FREESCALE MPVZ5150GC6T1

Freescale Semiconductor
Technical Data
Document Number: MPVZ5150
Rev 0, 11/2006
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPVZ5150 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
MPVZ5150
SERIES
INTEGRATED PRESSURE SENSOR
0 to 150 kPa (0 to 21.75 PSI)
0.2 to 4.7 V Output
SMALL OUTLINE PACKAGES
Features
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Patented Silicon Shear Stress Strain Gauge
Easy-to-Use Chip Carrier Option
Increased media compatibility fluorocarbon gel
MPVZ5150GC6T1
CASE 482A-01
MPVZ5150GC7U
CASE 482C-03
Typical Applications
•
•
•
•
Level Indicators
Process Control
Pump/Motor Control
Pressure Switching
PIN NUMBER(1)
1
2
3
4
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series Order
Device Marking
Number
482A
MPVZ5150GC6T1 MPVZ5150G
482C
MPVZ5150GC7U
MPVZ5150G
VS
Thin Film
Temperature
Compensation
and Gain
Stage # 1
Sensing
Element
Gain Stage # 2
and Ground
Reference
Shift Circuitry
VOUT
Pins 1 and 5 through 8 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
© Freescale Semiconductor, Inc., 2006. All rights reserved.
5
6
7
8
N/C
N/C
N/C
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin1 is noted by the
notch in the lead.
MPVZ5150 SERIES
Ported
Gauge, Axial Port, SMT
Elements Gauge, Axial Port, DIP
N/C
VS
GND
VOUT
TABLE 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
-40° to +125°C
°C
TA
-40° to +125°C
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
0
—
150
kPa
Supply Voltage
VS
4.75
5.0
5.25
VDC
Supply Current
IO
—
7.0
10
mAdc
(0 to 85°C)
VOFF
0.088
0.200
0.313
VDC
Full Scale Output(4)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
VFSO
4.588
4.700
4.813
VDC
Full Scale Span(5)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
VFSS
—
4.500
—
VDC
—
—
—
±2.5
%VFSS
V/P
—
30
—
mV/kPa
Response Time
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
IO+
—
0.1
—
mAdc
—
—
20
—
ms
—
—
±0.5
—
%VFSS
Pressure
Range(1)
(2)
Minimum Pressure Offset(3)
@ VS = 5.0 V
Accuracy(6)
Sensitivity
(7)
Warm-Up
Offset
1.
2.
3.
4.
5.
6.
7.
8.
9.
Time(8)
Stability(9)
1 kPa (kiloPascal) equals 0.145 PSI.
Device is ratiometric within this specified excitation range.
Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPVZ5150
2
Sensors
Freescale Semiconductor
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 3 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
Operating characteristics, internal reliability and qualification
tests are based on use of dry clean air as the pressure media.
Media other than dry clean air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
3
MIN
MAX
2
150
135
120
75
60
45
30
15
0
0
105
TYP
1
90
Output Voltabe (V)
4
Span Range (Typ)
Vout = VS*(0.006*P(kPa)+0.04)
± (PE * TM * 0.006 * Vs)
VS = 5.0 V ± 0.25 Vdc
PE = 3.75 kPa
TM = 1 @ 0 to 85°C
TM = 3 @ +125°C
TM = 3 @ -40°C
Vs = 5.0 V +/- 0.25 Vdc
Output Range (Typ)
5
Pressure (kPa)
(Typ)
Offset
Figure 2. Output Vs. Pressure Differential
Stainless
Steel Cap
Die
Gel Die Coat
P1
Thermoplastic
Case
Wire Bond
Lead Frame
P2
Die Bond
Differential Sensing
Element
Figure 3. Cross Sectional Diagrams (Not to Scale)
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
+5.0 V
VOUT
OUTPUT
Vs
IPS
1.0 µF
0.01 µF
GND
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646)
MPVZ5150
Sensors
Freescale Semiconductor
3
Transfer Function (MPVZ5150 Series)
Nominal Transfer Value: VOUT = VS x (0.006 x P(kPa) + 0.04)
± (Pressure Error x Temp. Mult. x 0.006 x VS)
VS = 5.0 V ± 0.25 Vdc
Temperature Error Multiplier
MPVZ5150 Series
Break Points
Temp
4.0
Multiplier
- 40
0 to 85°C
+125°
3.0
3
1
3
2.0
1.0
0.0
-40
-20
0
20
40
60
Temperature in °C
80
100
120
140
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
MPVZ5150 Series
Error Limits for Pressure
4.0
3.0
Error (kPa)
2.0
1.0
0.0
0
25
50
75
100
125
150
Pressure in kPa
-1.0
-2.0
-3.0
Pressure
Error (max)
-4.0
0 to 150 kPa
± 3.75 kPa
MPVZ5150
4
Sensors
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorocarbon gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using Table 3
below.
TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Part Number
Case Type
Pressure (P1) Side Identifier
MPVZ5150GC6T1
482A
Top with Port Attached
MPVZ5150GC7U
482C
Top with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
footprint, the packages will self align when subjected to a
design. The footprint for the surface mount packages must be
solder reflow process. It is always recommended to design
the correct size to ensure proper solder connection interface
boards with a solder mask layer to avoid bridging and
between the board and the package. With the correct
shorting between solder.
Figure 5. Small Outline Package Footprint
MPVZ5150
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
-A-
D
8 PL
4
0.25 (0.010)
5
N
M
T B
A
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
-T-
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
-A4
5
N
-BG
0.25 (0.010)
8
1
M
T B
D 8 PL
S
A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
-T-
INCHES
MILLIMETERS
MAX
MAX MIN
MIN
10.79
0.425 10.54
0.415
10.79
0.425 10.54
0.415
13.21
0.520 12.70
0.500
0.864
0.66
0.034
0.026
0.100 BSC
2.54 BSC
0.28
0.23
0.011
0.009
3.05
2.54
0.120
0.100
15˚
0˚
15˚
0˚
11.38
0.448 11.28
0.444
14.22
0.560 13.72
0.540
6.48
6.22
0.255
0.245
3.17
2.92
0.125
0.115
SEATING
PLANE
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPVZ5150
6
Sensors
Freescale Semiconductor
How to Reach Us:
Home Page:
www.freescale.com
E-mail:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
+1-800-521-6274 or +1-480-768-2130
http://www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
http://www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
[email protected]
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
[email protected]
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
[email protected]
MPVZ5150
Rev 0
11/2006
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2006. All rights reserved.