FREESCALE MP3V5050

MP3V5050
Rev 0, 08/2008
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5050
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 50 kPa (0 to 7.25 psi)
0.06 to 2.82 V Output
The MP3V5050 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but
particularly those employing a microcontroller or microprocessor with A/D inputs.
This patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
•
•
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated Over –40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Small Outline Package (SOP)
Easy-to-Use Chip Carrier Option
Multiple Porting Options for Design Flexibility
Barbed Side Ports for Robust Tube Connection
MP3V5050GP
CASE 1369-01
MP3V5050DP
CASE 1351-01
MP3V5050GC6U
CASE 482A-01
SMALL OUTLINE PACKAGE
PIN NUMBERS(1)
1
N/C
5
N/C
2
VS
6
N/C
3
Gnd
7
N/C
4
Vout
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
ORDERING INFORMATION
Device Type
Options
Case No.
MP3V Series Order No.
Packing Options
Device Marking
SMALL OUTLINE PACKAGE (MP3V5050 SERIES)
Ported Elements Side Port
Dual Port
Axial Port
1369
MP3V5050GP
Trays
MP3V5050G
1351
MP3V5050DP
Trays
MP3V5050G
482A
MP3V5050GC6U
Rails
MP3V5050G
482A
MP3V5050GC6T1
Tape & Reel
MP3V5050G
© Freescale Semiconductor, Inc., 2008. All rights reserved.
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for Small Outline Package Device
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
200
kPa
Storage Temperature
Tstg
–40° to +125°
°C
Operating Temperature
TA
–40° to +125°
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MP3V5050
2
Sensors
Freescale Semiconductor
Table 2. . Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
50
kPa
Supply Voltage(2)
VS
2.7
3.0
3.3
Vdc
Supply Current
Io
—
7.0
10
mAdc
Minimum Pressure Offset(3)
@ VS = 3.0 Volts
(0 to 85°C)
Voff
0.053
0.12
0.188
Vdc
Full Scale Output(4)
@ VS = 3.0 Volts
(0 to 85°C)
VFSO
2.752
2.8
2.888
Vdc
Full Scale Span(5)
@ VS = 3.0 Volts
(0 to 85°C)
VFSS
—
2.7
—
Vdc
Accuracy(6)
(0 to 85°C)
—
—
—
±2.5
%VFSS
V/P
—
54
—-
mV/kPa
Response Time(7)
tR
—
1.0
—-
ms
Output Source Current at Full Scale Output
Io+
—
0.1
—-
mAdc
Warm-Up Time(8)
—
—
20
—-
ms
Offset Stability(9)
—
—
±0.5
—-
%VFSS
Sensitivity
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MP3V5050
Sensors
Freescale Semiconductor
3
Figure 3 illustrates the Differential/Gauge Sensing Chip in
the basic chip carrier (Case 482). A fluorosilicone gel isolates
the die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the sensor
diaphragm.
The MP3V5050 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 4. The
output will saturate outside of the specified pressure range.
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
3
Transfer Function:
Vout = VS*(0.018*P+0.04) ± ERROR
VS = 3.0 Vdc
TEMP = 0 to 85°C
Output (V)
2
TYPICAL
MAX
MIN
1
0
0
5
10
15
20
25
30
35
40
45
50
55
Differential Pressure (kPa)
Figure 2. Output versus Pressure Differential
FLUOROSILICONE
GEL DIE COAT
3V
STAINLESS
STEEL CAP
DIE
P1
WIRE BOND
Vout
THERMOPLASTIC
CASE
OUTPUT
Vs
IPS
LEAD
FRAME
1.0 µF
DIFFERENTIAL
SENSING ELEMENT
0.01 µF
GND
470 pF
P2
DIE BOND
Figure 3. Cross-Sectional Diagram SOP
(not to scale)
Figure 4. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.)
MP3V5050
4
Sensors
Freescale Semiconductor
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
± (Pressure Error x Temp. Factor x 0.018 x VS)
VS = 3.0 V ± 0.30 Vdc
Temperature Error Band
MP3V5050 SERIES
4.0
Temp
3.0
Temperature
Error
Factor
–40
0 to 85
+125
2.0
Multiplier
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
Pressure (in kPa)
0.0
0
–1.0
10
20
30
40
50
60
–2.0
Pressure
Error (Max)
0 to 50 (kPa)
±1.25 (kPa)
–3.0
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MP3V pressure
Part Number
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Case Type
Pressure (P1) Side Identifier
MP3V5050GP
1369
Side with Port Attached
MP3V5050DP
1351
Side with Part Marking
MP3V5050GC6U/T1
482A
Vertical Port Attached
MP3V5050
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
6
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
7
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Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5050
9
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Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050
10
Sensors
Freescale Semiconductor
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MP3V5050
Rev 0
08/2008
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