深圳市南天星电子科技有限公司 专业代理飞思卡尔 (Freescale) 飞思卡尔主要产品 8 位微控制器 16 位微控制器 数字信号处理器与控制器 i.MX 应用处理器 基于 ARM®技术的 Kinetis MCU 32/64 位微控制器与处理器 模拟与电源管理器件 射频器件（LDMOS，收发器） 传感器（压力，加速度，磁场， 触摸，电池） 飞思卡尔产品主要应用 汽车电子 数据连接 消费电子 工业控制 医疗保健 电机控制 网络 智能能源 深圳市南天星电子科技有限公司 电话：0755－83040796 传真：0755－83040790 邮箱：[email protected] 网址：www.soustar.com.cn 地址：深圳市福田区福明路雷圳大厦 2306 室 Pressure Freescale Semiconductor MPX10 Rev 14, 10/2008 + 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output, directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. Features • • • • • Low Cost Patented Silicon Shear Stress Strain Gauge Design Ratiometric to Supply Voltage Differential and Gauge Options Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package MPX10 Series 0 to 10 kPa (0 to 1.45 psi) 35 mV Full Scale Span (Typical) Application Examples • • • • • • • • Air Movement Control Environmental Control Systems Level Indicators Leak Detection Medical Instrumentation Industrial Controls Pneumatic Control Systems Robotics ORDERING INFORMATION Package Case Device Name Options No. None Unibody Package (MPX10 Series) MPX10D Tray 344 • MPX10DP Tray 344C MPX10GP Tray 344B Small Outline Package (MPXV10G Series) MPXV10GC6U Rail 482A MPXV10GC7U Rail 482C # of Ports Single Dual Gauge MPXV10GC7U CASE 482C-03 Absolute Device Marking • • MPX10D MPX10DP MPX10GP • • • • MPXV10G MPXV10G • • • UNIBODY PACKAGE SMALL OUTLINE PACKAGE MPXV10GC6U CASE 482A-01 Pressure Type Differential MPX10D CASE 344-15 © Freescale Semiconductor, Inc., 2007-2008. All rights reserved. MPX10GP CASE 344B-01 MPX10DP CASE 344C-01 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units POP 0 — 10 kPa VS — 3.0 6.0 VDC IO — 6.0 — mAdc Full Scale Span(3) VFSS 20 35 50 mV Offset(4) VOFF 0 20 35 mV Sensitivity ΔV/ΔΡ — 3.5 — mV/kPa Linearity — –1.0 — 1.0 %VFSS Pressure Hysteresis (0 to 10 kPa) — — ±0.1 — %VFSS Temperature Hysteresis — — ±0.5 — %VFSS Temperature Coefficient of Full Scale Span TCVFSS –0.22 — –0.16 %VFSS/°C Temperature Coefficient of Offset TCVOFF — ±15 — µV/°C TCR 0.21 — 0.27 %ZIN/°C ZIN 400 — 550 Ω ZOUT 750 — 1250 Ω Response Time(5) (10% to 90%) tR — 1.0 — ms Warm-Up Time(6) — — 20 — ms — — ±0.5 — %VFSS Differential Pressure Range Supply (1) Voltage(2) Supply Current Temperature Coefficient of Resistance Input Impedance Output Impedance Offset Stability(7) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPX10 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Value Unit PMAX 75 kPa PBURST 100 kPa TSTG –40 to +125 °C TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. 3 +VS 2 Sensing Element 4 +VOUT –VOUT 1 GND Figure 1. Uncompensated Pressure Sensor Schematic Voltage Output versus Applied Differential Pressure The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). MPX10 Sensors Freescale Semiconductor 3 Pressure Temperature Compensation Figure 2 shows the typical output characteristics of the MPX10 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX10 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.Refer to application note AN3728, for more information regarding media compatibility. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: 1) end point straight line fit or 2) a least squares best line fit. While a least squares fit gives the 80 70 Output (mVdc) 60 MPX10 VS = 3 VDC P1 > P2 +25°C -40°C 50 Span Range (Typ) 40 30 +125°C 20 Offset (Typ) 10 0 PSI 0 kPa 0.3 2.0 0.6 0.9 4.0 6.0 1.2 8.0 1.5 10 Pressure Differential Figure 2. Output vs. Pressure Differential 70 Linearity 60 Output (mVdc) 50 Actual Span (VFSS) 40 30 Silicone Die Coat Stainless Steel Metal Cover Die P1 Wire Bond Epoxy Case Theoretical 20 Offset (VOFF) 10 0 0 Pressure (kPa) Max Figure 3. Linearity Specification Comparison Lead Frame P2 RTV Die Bond POP Figure 4. Unibody Package — Cross-Sectional Diagram (Not to Scale) MPX10 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Part Number MPX10D Case Type 344 Pressure (P1) Side Identifier Stainless Steel Cap MPX10DP 344C Side with Part Marking MPX10GP 344B Side with Port Attached MPXV10GC6U 482A Side with Port Attached MPXV10GC7U 482C Side with Port Attached MPX10 Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS C R M 1 B 2 -A- Z 4 3 DIM A B C D F G J L M N R Y Z N L 1 2 3 4 PIN 1 -TSEATING PLANE J F G F D 4 PL 0.136 (0.005) STYLE 1: PIN 1. 2. 3. 4. Y M T A DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL M STYLE 2: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT STYLE 3: PIN 1. 2. 3. 4. VCC - SUPPLY + SUPPLY GROUND NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30˚ NOM 30˚ NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00 GND -VOUT VS +VOUT CASE 344-15 ISSUE AA UNIBODY PACKAGE SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -A- -T- U L R H N PORT #1 POSITIVE PRESSURE (P1) -Q- B 1 2 3 4 PIN 1 K -P0.25 (0.010) J M T Q S S F C G D 4 PL 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT CASE 344B-01 ISSUE B UNIBODY PACKAGE MPX10 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. -AU V PORT #1 R W L H PORT #2 PORT #1 POSITIVE PRESSURE (P1) PORT #2 VACUUM (P2) N -QB SEATING PLANE SEATING PLANE 1 2 3 4 PIN 1 K -P-T- -T- 0.25 (0.010) M T Q S S F J G D 4 PL C 0.13 (0.005) M T S S Q S DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38 STYLE 1: PIN 1. 2. 3. 4. GROUND + OUTPUT + SUPPLY - OUTPUT CASE 344C-01 ISSUE B UNIBODY PACKAGE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPX10 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPX10 8 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. 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