LATTICE XPIO110GXS

XPIO 110GXS
Lowest
Power
10G
SERDES
!
Fully Integrated 10Gbps
Serializer/Deserializer Device
August 2004
Data Sheet
Features
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General Description
The XPIO™ 110GXS is a fully integrated 10 Gbps serializer/deserializer device designed for high-speed
switches and routers that require very low power budget
and a small footprint as well. Centering on 10 Gbps
speed, the XPIO 110GXS is a versatile chip that is
capable of handling applications in various standards,
such as OC-192 (9.95 Gbps) and 10GE (10.31 Gbps).
Single chip SERDES solution with
integrated transmitter and receiver
Continuous serial operation range from
9.95 Gbps to 10.31 Gbps
Parallel LVDS data range from 622 Mbps to
644 Mbps
Low power consumption (800 mW typical)
Performs 16:1 serialization and 1:16
deserialization
Embedded Limiting Amplifier enhances
receiver sensitivity
Low-jitter PLL for clock generation
On-chip Clock Data Recovery circuit
On-chip FIFO to decouple transmit clocks
Bit order swap for 10GE operations
Programmable 4-phase LVDS clock output
for easy system design
Repeating serial data output
Line loopback, diagnostic loopback, and
simultaneous loopback modes
Frequency Lock Alarm Output
Programmable differential output swing on
both Serial driver and Parallel LVDS driver
1.3V core voltage and 2.5V I/O voltage
Supports 10GE (10-Gigabit Ethernet),
OC-192, XFP, XSBI and SFI-4.1 interfaces
269-pin flip-chip BGA (15 x 15 mm body
size, 0.8 mm pitch)
-40 to 85°C operating temperature
An on-chip low jitter PLL generates all required clocks
based on an external reference clock at 1/16 or 1/64 frequency of the serial data rate, which is 622.08 MHz or
155.52 MHz, respectively, for OC-192 applications. An
Integrated Limiting Amplifier allows flexibility in placement and reduced bit-error rates (BER).
Fabricated with state-of-the-art CMOS technology, the
XPIO 110GXS performs all necessary functions for
serial-to-parallel and parallel-to-serial conversions, and
consumes less than one third of the power consumed
by the more conventional SiGe Bi-CMOS designs.
Overview
The XPIO 110GXS consists primarily of blocks of parallel-to-serial and serial-to-parallel functions plus system
timing. Low Voltage Differential Signaling (LVDS) is
used for parallel signal input and output while Current
Mode Logic (CML) is used for serial transmission and
reception. A limiting amplifier is designed into the chip
to improve serial receiver sensitivity. The system timing
blocks consist of the clock-multiplier-unit (CMU), LVPLL
(LVDS interface timing Phase-Lock-Loop) and CDR
(clock-data-recovery) units, which generate clocks for
the chip. Figure 1 shows the XPIO 110GXS chip block
diagram.
Table 1. XPIO 110GXS Supported Protocols
Device
Standards Supported
Data Rate
XPIO 110GXS
OC-192
10GE
9.95 Gbps
10.31 Gbps
© 2004 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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1
xpio110_08
Lattice Semiconductor
XPIO 110GXS Data Sheet
Figure 1. XPIO 110GXS Block Diagram
RX_LOS_POL
LB_LVDS_Enb
1
RX_LV_EN
RX_D_LV_P[0]
RX_D_LV_N[0]
.
.
.
RX_LOS
RX_REF_CK_Enb
0
RX_CLK
0
LVDS
Output
Bit
Order
Logic
0
1
1
16
RX_D_LV_P[15]
RX_D_LV_N[15]
RX_REF_CK_P
RX_REF_CK_N
REF_CK_P
REF_CK_N
RX_D_RP_Enb
RX_D_RP_P
RX_D_RP_N
RX_CK_LV_P *
RX_CK_LV_N
Deserializer
1:16
DEMUX
Clock
Data
Recovery
Serial
Data
SC_LOCK_DIFF[1:0]
RX_FILT_EXT_P
RX_FILT_EXT_N
RX_LOCK
RX_LV_CKDLY[1:0]
SC_LV_ISET[1:0]
RX_LOCK2REFb
Limiting
Amplifier
SC_LSB1STb
RX_D_P
RX_D_N
REF_CK_SEL
TX_CP_ISET[1:0]
CK622OUT_P
CK622OUT_N
TX_D_LV_P[0]
TX_D_LV_N[0]
.
.
.
TX_D_LV_P[15]
TX_D_LV_N[15]
1
0
Bit
Order
Logic
16
0
CMU 622
Out
TX_CK622_PA[1:0]
TX_LOCK
TX_FILT_EXT_P
TX_FILT_EXT_N
CK622OUT_SEL
LVDS
Input
TX_CLK
Serializer
16:1 MUX
FIFO_WRITE_CK
TX_LV_PLLBPb
Clock
Multiplier
Unit
1
LB_P622_Enb
0
TX
FIFO
1
FIFO_RD_CK
TX_FIFO_INIT
TX_FIFO_ERR
TX_CK_LV_P
TX_CK_LV_N
TX_CK_LV_PA[1:0]
LVPLL
TX CML
DRIVER
TX_CK_LV_SEL
2
TX_D_P
TX_D_N
TX_D_EN
TX_CML_ISET[1:0]
Lattice Semiconductor
XPIO 110GXS Data Sheet
The XPIO 110GXS is divided into a transmitter section and a receiver section. The major operations performed by
the chip are:
Transmitter Operation
1. Low jitter clock generation via the Clock-Multiplier-Unit (CMU)
2. 16-bit LVDS parallel data input
3. Parallel-to-serial conversion
10Gbps CML serial data output
Receiver Operation
1. CML serial input to a limiting amplifier
2. Clock and data recovery
3. Serial-to-parallel conversion
4. 16-bit LVDS parallel data output, with a synchronizing clock output
5. Built-in LVDS line loopback, and LVDS diagnostic loopback modes for testing and network diagnosis
Functional Description
The XPIO 110GXS transceiver is a low power, low jitter, and fully integrated serializer/deserializer chip. It operates
in the data rate range of 9.95-10.31 Gbps, performs all necessary parallel-to-serial and serial-to-parallel conversions. The chip is suitable for applications utilizing OC-192 and 10GE. The serial interface I/O uses the CML standard while the low speed parallel I/O is based on the LVDS standard. These standards are compliant to both the
Optical Interface Forum's SFI-4 standard and the 10GE’s XSBI standard. The LVDS parallel I/O can be directly
connected to Multi-Standard-Agreement (MSA) 300 systems.
To accommodate bit order differences between OC-192 and 10GE, the XPIO 110GXS provides the capability of bit
swapping. The data presented on TX_D_LV_P/N[15] or MSB is transmitted first, followed in order by
TX_D_LV_P/N[14] to TX_D_LV_P/N[0] when SC_LSB1STb is not connected or is connected to a logic high.
TX_D_LV_P/N[0] or LSB is transmitted first followed in order by TX_D_LV_P/N[1] to TX_D_LV_P/N[15] when
SC_LSB1STb is connected to a logic low. The parallel receive bus mirrors this behavior. The SC_LSB1STb unconnected, or at logic high, the first serial bit received is presented on RX_D_LV_P/N[15]. Conversely the first bit
received is presented on RX_D_LV_P/N[0] when SC_LSB1STb is pulled low.
Transmitter
The transmitter performs the serialization process, converting the 16-bit parallel LVDS data stream to a serial data
stream at approximately a 10 Gbps data rate. The transmitter consists of a LVDS data receiver, a FIFO, a 16:1 serializer, a low jitter CMU, and a 10Gbps output data driver.
LVDS Data Receiver
The Input and Analog Pin Assignments and Descriptions table in this document shows the 16 LVDS differential
data input pairs (TX_D_LV_P/N [15:0]). Data applied at the transmit data pairs is aligned to the LVDS input clock
(TX_CK_LV_P/N), which can be either 1/16th or 1/32nd the transmit data rate (622.08 or 311.04 nominally for OC192). The clock rate is selected through the assertion or deassertion of the TX_CK_LV_SEL pin. Figure 13
describes the LVDS data relationship to the LVDS input clock.
The LVDS input receivers convert the LVDS signals to CMOS signals. The converted signals are latched based on
an internal clock that is generated from the TX_CK_LV_P/N input clock through a phase-lock-loop (LVPLL). In
order to achieve optimal latch timing, the phase relationship between the internal clock and the TX_CK_LV_P/N
clock can be adjusted by programming TX_CK_LV_PA[1:0]. The LVDS PLL can also be bypassed by the assertion
of the TX_LV_PLLBPb pin, which is a desirable feature in some applications. When the LVPLL is bypassed it is up
to the system designer to manage the TX_CK_LV_P/N input.
Transmitter FIFO
A 16 bit wide and 8-word deep FIFO is designed into the XPIO 110GXS to decouple the LVDS clock from the serial
transmission clock. In addition, the FIFO also improves the tolerance to minor phase differences between the FIFO
write clock and read clock due to phase drift or phase wander.
3
Lattice Semiconductor
XPIO 110GXS Data Sheet
The FIFO circuitry indicates an overflow or underflow condition by asserting TX_FIFO_ERR high. The
TX_FIFO_ERR only provides status information about an overflow or underflow. It does not indicate which of the
two events actually occurred. During the period of time when the TX_FIFO_ERR signal is asserted, the TX_D_P/N
pins toggle at a constant rate. This prevents the AC coupling capacitors from becoming blocking capacitors.
The transmit FIFO’s read and write pointers can be recentered by asserting the TX_FIFO_INIT pin high. Thus, one
way to automatically recenter the FIFO read/write pointers after TX_FIFO_ERR is asserted is to connect
TX_FIFO_INIT and TX_FIFO_ERR together.
The FIFO read/write pointers are re-centered after:
• Device power on reset
• Transmitter reset (asserting RESET_TXb low)
• CMU PLL is out of lock
Serialization
The output data bus from the FIFO feeds a 16:1 serializer to generate a 9.953 Gbps (OC-192 rate) data stream.
The high-speed clock (TX_CLK) is a low jitter clock generated by the CMU. The serializer uses TX_CLK to clock
out high-speed data.
TX CML Driver
The serial data stream in turn becomes an input to a differential high-speed CML data driver. The TX_D CML driver
incorporates an internal 50-ohm termination resistor on both P and N branches for impedance matching with the
PCB transmission line. The CML output may require AC coupling (as in Figure 5). The output current of the CML
driver can be adjusted using two configuration pins, TX_CML_ISET[1:0]. These configuration pins are used to balance power consumption and performance.
In normal operation, the data presented at the LVDS TX inputs requires about nine clocks to transit the various
logic blocks before being presented at the TX CML driver output.
Clock-Multiplier-Unit (CMU)
The CMU consists of a differential PLL that is capable of producing a very low jitter serial clock. The clock is generated through a reference clock (REF_CLK_P/N) at either 1/16th or 1/64th the data transmission rate (This is nominally 622.08 or 155.52 MHz for OC-192 data rates). This reference clock must be generated from a differential
crystal oscillator that has a frequency accuracy of better than ±20ppm for SONET applications.
The CMU PLL can provide a phase-adjustable parallel data rate clock (CK622OUT_P/N) that is 1/16th the transmit
data rate to clock other devices or systems. The output of CK622OUT_P/N meets the LVDS signaling specifications. Using the TX_CK622_PA[1:0] configuration pins, the phase can be adjusted in T/4 increments, where T is the
period of the clock for the parallel interface.
Receiver
Limiting Amplifier
The XPIO 110GXS 10 Gbps CMOS receiver integrates a highly sensitive limiting amplifier. The XPIO 110GXS also
implements an amplifier offset compensation technology that works in conjunction with the limiting amplifier to
achieve superior amplifier input sensitivity. Sufficient gain is designed into the limiting amplifier to detect a peak-topeak differential input as small as 50mV. This attenuated signal can be properly detected and amplified to saturation.
Clock and Data Recovery (CDR)
One of the most critical circuits in the receiver is the clock and data recovery (CDR) block. The CDR block extracts
the clock from an incoming high-speed, non-return to zero (NRZ) data, and retimes the data based on an external
reference clock. Extraction of the clock embedded in the serial data-stream is performed through comparison of the
phase relationship between transitions of the data and the external reference clock.
4
Lattice Semiconductor
XPIO 110GXS Data Sheet
The external reference clock is essential for the CDR block. The reference clock provides two functions: One function is training the VCO in the CDR PLL to the serial data-stream frequency. The other is to generate a stable clock
when the input serial data is absent. The CDR PLL creates an internal reference frequency. The reference frequency is monitored, and a loss of lock is asserted when it goes out of specification.
Lock Detect
The XPIO 110GXS implements a CDR lock detector circuit that monitors the frequency of the internal clock.
RX_LOCK is asserted whenever a REF_CK or RX_REF_CK are operating within specification. RX_LOCK is deasserted under some specific circumstances:
1. When RX_RESETb is asserted (i.e. ‘0’)
2. When the REF_CK (or RX_REF_CK) is not present.
3. When the clock recovered from the incoming datastream falls outside the range specified by the
SC_LOCK_DIFF input pins. When the recovered clock is out of range, RX_LOCK will deassert briefly and then
be reasserted as it relocks to the REF_CK (RX_REF_CK). This effectively leaves the RX_LOCK signal toggling
as it attempts to reacquire the clock embedded in the RX_D_P/N data inputs.
Deserialization
The XPIO 110GXS uses a 1:16 demultiplexer to deserialize the high speed data from the CDR. The demultiplexer
generates the 16 bit parallel data stream. The bit order presented on the RX_D_LV_P/N[0..15] LVDS outputs mirrors the order on the TX_D_LV[0..15]P/N LVDS inputs. The first data bit received by the CDR is present on
RX_D_LV_P/N[15] when SC_LSB1STb is connected to a logic high, and it is present on RX_D_LV_P/N[0] when
SC_LSB1STb is connected to a logic low.
LVDS Data Transmitter
The 16-bit parallel data and clock are sent out via the RX_D_LV_P/N[0..15] and RX_LV_CK_P/N LVDS pins,
respectively. Data on the RX_D_LV_P/N pins is synchronous to the RX_LV_CK_P/N output pins. The data coming
in on the RX_D_P/N pins requires around five clocks to arrive at the RX_D_LV_P/N outputs. The output current of
the LVDS outputs is adjustable using the SC_LV_ISET[1:0] configuration pins. System designers can use these
pins to optimize the LVDS receive data performance.
XFP Module Considerations
The XPIO110GXS was conceived and implemented prior to the finalization of the XFP specification. The implication of this is the CML TX voltage swing is typically higher than that specified in the XFP MSA documents.
The XFP MSA specification indicates a XFP module should accept a maximum of 800mV input swing. In practice it
is the individual XFP module internal architecture that defines the maximum range. However, most XFP modules
simply rate themselves to the 800mV specification regardless of the likelihood they may operate beyond the range
specified in the XFP MSA.
Actual operation of the XPIO110GXS with existing XFP modules shows these still operate with the CML swing set
to the default TX_CML_ISET[1:0] = “11”. In order to more closely match the XFP specification a
TX_CML_ISET[1:0] = “01” configuration is recommended. This places the typical output swing from the CML TX
outputs at 650mV to 1100mV.
Loopback Operation
The XPIO 110GXS supports several loopback operations to provide diagnostic functions and to aid in performing
SONET/SDH functional tests.
LVDS Diagnostic Loopback
In LVDS loopback mode, 16 bit-wide data is fed into the TX LVDS input. The XPIO 110GXS routes data from the
LVDS transmit interface to the internal receiver interface, and then repeats the data at the LVDS RX output.
To enable this mode of operation set BIST_ENb=0, LB_LVDS_ENb=0, and BIST_LB_SC[1:0]=10.
5
Lattice Semiconductor
XPIO 110GXS Data Sheet
Figure 2. LVDS Loopback Mode Block Diagram
LB_LVDS_ENb=0
BIST_ENb=0
BIST_LB_SC0=0
BIST_LB_SC1=1
RX_D_P
RX_D_LV[0..15]
RX
LVDS Data
Deserializer
1
0
10G RX
RX_D_N
RX_CK_LV_P/N
LVDS Clock
Bypass
LVDS Data
Loopback
TX_D_P
TX_D_LV[0..15]
TX_CL_LV_P/N
1
0
TX
LVDS Data
Serializer
10G TX
TX_D_N
CMU
REF_CK_P/N
LVDS Line Loopback
Line loopback is a diagnostic mode that establishes a parallel connection between the output of the deserializer
and the input to the serializer. When this mode is active, serial receive data is deserialized, and internally looped
back to the serializer. The data provided at the serializer is transmitted via the CML output. Line loopback is activated by setting the LB_P622_Enb pin to a logic low.
Mode 1: Synchronous line loopback without clock clean-up. Driving LB_P622_Enb low enables line loopback
mode. Connecting the LVDS output clock, RX_CK_LV_P/N, to REF_CK_P/N makes the loopback mode synchronous. In addition, a separate reference clock is input to RX_REF_CKP/N for use by the CDR logic. The data transmitted across the TX_D_P/N pins is now timed to the LVDS clock making the RX and TX data synchronous.
However, the RX_CK_LV_P/N does not require SONET/SDH tolerance in order to transmit the parallel LVDS data.
This means the data repeated on TX_D_P/N will have significant jitter.
Figure 3. Line Loopback Mode 1 Block Diagram
LVDS Loopback
Mode 1
LB_LVDS_ENb=1
BIST_ENb=0
BIST_LB_SC0=0
BIST_LB_SC1=1
RX_D_LV[0..15]
RX_CK_LV_P/N
RX_D_P
RX
LVDS
Data
Deserializer
1
0
10G RX
RX_D_N
Parallel
Loopback
LB_P622_ENb=0
TX_D_P
TX_D_LV[0..15]
TX_CL_LV_P/N
1
0
TX
LVDS
Data
Serializer
TX_D_N
CMU
REF_CK_P/N
6
10G TX
Lattice Semiconductor
XPIO 110GXS Data Sheet
Mode 2: Synchronous line loopback with clock clean-up. Driving LB_P622_Enb low enables line loopback
mode. In order to make this loopback mode SONET/SDH compliant the CK622OUT_P/N must be connected to a
VCXO-powered PLL chip (e.g. MAX3670), and CK622OUT_SEL pulled/driven high. The output of the PLL provides
a low jitter reference clock that is in phase with the data presented at the LVDS parallel outputs. This reference
clock is connected to REF_CK_P/N. As in Mode 1 a separate reference clock is input to RX_REF_CK_P/N to drive
the CDR logic. Data on the TX_D_P/N and RX_D_P/N pins are now synchronous, and the data repeated on
TX_D_P/N meets SONET/SDH line loopback application requirements.
Figure 4. Line Loopback Mode 2 Block Diagram
LVDS Loopback
Mode 1
LB_LVDS_ENb=1
BIST_ENb=0
BIST_LB_SC0=0
BIST_LB_SC1=1
RX_D_LV[0..15]
RX_CK_LV_P/N
RX_D_P
RX
LVDS
Data
Deserializer
1
0
10G RX
RX_D_N
Parallel
Loopback
LB_P622_ENb=0
TX_D_P
1
TX_D_LV[0..15]
TX_CL_LV_P/N
TX
LVDS
Data
0
Serializer
10G TX
TX_D_N
CMU
REF_CK_P/N
Low Jitter Clock
Synchronous to
REF_CK_P/N
CK622_OUT_PN
External Low Jitter PLL
(e.g. MAX 3670)
To REF_CK_P/N
CK622OUT_SEL = 1
Reference
PLL
Reference Clocks
There are two AC coupled reference clock input pairs, REF_CK_P/N, and RX_REF_CK_P/N. The CDR block is
driven by either REF_CK_P/N or RX_REF_CK_P/N. The CMU block is only driven by REF_CK_P/N. The reference
clock input frequency for REF_CK_P/N can be either 1/16th (622MHz) or 1/64th (155MHz) the transmitter/receiver
data rate. Likewise, RX_REF_CK_P/N can be 1/16th or 1/64th the 10Gbps receiver rate. RX_REF_CK_P/N and
REF_CK_P/N are configured in tandem to 1/16th or 1/64th by REF_CK_SEL. They cannot be configured independently. AC coupling for all reference clocks is recommended.
7
Lattice Semiconductor
XPIO 110GXS Data Sheet
Driving RX_REF_CK_P/N is only necessary when:
• The transmitter and receiver run at independent data rates
• Line Loopback Mode 1 is active
• Line Loopback Mode 2 is active
Figure 5 shows how a reference clock is input to the XPIO 110GXS using an AC coupling scheme.
Figure 5. CML Output Driver Termination (AC Coupled)
VDD
VDD
50Ω
50Ω
50Ω
0.1µF
XPIO 110GXS
50Ω
0.1µF
Zo = 50Ω
External
Figure 6. CML Input Receiver (AC Coupled)
DCFB
VDD
0.1µ
0.1µ
Z0 = 50
50
External
XPIO
8
50
Lattice Semiconductor
XPIO 110GXS Data Sheet
Figure 7. Differential Oscillator Driving to XPIO 110GXS Clock Input (AC Coupled)
0.1µF
0.1µF
100Ω
Zo = 50Ω
External
XPIO 110GXS
Figure 8. LVDS Output and Input Connection
100Ω
Zo = 50Ω
LVDS Output
External
LVDS Input
Figure 9. External Loop Filter Components
0.39µF
0.01 µF
396Ω
TX_FILT_EXTP
396Ω
RX_FILT_EXTP
TX_FILT_EXTN
9
RX_FILT_EXTN
Lattice Semiconductor
XPIO 110GXS Data Sheet
PCB Layout Recommendations
The TX/RX filter components should be small form factor capacitors and resistors. They should be placed as close
as possible to the XPIO 110 device.
The TX filter components should be surrounded by a copper trace to GND. As shown below, the RX filter components should be enclosed by the GND.
Figure 10. PCB Layout Examples
TX External Filter
PCB Layout Example
RX External Filter
PCB Layout Example
1
13 14 15 16 17
A
L
B
M
C
N
D
E
GND
Copper Trace
GND
Copper Trace
GND Pin
Bottom View
These diagrams for example purposes only.
10
2
3
4
5
GND Pin
Lattice Semiconductor
XPIO 110GXS Data Sheet
Electrical Specifications
AC Signaling Definitions
Figure 11. Differential Voltage Measurements
V
V+
VICM, VOCM
VIS, VOS
V-
T
V+ -V-
VID, VOD =2 x VIS, VOS
T
Figure 12. Rise and Fall Time Measurements
80%
20%
tR
tF
Figure 13. LVDS Data to Clock Relationship of Transmitter, 1/16 th of Frequency (622.08MHz for OC-192)
TX_CK_LV_N, TX_CK_LV_SEL = 1, fclk = 622.08MHz
tSU
tCKP
tHD
tCKH
TX_D_LV_P/N[15:0]
Note: TX_D_LV_P/N[15:0] is latched using the rising edge of TX_CK_LV_N.
11
Lattice Semiconductor
XPIO 110GXS Data Sheet
Figure 14. LVDS Data to Clock Relationship of Transmitter, 1/32 nd of Frequency (311.04MHz for OC-192)
TX_CK_LV_P, TX_CK_LV_SEL = 0, fclk = 311.04MHz
tCKP
tSU
tCKH
tHD
TX_D_LV_P/N[15:0]
Figure 15. LVDS Data to Clock Relationship of Receiver
RX_D_LV_P/N[15:0]
tCQB
tCQA
RX_CK_LV_P
12
Lattice Semiconductor
XPIO 110GXS Data Sheet
Configuration Pin Descriptions
Pin Name
State
Action
Transmitter Controls
TX_D_EN
TX_LV_PLLBPb
TX_FIFO_INIT
1
TX_D_P/N output is active
0
TX_D_P/N output is inactive.
1
The internal LVDS PLL is active
0
The internal LVDS PLL is bypassed. External clock management and
phase adjustment is required when this pin is 0.
1
Initialize the TXFIFO
0
No action
11
TX_CML_ISET[1:0]
10
See VOD in the High Speed Input/Output Specifications section of this
data sheet.
01
00
TX_CK622_PA[1:0]1
RESET_TXb
PWDN_TXb
TX_CK_LV_SEL
11
3T/42
10
Adjust T/2
01
Adjust T/4
00
No Adjust
1
Transmitter in normal operation
0
Resets the transmitter
1
Transmitter is operating
0
Transmitter is powered down
1
TX_CK_LV is 1/16 of frequency
0
TX_CK_LV is 1/32 of frequency
TX_CK_LV_SEL = 1/16th of Frequency
TX_CK_LV_PA[1:0]
TX_CP_ISET[1:0]
11
Clock delay = 0
10
Clock delay = -T/16
01
Clock delay = T/16
00
Clock delay = T/8
nd
TX_CK_LV_SEL = 1/32 of Frequency
11
Clock delay = T/4
10
Clock delay = T/4-T/32
01
Clock delay = T/4+T/32
00
Clock delay = T/4+T/16
11
622MHz clock (default using internal pull-ups)
10
Invalid
01
Invalid
00
155MHz clock
1
RX_REF_CK is disabled
0
RX_REF_CK is enabled
11
LVDS output clock is delayed: 90ps
10
LVDS output clock is delayed: 180ps
01
LVDS output clock is delayed: 270ps
00
LVDS output clock is delayed: 360ps
Receiver Controls
RX_REF_CK_ENb
RX_LV_CKDLY[1:0]
13
Lattice Semiconductor
XPIO 110GXS Data Sheet
Configuration Pin Descriptions (Continued)
Pin Name
State
Action
RX_LOS_POL = 0
1
0
Receiver OK
1
RX_LOS is an active-low input
0
RX_LOS is an active-high input.
1
RX_D_RP_P/N signals are inactive
0
RX_D_RP_P/N signals are active
1
RX_PLL locks to the recovered receive data clock.
0
RX_PLL locks to the REF_CK or RX_REF_CK input
RX_LOS
RX_LOS_POL
RX_D_RP_ENb
RX_LOCK2REFb3
RX_LOS_POL = 1
Asserted by the receiver to indiReceiver OK
cate it has lost the data signal.
Asserted by the receiver to indicate it
has lost the data signal.
11
SC_LOCK_DIFF[1:0]3
10
01
See LOCKTOL in the High Speed Input/Output Specifications section of
this data sheet.
00
11
SC_LV_ISET[1:0]
10
01
See VOS in the Low Speed Input/Output Specifications section of this data
sheet.
00
RX_LV_EN
PWDN_RXb
RESET_RXb
1
RX_D_LV_P/N[15:0] are enabled
0
RX_D_LV_P/N[15:0] are disabled
1
Receiver is operating
0
Receiver is powered down
1
Receiver normal operation
0
Resets the receiver logic.
1
CK622 sourced by CDR
0
CK622 sourced by CMU
1
TX_D_LV_P/N[15] transmitted over TX_D_P/N first
RX_D_LV_P/N[15] first bit received from RX_D_P/N (e.g. SONET applications)
0
TX_D_LV_P/N[0] transmitted over TX_D_P/N first
RX_D_LV_P/N[0] first bit received from RX_D_P/N (e.g. 10GE applications)
General Controls
CK622OUT_SEL
SC_LSB1STb
REF_CK_SEL4
BIST_ENb
BIST_LB_SC[1:0]
1.
2.
3.
4.
1
REF_CK is 1/16 of frequency (622.08MHz for OC-192)
0
REF_CK is 1/64 of frequency (155.52MHz for OC-192)
1
Normal operation, built-in self tests are disabled.
0
Built-in self test enabled. Enable this for LVDS loopback mode only.
11
Invalid
10
LVDS loopback mode enable
01
Invalid
00
Invalid
Only available when CK622OUT_SEL = 0 (CMU CLK Mode).
T = period
Locks to REF_CK when RX_REF_CK_Enb = 1. Locks to RX_REF_CK when RX_REF_CK_Enb = 0.
Applies to RX_REF_CK also.
14
Lattice Semiconductor
XPIO 110GXS Data Sheet
Absolute Maximum Ratings1, 2, 3
1.3V Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 1.43V
2.5V Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.75V
DC Input Voltage (Differential Inputs). . . . . . . . . . . . . . -0.3 to VDD25 + 0.3V
DC Input Voltage (LVCMOS Inputs) . . . . . . . . . . . . . . . -0.3 to VDD25 + 0.3V
Output Current (Differential Outputs) . . . . . . . . . . . . . . . . . . . ±50 mA
Output Current (LVCMOS Outputs) . . . . . . . . . . . . . . . . . . . . ±15 mA
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C
Case Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . -55 to 125°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, following the programming specifications).
2. Thermal characteristics, maximum ratings, and thermal compliance requirements can be found in the Lattice Thermal Management document.
3. All voltages referenced to GND.
Recommended Operating Conditions
Parameter
Symbol
Test Condition
Min.
Typ.
Max.
Units
Ambient Temperature (Commercial)
TA
0
70
°C
Ambient Temperature (Industrial)
TA
-40
85
°C
1.3V Supply Voltage
VDDAR
VDDAT
VDDL
VDDT
VDDR
1.23
1.30
1.37
V
2.5V Supply Voltage
VDDAT25
VDDAR25
VDDH
2.37
2.5
2.63
V
15
Lattice Semiconductor
XPIO 110GXS Data Sheet
Electrical Characteristics
High Speed Input/Output Specifications
Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
AC Characteristics
tR
CML output rise time
See Figure 12.
—
35
45
ps
tF
CML output fall time
See Figure 12.
—
35
45
ps
fREFCLK
Input reference clock frequency
(REF_CK_P/N)
REF_CK_SEL = 1
622.08
—
644.53
MHz
REF_CK_SEL = 0
155.52
—
161.13
MHz
Receiver input reference clock
REF_CK_SEL = 1
frequency (RX_REF_CK_P/N, active only in
applications where REF_CK_P/N is used as REF_CK_SEL = 0
a transmitter)
622.08
—
644.53
MHz
fREFCLK
155.52
—
161.13
MHz
tDCREF
Reference clock duty cycle
40
—
60
%
∆ fREFCLK Reference clock frequency tolerance
-100
—
100
ppm
VDDT = 1.3V, See Figure 11.
0.65
—
1.0
V
VDDT = 1.3V,
TX_CML_ISET[1:0]=11,
See Figure 11.
1100
—
1750
VDDT = 1.3V,
TX_CML_ISET[1:0]=10
1000
—
1500
VDDT = 1.3V,
TX_CML_ISET[1:0]=01
650
—
1100
VDDT = 1.3V,
TX_CML_ISET[1:0]=00
1250
—
1800
DC Characteristics
VCOM
VOD
Serial output common mode voltage
(TX_D_P/N)
Serial output differential voltage swing
(TX_D_P/N)
mV
(pk-pk)
VID
Serial input differential voltage swing
(RX_D_P/N)
See Figure 11.
50
—
2000
mV
(pk-pk)
VICM
Serial input common mode voltage
(RX_D_P/N)
See Figure 11.
0.75
—
1.15
V
VID
Input voltage differential swing for
(REF_CK_P/N, RX_REF_CK_P/N)
See Figure 11.
250
—
2400
mV
(pk-pk)
—
0.085
—
UI
Performance Characteristics
JGEN
Transmitter jitter generation (peak to peak)
tACQ
Transmitter CMU PLL acquisition time
LOCKTOL
Frequency difference at which receiver PLL
goes out of lock
JTOL
Receiver jitter tolerance
tACQ
Receiver PLL acquisition time
—
10
—
µS
SC_LOCK_DIFF[1:0] = 11
—
1200
—
ppm
SC_LOCK_DIFF[1:0] = 10
—
600
—
ppm
SC_LOCK_DIFF[1:0] = 01
—
1200
—
ppm
SC_LOCK_DIFF[1:0] = 00
—
600
—
ppm
Exceeds SONET Jitter
Tolerance Mask
—
Note: Reference clock input characteristics should meet the following requirements for SONET/SDH applications:
-125 dBc/HZ @ 1 MHz offset
-105 dBc/HZ @ 100 KHz offset
16
10
—
µS
Lattice Semiconductor
XPIO 110GXS Data Sheet
Electrical Characteristics (Continued)
Low Speed Input/Output Specifications
Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
AC Characteristics
tR
LVDS output rise times
See Figure 12.
—
120
250
ps
tF
LVDS output fall times
See Figure 12.
—
120
250
ps
tCQB
LVDS output data invalid prior to LVDS output clock
See Figure 15.
—
—
150
ps
tCQA
LVDS output data invalid after LVDS
output clock
See Figure 15.
—
—
150
ps
fCLKOUT
LVDS output clock frequency, OC192 rate
(CK622OUT_P/N, RX_CK_LV_P/N)
—
622.08
—
MHz
tDCCLK
LVDS output clock frequency duty cycle
(CK622OUT_P/N, RX_CK_LV_P/N)
tCKH/tCKP
See Figure 13.
45
—
55
%
tR
LVDS input rise times
See Figure 12.
—
—
300
ps
tF
LVDS input fall times
See Figure 12.
—
—
300
ps
See Figure 13.
TX_CK_LV_SEL =1,
TX_CK_LV_PA[1:0]=11
260
—
—
ps
tSU
See Figure 13.
TX_CK_LV_SEL =0 and
TX_CK_LV_PA[1:0]=11
320
—
—
ps
See Figure 13.
TX_CK_LV_SEL =1 and
TX_CK_LV_PA[1:0]=11
260
—
—
ps
See Figure 13.
TX_CK_LV_SEL =0 and
TX_CK_LV_PA[1:0]=11
150
—
—
ps
TX_CK_LV_SEL is no connect
or high
—
622.08
—
MHz
TX_CK_LV_SEL is
connected to low
—
311.04
—
MHz
tCKH/tCKP
See Figure 13.
45
—
55
%
100Ω load on line-to-line
See Figure 11.
0.95
—
1.3
V
See Figure 11. 100Ω load on
line-to-line,
SC_LV_ISET[1:0]=11
100
—
165
mV
(pk-pk)
See Figure 11. 100Ω load on
line-to-line,
SC_LV_ISET[1:0]=10
50
—
100
mV
(pk-pk)
See Figure 11. 100Ω load on
line-to-line,
SC_LV_ISET[1:0]=01
80
—
125
mV
(pk-pk)
See Figure 11. 100Ω load on
line-to-line,
SC_LV_ISET[1:0]=00
130
—
210
mV
(pk-pk)
tSU
tHD
fCLK
tDCCLK
LVDS input data setup to LVDS input
clock
LVDS input data hold from LVDS input clock
LVDS input clock frequency at OC-192 rate
(TX_CK_LV_P/N)
LVDS input clock frequency duty cycle
(TX_CK_LV_P/N)
DC Characteristics
VOCM
VOS
LVDS transmitter common mode range
RX_D_LV_P/N[15:0], RX_CK_LV_P/N,
TX_CK622_P/N)
LVDS single-ended output voltage swing
(RX_D_LV_P/N[15:0], RX_CK_LV_P/N)
17
Lattice Semiconductor
XPIO 110GXS Data Sheet
Electrical Characteristics (Continued)
Low Speed Input/Output Specifications (Continued)
Over Recommended Operating Conditions
Symbol
Parameter
VICM
LVDS receiver common mode range
(TX_D_LV_P/N[15:0], TX_CK_LV_P/N)
VIH
LVDS input voltage HIGH
(TX_D_LV_P/N[15:0], TX_CK_LV_P/N)
VIS
LVDS single-ended input voltage swing
(TX_D_LV_P/N[15:0], TX_CK_LV_P/N)
Test Conditions
See Figure 11.
See Figure 11.
Min.
Typ.
Max.
Units
0.9
—
1.6
V
—
—
2.4
V
100
—
600
mV
(pk-pk)
Min.
Typ.
Max.
Units
1.6
—
2.6
V
LVCMOS Input/Output Specifications
Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
VIH
LVCMOS input high voltage
VIL
LVCMOS input low voltage
0
—
0.8
V
IIH
LVCMOS input high current
—
—
10
µA
IIL
LVCMOS input low current
VOH
LVCMOS output high voltage
With 4mA load
VOL
LVCMOS output low voltage
With 4mA load
IPU
LVCMOS input pull-up current
—
—
10
µA
2.0
—
2.5
V
0
—
0.4
V
90
—
170
µA
Min.
Typ.
Max.
Units
Power Supply Specifications
Over Recommended Operating Conditions
Symbol
Parameter
Test Conditions
PD
Power dissipation
—
0.8
1.05
W
IDD131
1.3V supply current
—
390
460
mA
IDD252
2.5V supply current
—
130
160
mA
1. 1.3V power supplies, including VDDAR, VDDAT, VDDL, VDDT, VDDR.
2. 2.5V power supplies, including VDDAR25, VDDAT25, VDDH.
18
Lattice Semiconductor
XPIO 110GXS Data Sheet
Common Pin Assignments and Descriptions4
Pad Name
Flip-chip BGA Ball Number4
Pin Description
RX analog circuit ground
E16, K14, L14, M15
TX analog circuit ground
F3, L5
I/O ground
D8, D9, E8, F7, F8, G8, H7, H8, H9, H10, J8, J9, J10, K8, K9, K10, L9,
L10, M10, N10, P10, R10, R11, R12
Logic circuit ground
C1, D12, D13, J12, M12, M16, N7, N14, P14, P15, R1
PLL ground
C12
High-speed limit amplifier ground
F14, G13, H13, J14
High-speed transmitter driver ground
F4, G5, H5, J4, K4, L4
VDDAR
RX analog circuit power
E11, F10, J15, J16
VDDAT
TX analog circuit power
M1, R8
VDDH
I/O power
C4, C5, C6, C7, C8, C9, C10, C11, D5, D10, D11, K11, L7, L8, L11, M6,
M7, M8, M9, M11, N11, N12, P9, P11, P12
GND
1, 3
VDDL
Logic circuit power
D4, E6, L12, R15, E10
VDDR
High-speed limit amplifier power
F15, F16
VDDT
High-speed transmitter driver power
J2, J3, M3
VDDAR25
Reference circuit power
J11
VDDAT25
Reference circuit power
F1
No connect
C2, C14, C15, C16, C17, D1, D14, D16, E1, E2, E4, E7, E13, E14, F5,
F6, F12, F13, F17, G4, G6, G10, G11, H4, H6, H12, J7, J13, J17, K5,
K6, K7, K12, K13, L6, L13, M2, M13, N2, N3, N5, N8, N9, N17, P3, P4,
P7, P16, P17, R2, R14
NC2
1. All grounds must be electrically connected at the board level.
2. NC pins should not be connected to any active signals, VDD or GND.
3. Balls for GND, VDDAR, VDDAT, VDDH, VDDL, VDDR, VDDT, VDDAR25 and VDDAT25 are connected within the substrate to their respective common signals.
4. Pin orientation A1 starts from the upper left corner of the top side view with alphabetical order ascending vertically and numerical order
ascending horizontally.
19
Lattice Semiconductor
XPIO 110GXS Data Sheet
Output Pin Assignments and Descriptions
Pin Name
Pin Description
TX_D_N
TX_D_P
10 Gbps CML transmit data. See Figure 5.
TX_LOCK
TX PLL lock indicator:
TX LOCK = 1, internal TX_CLK locked to REF_CLK;
TX LOCK = 0, PLL is unlocked.
CK622OUT_N
CK622OUT_P
RX_CK_LV_P
RX_CK_LV_N
Flip-chip
Function BGA Ball #
CML/
Out
K3
L3
LVCMOS/
Out
D7
622 MHz LVDS clock output. Phase is adjustable1 and locks to
CMU or CDR clock.2
LVDS/
Out
R4
R5
LVDS clock output. Clock is source synchronous to the LVDS
receive, runs at 622MHz and is phase adjustable.
LVDS/
Out
U9
T9
LVDS/
Out
T1, U1,
T2, U2
T3, U3
T4, U4
T5, U5
T6, U6
T7, U7
T8, U8
T10, U10
T11, U11
T12, U12
T13, U13
T14, U14
T15, U15
T16, U16
T17, U17
RX_LOCK
Receiver PLL lock indicator. The PLL locks to
REF_CK/RX_REF_CK.
RX_LOCK = 1, receiver PLL frequency is within 300 ppm;
RX_LOCK = 0, receiver PLL frequency is larger than 450 ppm;
Frequency difference range is adjustable by
SC_LOCK_DIFF[1:0].
LVCMOS/
Out
M17
RX_D_RP_P3
RX_D_RP_N
10 Gbps CML output, repeat data. This output repeats the data
at the RX_D_P/N inputs when RX_D_RP_Enb = 0. This output
can be used for diagnostic purposes and to evaluate the receivers limiting amplifier. These pins can be left unconnected if
unused.
CML/
Out
H14
G14
TX_FIFO_ERR
FIFO error. 1 = error, 0 = normal operation.
LVCMOS/
Out
D6
RX_D_LV_N[15], RX_D_LV_P[15],
RX_D_LV_N[14], RX_D_LV_P[14],
RX_D_LV_N[13], RX_D_LV_P[13],
RX_D_LV_N[12], RX_D_LV_P[12],
RX_D_LV_N[11], RX_D_LV_P[11],
RX_D_LV_N[10], RX_D_LV_P[10],
RX_D_LV_N[9], RX_D_LV_P[9],
RX_D_LV_N[8], RX_D_LV_P[8],
LVDS data output. See Figure 8.
RX_D_LV_N[7], RX_D_LV_P[7],
RX_D_LV_N[6], RX_D_LV_P[6],
RX_D_LV_N[5], RX_D_LV_P[5],
RX_D_LV_N[4], RX_D_LV_P[4],
RX_D_LV_N[3], RX_D_LV_P[3],
RX_D_LV_N[2], RX_D_LV_P[2],
RX_D_LV_N[1],RX_D_LV_P[1],
RX_D_LV_N[0], RX_D_LV_P[0]
1. CMU mode only.
2. Based on RX_REF_CK_Enb
3. Operation above 10.3Gbps is not supported.
20
Lattice Semiconductor
XPIO 110GXS Data Sheet
Input and Analog Pin Assignments and Descriptions1
Pin Name
Pin Description
RX_D_P, RX_D_N
10 Gbps CML input.
RX_REF_CK_P
RX_REF_CK_N
LVPECL/CML 155/622 MHz reference clock for RX. See
Figure 7.
REF_CK_N2
REF_CK_P
TX_CK_LV_N, TX_CK_LV_P
Function
Flip-chip
BGA
Ball #
CML/In
L15, K15
CML/In or
LVPECL/In
E17
D17
Transmitter reference clock input, see Figure 7. REF_CK is the
CMU reference clock.
CML/In
CML/In
N1
P1
LVDS TX clock, 622 MHz/311 MHz selectable, phase
adjustable.
LVDS/In
B9, A9
TX_D_LV_N[15], TX_D_LV_P[15] LVDS data input. See Figure 8.
TX_D_LV_N[14], TX_D_LV_P[14]
TX_D_LV_N[13], TX_D_LV_P[13]
TX_D_LV_N[12], TX_D_LV_P[12]
TX_D_LV_N[11], TX_D_LV_P[11]
TX_D_LV_N[10], TX_D_LV_P[10]
TX_D_LV_N[9], TX_D_LV_P[9]
TX_D_LV_N[8], TX_D_LV_P[8]
TX_D_LV_N[7], TX_D_LV_P[7]
TX_D_LV_N[6], TX_D_LV_P[6]
TX_D_LV_N[5], TX_D_LV_P[5]
TX_D_LV_N[4], TX_D_LV_P[4]
TX_D_LV_N[3], TX_D_LV_P[3]
TX_D_LV_N[2], TX_D_LV_P[2]
TX_D_LV_N[1], TX_D_LV_P[1]
TX_D_LV_N[0], TX_D_LV_P[0]
LVDS/In
B17, A17
B16, A16
B15, A15
B14, A14
B13, A13
B12, A12
B11, A11
B10, A10
B8, A8
B7, A7
B6, A6
B5, A5
B4, A4
B3, A3
B2, A2
B1, A1
RX_FILT_EXTP
RX_FILT_EXTN
RX External Filter. See Figure 9.
Analog
D15
E15
TX_FILT_EXTP
TX_FILT_EXTN
TX External Filter. See Figure 9.
Analog
M4
N4
RX_REF_CK_Enb
RX reference clock enable.
LVCMOS/In
M14
RX_LV_CKDLY[0]
RX_LV_CKDLY[1]
LVDS output clock delay programming.
LVCMOS/In
P13
R13
SC_LV_ISET[0]
SC_LV_ISET[1]
LVDS output current settings.
LVCMOS/In
R16
R17
RX_LOS
RX loss of signal. When RX_LOS is asserted, LVDS clock
RX_CK_LV_P/N is driven out, and the LVDS data pins are
muted (i.e. at differential 0).
LVCMOS/In
G12
RX_LOS_POL
RX lose signal polarity change.
LVCMOS/In
R7
RX_D_RP_Enb
Receive data repeater enable.
LVCMOS/In
H11
RX_LOCK2REFb
RX PLL lock to reference. The RX PLL locks to the recovered
data clock when this pin is unconnected/pulled high. The RX
PLL locks to either RX_REF_CK or REF_CK depending on the
state of RX_REF_CK_ENb.
LVCMOS/In
F11
SC_LOCK_DIFF[1]
SC_LOCK_DIFF[0]
Lock indicate frequency resolution settings.
LVCMOS/In
N13
N15
RESET_TXb
Transmitter reset.
LVCMOS/In
F9
LB_P622_Enb
Loopback enabled at parallel 622 MHz port.
LVCMOS/In
E12
LB_LVDS_Enb
Loopback of TX 16b LVDS to RX 16b LVDS.
LVCMOS/In
C13
TX_FIFO_INIT
FIFO initialization.
LVCMOS/In
D3
SC_LSB1STb
SERDES LSB 1 first out selection.
LVCMOS/In
F2
TX_CML_ISET[1]
TX_CML_ISET[0]
CML output current settings.
LVCMOS/In
J5
J1
21
Lattice Semiconductor
XPIO 110GXS Data Sheet
Input and Analog Pin Assignments and Descriptions1 (Continued)
Pin Name
Pin Description
Function
Flip-chip
BGA
Ball #
TX_CK_LV_PA[0]
TX_CK_LV_PA[1]
LVDS TX clock adjustment for 622 MHz or 311 MHz mode.
LVCMOS/In
G7
C3
TX_D_EN
10 Gbps CML TX enable.
LVCMOS/In
J6
TX_CK622_PA[1]
TX_CK622_PA[0]
CLK622 timing adjustment.
LVCMOS/In
P2
N6
PWDN_TXb
TX power down.
LVCMOS/In
P5
PWDN_RXb
RX power down.
LVCMOS/In
N16
RESET_RXb
RX reset.
LVCMOS/In
R6
CK622OUT_SEL
CK622 enable.
LVCMOS/In
P6
REF_CK_SEL
Ref CLK frequency selection.
LVCMOS/In
P8
RX_LV_EN
LVDS output enable.
LVCMOS/In
R9
TX_CP_ISET[1]
TX_CP_ISET[0]
TX charge pump current setting.
LVCMOS/In
R3, M5
TX_LV_PLLBPb
LVDS PLL bypass. Inverting phase of 622M clock
TX_CK_LV_P/N is used to sample the input parallel data.
LVCMOS/In
E9
TX_CK_LV_SEL
Sets TX_CK_LV_P/N frequency.
LVCMOS/In
G9
BIST ENb
Enable built-in self test. Used for LVDS loopback.
LVCMOS/In
E5
BIST LB SC[1]
TX_CP_ISE[0]
Configures LVDS loopback
D2, E3
1. All LVCMOS/In pins have built-in pullup resistors.
2. REF_CK is the CDR reference clock when RX_REF_CK_Enb = 1.
22
Lattice Semiconductor
XPIO 110GXS Data Sheet
Part Number Description
LS110GXS – X XXXXX X XX
Device Family
LS = Lattice SERDES
Optional Suffix
ES = Engineering Samples
Blank = Production
Device Number
110G = 1 Channel, 10Gbps
Grade
C = Commercial
I = Industrial
Standard Support
XS = XSBI (for 10G Ethernet) and
SFI-4.1 (for OC-192)
Package
CF269 = 269 Flip-chip BGA
Performance Grade
1 = 9.95 Gbps
2 = 9.95 - 10.31 Gbps
Ordering Information
Commercial
Part Number
Supported Data Rates (Gbps)
Voltage
Speed Grade
Package
Balls
LS110GXS-1CF269C
9.953
1.3V
-1
fcBGA
269
LS110GXS-2CF269C
9.953 to 10.31
1.3V
-2
fcBGA
269
Supported Data Rates (Gbps)
Voltage
Speed Grade
Package
Balls
9.953
1.3V
-1
fcBGA
269
Industrial
Part Number
LS110GXS-1CF269I
23