Freescale Semiconductor Technical Data Document Number: MPVZ5150 Rev 0, 11/2006 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPVZ5150 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. MPVZ5150 SERIES INTEGRATED PRESSURE SENSOR 0 to 150 kPa (0 to 21.75 PSI) 0.2 to 4.7 V Output SMALL OUTLINE PACKAGES Features • • • • • 2.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Patented Silicon Shear Stress Strain Gauge Easy-to-Use Chip Carrier Option Increased media compatibility fluorocarbon gel MPVZ5150GC6T1 CASE 482A-01 MPVZ5150GC7U CASE 482C-03 Typical Applications • • • • Level Indicators Process Control Pump/Motor Control Pressure Switching PIN NUMBER(1) 1 2 3 4 ORDERING INFORMATION Device Type Options Case No. MPX Series Order Device Marking Number 482A MPVZ5150GC6T1 MPVZ5150G 482C MPVZ5150GC7U MPVZ5150G VS Thin Film Temperature Compensation and Gain Stage # 1 Sensing Element Gain Stage # 2 and Ground Reference Shift Circuitry VOUT Pins 1 and 5 through 8 are NO CONNECTS GND Figure 1. Fully Integrated Pressure Sensor Schematic © Freescale Semiconductor, Inc., 2006. All rights reserved. 5 6 7 8 N/C N/C N/C N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin1 is noted by the notch in the lead. MPVZ5150 SERIES Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, DIP N/C VS GND VOUT TABLE 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 400 kPa Storage Temperature TSTG -40° to +125°C °C TA -40° to +125°C °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP 0 — 150 kPa Supply Voltage VS 4.75 5.0 5.25 VDC Supply Current IO — 7.0 10 mAdc (0 to 85°C) VOFF 0.088 0.200 0.313 VDC Full Scale Output(4) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSO 4.588 4.700 4.813 VDC Full Scale Span(5) @ VS = 5.0 V Differential and Absolute (0 to 85°C) VFSS — 4.500 — VDC — — — ±2.5 %VFSS V/P — 30 — mV/kPa Response Time tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc — — 20 — ms — — ±0.5 — %VFSS Pressure Range(1) (2) Minimum Pressure Offset(3) @ VS = 5.0 V Accuracy(6) Sensitivity (7) Warm-Up Offset 1. 2. 3. 4. 5. 6. 7. 8. 9. Time(8) Stability(9) 1 kPa (kiloPascal) equals 0.145 PSI. Device is ratiometric within this specified excitation range. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPVZ5150 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 4. The output will saturate outside of the specified pressure range. Figure 3 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. Operating characteristics, internal reliability and qualification tests are based on use of dry clean air as the pressure media. Media other than dry clean air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. 3 MIN MAX 2 150 135 120 75 60 45 30 15 0 0 105 TYP 1 90 Output Voltabe (V) 4 Span Range (Typ) Vout = VS*(0.006*P(kPa)+0.04) ± (PE * TM * 0.006 * Vs) VS = 5.0 V ± 0.25 Vdc PE = 3.75 kPa TM = 1 @ 0 to 85°C TM = 3 @ +125°C TM = 3 @ -40°C Vs = 5.0 V +/- 0.25 Vdc Output Range (Typ) 5 Pressure (kPa) (Typ) Offset Figure 2. Output Vs. Pressure Differential Stainless Steel Cap Die Gel Die Coat P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 3. Cross Sectional Diagrams (Not to Scale) Figure 4 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. +5.0 V VOUT OUTPUT Vs IPS 1.0 µF 0.01 µF GND 470 pF Figure 4. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) MPVZ5150 Sensors Freescale Semiconductor 3 Transfer Function (MPVZ5150 Series) Nominal Transfer Value: VOUT = VS x (0.006 x P(kPa) + 0.04) ± (Pressure Error x Temp. Mult. x 0.006 x VS) VS = 5.0 V ± 0.25 Vdc Temperature Error Multiplier MPVZ5150 Series Break Points Temp 4.0 Multiplier - 40 0 to 85°C +125° 3.0 3 1 3 2.0 1.0 0.0 -40 -20 0 20 40 60 Temperature in °C 80 100 120 140 Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C. Pressure Error Band MPVZ5150 Series Error Limits for Pressure 4.0 3.0 Error (kPa) 2.0 1.0 0.0 0 25 50 75 100 125 150 Pressure in kPa -1.0 -2.0 -3.0 Pressure Error (max) -4.0 0 to 150 kPa ± 3.75 kPa MPVZ5150 4 Sensors Freescale Semiconductor PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorocarbon gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using Table 3 below. TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Part Number Case Type Pressure (P1) Side Identifier MPVZ5150GC6T1 482A Top with Port Attached MPVZ5150GC7U 482C Top with Port Attached INFORMATION FOR USING THE SMALL OUTLINE PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and between the board and the package. With the correct shorting between solder. Figure 5. Small Outline Package Footprint MPVZ5150 Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -A- D 8 PL 4 0.25 (0.010) 5 N M T B A S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S DIM A B C D G H J K M N S V W W V C H J -T- MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE PIN 1 IDENTIFIER M K INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A4 5 N -BG 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MILLIMETERS MAX MAX MIN MIN 10.79 0.425 10.54 0.415 10.79 0.425 10.54 0.415 13.21 0.520 12.70 0.500 0.864 0.66 0.034 0.026 0.100 BSC 2.54 BSC 0.28 0.23 0.011 0.009 3.05 2.54 0.120 0.100 15˚ 0˚ 15˚ 0˚ 11.38 0.448 11.28 0.444 14.22 0.560 13.72 0.540 6.48 6.22 0.255 0.245 3.17 2.92 0.125 0.115 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ5150 6 Sensors Freescale Semiconductor How to Reach Us: Home Page: www.freescale.com E-mail: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 http://www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) http://www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. 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