EIC LL4153

LL4153
HIGH SPEED SWITCHING DIODE
MiniMELF (SOD-80C)
Cathode Mark
FEATURES :
φ 0.063 (1.64)
• High switching speed: max. 4 ns
• Continuous reverse voltage:max. 50 V
• Repetitive peak reverse voltage:max. 75 V
• Pb / RoHS Free
0.055 (1.40)
0.019(0.48)
0.011(0.28)
0.142(3.6)
0.134(3.4)
Mounting Pad Layout
0.098 (2.50)
Max.
0.049 (1.25)Min.
MECHANICAL DATA :
Case: MiniMELF Glass Case (SOD-80)
Weight: approx. 0.05g
0.079 (2.00)Min.
0.197 (5.00)
REF
Dimensions in inches and ( millimeters )
Maximum Ratings and Thermal Characteristics (Rating at
25 °C ambient temperature unless otherwise specified.)
Parameter
Symbol
Value
Unit
Maximum Repetitive Peak Reverse Voltage
VRM
75
V
Maximum Continuous Reverse Voltage
VR
50
V
Maximum Continuous Forward Current
IF
200
mA
Maximum Surge Forward Current at t < 1s , Tj = 25°C
IFSM
0.5
A
Maximum Power Dissipation
PD
500
mW
Maximum Junction Temperature
TJ
200
°C
Storage Temperature Range
TS
-65 to + 200
°C
Electrical Characteristics (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Reverse Current
IR
Forward Voltage
Diode Capacitance
Cd
Reverse Recovery Time
Trr
Page 1 of 2
VF
Test Condition
VR = 50 V
VR = 50 V , Tj = 150 °C
IF = 50 mA
f = 1MHz ; VR = 0
IF = 10 mA to IR = 10mA
RL = 100Ω ; measured
at IR = 1mA
Min.
Typ.
Max.
Unit
-
-
0.05
50
0.88
2.0
µA
µA
V
pF
-
-
4
ns
Rev. 02 : March 25, 2005
RATING AND CHARACTERISTIC CURVES ( LL4153 )
FIG. 1 MAXIMUM FORWARD CURRENT
VERSUS AMBIENT TEMPERATURE
FIG. 2 TYPICAL FORWARD VOLTAGE
1000
Forward Current , IF (mA)
CONTINUOUS CURRENT, IF (mA)
200
150
100
50
100
10
TJ = 25°C
1
0.1
0
0.01
0
100
200
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Forward Voltage , VF (V)
Ambient Temperature , Ta (°C)
FIG. 3 TYPICAL DIODE CAPACITANCE AS
A FUNCTION OF REVERSE VOLTAGE
FIG. 4 TYPICAL REVERSE CURRENT
VERSUS JUNCTION TEMPERATURE
103
1.2
Reverse Current , IR (µA)
Diode Capacitance , Cd (pF)
1.0
0.9
0.8
0.7
f = 1MHz;
TJ = 25°C
0.6
10
2
VR = 75V
10
1
10-1
0.5
10-2
0.4
0
10
Reverse Voltage , VR (V)
Page 2 of 2
20
0
100
200
Junction Temperature, Tj (°C)
Rev. 02 : March 25, 2005