preset threshold. The loop voltage is compared to a threshold stored in S100. If the voltage is
below the threshold, it is presumed that another device is off-hook on the same line, dialing will not be
attempted, and the response is LINE UNAVAILABLE.
Enable using a measured threshold. The loop voltage is compared to a measured threshold stored in S101.
This threshold is continuously monitored and is initialized by the modem automatically each time the modem
is powered up or when a phone line is plugged in. S101 is set to (S102)% of the measured loop voltage. The
default value of S102 is 85(%). A re-calibration of the threshold can also be initiated manually with the
ATS101=0 command. After initialization, if the line voltage is below the threshold, it is presumed that another
device is off-hook on the same line, dialing will not be attempted, and the response is LINE UNAVAILABLE.
%Z
Enter power down mode. Hardware reset is required to return to normal operation.
◊
NOTE: ◊ = Indicates the default value
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Table 18. Extended AT\ Command Set
COMMAND
\$
\Cn
\C0
\C1
\Gn
\G0
\G1
\G2
\G3
\Nn
\N0
\N1
\N2
\N3
\N4
\N5
Fallback selection and pre-link data buffer.
Time-out and fallback; speed buffer; no data buffer.
Time-out and fallback; speed buffer; buffer receive data.
◊
◊
\Vn
\V0
\V1
\V2
\V3
\V4
Modem-to-modem flow control (Only in Speed Buffer Mode).
Disable.
Enable XON/XOFF in transmit and receive paths.
Enable in transmit path only.
Enable in transmit and receive paths, with pass-through.
Asynchronous protocol.
Wire mode (only in Speed Buffer Mode).
Wire mode (only in Speed Buffer Mode).
MNP reliable mode (or drop call if failed to negotiate MNP link)
V.42 or MNP auto-reliable mode (fallback to Speed Buffer mode if failed to negotiate either link)
V.42 reliable mode (or drop call if failed to negotiate V.42 link)
V.42 reliable mode (or drop call).
◊
\Tn
\T1
\T2
\T3
\T4
\T5
\T6
\T7
\T8
\T9
\T10
\T11
\T12
\T13
ACTION
Help screen lists all AT\ commands.
Select serial DTE interface speed. Note that when using the parallel HPI interface, this command causes no
effect on operation. The only action that is taken is to load this parameter selection into a register that can be
accessed via the HPI.
Autobaud
300
1200
2400
4800
7200
9600
14.4 K
19.2 K
38.4 K
57.6 K
115.2 K
230.4 K
◊
◊
Connect message type.
Reports line rate upon data mode, link message after link negotiation.
Connect and protocol message sent after link negotiation, connect reported as DTE rate.
Connect and protocol message sent after link negotiation (Microcom compatible), connect reported as line
rate.
Connect message only after protocol negotiation, connect reported as DTE rate.
Connect message reports asymmetrical connect speeds.
NOTE: ◊ = Indicates the default value
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Table 19. Extended AT+ Commands (FAX and Caller ID)
COMMAND
+FCLASS
+FCLASS=0
+FCLASS=1
+FCLASS=?
+FCLASS?
◊
ACTION
Selects between FAX and Data Mode operation.
Select Data Mode.
Select facsimile Class 1 mode.
Report service classes supported.
Report current selection.
+FTS=n
Stop transmission and pause for n x 10 msec before execution of next command.
+FRS=n
Wait for silence (loss of energy) for n = 0−255 x 10 msec increments. This command is included for
compatibility, but is totally ignored.
+FTM=?
+FTM=n
Reports Class 1 FAX transmitter capabilities (24, 48, 72, 73, 74, 96, 97, 98, 121, 122, 145, 146).
Selects Class 1 FAX transmitter speed (n = any of those listed in capabilities).
+FRM=?
+FRM=n
Reports Class 1 FAX receiver capabilities (24, 48, 72, 73, 74, 96, 97, 98, 121, 122, 145, 146).
Selects Class 1 FAX receiver speed (n = any of those listed in capabilities).
+FTH=n
Where n = 3. Selects transmitter mode for FAX control channel.
+FRH=n
Where n = 3. Selects receiver mode for FAX control channel.
+PHF
+VCDT=n
+VCDT=0
+VCDT=1
+VCDT=2
+VCDT=3
+VCDT=4
+VCID
+VCID=?
+VCID?
+VCID=0
+VCID=1
+VCID=2
Hook flash.
◊
◊
Configure CID response format for various countries.
CID message sent after first ring (USA type).
CID message preceded by DTAS dual-tone alert signal (European type).
CID message preceded by an abbreviated (non-ringing) ring pulse (France, Spain type).
CID message preceded by polarity reversal plus DTAS signal (United Kingdom type).
CID message preceded by polarity reversal plus seizing signal (Japan).
Caller ID functionality.
Report the available range of selections.
Report the current selection.
Disable Caller ID reporting.
Enable Caller ID reporting with formatted presentation. When received, basic Caller ID information
(time, number, etc.) is presented to the DTE interface formatted as ASCII text. Compatible with either
single-line or multi-line Caller ID data. See also the +VCID=2 option.
Enable Caller ID with unformatted presentation. When received, complete Caller ID data is presented
to the DTE interface as the received data represented in hex ASCII, i.e., if the hex byte of 41 is
received, the hex value of 34 (ASCII ”4”) followed by the value 31 (ASCII ”1”) is sent. Compatible with
either single-line or multi-line Caller ID data. See also the +VCID=1 option.
NOTE: ◊ = Indicates the default value
40
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Table 20. Extended AT* Command Set
COMMAND
*Y254:Aaaaa,bbbb
*Y254:Oaaaa,bbbb
*Y254:Qaaaa
*Y254:Qaaaa,n,m
*Y254:Waaaa,vvvv
*Y254:W618A,n
*Y254:W6189,n
ACTION
AND address aaaa with bit pattern bbbb. Note that aaaa must be exactly four digit hex and must reflect any
leading zeros.
OR address aaaa with bit pattern bbbb.
Reads selected data memory location address aaaa (hex).
Display memory from address aaaa (hex). For n=0–3, display program memory from page n. For n=4,
display data memory. The parameter m specifies the number of lines to be displayed in hex. Each line
displays 12 locations. If m is omitted, 23 lines of 12 values are displayed. If m and n are both omitted, one
data memory location is displayed.
Writes vvvv (Hex) to data memory location aaaa (hex). Used to modify user adjustable PTT parameters
(see Table 22 for User Adjustable PTT parameter definitions).
Select free running or data triggered Buffer Flush timer mode. If n = 0, free running mode is selected.
If n = 1, data triggered mode is selected. Default is 0. Refer to the HPI interface section for a description of
the Buffer Flush timer function.
Select BSkyB compatibility mode. If n = 0, compatibility is not selected. If n = 1, compatibility is selected.
Default is 0.
Table 21. Extended AT! Command Set
COMMAND
!Cn
!C0
!C1
◊
!Xn
!X0
!X1
!X2
◊
ACTION
Configures AT command response mode. Also see ATVn commands.
Configure AT command responses in standard response mode (default).
Configure AT command response in alternate response mode. Must be selected to receive numeric response
types as selected by ATV0.
Phone exclusion relay driver control enable. Enables XF output as a relay driver control to isolate a local
external parallel phone handset from the phone line (the modem is always connected to the phone line). It is
assumed that the relay is normally closed. The implemented polarity for XF is such that when XF is high (or
power is off), the relay is deactivated (and the phone is connected), and when XF is low, the relay is activated
(and the phone is disconnected). Appropriate circuitry must be used to implement relay driver for this function
to operate correctly. See also Parallel Phone Handset Exclusion Relay Driver Control description in the
Parallel Phone Exclusion Relay Control section.
Disabled. XF is always high, to keep relay always deactivated, with external handset always connected to the
phone line (default).
Modem disconnects immediately from online state and goes back on hook whenever a parallel phone is
detected going off-hook. XF then goes low for a period given by S-register 231 (default is 500msec) and then
high again. This action ensures that the current call will get disconnected properly and the parallel phone will
receive a dial tone to place a new call. Should only be used if AT%I1 also selected.
XF goes low to activate the relay to isolate handset whenever modem is off-hook. With this selection, the
external parallel handset will not be able to acquire the phone line any time the modem is off-hook, and if the
phone is off-hook when the modem goes off-hook, the phone will be immediately disconnected from the line.
NOTE: ◊ = Indicates the default value
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
user adjustable PTT parameters definitions
The adjustable PTT parameters are initialized according to the selected country code setting, or by other
specific AT commands, and therefore normally do not require modification by the user. The information in this
section is provided for those exceptionable situations that might require these parameters to be further modified.
The PTT parameters may be modified using the following AT command.
AT*Y254:Wpppp,vvvv
where, pppp = parameter #, vvvv = parameter value – both in 4-digit hexadecimal format.
Table 22. User-Adjustable PTT Parameters Definitions
PARAMETER #
PULSE DIALING
UNIT
0100
Reserved
0101
Break Time
msec
0102
Make Time
msec
0103
Inter-digit Time, Part 1 (total = 1 + 2, See #104)
msec
0104
Inter-digit Time, Part 2 (total = 1 + 2, See #103)
msec
Number of pulses generated for…
0105
Digit 0
0106
Digit 1
0107
Digit 2
0108
Digit 3
0109
Digit 4
010A
Digit 5
010B
Digit 6
010C
Digit 7
010D
Digit 8
010E
Digit 9
DTMF Dialing
010F
Hi/Lo tone attenuation expressed as a 4-digit hexadecimal
”0XY0”
where, X = high group tone attenuation in dB
Y = low group tone attenuation in dB
dB
0110
Tone ON Time
msec
0111
Tone OFF Time (inter−digit)
msec
Off−Hook Delay
0112
msec
Incoming Ring Detection
42
0113
Maximum Ring Signal Frequency, Fmax (Hz)
Enter 2400 x (1/Fmax)
0114
Minimum Ring Signal Frequency, Delta, Fmin − Fmax (Hz)
Enter 2400 x (1/Fmin) − 2400 x (1/Fmax)
0115
Minimum Ring ON Duration, Ton (seconds)
Enter Ton x 2400
0116
Maximum Ring Cadence, Tring (seconds)
Enter Tring x 2400
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DEFAULTS
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Table 22. User-Adjustable PTT Parameters Definitions (Continued)
PARAMETER #
PULSE DIALING
UNIT
DEFAULTS
Pre−CPM Tone Detector Filters
0117
Band−pass Filter Coefficients (0117 to 012B)
Post−CPM Tone Detector Filters
012C
Band−pass Filter Coefficients (012C to 0140)
Pre−CPM Tone (Dial Tone) Detect
0141
Dial Tone ON Threshold Level
Arbitrary
0142
Dial Tone OFF Threshold Level
Arbitrary
Post−CPM Tone Detect
0143
ON Threshold
Arbitrary
0144
OFF Threshold
Arbitrary
0145
Blacklisting System
16-bit Address
Blacklisting Parameter Table
0146
Country Specific Bit Mapped Options
014E
Loop Current Detection
014F
ON Timer
msec
0150
OFF Debounce Timer
msec
Busy Tone Cadence
0151
Enter 2400 x Tmin
0152
Minimum Cadence, Tmin (seconds)
Maximum Cadence Delta, Tmax − Tmin (seconds)
0153
Minimum Tone ON Time, Ton (seconds)
Enter 2400 x Ton
Enter 2400 x Tmax − 2400 x Tmin
Ringback Tone Cadence
0154
Dialtone Detection
0157
Detection Window
msec
0158
Minimum Tone ON Time, Ton (seconds)
Enter 2400 x Ton
0159
‘W’ Dial Modifier Wait Time
seconds
Country−dependent Restricted Options
015A
Variable, up to six parameters
Nominal Transmit Level
0178
Gain Multiplier (16-bits)
Q12 format (S3.12)
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3F00h
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
special test commands
summary
To facilitate the process of testing, the modem supports a number of special test commands where the user can
put the modem into a non-standard mode of operation.
special ‘AT’ commands
continuous DTMF transmission
AT*Y1Dn
where, n = digit to be dialed
The modem goes off−hook and transmits a continuous DTMF digit. This facilitates adjustment and
measurement of level and twist.
This mode is terminated by a character abort (hitting any keys).
sustaining the transmitter at any modulation
AT*Y113
This command disables the Poor Signal Quality Retrain feature. It is useful for examination of the modem’s
transmit spectrum in the following way.
Procedure:
1. Disable V.42, i.e. AT\N0, to avoid protocol requesting a disconnect.
2. Disable loss-of-carrier disconnect by executing ATS10=255.
3. AT*Y113
4. After modem is connected escape into command mode, i.e. +++, to avoid garbage characters flooding the
terminal screen when you remove the remote modem’s signal.
5. Remove remote modem’s signal.
Also note that AT*Y113 must be re-executed each time a call is made.
44
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
country code setting
The modem can be configured to operate in any of the countries shown below by an AT command as follows,
AT*Y162K = CC, where CC is the corresponding numeric code
The selected country code is saved automatically in EEPROM if installed.
Also the country code setting should be initialized before any other initialization is performed. This is because
the country code setting initializes many parameters which, if modified separately, will simply be changed back
by the country code setting if it is initialized later.
Table 23. Country Code Setting
COUNTRY
Algeria
CODE
213
COUNTRY
Hungary
CODE
COUNTRY
CODE
36
Qatar
974
911
Argentina
54
India
91
Reset‡
Australia
61
Indonesia
62
Russia
Austria
43
Ireland
353
Saudi_Arabia
Bahrain
973
Israel
972
Singapore
65
Belgium
32
Italy†
21
Slovakia
428
Bolivia
591
Japan
81
Slovenia
386
Brazil
55
Jordan
962
South_Africa
27
Chile
56
Korea
82
Spain
34
China
86
Kuwait
965
Sweden
46
Colombia
57
Lebanon
961
Switzerland
41
Costa_Rica
506
Malaysia
60
Syria
963
CTR21/TBR21
21
Mexico
52
Taiwan
886
Cyprus
357
Morocco
212
Thailand
66
Czechoslovakia
42
Netherlands
31
Trinidad
888
Denmark
45
New_Zealand
64
Turkey
90
Ecuador
593
Norway
47
Tunisia
216
Egypt
20
Oman
968
UAE
971
Finland
358
Panama
507
UK
44
France
33
Peru
51
Uruguay
598
Germany
49
Philippines
63
USA/Canada
1
Greece
30
Poland
48
Venezuela
58
Guatemala
502
Portugal
351
Yemen
967
Hong_Kong
852
Puerto_Rico
999
7
966
†
In most cases, the country code of 21 for Italy as indicated is appropriate, however, some circumstances may require a different configuration.
In cases where a user desires to comply with the traditional homologation requirements of Italy, for example NET4 compliance, a special AT
command sequence is required as follows:
AT*Y162K=386
AT*Y254:W101,3C,28,28,348
AT*Y254:W14E,169
AT*Y254:W158,2D0
AT*Y254:W17D,100C,1110
‡ After a power−on reset, country code is 911, indicating that no country code has been programmed. Operation is the same as USA/Canada.
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
s-registers/commands
The S command allows you to view (Sn?) or change (Sn=x) the S-Registers. The S-Registers store values for
functions that typically are rarely changed, such as timers or counters, and the ASCII values of control
characters, such as Carriage Return. S−Register values are entered and displayed in decimal ASCII form.
Table 24 summarizes the S-Register set.
Table 24. S-Register Commands
S-REG.
DECIMAL
(DEFAULT)
FUNCTION
ASCII
UNITS
0
Automatic answer.
0
1
Ring Count (reset after 10 seconds).
0
2
Escape code character.
43
+
3
Carriage return character.
13
CR
4
Line feed character.
10
LF
5
Backspace character.
08
BS
6
Dial tone wait timer
02
seconds
7
Carrier wait timer; @ dial command modifier wait timer;
ringback wait timer.
80
seconds
8
Dial pause timer for, dial command modifiers.
02
seconds
9
Carrier presence timer.
06
0.1 second
10
Carrier loss timer.
14
0.1 second
12
Escape code guard timer.
50
0.02 second
25
DTR delay timer.
05
0.01 seconds
30
Activity Timer
0
minutes
38
Hang-up delay timer.
20
seconds
71
Buffer flush timer for HPI interrupt
10
0.001 seconds
72
V.23 Reversible Mode
0
1=enable
0=disable
100
Static on-hook line sensing voltage threshold
9
n x 2.75
101
Measured on-hook line sensing voltage threshold
−
n x 2.75
102
Measured on-hook line sensing voltage threshold
percentage of actual line voltage
85
percent
231
Phone exclusion relay driver hook flash duration time
50
0.01 seconds
result codes
Table 25 and Table 26 show the AT command response result codes in standard and alternate command
response modes. In alternate command response mode, both text (verbose) and numeric response types are
available. Note that the AT!C command is used to select between the standard and alternate command
response modes, and the ATV command is used to select between text and numeric response types. The AT\V
command selects the format of the connect message.
46
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
result codes (continued)
Table 25. Standard Result Code Definitions (!C0)
VERBOSE
DESCRIPTION
OK
Command has been accepted
ERROR
Modem detected an error in an AT command.
CONNECT
A connection established (300 bps, fax, or V.21).
RING
Modem detected an incoming call.
RINGING
Modem detected ring−back tone from far end. (If ATX5 is selected.)
NO CARRIER
Call disconnected.
NO DIALTONE
Modem cannot detect Dial Tone
BUSY
Busy response from network is detected
LINE UNAVAILABLE
Low loop voltage before modem goes off hook to dial (Indicates another device is using the line).
NO ANSWER
Remote modem did not answer.
Modem did not detect period of silence set by S7 when using the @ dial modifier in the dial
command.
FORBIDDEN NUMBER
The number to be dialed has been blacklisted. Further attempt to dial is prohibited until either
delay timeout is reached or until modem is reset.
BLACK LIST FULL
The list of forbidden number is full. (Only for countries that require blacklisting).
DELAY LIST FULL
The ten delay records are active. No resources to handle more numbers. (Only for countries that
require redialing delay).
DELAYED xx HOURS xx
MINUTES xx SECONDS
The number is blocked from further dialing for the length of time displayed because of past failed
attempts.
CONNECT 75
Line Speed. Connect Message format for \V0
CONNECT 300
Line Speed. Connect Message format for \V0
CONNECT 1200
Line Speed. Connect Message format for \V0
CONNECT 2400
Line Speed. Connect Message format for \V0
CONNECT 4800
Line Speed. Connect Message format for \V0
CONNECT 9600
Line Speed. Connect Message format for \V0
CONNECT 7200
Line Speed. Connect Message format for \V0
CONNECT 12000
Line Speed. Connect Message format for \V0
CONNECT 16800
Line Speed. Connect Message format for \V0
CONNECT 14400
Line Speed. Connect Message format for \V0
CONNECT 19200
Line Speed. Connect Message format for \V0
CONNECT 21600
Line Speed. Connect Message format for \V0
CONNECT 24000
Line Speed. Connect Message format for \V0
CONNECT 26400
Line Speed. Connect Message format for \V0
CONNECT 28800
Line Speed. Connect Message format for \V0
CONNECT 31200
Line Speed. Connect Message format for \V0
CONNECT 33600
Line Speed. Connect Message format for \V0
CONNECT 28000
Line Speed. Connect Message format for \V0
CONNECT 29333
Line Speed. Connect Message format for \V0
CONNECT 30666
Line Speed. Connect Message format for \V0
CONNECT 32000
Line Speed. Connect Message format for \V0
CONNECT 33333
Line Speed. Connect Message format for \V0
CONNECT 34666
Line Speed. Connect Message format for \V0
CONNECT 36000
Line Speed. Connect Message format for \V0
CONNECT 37333
Line Speed. Connect Message format for \V0
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
result codes (continued)
Table 25. Standard Result Code Definitions (!C0) (Continued)
VERBOSE
DESCRIPTION
CONNECT 38666
Line Speed. Connect Message format for \V0
CONNECT 40000
Line Speed. Connect Message format for \V0
CONNECT 41333
Line Speed. Connect Message format for \V0
CONNECT 42666
Line Speed. Connect Message format for \V0
CONNECT 44000
Line Speed. Connect Message format for \V0
CONNECT 45333
Line Speed. Connect Message format for \V0
CONNECT 46666
Line Speed. Connect Message format for \V0
CONNECT 48000
Line Speed. Connect Message format for \V0
CONNECT 49333
Line Speed. Connect Message format for \V0
CONNECT 50666
Line Speed. Connect Message format for \V0
CONNECT 52000
Line Speed. Connect Message format for \V0
CONNECT 53333
Line Speed. Connect Message format for \V0
CONNECT 54666
Line Speed. Connect Message format for \V0
CONNECT 56000
Line Speed. Connect Message format for \V0
CONNECT line speed /REL
Line Speed\Protocol. Connect message for \V2
CONNECT 300
Connect DTE speed. \V1 and \V3 format
CONNECT 1200
Connect DTE speed. \V1 and \V3 format
CONNECT 2400
Connect DTE speed. \V1 and \V3 format
CONNECT 4800
Connect DTE speed. \V1 and \V3 format
CONNECT 7200
Connect DTE speed. \V1 and \V3 format
CONNECT 9600
Connect DTE speed. \V1 and \V3 format
CONNECT 14400
Connect DTE speed. \V1 and \V3 format
CONNECT 19200
Connect DTE speed. \V1 and \V3 format
CONNECT 38400
Connect DTE speed. \V1 and \V3 format
CONNECT 57600
Connect DTE speed. \V1 and \V3 format
CONNECT 115200
Connect DTE speed. \V1 and \V3 format
CONNECT 230400
Connect DTE speed. \V1 and \V3 format
CONNECT Rx Tx
Connect Rx line speed Tx line speed. \V4 format
PROTOCOL: NONE
Connection established without Error Correction
PROTOCOL: V42
V.42 Error Correction established
PROTOCOL: V42bis
V.42bis Data Compression established
PROTOCOL: ALTERNATE,
CLASS 3+ CLASS 4
MNP Error Correction established
48
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
result codes (continued)
Table 26. Alternate Mode (!C1) Result Code Definitions
NUMERIC
VERBOSE
DESCRIPTION
0
OK
Command has been accepted
1
CONNECT
Short form connect message or 300bps FSK connection
2
RING
Incoming ring detected
3
NO CARRIER
Modem has been disconnected from line
4
ERROR
Invalid command has been rejected
5
CONNECT 1200
Successful 1200 bps connection at DCE rate
6
NO DIALTONE
Modem cannot detect Dial Tone
7
BUSY
Busy response from network is detected
8
NO ANSWER
S7 timed out while ringback after executing dial modifier @
10
CONNECT 2400
Successful 2400 bps connection at DCE rate
11
CONNECT 4800
Successful 4800 bps connection at DCE rate
12
CONNECT 9600
Successful 9600 bps connection at DCE rate
13
CONNECT 7200
Successful 7200 bps connection at DCE rate
14
CONNECT 12000
Successful 12000 bps connection at DCE rate
15
CONNECT 14400
Successful 14400 bps connection at DCE rate
16
CONNECT 19200
Successful 19200 bps connection at DCE rate
17
CONNECT 38400
Successful 38400 bps connection at DTE rate
18
CONNECT 57600
Successful 57600 bps connection at DTE rate
19
CONNECT 115200
Successful 11500 bps connection at DTE rate
22
CONNECT 75
Successful 75 bps connection at DCE rate.
24
DELAYED time
Re−dial attempt aborted. Delayed re−dial in progress
32
FORBIDDEN NUMBER
Re−dial attempt aborted. Number is blacklisted
40
+MRR: 300,300
DCE carrier at 300 bps
44
+MRR: 1200,75
V.23 TX=1200 bps, RX=75 bps
45
+MRR: 75,1200
V.23 TX=75 bps, RX=1200 bps
46
+MRR: 1200
DCE carrier at 1200 bps
47
+MRR: 2400
DCE carrier at 2400 bps
48
+MRR: 4800
DCE carrier at 4800 bps
49
+MRR: 7200
DCE carrier at 7200 bps
50
+MRR: 9600
DCE carrier at 9600 bps
51
+MRR: 12000
DCE carrier at 12000 bps
52
+MRR: 14400
DCE carrier at 14400 bps
53
+MRR: 16800
DCE carrier at 16800 bps
54
+MRR: 19200
DCE carrier at 19200 bps
55
+MRR: 21600
DCE carrier at 21600 bps
56
+MRR: 24000
DCE carrier at 24000 bps
57
+MRR: 26400
DCE carrier at 26400 bps
58
+MRR: 28800
DCE carrier at 28800 bps
59
CONNECT 16800
Successful 16800 bps connection at DCE rate
61
CONNECT 21600
Successful 21600 bps connection at DCE rate
62
CONNECT 24000
Successful 24000 bps connection at DCE rate
63
CONNECT 26400
Successful 26400 bps connection at DCE rate
64
CONNECT 28800
Successful 28800 bps connection at DCE rate
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
result codes (continued)
Table 26. Alternate Mode (!C1) Result Code Definitions (Continued)
NUMERIC
50
VERBOSE
DESCRIPTION
70
+ER: NONE
Modem connected without error correction
77
+ER: LAPM
Modem connected with V.42 error correction
78
+MRR: 31200
DCE carrier at 31200 bps
79
+MRR: 33600
DCE carrier at 33600 bps
80
+ER: ALT
Modem connected with MNP error correction
83
LINE UNAVAILABLE
Line already occupied by another device (i.e. phone)
84
CONNECT 33600
Successful 33600 bps connection at DCE rate
91
CONNECT 31200
Successful 31200 bps connection at DCE rate
134
+MCR: 103B
Modem connected in Bell 103 mode
135
+MCR: 212B
Modem connected in Bell 212 mode
136
+MCR: V21
Modem connected in V.21 mode
137
+MCR: V22
Modem connected in V.22mode
138
+MCR: V22B
Modem connected in V.22bis mode
139
+MCR: V23
Modem connected in V.23 mode
140
+MCR: V32
Modem connected in V.32 or V.32bis mode
142
+MCR: V34
Modem connected in V.34 mode
145
+MCR: V90
Modem connected in V.90 mode
150
+MRR: 32000
DCE carrier at 32000 bps
152
+MRR: 36000
DCE carrier at 36000 bps
154
+MRR: 40000
DCE carrier at 40000 bps
156
+MRR: 44000
DCE carrier at 44000 bps
158
+MRR: 48000
DCE carrier at 48000 bps
160
+MRR: 52000
DCE carrier at 52000 bps
162
+MRR: 56000
DCE carrier at 56000 bps
165
CONNECT 32000
Successful 32000 bps connection at DCE rate
167
CONNECT 36000
Successful 36000 bps connection at DCE rate
169
CONNECT 40000
Successful 40000 bps connection at DCE rate
171
CONNECT 44000
Successful 44000 bps connection at DCE rate
173
CONNECT 48000
Successful 48000 bps connection at DCE rate
175
CONNECT 52000
Successful 52000 bps connection at DCE rate
177
CONNECT 56000
Successful 56000 bps connection at DCE rate
180
CONNECT 28000
Successful 28000 bps connection at DCE rate
181
CONNECT 29333
Successful 29333 bps connection at DCE rate
182
CONNECT 30666
Successful 30666 bps connection at DCE rate
183
CONNECT 33333
Successful 33333 bps connection at DCE rate
184
CONNECT 34666
Successful 34666 bps connection at DCE rate
185
CONNECT 37333
Successful 37333 bps connection at DCE rate
186
CONNECT 38666
Successful 38666 bps connection at DCE rate
187
CONNECT 41333
Successful 41333 bps connection at DCE rate
188
CONNECT 42666
Successful 42666 bps connection at DCE rate
189
CONNECT 45333
Successful 45333 bps connection at DCE rate
190
CONNECT 46666
Successful 46666 bps connection at DCE rate
191
CONNECT 49333
Successful 49333 bps connection at DCE rate
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
result codes (continued)
Table 26. Alternate Mode (!C1) Result Code Definitions (Continued)
NUMERIC
VERBOSE
DESCRIPTION
192
CONNECT 50666
Successful 50666 bps connection at DCE rate
193
CONNECT 53333
Successful 53333 bps connection at DCE rate
194
CONNECT 54666
Successful 54666 bps connection at DCE rate
195
+MRR: 28000
DCE carrier at 28000 bps
196
+MRR: 29333
DCE carrier at 29333 bps
197
+MRR: 30666
DCE carrier at 30666 bps
198
+MRR: 33333
DCE carrier at 33333 bps
199
+MRR: 34666
DCE carrier at 34666 bps
200
+MRR: 37333
DCE carrier at 37333 bps
201
+MRR: 38666
DCE carrier at 38666 bps
202
+MRR: 41333
DCE carrier at 41333 bps
203
+MRR: 42666
DCE carrier at 42666 bps
204
+MRR: 45333
DCE carrier at 46666 bps
205
+MRR: 46666
DCE carrier at 46666 bps
206
+MRR: 49333
DCE carrier at 49333 bps
207
+MRR: 50666
DCE carrier at 50666 bps
208
+MRR: 53333
DCE carrier at 53333 bps
209
+MRR: 54666
DCE carrier at 54666 bps
ATI6 command response
The ATI6 command can be used to provide detailed and useful information regarding characteristics of a
modem connection. This command provides detailed information regarding an ongoing call, or summarized
information regarding the most recent (but completed) call.
To provide information regarding an ongoing call, the host must reenter command mode on the modem,
normally accomplished by entering +++. Note however, that some modems will drop an ongoing call if this
sequence is entered, because the sequence serves some control function for the remote modem. In order to
avoid this, the escape sequence character to reenter command mode can be changed to a different value (for
example, ”−”) by changing the value in S−Register 2, using the ATS2= command.
The detailed ATI6 command response consists of eight lines of information. The summarized ATI6 command
response consists only of the first three lines of the detailed response. The figure below shows the detailed ATI6
command response, as it would be sent to the host.
Detailed ATI6 command response:
Time in Data (Sec.): 00000023
Local Retrain/RR: 00/00
Remote Retrain/RR: 00/00
Clock Offset (ppm): 08.8
Round Trip Delay (msec): 0006
RX Level −11.0 dB
TX Level −17 dB
SNR
52.4 dB
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
51
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
ATI6 command response (continued)
The following describes in detail the information provided in this command response:
Line 1 − Time in Data Mode: The time in seconds that the modem has been connected. This value is latched
so that it can be read after the call is completed.
Line 2 − Local Retrain/RR: Two pieces of information are presented on this line. The first parameter
indicates the number of retrains requested by the local modem. The second parameter indicates the
number of rate renegotiations requested by the local modem. Higher values indicate an unstable
connection. These values are latched so that they can be read after the call is completed.
Line 3 − Remote Retrain/RR: Same as 2 but as requested by the remote modem.
Line 4 − Clock offset (ppm = parts per million): Represents a measure of the difference in clock frequency
between the local and the remote modems. The larger this number, the more difficult it is for the modem to
maintain reliable data transfers. A large value for clock offset may indicate a clock frequency problem on the
local or remote modem.
LIne 5 − Round trip (or “bulk”) delay: This value represents a measure in milliseconds of the propagation
delay present in the telephone network. This delay consists of the total round trip time delay for a signal to
propagate from the modem transmitter, through the network to the remote connection, and back. Although
this parameter may not be significant to a user, it is critical for certain aspects of internal modem operation.
For the modern digital telephone network, coast to coast delays in the US are generally between
30 − 100 msec. Local calls will have a smaller delay, while calls to various international locations may exhibit
a significantly larger value.
Line 6,7 − RX/TX Levels: Measure in dB of the level of the signal present at the modem’s receiver and
transmitter, respectively. For V.90 connections, nominal levels for these parameters are generally in the
range of −10 to −20 dB. For other modulations, these values may vary widely.
Line 8 − SNR: Signal to Noise Ratio in dB. A measure of the relative amount of undesirable signal qualities
present in the modem’s received signal. Higher values indicate less noise compared to the desired signal. A
high−speed data connection (50 Kbps or higher) requires an SNR of 50 dB or greater.
non-volatile EEPROM initialized configuration storage
The 54V90 modem provides for the capability to store several types of initialized information in an external serial
EEPROM, to be saved in a non-volatile form for recall at a later time, even after the modem has been powered
off. The information storable in EEPROM includes numerous AT command configurations set up by the user,
many S-Register settings, and various other operating parameters.
EEPROM functionality is supported by two AT commands — ATZ and AT&W. The AT&W command stores
information to the EEPROM. The information stored by the AT&W command is retrieved either on power-up or
with the ATZ command.
To allow use of the software support for information storage in the external serial EEPROM, the EEPROM should
be connected as shown in the reference design schematics in this document. If the AT&W command is invoked
and the EEPROM is not installed, the command response is ERROR.
52
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
non-volatile EEPROM initialized configuration storage (continued)
The information stored in the EEPROM is shown below. Note that the selected country code is saved in
EEPROM automatically without the use of AT&W. Configuration parameters saved by AT&W:
D
D
D
D
D
D
D
D
D
E,L,M,T,P,Q,V,X,Y
&C,&D,&G,&H,&K,&L,&R,&S,&P
%C,%K,%O,%I,%V
\C,\G,\K,\N,\T,\V
+VCDT,+VCID
BskyB Enable (when selected with *Y254:W6189,1)
!X, !C
S0,6,7,8,10,25,30,38,71,72,100,102,231
In alternate response mode (AT!C1 mode): B, W, &Q, N
parallel phone exclusion relay control
The 54V90 modem provides the capability to use the DSP XF output to control an external relay, which can be
used to isolate an external telephone handset from the phone line when system conditions require this.
Control of the XF output state to support a variety of system configurations is provided. Software control of the
XF output for exclusion relay control is implemented through the AT!X commands (see AT command set
description for additional information).
The functionality of the exclusion relay control is implemented assuming the relay used is of a normally closed
(when not energized/not activated) configuration. The polarity of the XF output is defined to be that XF is a one
when the relay is to be deactivated (closed) and zero when the relay is to be activated (opened). When the
system is powered off, the relay will also be deactivated (since no power is available to open the relay) and the
phone is connected to the line.
The particular circuitry used to control the relay may vary depending on the specific relay used, however, the
functionality described above must be implemented for proper operation.
A functional diagram of the exclusion relay connection is shown in Figure 12.
Exclusion Relay
NC
Phone
Line
NC
C54V90
XF
Telephone Handset
Figure 12. Exclusion Relay Connection Functional DIagram
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
53
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
connecting HPI interface to ISA bus
The HPI data, control and address lines can be mapped to the ISA bus as shown below. The I/O driver must
indirectly address the data memory through the HPIA register, and must also insure that each 16-bit data access
is implemented as two 8-bit accesses.
The DSP I/O pins are not 5-V tolerant, so a level translation is required in a 5-V system.
ISA Bus
TMS320C54V90 HPI
BALE
HAS
SA0
HBIL
SA1
HCNTL0
SA2
HCNTL1
HR/W
IOW
HDS1
IOR
HDS2
SD7−SD0
HD7−HD0
Decoded I/O
Select
HCS
IRQx
HINT
Reset
Reset
Figure 13. Connecting HPI Interface to ISA Bus
54
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
connecting HPI interface to ISA bus (continued)
Table 27. Mapping of I/O Space to HPI Registers
/IOW
SA2
SA1
SA0
FUNCTION
0
0
0
0
Write HPI Control Register Low Byte
0
0
0
1
Write HPI Control Register High Byte
0
0
1
0
Write HPI Data Register Low Byte (with address pre-increment)
0
0
1
1
Write HPI Data Register High Byte (with address pre-increment)
0
1
0
0
Write HPI Address Register Low Byte
0
1
0
1
Write HPI Address Register High Byte
0
1
1
0
Write HPI Data Register Low Byte (without address pre-increment)
0
1
1
1
Write HPI Data Register High Byte (without address pre-increment)
1
0
0
0
Read HPI Control Register Low Byte
1
0
0
1
Read HPI Control Register High Byte
1
0
1
0
Read HPI Data Register Low Byte (with address post-increment)
1
0
1
1
Read HPI Data Register High Byte (with address post-increment)
1
1
0
0
Read HPI Address Register Low Byte
1
1
0
1
Read HPI Address Register High Byte
1
1
1
0
Read HPI Data Register Low Byte (without address post-increment)
1
1
1
1
Read HPI Data Register High Byte (without address post-increment)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
55
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 SCHEMATIC
3.3 V
1.5 V
OPTIONAL SERIAL EEPROM
1
2
3
3.3 V
6
7
8
A0
A1
A2
SDA
R31
4.7 K
5
R40
4.7 K
R30
0 NI
R41
0 NI
3.3 V
SCLK
WP
4
VCC GND
R42
4.7 K
C40
2.2 F
C41
.01 F
C33
.01 F
Place close to U1
C34
.01 F
C35
.01 F
C36
22 F
Place close to U1
3.3 V
3.3 V
3.3 V
R43
0 NI
79
78
77
31
12
16
52
68
91
125
142
4
33
56
75
112
130
1
3
14
15
34
37
40
50
57
70
72
76
90
93
106
111
126
128
144
R32
NI
38
71
41
42
45
47
35
43
36
44
48
49
59
60
53
54
73
74
96
82
97
Y1
14.7456 MHz
C39
15 pF
X1
TOUT
X2/CLKIN
88
85
86
89
87
C38
15 pF
INT0
INT1
INT2
INT3
HD0
Hd1
HD2
HD3
HD4
HD5
HD6
HD7
3.3 V
64
65
66
67
58
69
81
95
120
124
135
6
R21
2 K
TCK
TD0
TDI
TMS
TRST
R20
4.7 K
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D5†
3.3 V
HPI16
RS
CLKOUT
NMI
READY
HOLDA
XF
IACK
IAQ
PS
DS
IS
MSTRB
IOSTRB
R/W
MP/MC
HOLD
MSC
HAS
HBIL
HCNTL0
HCNTL1
HCS
HDS1
HDS2
HP/ENA
HR/W
HRDY
HINT/TOUT1
99
100
101
102
103
104
113
114
115
116
117
118
119
121
122
123
C3
.22 F
U1
TMS320C54V90
EMU0
EMU1/OFF
13
HAS
HBIL
62
HCNTL0
39
HCNTL1
46
HCS
17
HDS1
127
HDS2
129
HPIENA
92
HR/W
18
HRDY
55
HINT/TOUT1 51
TX
RX
BCLKR0
BCLKR1
BDR0
BDR1
DAAEN
BFSR0
BFSRX2
BFSR1
BCLKX0
BCLKX1
BDX0
BDX1
BFSX0
BFSX1
C1A
C1A5V
83
84
C1A
5V
R48
0
CLKMD3
CLKMD2
CLKMD1
BIO
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
CVDD
DVDD
DVDD
DVDD
DVDD
DVDD
DVDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
UARTTX
UARTRX
R47
NI
TP5 TP6 TP7 TP8 TP9
†
HD0
HD1
HD2
HD3
HD4
HD5
HD6
HD7
3.3 V
R45
4.7 K
R46
4.7 K
TP10 TP11
D5 only required if C1A5V is not > DVDD − 0.5 V during power up, see the Recommended Operating Conditions table.
56
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
80
98
94
63
19
28
27
61
29
20
21
22
24
25
23
32
30
26
131
132
133
134
136
137
138
139
140
141
5
7
8
9
10
11
105
107
108
109
110
143
2
RESET
TP1
3.3 V
3.3 V
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 SCHEMATIC (CONTINUED)
Q4 needs a 100-mm square pad area on top of board. Place same area on bottom of PCB. Connect top and bottom areas areas with feed through holes for heat conduction.
Q4 will dissipate 0.5W max. under worst case condition.
Q1
MMBTA42LT1
2
3
R7
5.36 K
5V
Z4
5.6 V
1/2 W
C1A
R8
5.36 K
R15
5.36 K
D3
BAV99
1
R27
10 3
1
2
C1
pF
R28
10 3
4
5
6
7
8
TSTA/QE2
TX/FILT2
TSTB/DC1
IGND
C18
RNG1
NC/FILT
RX
REXT
DCT/REXT2
RNG2
QB
QE
1
NC/REF
NC/VREG2
VREG
Top view
for Q1,
Q2, Q3
C12
1 F
C5
.1 F
Q2
MMBTA92LT1
2.2 K
3
R18
R11
9.31 K
C6
.1 F
R12
78.7 R19
5.36 K
C14
.68 F
1
R16 K
5.36
C22
1.8 nF
C16
.1 F
Z1
43 V
1/2 W
3
1
2
C19
3.9 nF
C18
3.9 nF
C8
560 pF
C7
560 pF
MMBTA42LT1
L1
330 H
R10
56 K
RV2
NI
Q3
FB2
Fbead
3
D2
CMPD20D4S/SOT 1
2
1
2
D1
CMPD20D4S/SOT
R9
56 K
R6
120 K
C20
.01 F
R13
215
C9
.01 F
C4
150 pF
2
R17
5.36 K
R2
402 11
10
9
Z5
5.6V 1/2W
3
3
14
13
12
1
D4
BAV99
2
1
2
16
15
2
3
1
R5
100 K
C13
.22 F
U2
Si3016
2
4
BCP56T1
NPN
60 V 1/2 W
Q4
R24
150 R26
10 M
RV1
275V/100A
R25
10
M
RING
C25
1000 pF
LINE
C24
1000 pF
3
TIP
L2
330 H
FB1
Fbead
Optional 5 V Charge Pump†
3.3 V
C42
470 pF
CLKOUT
5V
D6
BAV99
1
3
R49
22 2
C43
0.01 F
C44
0.01 F
†This circuit can be used, if desired, to provide 5 V supply for the TMS320C54V90
POST OFFICE BOX 1443
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57
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
TMS320C54V90 SCHEMATIC (CONTINUED)
Memory Control
SN74LVC00A
U6A
2
DSPMSTRB
3
DSPRW
1
PS
3.3 V
16
A
Y0
B
Y1
G
Y2
Y3
VCC
GND
DSPMSTRB
4
R/W
5
6
14
1
2
7
12
Optional Patch ROM − 1 Mbit
14
R/W
PS
MSTRB
3.3 V
C46
0.1 µF
9
12
30
10
D[0:15]
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
29
28
27
26
25
24
23
22
20
19
18
17
16
15
14
13
VDD
7
3.3 V
14
9
11
SN74LVC00A
8
10
7
USD
R/W
USC
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A16
A17
A18
19
R/W
PS
MSTRB
40
21
3.3 V
SST30VF100
Pinout shown is 40-pin TSOP
25
24
23
22
21
20
19
18
8
7
6
5
4
3
2
1
48
17
16
11
26
28
37
C46
0.1 µF
D[0:15]
A0
DQ0
A1
DQ1
A2
DQ2
A3
DQ3
A4
DQ4
A5
DQ5
A6
DQ6
A7
DQ7
A8
DQ8
A9
DQ9
A10
DQ10
A11
DQ11
A12
DQ12
A13
DQ13
A14
DQ14
A15 DQ15/A−1
A16
NC/A17
NC/A18
WE
CE
OE
VDD
VSS
27
BYTE
RP
29
31
33
35
38
40
42
44
30
32
34
36
39
41
43
45
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251−1443
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
3.3 V
47
12
VSS
46
Pinout shown is 48−pin TSOP
SST39VF200A 128K x 16
SST39VF400A 256K x 16
SST39VF800A 512K x 16
58
MSTRB
USB
U4
A[0:22]
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
WE
CE
OE
VSS
VSS
7
6
5
Optional Patch ROM − 2, 4, 8-Mbit Family
U4
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
USA
14
4
3.3 V
SN74LVC00A
31
32
33
34
35
36
37
38
39
1
2
3
4
5
6
7
3
DSPRW
8
13
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A16
3.3 V
MSTRB
7
SN74LVC139A
A[0:22]
SN74LVC00A
3.3 V
Alternate Memory Control
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Table 28. Bill of Materials
ITEM
QUANTITY
REFERENCE
VALUE
PCB FOOTPRINT
MFR PART NUMBER
1
2
C4, C1
150pF
1808 20% 3KV X7R
Required to be Y2-compliant capacitors
2
1
C5
.1µF
10% 50v Case A
TANT
3
2
C6, C16
.1µF
0603 10% 16v X7R
4
2
C7, C8
560pF
0805 20% 250V X7R
5
1
C9
.01µF
0805 20% 250V X7R
6
5
C20, C33, C34,
C35, C41
.01µF
0603 20% 16V X7R
7
1
C12
1µF
8
2
C3, C13
.22µF
0603 10% 16V X7R
9
1
C14
.68µF
20% 16V TANT
Case A
10
2
C18, C19
3.9nF
0603 20% 16v X7R
11
1
C22
1.8nF
0603 20% 50V X7R
12
2
C24, C25
1000pF
13
1
C36
22µF
A case 6.3v
14
2
C39, C38
15pF
0603 5% 50v NPO
15
1
C40
2.2µF
A case 6.3v
16
2
D2, D1
CMPD2004S
SOT−23
Central Semi
17
2
D4, D3
BAV99
SOT−23
Diodes Inc BAV99−7
On Semi
Fairchild
Zetex BAV99TA
18
2
FB2, FB1
Fbead
0805
Murata BLM21B102S
19
2
L1, L2
330µH
20
2
Q3, Q1
MMBTA42LT1
SOT−23
21
1
Q2
MMBTA92LT1
SOT−23
22
1
Q4
BCP56T1 NPN 60v
1/2W
SOT−223
23
1
RV1
275V/100A
24
1
R2
402
1206 1% 1/8W
1210 (SMTPCB
pads)
25
1
R5
100k
0603 1% 1/16W
26
1
R6
120k
0603 5% 1/16W
27
6
R7, R8, R15, R16,
R17, R19
5.36k
1210 1% 1/4W
28
2
R9, R10
56K
0805 5% 1/10W
29
1
R11
9.31K
0603 1% 1/16W
30
1
R12
78.7
0603 1% 1/16W
20% 16v TANT
Case A
1812 3KV X7R
Required to be Y2-compliant capacitors
Sporton RCP0408−301K01
DO−214AA
ST SMP100−270LC
Teccor P3100SB
†
D5 only required if C1A5V is not > DVDD − 0.5 V during power up, see the Recommended Operating Conditions table.
NOTE: Contact Texas Instruments to obtain an Excel spreadsheet version of this Bill of Materials, if desired.
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
Table 28. Bill of Materials (Continued)
ITEM
QUANTITY
REFERENCE
VALUE
31
1
R13
215
0603 1% 1/16W
PCB FOOTPRINT
MFR PART NUMBER
32
1
R18
2.2k
0805 5% 1/10W
33
7
R20, R21, R31,
R40, R42, R45,
R46
4.7k
0603 5% 1/16W
34
1
R24
150
0603 5% 1/16W
35
2
R25, R26
10M
0805 5% 1/10W
36
3
R30, R41, R43
0 NI
0603 5% 1/16W
(NI = not installed)
37
2
R32, R47
NI
0603 5% 1/16W
(NI = not installed)
38
1
R48
0
0603 5% 1/16W
39
2
R27, R28
10
0805 5% 1/10W
40
11
TP1, TP2, TP3,
TP4, TP5, TP6,
TP7, TP8, TP9,
TP10, TP11
TEST POINT
41
1
U1
TMS320C54V90
42
1
U2
Si3016
43
1
Y1
14.7456 MHz
HC−49/US
Fundamental Mode, parallel resonant,
30Ω ESR max, 10 pF Cload.
44
1
Z1
43V 1/2W
SOD−123
Diodes Inc BZT52C43
General Semi MMSZ5260B
45
2
Z4, Z5
5.6V 1/2W
SOD−123
Diodes Inc BZT52C5V6−13
General Semi MMSZ5232B
46
1
D5†
Schottky
2.5 x 5 mm
Panasonic MA2Q735
Toshiba CRS03
Rohm RB160L−40
(not a part)
SOIC−16
(0.05 pitch, 0.153
body width)
OPTIONAL COMPONENTS
1
1
C42
470pF
0603 10% 50V NPO
2
2
C43, C44
.01µF
0603 20% 16V X7R
3
1
D6
BAV99
SOT−23
4
1
R49
22
Diodes Inc. BAV99-7
On Semi
Fairchild
Zetex BAV99TA
0603 5% 1/16W
†
D5 only required if C1A5V is not > DVDD − 0.5 V during power up, see the Recommended Operating Conditions table.
NOTE: Contact Texas Instruments to obtain an Excel spreadsheet version of this Bill of Materials, if desired.
60
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
general DAA layout guidelines
description
The integrated DAA provides a very high level of integration for modem designs. Integration of the analog front
end (AFE) and hybrid, and the removal of the transformer, relays, and opto-couplers reduces the layout effort
considerably. The DAA consists of two parts—the DSP-side and the line-side. When designing with the DAA,
there are several layout guidelines that will assist the designer in attaining telecom, safety, and EMC approvals.
This document is divided into six main sections: operational items, analog performance related items, EMC
items, safety items, assembly items, and thermal considerations. Operational items are defined as those items
that must be followed to ensure functionality of the solution. Analog performance related items are layout
recommendations that are pertinent to the analog performance of the solution. EMC items are those items that
will affect the emissions/immunity performance of the solution. Safety items are layout issues that could impact
safety requirements of a particular modem solution. Assembly items are items that should be noted to assist
in assembly of the solution. Thermal considerations are those items that may affect operational performance
due to extreme temperatures.
operational guidelines
Figure 14 depicts the placement of the chipset, some of the major discrete components, and the RJ11
connector. Note the placement of the DSP and the Si3016. Aligning these devices so that pins 73/74 of the DSP
face pins 1–8 of the Si3016 will aid in following some of the more specific layout guidelines. Utilizing this
placement will also allow the design to closely resemble the example layout, enabling the designer to directly
follow these guidelines.
2.5-mm spacing requirement between TNV (line side)
component and any SELV (digitally grounded) component.
+
C4
DSP
Side
Device
L1
FB1
RV1
Diode
Bridge
–
C1
Line
Side
Device
L2
D1/D2
C24
RJ11
FB2
C25
Additional 2.0-mm spacing
requirement when using L1
and L2 within TNV circuit.
Figure 14. Chipset Diagram
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
layout requirements
For the line-side chip (U2), the primary layout considerations are the placement and routing of C6, C9, C16, D1,
D2, and RV2.
Capacitors C6 and C16 provide regulation of the supplies powering U2. The loop formed by C6 to pins 3
and 9 and the loop formed by C16 to pins 3 and 10 should be made as small as possible. Figure 15 shows an
example of how to minimize these loops. The trace back to pin 3 is thicker because multiple loops use this path.
The thicker trace has a lower impedance, which lessens the effect of multiple currents in that trace.
Capacitor C9, dual diodes D1 and D2, and the MOV RV2 form a loop that should be minimized. C9 performs
a low pass filter function on the transmit and receive signals. The inductance in the loop from C9 to the diode
bridge (D1 and D2) can affect the ability of C9 to suppress out-of-band energy. See Figure 16 for a layout
example.
The placement of capacitors C12 and C13 is also important because these components are in high gain loops.
Noise in these loops may affect the signals at TIP and RING. The loop formed from pin 15 through C12 to
pin 1 (QE2) and the loop formed from pin 16 though C13 to pin 1 should be routed as short as possible. Figure 15
illustrates an example of these loops. Also, the trace from Q4 pin 3 (emitter) should connect directly to the QE2
pin and should not share the same route as the C12 and C13 capacitors to QE2.
Figure 15. Routing for C6, C16, C12, C13, Q4, R2, and R11
62
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
analog performance
The components on the line side of the DAA are composed of a small digital interface section (capacitor barrier
interface, converters, and control logic), and the remaining components are used for either analog circuits
(hybrid, dc impedance, ac impedance, ringer impedance, etc.) or safety and EMC (surge protector, ferrite
beads, EMC capacitors, etc.).
Routing all traces in the DAA section with 15 mil or greater traces when possible will ensure high overall analog
performance of the silicon DAA. Furthermore, the DAA section should not use a ground plane for the IGND
signal; instead the IGND signal should be routed using a 20-mil trace. Thermal considerations may also be
affected by the size of the IGND trace. See the Thermal Considerations section.
After placing C6, C12, C13, and C16, the designer should focus on placing R11 and routing the trace from Q4
pin 3 to U2 pin 1 using as small a loop as possible to ensure good analog performance. Due to the relatively
high current that can flow in the trace from Q4 pin 3 to U2 pin 1, this trace should be routed separately from the
trace coming from C12 and C13 to pin 1. This will ensure that the current from Q4 will not affect the sensitive
C12 and C13 loops. Figure 15 illustrates an example of the placement and routing of R11, Q4, and U2.
EMC
Several sources conduct or radiate EMC from/to electronic apparatus. Among these are the following:
D Antenna loops formed by ICs and their decoupling capacitors
D PC-board traces carrying driving and driven-chip currents
D Common impedance coupling and crosstalk
To minimize EMC-related problems, all extraneous system noise and the effects of parasitic PC-board trace
antennas must be reduced. Employment of an effective system shielding may also be necessary. The following
section discusses how to minimize the EMC problems that can occur on the DAA design.
Capacitors C1, C2, C4, and C9 provide the path for the isolation currents. The typical application schematic
recommends that C2 not be installed. If C2 is not installed, the isolation current flows in the following manner:
1. From the DSP C1A pin
2. Across C1 to pin 4 of the Si3016 (U2)
3. From pin 4 to pin 3 of U2
4. To C9
5. Across C9 to C4
6. And finally, across C4 to ground
Because the isolation signal operates around 2 MHz, it is important to keep the path of the signal as small as
possible (see Figure 16).
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EMBEDDED V.90 MODEM DSP
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EMC (continued)
Figure 16. Isolation Interface and Diode Bridge
Short, direct routes using thick 20 mil minimum traces, should be used to connect the isolation capacitors to
their respective pins. The GND side of these caps should be connected directly to ground, as close to the DSP
as possible. The IGND side of C2 should connect directly to the IGND pin of the Si3016. It is acceptable to use
a long trace to connect C4 to the Q1 pin 3 node, as long as there is an IGND trace that follows the C4 to Q1
trace.
For those designs that exhibit emission problems related to the isolation interface, the C30 capacitor may be
installed. C30 will shunt some of the high frequency energy and reduce emissions due to the harmonics of the
isolation link.
FB1, FB2, RV1, C24, C25, C31, and C32, and if implemented, a fuse should be placed as close as possible
to the RJ11 as shown in Figure 17. It is important for the routing from the RJ11 connector through the ferrite
beads FB1 and FB2 to be well matched. The routing to C24 and C25 should also be well matched. The distance
from the TIP and RING connections on the RJ11 through the EMC capacitors C24 and C25 to chassis ground
should be kept as short as possible. If possible, the routing through the ringer network to the line-side device
pin 5 and pin 6 should also be well matched as shown in Figure 18.
Figure 17. RJ11
64
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
EMC (continued)
Figure 18. Ringer Network
Routing all the connections from RJ11 to FB1, FB2, RV1, C24, C25, C31, C32, and F1 using a 20-mil trace will
improve the EMC performance of the solution.
Good general design practices should be followed to improve the EMC performance of the solution. This
includes laying out the digital ground plane as small as possible and rounding off the corners. Placing series
resistors on the clock signals near their source and ensuring that the traces from oscillators or crystals are made
as short as possible will contribute to the overall emissions performance of the solution.
When using the DAA in unearthed systems, the designer should consider making some modifications to prevent
common mode 50/60 Hz signals from entering the signal path. In an unearthed system, a large 50/60 Hz signal
can be present between IGND (line-side pin 3) and digital ground. This signal is often as large as 50 VRMS.
The primary consideration is to use well-matched capacitors which bridge the telephone network voltage (TNV)
to the safety extra-low voltage (SELV). C1 should match C4, and C24 should match C25. Matching should be
within 10%. To the extent that C1 and C24 does not equal C4 and C25, there will be a common mode to
differential conversion of the 50/60 Hz signal. Typical common mode rejection of the 50/60 Hz signal is better
than 95 dB.
A secondary consideration is capacitive coupling from DGND (SELV) to nodes on the line-side (TNV) circuitry.
The most prevalent system design where capacitive coupling occurs is in mini PCI and MDC designs. However,
this coupling always exists and can have a noticeable effect on analog performance when SELV is physically
close to TNV.
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EMBEDDED V.90 MODEM DSP
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EMC (continued)
For safety considerations, 3-mm spacing is recommended between TNV and SELV (international minimum is
2.5 mm). However, there are three nodes on the line side which require special consideration to insure robust
analog performance in unearthed systems:
D RX pin on Si3016
D FILT pin on Si3016
D FILT2 pin on Si3016
For these pins and the traces that connect to these pins, the following guidelines should be followed:
D Whenever possible, keep at least a 5 mm distance between these nodes and SELV.
D An IGND guard ring can be used on the board level. This IGND guard ring should be inserted between SELV
and the nodes listed above. For FR4 board material, the IGND guard can be placed on any layer. Optimal
placement would be for the IGND guard ring to be on the same layer as the nodes listed above. This guard
ring allows SELV to couple into IGND rather than the nodes listed above.
D For designs (e.g., MDC, mini PCI designs) which have TNV circuitry in close proximity (< 5 mm) to a SELV
plane, a ay shield can be used to protect against coupling. This coupling occurs through air between the
SELV plane and the TNV nodes described above. A small IGND shield can be placed between the TNV
nodes and the SELV plane. This plane allows the SELV to couple into IGND rather than the TNV nodes.
safety
The layout of the modem circuitry, in particular the area of the circuit that is exposed to telephone network
voltages (TNV), is subject to many safety compliance issues. It is recommended that all customers consult with
their safety expert or consultant on the various regulations that could impact their designs. One of the most
critical layout issues that relates to safety is to ensure that a minimum 2.5-mm (3-mm preferable) or 100-mil
space is provided between safety extra low voltage (SELV) and TNV circuitry. Designs requiring 5 kV isolation
between TNV and SELV should use 5 mm minimum spacing.
When L1 and L2 are included in the DAA, the spacing requirements between the TNV circuit and SELV needs
to be increased from 2.5 mm to 3.5 mm. This increased spacing requirement compensates for the secondary
peaking effects during longitudinal surges resulting from the addition of L1 and L2.
In addition to the increased spacing requirement between TNV and SELV, there is a second spacing
requirement within the TNV circuit. During surge events, the voltage across the L1 and L2 inductors can be
sufficient to create arcing to nearby TNV nodes. To prevent arcing, it is recommended the opposing terminals
of the L1 and L2 inductors be isolated from each other by 2.0 mm. Thus, the nodes corresponding to RV1, FB1,
FB2, RJ11, and one terminal of L1/L2, should be isolated by 2.0 mm from nodes that connect to the other
terminal of L1/L2.
assembly
There are several steps that can be taken in layout to ensure that the assembly process goes smoothly. For
example, an assembly-related error is to install the polarized capacitors with the polarity backwards. This can
be prevented by stenciling the board with a plus sign on the correct side of C12, C14, and C5 to indicate the
proper orientation for the polarized capacitors. Also, indicating pin 1 on the board with a stencil marking
improves the chances that the integrated circuits will be installed correctly. Thought should also be given to using
several footprints for a given component to allow for multiple vendor choices. Popular components using
multiple footprints are C1, C2, C4, C12, C24, C25, C31, C32, F1, and Z1. Taking these basic steps will assist
in the assembly process and ease future troubleshooting.
66
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
thermal considerations
When using the DAA in common applications, there are several thermal considerations that should be taken
into account. These thermal considerations will ensure that the device is not operating outside of the
recommended operating conditions, thus protecting the device from possible degradation.
On small form factor printed circuit board (PCB) designs, the ability of the PCB to dissipate heat becomes a very
important design consideration. These small designs will require additional mechanisms to remove the heat
from the DAA. For applications with a PCB area of less than approximately 3000 mm2, thermal design rules
should be applied.
check list
Table 29 is a check list that the designer can use during layout. The items marked as required should be taken
into consideration first.
Table 29. Layout Check List
n
#
LAYOUT ITEMS
REQUIRED
OPERATIONAL ITEMS
1
Small loop from C6 to U2 pin 9 and pin 3
Yes
2
Small loop from C16 to U2 pin 10 and pin 3
Yes
3
Small loop from C12 to U2 pin 15 and pin 1
Yes
4
Small loop from C13 to U2 pin 16 and pin 1
Yes
22
Copper pad heat sink is at least 0.08 sq. in. for Q4.
Yes
5
Small loop from R11 to U2 pin 11 and pin 3
Yes
6
Separate trace from Q4 pin 3 to U2 pin 1 than the trace from C12 and C13 to U2 pin 1
Yes
7
Minimum of 15 mil traces in DAA section
8
Minimum of 20 mil trace for IGND
9
ANALOG PERFORMANCE
No ground plane in DAA section
Yes
n/a
> 5-mm spacing between SELV and TNV nodes (RX, FILT, FILT2)
Yes
n/a
IGND guard ring to protect TNV nodes (RX, FILT, FILT2)
Yes
n/a
IGND Faraday shield to protect TNV nodes (RX, FILT, FILT2)
Yes
EMC ITEMS
10
Small loop formed between U2, C1, C9, and C4.
Yes
11
Minimum of 20 mil trace from DSP to C1, C9, and C4 and from U2 to C1 and C9
12
FB1, FB2, and RV1 placed as close as possible to the RJ11
Yes
n/a
Routing from TIP and RING of the RJ11 through F1 to the ferrite beads is well matched
Yes
16
Distance from TIP and RING through EMC capacitors C24 and C25 to Chassis Ground is short
Yes
17
C9 is located near C4
n/a
C4 is located with C2 between DSP and U2
18
Minimum of 20 mil trace from RJ11 to FB1, FB2, RV1, C24, C25, C31, C32, and F1
19
Routing of TIP and RING signals from the RJ11 through the ringer networks to U2 pin 5 and pin 6 is well
matched
20
Trace from D1 & D2 to IGND and to C4–C9 node is well matched and forms a small loop.
21
DGND return paths for C10 and C3 should be on component side.
n/a
Digital Ground plane is made as small as possible
n/a
Ground plane has rounded corners
n/a
Series resistors on clock signals are placed near source
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
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check list (continued)
Table 29. Layout Check List (Continued)
n
#
LAYOUT ITEMS
REQUIRED
SAFETY ITEMS
23
Additional 2 mm spacing for inductors (if necessary)
24
Minimum 2.5-mm (100 mils) between SELV and TNV (3.0-mm or higher recommended, see Safety
section)
n/a
Space for fire enclosure
26
Polarity for C5 is negative side connects with U2 pin 14
27
Polarity for C12 is negative side connects with U2 pin 15
n/a
Polarity for C14 is negative side connects with U2 pin 3 (IGND)
ASSEMBLY ITEMS
68
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Yes
DSP C1A
DSP GND
DSP C1A5V
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
* To expedite layout reviews, it is suggested that
reference designators for components on the DAA
section match those of the reference design.
* A loop is “minimized” by reducing trace lengths and
enclosed loop area.
19 Recommend routing of traces associated with the
RNG1 network be matched in length relative to
the RNG2 network.
17 Must place C9 adjacent to C4. Trace segment
connecting C9 to C4 must be direct (no vias) and
implemented on the component side.
10 Must minimize C1 and U2-4, U2-3, C9, C4, loop.
11 Require 20 mil minimum.
To
DSP
C3
R27
Z4
Dedicated traces must join close to U2-1 pin.
C30
Dedicate trace segment to the Q4, U2-1 connection.
C1
D4A
C9
D4B
DAA Section
R28
Z4
VREG
QE
C18
C7
C8
9
10
11
12
13
14
15
16
C6
R9
R10
C16
C5 26
C13
R11
27
C12
3 Must minimize U2-15, C12 and U2-1 loop.
4 Must minimize U2-16, C13 and U2-1 loop.
8
D1A
D2A
D1B
D2B
FB2
C24
FB1
RV1
C31
C32
RING
TIP
12 FB1, FB2, C24, C25, C31, C32 must be placed
near RJ11 jack.
18 Recommend 20 mil minimum.
L1
C25 23 Additional spacing
may be necessary for
L1 and L2.
L2
18 Recommend 20 mil minimum.
16 Minimize TIP, FB2, C24, C25, C31,
C32, FB1, L1, L2, RING loop.
Recommend 20 mil for all IGND traces. IGND must
not be implemented as a ground plane.
Connections C6, C16, R11 to U2-3 should be direct
and implemented on the component side.
24 2.5 mm isolation requirement applies.
1, 2 & 9
9 Must minimize U2-11, R11 and U2-3 loop.
2 Must minimize U2-10, C16 and U2-3 loop.
1 Must minimize U2-9, C6 and U2-3 loop.
Q4
20 Recommend trace from diode bridge to IGND and to C4−C9
node to be matched in length and loop is minimized.
RNG2
Network
C19
Si3016
VREG2
QB
REF
RNG2
REXT
RX
FILT
FILT2
REXT2
U2
RNG1
C1B
IGND
DCT
QE2
RNG1
Network
8
7
6
5
4
3
2
1
Need minimum 0.08 sq. in. copper pad as
heat sink when using Motorola BCP56T1.
7 Recommend 15 mil traces on DAA Section unless otherwise indicated.
Figure 19. TMS320C54V90 Modem Layout Guidelines
C4
D3A
D3
6 Dedicate trace segment to the C13, C12-to-U2-1 connection.
Trace segment should be direct (no vias) and implemented on
the component side.
No ground plane in the DAA Section.
24 All components and traces on the DAA Section must be at least
2.5 mm (100 mils) away non-DAA traces. Only C1, C4, C24 and C25
may bridge the 2.5 mm isolation.
9
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
check list (continued)
69
TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
additional TMS320C54V90-to-Si3016 layout guidelines
purpose
This section discusses layout issues specific to the TMS320C54V90. The layout guidelines in the previous
section discuss the generic layout issues associated with the DAA circuit, especially the IC and components
on the line side of the isolation barrier.
In TMS320C54V90, the line side device is the Si3016. The digital portion of the DAA is not a separate chip, but
has been integrated into the TMS320C54V90 DSP.
capacitively coupled data link
A digital data link carries samples of the modem signal and control information between the two parts of the DAA.
The link is bidirectional and capacitively coupled for isolation. The link runs between C1A (pin 73) of the DSP
and C1B (pin 4) of the Si3016.
The load capacitance on the C1A pin is critical. The driver is designed for a maximum load capacitance of 10 pF.
Excessive capacitive load will degrade the link signal and may cause erratic operation or increased sensitivity
to external noise sources.
DAA 5V
The DSP has an input pin, C1A5V (pin74), which is an input for a 5V supply used only by the C1A driver. This
pin needs to be bypassed for low noise. There are also some surge protection components that connect
to 5 V. These connections should be short and direct.
layout guidelines
The following layout guidelines are intended to:
D minimize the capacitive load on C1A
D bypass the 5-V supply
D provide effective surge protection
The component reference designators refer to the TMS320C54V90 reference design.
1. The DSP and the Si3016 should be located close together and oriented so that there is a short direct path
from C1A to C1B. This path should be no longer than 25 mm.
2. The connection from C1A to C1B, through R27, C1, and R28 should be made with all components and
circuit traces on the same side of the board (no vias).
3. There shall be no ground or power planes under C1, or R28. The planes may be removed under the trace
from C1A to R27, and under R27, but it is not essential.
4. A 0.22-uF bypass capacitor should be connected to the C1A5V pin as close as possible to the pin, and the
other side connected to a ground plane.
5. The connections from Z4 and D3 to the C1A5V pin should be as short and direct as possible. Avoid vias.
6. Some early versions of the Reference Design had a 10 pF cap from C1A to ground or from the junction of
R27/C1 to ground. This was optional and intended for EMI suppression if needed. This cap should not be
installed under any circumstances.
70
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EMBEDDED V.90 MODEM DSP
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layout guidelines (continued)
D3
Z4
U2
5V
Si3016
74
C1A5V
R27
10
73
C1A
C1
150 PF
3
R28
10
4
IGND
C1B
9
C3
VREG
.22
D4
Figure 20. Partial Schematic
Ground or Power Planes
U1
Z4
C3
To 5V
U2
D3
74
73
R27
C1
R28
Figure 21. Example Layout
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EMBEDDED V.90 MODEM DSP
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enhanced overvoltage protection
Although designs using the Si3016 comply with UL1950 3rd Edition and pass all over-current and over-voltage
tests, there are still several issues to consider.
Figure 22 shows two designs that can pass the UL1950 overvoltage tests, as well as electromagnetic
emissions. The top schematic of Figure 22 shows the configuration in which the ferrite beads (FB1, FB2) are
on the unprotected side of the sidactor (RV1). For this configuration, the current rating of the ferrite beads needs
to be 6 A. However, the higher current ferrite beads are less effective in reducing electromagnetic emissions.
The bottom schematic of Figure 22 shows the configuration in which the ferrite beads (FB1, FB2) are on the
protected side of the sidactor (RV1). For this design, the ferrite beads can be rated at 200 mA.
In a cost optimized design, it is important to remember that compliance to UL1950 does not always require
overvoltage tests. It is best to plan ahead and know which overvoltage tests will apply to your system.
System-level elements in the construction, such as fire enclosure and spacing requirements, need to be
considered during the design stages. Consult with your professional testing agency during the design of the
product to determine which tests apply to your system.
72
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
enhanced overvoltage protection (continued)
C24
75 W @ 100 MHz, 6 A
1.25 A
FB1
TIP
250 V min†
RV1
75 W @ 100 MHz, 6 A
FB2
Ring
C25
C24
FB1
1.25 A
TIP
600 W @ 100 MHz, 200 mA
250 V
min†
RV1
FB2
600 W @ 100 MHz, 200 mA
Ring
C25
†
Teccor FI250T or equivalent.
Figure 22. Circuits that Pass All UL1950 Overvoltage Tests
special telephone interface considerations
ringer impedance
The ring detector in a typical DAA is AC coupled to the line with a large, 1 uF, 250 V decoupling capacitor. The
ring detector on the Si3016 is also capacitively coupled to the line, but it is designed to use smaller, less
expensive 1.8 nF capacitors. Inherently, this network produces a very high ringer impedance to the line on the
order of 800 to 900 kW. This value is acceptable for the majority of countries, including FCC and CTR21.
Several countries including the Czech Republic, Poland, South Africa and South Korea, require a maximum
ringer impedance. For Poland, South Africa, and South Korea, the maximum ringer impedance specification
can be met with an internally synthesized impedance by setting the RZ bit in Register 16.
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ringer impedance (continued)
For Czech Republic designs, an additional network comprised of C15, R14, Z2, and Z3 is required. (See
Figure 23 and Table 30.) This network is not required for any other country. However, if this network is installed,
the RZ bit should not be set for any country.
TIP
C15
R14
Z2
Z3
RING
Figure 23. Ringer Impedance Network
Table 30. Component Values—Optional Ringer Impedance Network
SYMBOL
VALUE
C15
1 µF, 250 V
R14
7.5 kW, 1/4 W
Z2,Z3
5.6 V
billing tone detection
“Billing tones” or “metering pulses” generated by the central office can cause modem connection difficulties. The
billing tone is typically either a 12-kHz or 16-kHz signal and is sometimes used in Germany, Switzerland, and
South Africa. Depending on line conditions, the billing tone may be large enough to cause major errors related
to the modem data. The Si3016 has a feature which allows the device to provide feedback as to whether a billing
tone has occurred and when it ends.
Billing tone detection is enabled by setting the BTE bit (Register 17, bit 2). Billing tones less than 1.1 Vpk on
the line will be filtered out by the low pass digital filter on the Si3016. The ROV bit is set when a line signal is
greater than 1.1 Vpk, indicating a receive overload condition. The BTD bit is set when a line signal (billing tone)
is large enough to excessively reduce the line-derived power supply of the line-side device (Si3016). When the
BTD bit is set, the DC termination is changed to an 800 W DC impedance. This ensures minimum line voltage
levels even in the presence of billing tones.
74
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billing tone detection (continued)
The OVL bit (Register 19) should be polled following a billing tone detection. When the OVL bit returns to zero,
indicating that the billing tone has passed, the BTE bit should be written to zero to return the DC termination
to its original state. It will take approximately one second to return to normal DC operating conditions. The BTD
and ROV bits are sticky, and they must be written to zero to be reset. After the BTE, ROV, and BTD bits are all
cleared, the BTE bit can be set to reenable billing tone detection.
Certain line events, such as an off-hook event on a parallel phone or a polarity reversal, may trigger the ROV
or the BTD bits, after which the billing tone detector must be reset. The user should look for multiple events
before qualifying whether billing tones are actually present.
Although the DAA will remain off-hook during a billing tone event, the received data from the line will be corrupted
when a large billing tone occurs. If the user wishes to receive data through a billing tone, an external LC filter
must be added. A modem manufacturer can provide this filter to users in the form of a dongle that connects on
the phone line before the DAA. This keeps the manufacturer from having to include a costly LC filter internal
to the modem when it may only be necessary to support a few countries/customers.
Alternatively, when a billing tone is detected, the system software may notify the user that a billing tone has
occurred. This notification can be used to prompt the user to contact the telephone company and have the billing
tones disabled or to purchase an external LC filter.
billing tone filter (optional)
In order to operate without degradation during billing tones in Germany, Switzerland, and South Africa, an
external LC notch filter is required. (The Si3016 can remain off-hook during a billing tone event, but modem data
will be lost in the presence of large billing tone signals.) The notch filter design requires two notches, one at
12 kHz and one at 16 kHz. Because these components are fairly expensive and few countries supply billing tone
support, this filter is typically placed in an external dongle or added as a population option for these countries.
Figure 24 shows an example billing tone filter. Figure 25 shows the billing tone filter and the ringer impedance
network for the Czech Republic. Both of these circuits may be combined into a single external dongle.
L1 must carry the entire loop current. The series resistance of the inductors is important to achieve a narrow
and deep notch. This design has more than 25 dB of attenuation at both 12 kHz and 16 kHz.
C1
C2
L1
TIP
From Line
L2
To
DAA
C3
RING
Figure 24. Billing Tone Filter
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billing tone filter (optional) (continued)
Table 31. Component Values—Optional Billing Tone Filters
SYMBOL
VALUE
C1,C2
0.027 µF, 50 V, ±10%
C3
0.01 µF, 250 V, ±10%
L1
3.3 mH, >120 mA, <10 W, ±10%
L2
10 mH, >40 mA, <10 W, ±10%
C1
C2
L1
TIP
From Line
L2
To
DAA
C3
RING
Figure 25. Dongle Applications Circuit
The billing tone filter affects the AC termination and return loss. The current complex AC termination will pass
worldwide return loss specifications both with and without the billing tone filter by at least 3 dB. The AC
termination is optimized for frequency response and hybrid cancellation, while having greater than 4 dB of
margin with or without the dongle for South Africa, Australia, CTR21, German, and Swiss country-specific
specifications.
76
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absolute maximum ratings
Differential Voltage Tip to Ring (steady-state, excluding surges) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 275 V
Voltage Tip-to-Ground or Ring-to-Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
Supply voltage I/O range, DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 4.0 V
Supply voltage core range, CVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 2.0 V
Input Voltage- Logic inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 4.5 V
Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 4.5 V
Operating case temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0_C to 100_C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40_C to 150_C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated
conditions for extended periods may affect device reliability.
recommended operating conditions
MIN
TC
Operating case temperature
DVDD
Supply voltage, I/O†
CVDD
C1A5V
VIH
0
‡
MAX
UNIT
100
_C
2.7
3.3
3.6
V
Supply voltage, DSP core
1.42
1.5
1.65
V
Supply voltage, DAA‡
4.75
5
5.25
V
RS, INTn, NMI, X2/CLKIN,
BIO, BCLKR0, BCLKR1,
BCLKR2, BCLKX0,
BCLKX1, BCLKX2, HCS,
HDS1, HDS2, TCK,
CLKMDn
High-level input voltage
All other inputs
†
NOM
2.4
Vcc + 0.3
2
Vcc + 0.3
−0.3
0.8
V
V
VIL
Low-level input voltage
IOH
High-level output current
−300
µA
IOL
Low-level output current
1.5
mA
DVDD must be > C1A5V − 3.3 V during power up.
C1A5V must be > DVDD − 0.5 V during power up.
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electrical characteristics over recommended operating case temperature range
PARAMETER
TEST CONDITIONS
MIN
2.4
VOH
High-level output voltage
DVDD = 3.3 ±0.3 V, IOH = Max
VOL
Low-level output voltage
IOL = MAX
IIZ
Input current for
outputs in high
impedance
D0−D15, HD0−HD7
Bus holders enabled,
DVDD = MAX,
VI = Vss to DVDD
All other inputs
CVDD = MAX,
VI = Vss to DVDD
X2/CLKIN
TRST
II
Input
p ccurrent
e
HPIENA
TMS, TCK, TDI,
VI = Vss to
o DVDD
HPI†
All other input-only pins
†
TYP
MAX
UNIT
V
0.4
−50
V
50
µA
−5
5
−40
40
−5
300
−5
300
−300
5
−5
5
µA
µ
Icc
Supply current, 3.3 V
DVDD = 3.3 V, 59 MIPS,
TC = 25°C
2.5
mA
Icore
Supply current, 1.5 V
DVDD = 1.5 V, 59 MIPS,
TC = 25°C
28
mA
I
Supply current, standby
IDLE3 (AT%Z)
3.5
mA
IC1
Supply current, C1A5V
internal DAA active
0.5
mA
Ci
Input capacitance
10
pF
Co
Output capacitance
10
pF
HPI input signals except for HPIENA
78
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EMBEDDED V.90 MODEM DSP
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switching characteristics
In the following sections, many timing parameters are defined in terms of the parameter H which is 0.5 tc(CO).
For 58 MIPS operation, H=33.9 ns and for 117 MIPS operation, H=16.9 ns. See Clocking Considerations and
Mode Selection sections for additional information on clock options.
The HPI interface, reset, and interrupt can be completely asynchronous to CLKOUT.
reset and interrupt timings over recommended operating conditions (see Figure 26 and Figure 27)†
PARAMETER
th(RS)
MIN
Hold time, RS after CLKOUT low
low‡
MAX
UNIT
0
ns
th(INT)
Hold time, INTn after CLKOUT
0
ns
tw(RSL)
Pulse duration, RS low§
4H+5
ns
tw(INTH)S
Pulse duration, INTn high (synchronous)
2H+7
ns
tw(INTH)A
Pulse duration, INTn high (asynchronous)
4H
ns
tw(INTL)S
Pulse duration, INTn low (synchronous)
2H+7
ns
tw(INTL)A
Pulse duration, INTn low (asynchronous)
4H
ns
tsu(INT)
Setup time, INTn, RS before CLKOUT low
8
10
ns
†
Note that reset (RS) may cause a change in clock frequency, therefore changing the value of H.
The external interrupt INTn is synchronized to the core CPU by way of a two-flip-flop synchronizer which samples the input with consecutive falling
edges of CLKOUT. The input to the interrupt pin is required to represent a 1-0-0 sequence at the timing that is corresponding to three CLKOUT
sampling sequences.
§ If the PLL mode is selected, then at power-on sequence, RS must be held low for at least 50 ms to ensure synchronization and lock-in of the
PLL.
‡
X2/CLKIN
tsu(RS)
tw(RSL)
RS, INTn
tsu(INT)
th(RS)
CLKOUT
Figure 26. Reset and Interrupt Timing
CLKOUT
tsu(INT)
tsu(INT)
th(INT)
INTn
tw(INTH)A
tw(INTL)A
Figure 27. Interrupt Timing
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EMBEDDED V.90 MODEM DSP
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HPI timing
HPI switching characteristics over recommended operating conditions [H = 0.5tc(CO)] (see Figure 28 through
Figure 30 and Notes A, B, and C)
PARAMETER
ten(DSL-HD)
td(DSL-HDV1)
Enable time, HD driven from DS low
Delay time, DS
low to HDx valid
for first byte of an
HPI read
MIN
MAX
2
15
Case 1a: Memory accesses when DMAC is active
in 16-bit mode and tw(DSH) < 18H
18H+15 – tw(DSH)
Case 1b: Memory accesses when DMAC is active
in 16-bit mode and tw(DSH) ≥ 18H
15
Case 2a: Memory accesses when DMAC is
inactive and tw(DSH) < 10H
10H+15 – tw(DSH)
Case 2b: Memory accesses when DMAC is
inactive and tw(DSH) ≥ 10H
15
Case 3: Register accesses
15
td(DSL-HDV2)
Delay time, DS low to HDx valid for second byte of an HPI read
th(DSH-HDV)R
Hold time, HDx valid after DS high, for a HPI read
tv(HYH-HDV)
Valid time, HDx valid after HRDY high
td(DSH-HYL)
Delay time, DS high to HRDY
td(DSH
d(DSH-HYH)
HYH)
Delay time
time, DS
high
g to HRDY
high
3
low†
5
ns
4
ns
9
ns
Case 2: Memory accesses when DMAC is inactive
10H+10
Delay time, HCS low/high to HRDY low/high
td(COH-HYH )
ns
ns
18H+10
td(HCS-HRDY)
ns
15
Case 1: Memory accesses when DMAC is active
Case 3: Write accesses to HPIC register‡
UNIT
ns
6H+10
8
ns
Delay time, CLKOUT high to HRDY high
10
ns
td(COH-HTX)
Delay time, CLKOUT high to HINT change
10
ns
tsu(HBV-DSL)
Setup time, HBIL valid before DS low
th(DSL-HBV)
10
ns
Hold time, HBIL valid after DS low
5
ns
tsu(HSL-DSL)
Setup time, HAS low before DS low
5
ns
tw(DSL)
Pulse duration, DS low
20
ns
tw(DSH)
Pulse duration, DS high
10
ns
tsu(HDV-DSH)
Setup time, HDx valid before DS high, HPI write
5
ns
th(DSH-HDV)W
Hold time, HDx valid after DS high, HPI write
3
ns
†
The HRDY output is always high when the HCS input is high, regardless of DS timings.
This timing applies when writing a one to the DSPINT bit or HINT bit of the HPIC register. All other writes to the HPIC occur asynchronously, and
do not cause HRDY to be deasserted.
NOTES: A. DS refers to the logical OR of HCS, HDS1 and HDS2.
B. HDx refers to any of the HPI data bus pins (HD0, HD1, HD2, etc.)
C. DMAC stands for direct memory access (DMA) controller. The HPI shares the internal DMA bus with the DMAC, thus HPI access
times are affected by DMAC activity.
‡
80
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
HPI timing (continued)
Second Byte
First Byte
Second Byte
HAS
tsu(HBV-DSL)
tsu(HSL-DSL)
th(DSL-HBV)
HAD†
Valid
Valid
tsu(HBV-DSL)‡
th(DSL-HBV)‡
HBIL
HCS
tw(DSH)
tw(DSL)
HDS
td(DSH-HYH)
td(DSH-HYL)
HRDY
ten(DSL-HD)
td(DSL-HDV2)
td(DSL-HDV1)
th(DSH-HDV)R
HD READ
Valid
Valid
tsu(HDV-DSH)
tv(HYH-HDV)
th(DSH-HDV)W
HD WRITE
Valid
Valid
Valid
Valid
td(COH-HYH)
CLKOUT
†
‡
HAD refers to HCNTL0, HCNTL1, and HR/W
When HAS not used (HAS always high.)
Figure 28. Using HDS to Control Accesses (HCS Always Low)
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EMBEDDED V.90 MODEM DSP
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HPI timing (continued)
Second Byte
First Byte
Second Byte
HCS
HDS
td(HCS-HRDY)
HRDY
Figure 29. Using HCS to Control Accesses
CLKOUT
td(COH-HTX)
HINT
Figure 30. HINT Timing
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SPRS165F − JULY 2001 − REVISED OCTOBER 2003
MECHANICAL DATA
PGE (S-PQFP-G144)
108
PLASTIC QUAD FLATPACK
73
109
72
0,27
0,17
0,08 M
0,50
144
0,13 NOM
37
1
36
Gage Plane
17,50 TYP
20,20 SQ
19,80
22,20
SQ
21,80
0,25
0,05 MIN
0°− 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040147 / C 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
Thermal Resistance Characteristics
PARAMETER
°C/W
RΘJA
56
RΘJC
5
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TMS320C54V90
EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
MECHANICAL DATA
GGU (S-PBGA-N144)
PLASTIC BALL GRID ARRAY PACKAGE
12,10
SQ
11,90
9,60 TYP
0,80
A1 Corner
0,80
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13
Bottom View
0,95
0,85
1,40 MAX
Seating Plane
0,55
0,45
0,08
0,45
0,35
0,10
4073221-2/C 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice
C. MicroStar BGAt configuration
Thermal Resistance Characteristics
PARAMETER
°C/W
RΘJA
38
RΘJC
5
MicroStar BGA is a trademark of Texas Instruments.
84
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EMBEDDED V.90 MODEM DSP
SPRS165F − JULY 2001 − REVISED OCTOBER 2003
MECHANICAL DATA
Si3016
16-PIN SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Table 32. Package Diagram Dimensions
CONTROLLING DIMENSION: MM
SYMBOL
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
A
0.053
0.069
1.35
1.75
A1
0.004
0.010
0.10
0.25
A2
0.051
0.059
1.30
1.50
b
0.013
0.020
0.330
0.51
c
0.007
0.010
0.19
0.25
D
0.386
0.394
9.80
10.01
E
0.150
0.157
3.80
4.00
e
0.050 BSC
—
1.27 BSC
—
H
0.228
0.244
5.80
6.20
L
0.016
0.050
0.40
1.27
L1
0.042 BSC
—
1.07 BSC
—
γ
—
0.004
—
0.10
θ
0°
8°
0°
8°
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SI3016-KS
NRND
0
1008
TBD
Call TI
Call TI
SI3016-KSR
NRND
0
2500
TBD
Call TI
Call TI
TMS320C54V90AGGU
NRND
BGA
GGU
144
160
TBD
SNPB
Level-3-220C-168HR
TMS320C54V90APGE
NRND
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMS320C54V90BGGU
NRND
BGA
GGU
144
1
TBD
SNPB
Level-3-220C-168HR
TMS320C54V90BPGE
NRND
LQFP
PGE
144
60
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TMS320C54V90GGU
NRND
BGA
GGU
144
160
TBD
SNPB
Level-3-220C-168HR
TMS320C54V90PGE
NRND
LQFP
PGE
144
1
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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information may not be available for release.
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Addendum-Page 1
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