Freescale Semiconductor Technical Data MPVZ5010G Rev 0, 09/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPVZ5010G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, healthcare, industrial and automotive market. The analog output can be read directly into the A/D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. MPVZ5010G SERIES INTEGRATED PRESSURE SENSOR 0 to 10 kPA (0 to 1019.78 mm H2O) 0.2 to 4.7 V OUTPUT SMALL OUTLINE PACKAGE SURFACE MOUNT Features • • • • 5.0% Maximum Error over 0° to 85°C Temperature Compensated over -40° to +125°C Durable Thermoplastic (PPS) Package Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples • Washing Machine Water Level Measurement (Reference AN1950) • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Appliance Liquid Level and Pressure Measurement • Respiratory Equipment MPVZ5010GW6U CASE 1735-01 MPVZ5010G6U/T1 CASE 482-01 SMALL OUTLINE PACKAGE THROUGH-HOLE ORDERING INFORMATION Device Type Case No. MPVZ Series Order No. Packing Options Surface Mount 1735-01 MPVZ5010GW6U Rails MZ5010GW Through-Hole 1560-02 MPVZ5010GW7U Rails MZ5010GW Surface Mount 482-01 MPVZ5010G6U Rails MZ5010G Surface Mount 482-01 MPVZ5010G6T1 Tape & Reel MZ5010G Through-Hole 482B-03 MPVZ5010G7U Rails MZ5010G J Device Marking MPVZ5010GW7U CASE 1560-02 MPVZ5010G7U CASE 482B-03 PIN NUMBERS(1) 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © Freescale Semiconductor, Inc., 2005. All rights reserved. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1 and 5 through 8 are NO CONNECTS for surface mount package Pins 4, 5, and 6 are NO CONNECTS for unibody package Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 40 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPVZ5010G 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit POP 0 — 10 1019.78 kPa mm H2O Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 5.0 10 mAdc Pressure Range (1) Minimum Pressure Offset(3) @ VS = 5.0 Volts (0 to 85°C) Voff 0 0.2 0.425 Vdc Full Scale Output(4) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.475 4.7 4.925 Vdc Full Scale Span(5) @ VS = 5.0 Volts (0 to 85°C) VFSS 4.275 4.5 4.725 Vdc Accuracy(6) (0 to 85°C) — — — ±5.0 %VFSS V/P — 450 4.413 —- mV/kPa mV/mm H2O Response Time(7) tR — 1.0 —- ms Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc Warm-Up Time(8) — — 20 —- ms Offset Stability(9) — — ±0.5 —- %VFSS Sensitivity 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPVZ5010G Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPVZ5010G series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other Fluoro Silicone Gel Die Coat than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Stainless Steel Cap Die +5 V P1 Thermoplastic Case Wire Bond Vout OUTPUT Vs Lead Frame IPS 1.0 µF P2 0.01 µF GND 470 pF Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram SOP (not to scale) 5.0 Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Transfer Function (kPa): Vout = VS × (0.09 × P + 0.04) ± 5.0% VFSS VS = 5.0 Vdc TEMP = 0 to 85°C 4.0 Output (V) 3.0 TYPICAL MAX 2.0 MIN 1.0 0 0 2.0 4.0 6.0 8.0 10 Differential Pressure (kPa) Figure 4. Output versus Pressure Differential MPVZ5010G 4 Sensors Freescale Semiconductor Transfer Function (MPVZ5010G) Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V ± 0.25 Vdc P = kPa Temperature Error Band MPVZ5010G SERIES 4.0 3.0 Temperature Error Factor 2.0 Temp Multiplier –40 0 to 85 +125 3 1 3 1.0 0.0 –40 –20 0 20 40 80 60 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band 0.5 0.4 0.3 Pressure Error (kPa) 0.2 0.1 0 –0.1 Pressure (kPa) 0 1 2 3 4 5 6 7 8 9 10 –0.2 –0.3 –0.4 –0.5 Pressure 0 to 10 (kPa) Error (Max) ±0.5 (kPa) MPVZ5010G Sensors Freescale Semiconductor 5 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media. The MPX pressure sensor Part Number is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Case Type MPVZ5010GW6U 1735-01 Vertical Port Attached MPVZ5010GW7U 1560-02 Vertical Port Attached MPVZ5010G6U/T1 482-01 Stainless Steel Cap 482B-03 Stainless Steel Cap MPVZ5010G7U MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPVZ5010G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5010G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5010G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5010G Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5010G 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5010G Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5010G 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -ANOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. 4 5 -BG 8 1 0.25 (0.010) M T B D 8 PL S A S DETAIL X S PIN 1 IDENTIFIER N C -T- SEATING PLANE DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 K M J DETAIL X CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ5010G Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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