FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-27300-4E
ASSP
BIPOLAR
VOLTAGE DETECTOR
MB3761
■ DESCRIPTION
Designed for voltage detector applications, the Fujitsu MB3761 is a dual comparator with a built-in high precision
reference voltage generator. Outputs are open-collector outputs and enable use of the OR-connection between
both channels. Both channels have hysteresis control outputs. Because of a wide power supply voltage range
and a low power supply current, the MB3761 is suitable for power supply monitors and battery backup systems.
■ FEATURES
•
•
•
•
•
Wide power supply voltage range: 2.5 V to 40 V
Low power and small voltage dependency supply current: 250 µA Typ
Built-in stable low voltage generator: 1.20 V Typ
Easy-to-add hysteresis characteristics.
One type of package (SOP-8pin : 1 type)
■ APPLICATIONS
• Industrial Equipment
• Arcade Amusement
etc.
Copyright©1994-2006 FUJITSU LIMITED All rights reserved
MB3761
■ PIN ASSIGNMENT
(TOP VIEW)
IN-B
(+)
1
B
HYS-A
2
IN-A
3
OUT-A
4
8
VCC
7
HYS-B
6
OUT-B
5
GND
(-)
(+)
A
(-)
(FPT-8P-M01)
2
MB3761
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Min
Max
Unit
Power Supply Voltage
VCC
⎯
41
V
Output Voltage
VO
⎯
41
V
Output Current
IO
⎯
50
mA
Input Voltage
VIN
− 0.3
+ 6.5
V
Power Dissipation
PD
⎯
350
(TA ≤ +70°C)
mW
TSTG
− 55
+ 125
°C
Storage Temperature
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
Value
Unit
Min
Max
VCC
2.5
40
V
Operating Ambient Temperature
TA
− 20
+ 75
°C
Output Current at pin 4
IO4
⎯
4.5
mA
Output Current at pin 6
IO6
⎯
3.0
mA
Power Supply Voltage
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
3
MB3761
■ ELECTRICAL CHARACTERISTICS
(TA=+25°C, VCC=5 V)
Parameter
Power Supply Voltage
Threshold Voltage
Deviation of Threshold
Voltage
Offset Voltage between
Outputs
Conditions
Value
Min
Typ
Max
Unit
ICCL
VCC= 40 V, VIL= 1.0 V
-
250
400
µA
ICCH
VCC= 40 V, VIH = 1.5 V
-
400
600
µA
VTH
IO = 2 mA, VO= 1 V
1.15
1.20
1.25
V
∆VTH1
2.5 V ≤ VCC ≤ 5.5 V
-
3
12
mV
∆VTH2
4.5 V ≤ VCC ≤ 40 V
-
10
40
mV
VOOSA
IOA= 4.5 mA, VOA= 2 V,
IHA= 20 µA, VHA= 3 V
-
2.0
-
mV
VOSSB
IOB= 3 mA, VOB= 2 V,
IHB= 3 mA, VHB= 2 V
-
2.0
-
mV
-20°C ≤ TA ≤ +70°C
-
±0.05
-
mV/°C
-10
-
+10
mV
Temperature Coefficient of
Threshold Voltage
α
Difference Voltage on
Threshold Voltage between
Channel
∆VTHAB
-
IIL
VIL= 1.0 V
-
5
IIH
VIH= 1.5 V
-
100
500
nA
Output Leakage Current
IOH
VO= 40 V, VIL= 1.0 V
-
-
1
µA
Hysteresis Output Leakage
Current
IHLA
VCC= 40 V, VHA= 0 V,
VIL= 1.0 V
-
-
0.1
µA
IHHB
VHB= 40 V, VIH= 1.5 V
-
-
1
µA
IOLA
VO= 1.0 V, VIH= 1.5 V
6
12
-
mA
IOLB
VO= 1.0 V, VIH= 1.5 V
4
10
-
mA
IHHA
VH= 0 V, VIH= 1.5 V
40
80
-
µA
IHLB
VH= 1.0 V,VIL = 1.0 V
4
10
-
mA
VOLA
IO= 4.5 mA, VIH = 1.5 V
-
120
400
mV
VOLB
IO= 3.0 mA, VIH= 1.5 V
-
120
400
mV
VHHA
IH= 20 µA, VIH= 1.5 V
-
50
200
mV
VHLB
IH= 3.0 mA, VIL= 1.0 V
-
120
400
mV
tPHL
RL= 5 kΩ
-
2
-
µs
tPLH
RL= 5 kΩ
-
3
-
µs
Input Current
Output Sink Current
Hysteresis Current
Output Saturation Voltage
Hysteresis Saturation
Output Delay Time
4
Symbol
nA
MB3761
■ EQUIVALENT CIRCUIT
HYS-A
2
OUT-A
4
8
V CC
7
HYS-B
5
GND
V REF
1.2 V
3
1
6
IN-A
IN-B
OUT-B
■ OPERATIONAL DEFINITIONS
VO(A)
VIN
R4
VCC
R6
RL
R1
1
8
2
7
3
6
R5
R3
RL
VIL(A)
VIH(A)
VIN
V H(B)
HYS-B
VH(B)
OUT-B
VO(B)
4
5
R2
VIN
VO(A)
OUT-A
VO(B)
GND
VIN
VIL(B) VIH(B)
Note:
VIH(A)
= (1 + R1 )VR
R2
VIL(A) = (1 +
R1 )VR − R1 VCC
R3
R2 // R3
VIH(B)
R4
= (1 +
) VR
R5 // R6
VIL(B) = (1 + R4 ) VR
R5
.
VR .=. VTH (=. 1.20 V)
R2 // R3 =
R2 R3
R2 + R 3
R5 // R6 =
R5 R6
R5 + R6
5
MB3761
■ TYPICAL PERFORMANCE CHARACTERISTICS
Power Supply Current vs. Power Supply Voltage
Ta=+70˚C
Ta=+25˚C
Ta=-20˚C
400
VIH = 1.5 V
300
Ta=+70˚C
200
Ta=-20˚C
VIL = 1.0 V Ta=+25˚C
100
0 0
10
20
30
Hysteresis (A) Current IHHA (µA)
150
500
Power Supply Current ICC (µA)
Hysteresis (A) Current vs. Power Supply Voltage
Ta=+70˚C
120
Ta=+25˚C
Ta=-20˚C
90
VIH = 1.5 V
60
30
0 0
40
10
Power Supply Voltage VCC (V)
Output Saturation (A) Voltage vs.
Output Sink (A) Current
Output Saturation (B) Voltage VOLB (V)
Output Saturation (A) Voltage VOLA (V)
Ta=
Ta=
-20˚C +25˚C
VCC = 5 V
Ta=
+70˚C
VIH = 1.5 V
0.6
0.4
0.2
0
0
5
10
15
20
25
Ta= Ta=
Ta=
-20˚C +25˚C +70˚C
0.8
VCC = 5 V
VIH = 1.5 V
0.6
0.4
0.2
0
0
5
10
15
20
25
Output Sink (B) Current IOL(B) (mA)
Threshold Voltage vs.
Operating Ambient Temperature
Threshold Voltage vs. Power Supply Voltage
1.22
Threshold Voltage VTH (V)
Threshold Voltage VTH (V)
1.22
1.21
1.20
Ta = +25˚C
1.19
1.18
10
20
30
Power Supply Voltage V
CC
6
40
1.0
Output Sink (A) Current IOL(A) (mA)
1.17 0
30
Output Saturation (B) Voltage vs.
Output Sink (B) Current
1.0
0.8
20
Power Supply Voltage VCC (V)
40
(V)
1.21
1.20
1.19
V CC = 5 V
1.18
1.17-20
0
+20
+40
+60
+80
Operating Ambient Temperature Ta (°C)
MB3761
■ APPLICATION EXAMPLES
1. Addition of Hysteresis
VO(A)
VCC (VIN)
R1
1
8
2
7
3
6
4
5
RL
R2
VIL(A)
VIN (VCC)
VIH(A)
VO(A)
R1 + R2
.
VIH(A) =. (1 +
)V R
R3
R3
.. (1 + R2 )V R
VIL(A) =
R3
GND
VH(B)
VCC
R1
RL
1
8
2
7
VH(B)
3
6
VO(B)
4
5
VIH
R2
R3
VO(B)
C1
VIH
VIL(B)
GND
VIH(B)
VIH(B) .=. (1 + R1 )V R
R2
R1
.
VIL(B) =. (1 +
)V R
R2 + R3
Note : All calculations occur with the output voltage
at 0. The hysteresis values are adjusted for
load condition and saturation voltage.
2. Voltage Detection for Alarm
VO
VCC
R3
RL
R1
R2
1
8
2
7
3
6
4
5
VO
VCCL
VCCH
VCC
VCCH = (1 + R1 )VR
R2
R4
GND
For hysteresis, a positive feedback from pin 2 or 7 is required.
VCCL = (1 + R3 )VR
R4
VCCL ≥ 2.5 V
7
MB3761
3. Voltage Detection for Alarm
VO
VCC
R3
RL
R1
R4
1
8
2
7
3
6
4
5
VO
VCC
VCCL
VCCH
R2
GND
VCCH = (1 +
R3
)VR
R4
VCCL = (1 + R1 )VR
R2
VCCL ≥ 2.5 V
4. Programmable Zener
V CC
V Z = (1 +
R1
VZ
R2
+
R3
1
8
2
7
3
6
4
5
VZ
≤ V CC - V Z ≤ 6 mA
R1
R2 + R3
GND
Note : Channel B can be used independently.
8
R2
) VR
R3
MB3761
5. Recovery Reset Circuit
V CC = 5 V
R1
R2
3.3 kΩ
15 kΩ
R4
330 kΩ
6.8 kΩ
R3
1
8
2
7
3
6
4
5
OUT
R5
6.8 kΩ
0.1 µF
C1
OUT
GND
9
MB3761
■ TYPICAL CHARACTERISTICS
DC Characteristics
Response Characteristics
V CC (V)
V O (V)
6
4
0
V O (V)
2
0
1
3
2
4
6
5
Power-On Reset Time is provided by the following
approximate equation:
tRST
10
R1 (R2 + R3 )
VTH
R3 R4
= -C1 R4 • In
VTH
{ 1 - VCC
(1 +
R1
R2 + R3
•
The recommended value of hFE of the external
transistor is from 50 to 200.
•
In the case of an instant power fail,
the remaining charge in C1 effects tRST.
•
If necessary, the reversed output is provided
on HYS terminal
{
•
= VCCL +
V CC
V CC (H)
VO
4.4
t RST
≈ 30 ms
Voltage Threshold Levels (VCCL and VCCH) and
Hysteresis Width can be changed by the resistors
(R1 through R4).
R1 + R2 + R3
VCCL =
VTH
R3
VCCH
V CC (L)
0
0
V CC (V)
•
5
)
MB3761
■ NOTES ON USE
• Take account of common impedance when designing the earth line on a printed wiring board.
• Take measures against static electricity.
- For semiconductors, use antistatic or conductive containers.
- When storing or carrying a printed circuit board after chip mounting, put it in a conductive bag or container.
- The work table, tools and measuring instruments must be grounded.
- The worker must put on a grounding device containing 250 kΩ to 1 MΩ resistors in series.
• Do not apply a negative voltage
- Applying a negative voltage of −0.3 V or less to an LSI may generate a parasitic transistor, resulting in
malfunction.
■ ORDERING INFORMATION
Part number
Package
Remarks
MB3761PF-❏❏❏
8-pin plastic SOP
(FPT-8P-M01)
Conventional version
MB3761PF-❏❏❏E1
8-pin plastic SOP
(FPT-8P-M01)
Lead Free version
■ RoHS Compliance Information of Lead (Pb) Free version
The LSI products of Fujitsu with “E1” are compliant with RoHS Directive , and has observed the standard of
lead, cadmium, mercury, Hexavalent chromium, polybrominated biphenyls (PBB) , and polybrominated diphenyl
ethers (PBDE) .
The product that conforms to this standard is added “E1” at the end of the part number.
■ MARKING FORMAT (Lead Free version)
Lead Free version
3761
E1XXXX
XXX
INDEX
11
MB3761
■ LABELING SAMPLE (Lead free version)
Lead free mark
JEITA logo
MB123456P - 789 - GE1
(3N) 1MB123456P-789-GE1
1000
(3N)2 1561190005 107210
JEDEC logo
G
Pb
QC PASS
PCS
1,000
MB123456P - 789 - GE1
2006/03/01
ASSEMBLED IN JAPAN
MB123456P - 789 - GE1
1/1
0605 - Z01A
1000
1561190005
Lead Free version
12
MB3761
■ MB3761PF-❏❏❏E1 RECOMMENDED CONDITIONS OF MOISTURE SENSITIVITY LEVEL
Item
Condition
Mounting Method
IR (infrared reflow) , Manual soldering (partial heating method)
Mounting times
2 times
Storage period
Before opening
Please use it within two years after
Manufacture.
From opening to the 2nd
reflow
Less than 8 days
When the storage period after
opening was exceeded
Please processes within 8 days
after baking (125 °C, 24H)
5 °C to 30 °C, 70%RH or less (the lowest possible humidity)
Storage conditions
[Temperature Profile for FJ Standard IR Reflow]
(1) IR (infrared reflow)
H rank : 260 °C Max
260 °C
255 °C
170 °C
~
190 °C
(b)
RT
(a)
(a) Temperature Increase gradient
(b) Preliminary heating
(c) Temperature Increase gradient
(d) Actual heating
(d’)
(e) Cooling
(c)
(d)
(e)
(d')
: Average 1 °C/s to 4 °C/s
: Temperature 170 °C to 190 °C, 60s to 180s
: Average 1 °C/s to 4 °C/s
: Temperature 260 °C Max; 255 °C or more, 10s or less
: Temperature 230 °C or more, 40s or less
or
Temperature 225 °C or more, 60s or less
or
Temperature 220 °C or more, 80s or less
: Natural cooling or forced cooling
Note : Temperature : the top of the package body
(2) Manual soldering (partial heating method)
Conditions : Temperature 400 °C Max
Times
: 5 s max/pin
13
MB3761
■ PACKAGE DIMENSION
8-pin plastic SOP
(FPT-8P-M01)
8-pin plastic SOP
(FPT-8P-M01)
Lead pitch
1.27 mm
Package width ×
package length
5.3 × 6.35 mm
Lead shape
Gullwing
Sealing method
Plastic mold
Mounting height
2.25 mm MAX
Weight
0.10 g
Code
(Reference)
P-SOP8-5.3×6.35-1.27
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
+0.25
+.010
+0.03
*1 6.35 –0.20 .250 –.008
0.17 –0.04
+.001
8
.007 –.002
5
*2 5.30±0.30 7.80±0.40
(.209±.012) (.307±.016)
INDEX
Details of "A" part
+0.25
2.00 –0.15
+.010
.079 –.006
1
1.27(.050)
"A"
4
0.47±0.08
(.019±.003)
0.13(.005)
(Mounting height)
0.25(.010)
0~8˚
M
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
+0.10
0.10 –0.05
+.004
.004 –.002
(Stand off)
0.10(.004)
C
14
2002 FUJITSU LIMITED F08002S-c-6-7
Dimensions in mm (inches).
Note: The values in parentheses are reference values.
MB3761
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
Edited
Business Promotion Dept.
F0605