SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 OC-48/24/12/3 SONET/SDH MULTIRATE TRANSCEIVER FEATURES • • • • • • • • • Fully Integrated SONET/SDH Transceiver to Support Clock/Data Recovery and Multiplexer/Demultiplexer Functions Supports OC-48, OC-24, OC-12, Gigabit Ethernet, and OC-3 Data Rate With Autorate Detection Supports Transmit Only, Receiver Only, Transceiver and Repeater Functions in a Single Chip Through Configuration Pins Supports SONET/SDH Frame Detection On-Chip PRBS Generation and Verification Supports 4-Bit LVDS (OIF99.102) Electrical Interface Parity Checking and Generation for the LVDS Interface Single 2.5-V Power Supply Interfaces to Back Plane, Copper Cables, or • • • • • • • • • • • Optical Modules Hot Plug Protection Low Jitter PECL Compatible Differential Serial Interface With Programmable De-Emphasis for the Serial Output On-Chip Termination for LVDS and PECL Compatible Interface Receiver Differential Input Thresholds 150 mV Min Supports SONET Loop Timing Low Power CMOS ESD Protection >2 kV 155-MHz or 622-MHz Reference Clock Maintains Clock Output in Absence of Data Local and Remote Loopback 100-Pin PZP Package With PowerPAD™ Design With 5-mm × 5-mm (Typ) Heatsink DESCRIPTION The SLK2511B is a single chip multirate transceiver IC used to derive high-speed timing signals for SONET/SDH based equipment. The chip performs clock and data recovery, serial-to-parallel/parallel-to-serial conversion and frame detection function conforming to the SONET/SDH standards. The device can be configured to operate under OC-48, OC-24, OC-12, or OC-3 data rates through the rate selection pins or the autorate detection function. An external reference clock operating at 155.52 MHz or 622.08 MHz is required for the recovery loop, and it also provides a stable clock source in the absence of serial data transitions. The SLK2511B accepts 4-bit LVDS parallel data/clock and generates a NRZ SONET/SDH-compliant signal at OC-3, OC-12, OC-24, or OC-48 rates. It also recovers the data and clock from the serial SONET stream and demultiplexes it into 4-bit LVDS parallel data for full duplex operation. TXDATA0 and RXDATA0 are the first bits that are transmitted and received in time, respectively. The serial interface is a low jitter, PECL compatible differential interface. The SLK2511B provides a comprehensive suite of built-in tests for self-test purposes including local and remote loopback and PRBS (27-1) generation and verification. The device comes in a 100-pin VQFP package that requires a single 2.5-V supply with 3.3-V tolerant inputs on the control pins. The SLK2511B is power efficient, dissipating less than 900 mW at 2.488 Gbps, the OC-48 data rate, and it is characterised for operation from –40°C to 85°C. AVAILABLE PACKAGE OPTIONS (1) (1) TA PowerPAD QUAD (PZP) –40°C to 85°C SLK2511BPZP For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. BLOCK DIAGRAM 2 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 Submit Documentation Feedback 3 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 Table 1. TERMINAL FUNCTIONS TERMINAL NAME NO. TYPE DESCRIPTION CLOCK PINS REFCLKP, REFCLKN 94 95 LVDS/PECL compatible input Differential reference input clock. There is an on-chip 100-Ω termination resistor differentially placed between REFCLKP and REFCLKN. The dc bias is also provided on-chip for ac-coupled case. RXCLKP, RXCLKN 67 68 LVDS output Receive data clock. The data on RXDATA(0:3) is on the falling edges of RXCLKP. The interface of RXDATA(0:3) and RXCLKP is source synchronous (see Figure 7). TXCLKP, TXCLKN 79 80 LVDS input Transmit data clock. The data on TXDATA(0:3) is latched on the rising edge of TXCLKP. TXCLKSRCP, TXCLKSRCN 70 71 LVDS output Transmit clock source. A clock source generated from the SLK2511B to the downstream device (i.e., framer) that could be used by the downstream device to transmit data back to the SLK2511B. This clock is frequency-locked to the local reference clock. SRXDIP, SRXDIN 14 15 PECL compatible input Receive differential pairs; high-speed serial inputs. STXDOP, STXDON 9 8 PECL compatible input Transmit differential pairs; high-speed serial outputs. 73 74 LVDS output Frame sync pulse. This signal indicates the frame boundaries of the incoming data stream. If the frame-detect circuit is enabled, FSYNC pulses for four RXCLKP and RXCLKN clock cycles when it detects the framing patterns. 66–63, 60–57 LVDS output Receive data pins. Parallel data on this bus is valid on the falling edge of RXCLKP (seeFigure 7 ). RXDATA0 is the first bit received in time. 56 55 LVDS output Receive data parity output 88–81 LVDS input Transmit data pins. Parallel data on this bus is clocked on the rising edge of TXCLKP. TXDATA0 is the first bit transmitted in time. 99 98 LVDS input Transmit data parity input AUTO_DETECT 34 TTL input (with pulldown) Data rate autodetect enable. Enable the auto-detection function for different data rates. When AUTO_DETECT is high, the autodetection circuit generates RATEOUT0 and RATEOUT1 to indicate the data rates for the downstream device. CONFIG0, CONFIG1 17 18 TTL input (with pulldown) Configuration pins. Put the device under one of the four operation modes: TX only, RX only, transceiver, or repeater mode. (See Table 4) ENABLE 44 TTL input (with pullup) Standby enable. When this pin is held low, the device is disabled for IDDQ testing. When high, the device operates normally. FRAME_EN 27 TTL input (with pullup) Frame sync enable. When this pin is asserted high, the frame synchronization circuit for byte alignment is turned on. LCKREFN 24 TTL input (with pullup) Lock to reference. When low, RXCLKP/N output is forced to lock to REFCLK. When high, RXCLKP/N is the divided down clock extracted from the receive serial data. LLOOP 53 TTL input (with pulldown) Local loopback enable. When high, the serial output is internally looped back to its serial input. LOL 45 TTL output Loss of lock. When the clock recovery loop has locked to the input data stream and the phase differs by less than 100 ppm from REFCLK then LOL is high. When the phase of the input data stream differs by more than 100 ppm from REFCLK, then LOL is low. If the difference is too big (> 500 ppm), the LOL output is not valid. LOOPTIME 51 TTL input (with pulldown) Loop timing mode. When high, the PLL for clock synthesizer is bypassed. The recovered clock timing is used to send the transmit data. LOS 46 TTL output Loss of signal. When no transitions appear on the input data stream for more than 2.3 µs, a loss of signal occurs and LOS goes high. The device also transmits all zeroes downstream using REFCLK as its clock source. When a valid SONET signal received the LOS signal goes low. PRBSEN 41 TTL input (with pulldown) PRBS testing enable. When this pin is asserted high, the device is put into the PRBS testing mode. 4 and 5 TTL input (with pulldown) Programmable de-emphasis control. Combinations of these two bits can be used to optimize serial data transmission. PS 21 TTL input (with pulldown) Polarity select. This pin, used with the SIGDET pin, sets the polarity of SIGDET. When high, SIGDET is an active low signal. When low, SIGDET is an active high signal. RATEOUT0, RATEOUT1 37 36 TTL output Autorate detection outputs. When AUTO_DETECT is high, the autodetection circuit generates these two bits to indicate the data rates for the downstream device. RESET 48 TTL input TXFIFO and LOL reset pin. Low is reset and high is normal operation. SERIAL SIDE DATA PINS PARALLEL SIDE DATA PINS FSYNCP, FSYNCN RXDATA[0:3] P/N RXPARP, RXPARN TXDATA[0:3] P/N TXPARP, TXPARN CONTROL/STATUS PINS PRE1, PRE2 4 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 Table 1. TERMINAL FUNCTIONS (continued) TERMINAL NAME TYPE NO. DESCRIPTION RLOOP 54 TTL input (with pulldown) Remote loopback enable. When high, the serial input is internally looped back to its serial output with the timing extracted from the serial data. RSEL0, RSEL1 39 38 TTL input (with pulldown) Data rate configuration pins. Puts the device under one of the four data rate operations: OC-48, OC-24, OC-12, or OC-3. RX_MONITOR 47 TTL input (with pulldown) RX parallel data monitor in repeater mode. This pin is only used when the device is put under the repeater mode. When high, the RX demux circuit is enabled and the parallel data is presented. When low, the demux is shut down to save power. SIGDET 20 TTL input (with pulldown) Signal detect. This pin is generally connected to the output of an optical receiver. This signal may be active high or active low depending on the optical receiver. The SIGDET input is XORed with the PS pin to select the active state. When SIGDET is in the inactive state, data is processed normally. When activated, indicating a loss of signal event, the transmitter transmits all zeroes and force the LOS signal to go high. TESTEN 43 TTL input (with pulldown) Production test mode enable. This pin should be left unconnected or tied low. PAR_VALID 2 TTL output Parity checker output. The internal parity checker on the parallel side of the transmitter checks for even parity. If there is a parity error, the pin is pulsed low for 2 clock cycles. PRBSPASS 42 TTL output PRBS test result. This pin reports the status of the PRBS test results (high = pass). When PRBSEN is disabled, the PRBSPASS pin is set low. When PRBSEN is enabled and a valid PRBS is received, then the PRBSPASS pin is set high. REFCLKSEL 40 TTL input (with pulldown) Reference clock select. The device can accept a clock frequency of 155.52 MHz or 622.08 MHz, which is selected by this pin (0 = 622.08-MHz mode and 1 = 155.52-MHz mode). SPILL 49 TTL output TX FIFO collision output VOLTAGE SUPPLY AND RESERVED PINS GND GNDA 1, 6, 19, 23, Ground 26, 28, 30, 31, 33 Digital logic ground 10, 13 Ground Analog ground 61, 69, 76, 77, 89, 93, 96, 100 Ground LVDS ground GNDPLL 12 Supply PLL ground RSVD 52 Reserved This pin needs to be tied to ground or left floating for normal operation. 3, 22, 25, 29, 32, 35, 50 Supply Digital logic supply voltage (2.5 V) GNDLVDS VDD VDDA VDDLVDS VDDPLL 7, 16 Supply Analog voltage supply (2.5 V) 62, 72, 75, 78, 90, 91, 92, 97 Supply LVDS supply voltage (2.5 V) 11 Supply PLL voltage supply (2.5 V) Submit Documentation Feedback 5 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 DETAILED DESCRIPTION The SLK2511B is designed to support OC-48/24/12. The operating data speed can be configured through the RSEL0 and RSEL1 pins as indicated in Table 2. Table 2. Data Rate Select SERIAL DATA RATE RSEL0 RSEL1 PARALLEL LVDS DATA RATE TXCLK/RXCLK OC-48:2.488 Gb/s 0 0 622.08 Mbps 622.08 MHz OC-24:1.244 Gb/s 1 0 311.04 Mbps 311.04 MHz OC-12:622 Mb/s 0 1 155.52 Mbps 155.52 MHz OC-3:155 Mb/s 1 1 38.88 Mbp 38.88 MHz The user can also enable the autorate detection circuitry through the AUTO_DETECT pin. The device automatically detects the OC-N of the data line rate and generates two bits of output to indicate the data rate to other devices in the system. When using AUTO_DETECT, RSEL0 and RSEL1 need to be set to 00 or be unconnected. Table 3. Data Rate Reporting Under Autorate Detection Mode SERIAL DATA RATE RATEOUT0 RATEOUT1 PARALLEL LVDS DATA RATE TXCLK/RXCLK OC-48:2.488 Gb/s 0 0 622.08 Mbps 622.08 MHz OC-24:1.244 Gb/s 1 0 311.04 Mbps 311.04 MHz OC-12:622 Mb/s 0 1 155.52 Mbps 155.52 MHz OC-3:155 Mb/s 1 1 38.88 Mbp 38.88 MHz The SLK2511B has four operational modes controlled by two configuration pins. These operational modes are listed in Table 4. When the device is put in a certain mode, unused circuit blocks are powered down to conserve the system power.a While the transceiver mode, transmit only mode, and receive only mode are straightforward, the repeater mode of operation is shown in Figure 4. The receive serial data is recovered by the extracted clock and it is then sent back out on the transmit serial outputs. The data eye is open both vertically and horizontally in this process. In the repeater mode, the user can select to turn on the RX demux function through the RX_MONITOR pin and allow the parallel data to be presented. This feature enables the repeater device not only to repeat but also to listen in. Table 4. Operational Modes 6 MODE CONFIG0 CONFIG1 1 0 0 Full duplex transceiver mode DESCRIPTION 2 0 1 Transmit only mode 3 1 0 Receive only mode 4 1 1 Repeater mode Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 HIGH-SPEED ELECTRICAL INTERFACE The high-speed serial I/O uses a PECL compatible interface. The line could be directly coupled or ac-coupled. See Figure 10 and Figure 11 for configuration details. As shown in the figures, an on-chip 100-Ω termination resistor is placed differentially at the receive end. The PECL output also provide de-emphasis for compensating ac loss when driving a cable or PCB backplane over long distance. The level of the de-emphasis is programmable via PRE1 and PRE2 pins. Users can use software to control the strength of the de-emphasis to optimize the device for a specific system requirement. Table 5. Programmable De-Emphasis (1) PRE1 PRE2 DE-EMPHASIS LEVEL (V(ODp)d/V(ODd) (1)– 1) 0 0 De-emphasis disabled 1 0 10% 0 1 20% 1 1 30% V(ODp): Differential voltage swing when there is a transition in the data stream. V(ODd): Differential voltage swing when there is no transition in the data stream. Figure 1. Output Differential Voltage Under De-Emphasis LVDS PARALLEL DATA INTERFACE The parallel data interface consists of a 4-bit parallel LVDS data and clock. The device conforms to OIF99.102 specification when operating at the OC-48 rate. When operating at lower serial rates the clock and data frequency are scaled down accordingly, as indicated in Table 2. The parallel data TXDATA[0:3] is latched on the rising edge of the TXCLK and then is sent to a data FIFO to resolve any phase difference between TXCLK and REFCLK. If there is a FIFO overflow condition, the SPILL pin is set high. The FIFO resets itself to realign between two clocks. The internal PLL for the clock synthesizer is locked to the REFCLK and it is used as the timing to serialize the parallel data (except for the loop timing mode where the recovered clock is used). On the receive side, RXDATA[0:3] is updated on the rising edge of RXCLK. Figure 7 and Figure 8 show the timing diagram for the parallel interface. The SLK2511B also has a built-in parity checker and generator for error detection of the LVDS interface. On the transmit side, it accepts the parity bit, TXPARP/N, and performs the parity checking function for even parity. If an error is detected, it pulses the PAR_VALID pin low for two clock cycles. On the receive side, the parity bit RXPARP/N is generated for the downstream device for parity error checking. Differential termination 100-Ω resistors are included on-chip between TXDATAP/N. REFERENCE CLOCK The device accepts either a 155.52-MHz or a 622.08-MHz clock. A clock select pin (REFCLKSEL) allows the selection of the external reference clock frequency. The REFCLK input is compatible with the LVDS level and also the 3.3-V LVPECL level using ac-coupling. A 100-Ω differential termination resistor is included on-chip, as well as a dc biasing circuit (3 kΩ to VDD and 4.5 kΩ to GND) for the ac-coupled case. A high quality REFCLK must be used on systems required to meet SONET/SDH standards. For non-SONET/SDH compliant systems, loose tolerances may be used. Submit Documentation Feedback 7 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 Table 6. Reference Clock Frequency REFCLKSEL REFERENCE CLOCK FREQUENCY 0 622.08 MHz 1 155.52 MHz CLOCK AND DATA RECOVERY The CDR unit of SLK2511B recovers the clock and data from the incoming data streams. In the event of receive data loss, the PLL automatically locks to the local REFCLK to maintain frequency stability. If the frequency of the data differs by more that 100 ppm with respect to the REFCLK frequency, the LOL pin is asserted as a warning. Actual loss of lock occurs if the data frequency differs by more than 170 ppm. MINIMUM TRANSITION DENSITY The loop filter transfer function is optimized to enable the CDR to track ppm difference in the clocking and tolerate the minimum transition density that can be received in a SONET data signal (±20 ppm). The transfer function yields a typical capture time of 3500 bit times for random incoming NRZ data after the device is powered up and achieves frequency locking. The device tolerates up to 72 consecutive digits (CID) without sustaining an error. JITTER TOLERANCE Input jitter tolerance is defined as the peak-to-peak amplitude of sinusoidal jitter applied on the input signal that causes the equivalent 1-dB optical/electrical power penalty. This refers to the ability of the device to withstand input jitter without causing a recovered data error. The device has a jitter tolerance that exceeds the mask shown in Figure 2 (GR-253 Figure 5-28) (1). This jitter tolerance is measured using a pseudorandom data pattern of 231–1. OC-N/STS-N LEVEL f0 (Hz) F1 (Hz) F2 (Hz) F3 (kHz) F4 (kHz) A1 (Ulpp) A2 (Ulpp) A3 (Ulpp) 3 10 30 300 6.5 65 0.15 1.5 15 12 10 30 300 25 250 0.15 1.5 15 0.15 1.5 15 24 48 (1) Not Specified 10 600 6000 100 1000 The tolerance margin is 20% or more at all modulating frequencies when measured using the HP 7150A jitter analysis system on the Texas Instruments provided EVM. Figure 2. Input Jitter Tolerance 8 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 JITTER GENERATION The jitter of a serial clock and serial data outputs must not exceed 0.01 UIrms/0.1 UIp-p when a serial data with no jitter is presented to the inputs. The measurement bandwidth for intrinsic jitter is 12 kHz to 20 MHz. LOOP TIMING MODE When LOOPTIME is high, the clock synthesizer used to serialize the transmit data is bypassed and the timing is provided by the recovered clock. However, REFCLK is still needed for the recovery loop operation. LOSS OF LOCK INDICATOR The SLK2511B has a lock detection circuit to monitor the integrity of the data input. When the clock recovery loop is locked to the input serial data stream, the LOL signal goes high. If the recovered clock frequency deviates from the reference clock frequency by more than 100 ppm, LOL goes low. If the data stream clock rate deviates by more than 170 ppm, loss of lock occurs. If the data streams clock rate deviates more than 500 ppm from the local reference clock, the LOL output status might be unstable. Upon power up, the LOL goes low until the PLL is close to phase lock with the local reference clock. LOSS OF SIGNAL The loss of signal (LOS) alarm is set high when no transitions appear in the input data path for more than 2.3µs. The LOS signal becomes active when the above condition occurs. If the serial inputs of the device are ac-coupled to its source, the ac-couple capacitor needs to be big enough to maintain a signal level above the threshold of the receiver for the 2.3µs no transition period. Once activated, the LOS alarm pin is latched high until the receiver detects an A1A2 pattern. The recovered clock (RXCLK) is automatically locked to the local reference when LOS occurs. The parallel data (RXDATAx) may still be processed even when LOS is activated. SIGNAL DETECT The SLK2511B has an input SIGDET pin to force the device into the loss of signal state. This pin is generally connected to the signal detect output of the optical receiver. Depending on the optics manufacturer, this signal can be either active high or active low. To accommodate the differences, a polarity select (PS) pin is used. For an active low, SIGDET input sets the PS pin high. For an active high, SIGDET input sets the PS pin low. When the PS signal pin and SIGDET are of opposite polarities, the loss of signal state is generated and the device transmits all zeroes downstream. MULTIPLEXER OPERATION The 4-bit parallel LVDS data is clocked into an input buffer by a clock derived from the synthesized clock. The data is then clocked into a 4:1 multiplexer. The D0 bit is the most significant bit and is shifted out first in the serial output stream. DEMULTIPLEXER OPERATION The serial 2.5 Gbps data is clocked into a 1:4 demultiplexer by the recovered clock. The D0 bit is the first bit that is received in time from the input serial stream. The 4-bit parallel data is then sent to the LVDS driver along with the divided down recovered clock. Submit Documentation Feedback 9 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 FRAME SYNCHRONIZATION The SLK2511B has a SONET/SDH-compatible frame detection circuit that can be enabled or disabled by the user. Frame detection is enabled when the FRAMEN pin is high. When enabled it detects the A1, A2 framing pattern, which is used to locate and align the byte and frame boundaries of the incoming data stream. When FRAMEN is low the frame detection circuitry is disabled and the byte boundary is frozen to the location found when detection was previously enabled. The frame detect circuit searches the incoming data for three consecutive A1 bytes followed immediately by one A2 byte. The data alignment circuit then aligns the parallel output data to the byte and frame boundaries of the incoming data stream. During the framing process the parallel data bus does not contain valid and aligned data. Upon detecting the third A1, A2 framing patterns that are separated by 125µs from each other, the FSYNC signal goes high for 4 RXCLK cycles, indicating frame synchronization has been achieved. The probability that random data in a SONET/SDH data stream mimics the framing pattern in the data payload is extremely low. However, there is a state machine built in to prevent false reframing if a framing pattern does show up in the data payload. TESTABILITY The SLK2511B has a comprehensive suite of built-in self-tests. The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The enable pin allows for all circuitry to be disabled so that an Iddq test can be performed. The PRBS function allows for a BIST (built-in self-test). IDDQ FUNCTION When held low, the ENABLE pin disables all quiescent power in both the analog and digital circuitry. This allows for IDDQ testing on all power supplies and can also be used to conserve power when the link is inactive. LOCAL LOOPBACK The LLOOP signal pin controls the local loopback. When LLOOP is high, the loopback mode is activated and the parallel transmit data is selected and presented on the parallel receive data output pins. The parallel transmit data is also multiplexed and presented on the high-speed serial transmit pins. Local loopback can only be enabled when the device is under the transceiver mode. Figure 3. Local Loopback Data Path 10 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 REMOTE LOOPBACK The RLOOP signal pin controls the remote loopback. When RLOOP is high, the serial receive data is selected and presented on the serial transmit data output pins. The serial received data is also demultiplexed and presented on the parallel receive data pins. The remote loop can be enabled only when the device is under transceiver mode. When the device is put under the repeater mode with RX_MONITOR high, it performs the same function as the remote loopback. Figure 4. Remote Loopback Data Path/Repeater Mode Operation PRBS The SLK2511B has two built-in pseudorandom bit stream (PRBS) functions. The PRBS generator is used to transmit a PRBS signal. The PRBS verifier is used to check and verify a received PRBS signal. When the PRBSEN pin is high, the PRBS generator and verifier are both enabled. A PRBS is generated and fed into the parallel transmitter input bus. Data from the normal input source is ignored in PRBS mode. The PBRS pattern is then fed through the transmitter circuitry as if it was normal data and sent out by the transmitter. The output can be sent to a bit error rate tester (BERT) or to the receiver of another SLK2511B. If an error occurs in the PRBS pattern, the PRBSPASS pin is set low for 2 RXCLKP/N cycles. POWER-ON RESET Upon application of minimum valid power, the SLK2511B generates a power-on reset. During the power-on reset the PRXDATA[0:3] signal pins goes to 3-state. RXCLKP and RXCLKN are held low. The length of the power-on reset cycle is dependent upon the REFCLKP and REFCLKN frequency but is less than 1ms in duration. Submit Documentation Feedback 11 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage TTL input terminals Voltage range LVDS terminals Any other terminal except aboven VALUE UNIT –0.3 to 3 V –0.3 to 4 V –0.3 to 3 V –0.3 to VDD + 0.3 V PD Package power dissipation Tstg Storage temperature –65 to 150 Electrostatic discharge HBM: 2 kv Characterized free-air operating temperature range –40 to 85 °C 260 °C TA See Dissipation Rating Table Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds (1) °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (2) (3) PACKAGE TA≤ 25°C POWER RATING DERATING FACTOR (1) ABOVE TA = 25°C TA = 85°C POWER RATING PZP (2) 3.4 W 33.78 mW/°C 1.3 W PZP (3) 2.27 W 22.78 mW/°C 0.911 W This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA). 2 oz trace and copper pad with solder. 2 oz trace and copper pad without solder. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 2.5 2.625 V PD Power dissipation Frequency = 2.488 Gb/sec, PRBS pattern 900 1100 mW Shutdown current Enable = 0, VDDA, VDD pins, VDD = max 20 TA 2.375 NOM Operating free-air temperature – 40 µA 85 °C START-UP SEQUENCE To ensure proper start up, follow one of the following steps when powering up the SLK2511B. 1. Keep ENABLE (pin 44) low until power supplies and reference clock have become stable. 2. Drive ENABLE (pin 44) low for at least 30 ns after power supplies and reference clock have become stable. The following step is recommended with either of the above two sequences. 3. Drive RESET low for at least 10 ns after link has become stable to center the TXFIFO. 12 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TTL VIH High-level input voltage 2 VIL Low-level input voltage IIH Input high current VDD = MAX, VIN = 2 V IIL Input low current VDD = MAX, VIN =0.4 V –40 VOH High-level output voltage IOH = –1 mA 2.10 VOL Low-level output voltage IOH = 1 mA CI Input capacitance 3.6 V 0.80 V 40 µA µA 2.3 0.25 V 0.5 V 4 pF 1575 mV LVDS INPUT SIGNALS VI Input voltage 825 VID(th) Input differential threshold voltage See Figure 5 Assumes 60% / 40% duty cycle 250 Assumes 55% / 45% duty cycle 200 tr/tf Input transition time 20% to 80% CI Input capacitance RI Input differential impedance On-chip termination tsu Input setup time requirement See Figure 8 300 th Input hold time requirement See Figure 8 300 T(duty) Input clock duty cycle 80 40% mV 100 375 ps 3 pF 120 Ω ps ps 60% LVDS OUTPUT SIGNALS VOD Output differential voltage VOS Output common mode voltage VOD Change VOD between 1 and 0 VOS Change VOS between 1 and 0 I(SP), I(SN), I(SPN) Output short circuit current Outputs shorted to ground or shorted together Ioff Power-off current VDD = 0 V t(cq_max) tr/tf 800 1375 25 mV 25 Clock-output time See Figure 7 Output transition time 20% to 80% 24 mA 10 µA 100 100 Output clock duty cycle Data output to FRAME_SYNC delay 100 300 45% 55% 4 ps ps 7 Bit times (OC-48 = 622.08 MHz, Clock Rates With tr/tf ≤ 500 ps) 250 200 LVDS VID - Input - mV t(cq_min) RL = 100 ±1% 300 1070 150 100 50 0 40 42 44 46 48 50 52 54 Input Duty-Cycle - % 56 58 60 Figure 5. LVDS Differential Input Voltage vs Input Duty Cycle Submit Documentation Feedback 13 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 TIMING REQUIREMENTS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 20 ppm REFERENCE CLOCK (REFCLK) Frequency tolerance (1) –20 Duty cycle 40% Jitter 50% 12 kHz to 20 MHz 60% 3 ps rms PLL PERFORMANCE SPECIFICATIONS PLL startup lock time VDD, VDDC = 2.3 V, after REFCLK is stable Acquisition lock time Valid SONET signal or PRBS OC-48 1 2031 ms Bit Times SERIAL TRANSMITTER/RECEIVER CHARACTERISTICS V(ODD) = |STXDOP-STXDON|, transmit differential output voltage under de-emphasis PRE1 = 0, PRE2 = 0, Rt = 50, See Table 5 and Figure 1 650 850 1000 PRE1 = 1, PRE2 = 0 550 750 900 PRE1 = 0, PRE2 = 1 540 700 860 PRE1 = 1, PRE2 = 1 V(CMT) Transmit common mode voltage range Rt = 50Ω Receiver Input voltage requirement, VID=|SRXDIP–SRXDIN| 500 650 800 1100 1250 1400 150 V(CMR) Receiver common mode voltage range 1100 Il Receiver input leakage -550 Rl Receiver differential impedance CI Receiver input capacitance 80 mV mV 1250 100 2250 mV 550 µA 120 Ω 1 pF td(TX_Latency) 50 td(RX_Latency) 50 (1) mV Bit Times The ±20 ppm tolerance is required to meet SONET/SDH requirements. For non-SONET/SDH compliant systems, looser tolerances may apply. SERIAL DIFFERENTIAL SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS tt Differential signal rise time (20% to 80%) RL = 50Ω tj Output jitter Jitter-free data, 12 kHz to 20 MHz, RLOOP = 1 Jitter tolerance RLOOP = 1, See Figure 2 Jitter transfer RLOOP = 1, See Figure 2 14 Submit Documentation Feedback MIN TYP MAX 80 100 140 UNIT ps 0.05 0.1 UI(pp) SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 TYPICAL CHARACTERISTICS Figure 6. Test Load and Voltage Definitions for LVDS Outputs Figure 7. LVDS Output Waveform Figure 8. LVDS Input Waveform Submit Documentation Feedback 15 SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 APPLICATION INFORMATION Figure 9. Transmitter Test Setup Figure 10. High-Speed I/O Directly Coupled Mode Figure 11. High-Speed I/O AC Coupled Mode 16 Submit Documentation Feedback SLK2511B www.ti.com SLLS763B – JANUARY 2007 – REVISED MARCH 2007 APPLICATION INFORMATION (continued) DESIGNING WITH THE PowerPAD PACKAGE The SLK2511B is housed in high-performance, thermally enhanced, 100-pin PZP PowerPAD packages. Use of a PowerPAD package does not require any special considerations except to note that the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Correct device operation requires that the PowerPAD be soldered to the thermal land. Do not run any etches or signal vias under the device, but have only a grounded thermal land, as explained below. Although the actual size of the exposed die pad may vary, the minimum size required for the keepout area for the 100-pin PZP PowerPAD package is 12 mm × 12 mm. A thermal land, which is an area of solder-tinned-copper, is required underneath the PowerPAD package. The thermal land varies in size depending on the PowerPAD package being used, the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous thermal vias, depending on PCB construction. Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD™ Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web pages beginning at URL http://www.ti.com. Figure 12. Example of a Thermal Land For the SLK2511B, this thermal land should be grounded to the low-impedance ground plane of the device. This improves not only thermal performance but also the electrical grounding of the device. It is also recommended that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size should be as large as possible without shorting device signal terminals. The thermal land may be soldered to the exposed PowerPAD using standard reflow soldering techniques. While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is recommended that the thermal land be connected to the low-impedance ground plane of the device. More information may be obtained from the TI application note PHY Layout, TI literature number SLLA020. Submit Documentation Feedback 17 PACKAGE OPTION ADDENDUM www.ti.com 16-Mar-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SLK2511BPZP ACTIVE HTQFP PZP 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR SLK2511BPZPG4 ACTIVE HTQFP PZP 100 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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