LTC2355-12/LTC2355-14 Serial 12-Bit/14-Bit, 3.5Msps Sampling ADCs with Shutdown U FEATURES DESCRIPTIO ■ The LTC®2355-12/LTC2355-14 are 12-bit/14-bit, 3.5Msps serial ADCs with differential inputs. The devices draw only 5.5mA from a single 3.3V supply and come in a tiny 10-lead MSOP package. A Sleep shutdown feature further reduces power consumption to 13µW. The combination of speed, low power and tiny package makes the LTC2355-12/ LTC2355-14 suitable for high speed, portable applications. 3.5Msps Conversion Rate 74.2dB SINAD at 14-Bits, 71.1dB SINAD at 12-Bits Low Power Dissipation: 18mW 3.3V Single Supply Operation 2.5V Internal Bandgap Reference can be Overdriven 3-Wire SPI-Compatible Serial Interface Sleep (13µW) Shutdown Mode Nap (4mW) Shutdown Mode 80dB Common Mode Rejection 0V to 2.5V Unipolar Input Range Tiny 10-Lead MSOP Package ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ U APPLICATIO S The devices convert 0V to 2.5V unipolar inputs differentially. The absolute voltage swing for AIN+ and AIN– extends from ground to the supply voltage. Communications Data Acquisition Systems Uninterrupted Power Supplies Multiphase Motor Control Multiplexed Data Acquisition RFID ■ ■ ■ ■ ■ ■ The 80dB common mode rejection allows users to eliminate ground loops and common mode noise by measuring signals differentially from the source. The serial interface sends out the conversion results during the 16 clock cycles following a CONV rising edge for compatibility with standard serial interfaces. If two additional clock cycles for acquisition time are allowed after the data stream in between conversions, the full sampling rate of 3.5Msps can be achieved with a 63MHz clock. , LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. W BLOCK DIAGRA THD, 2nd, 3rd and SFDR vs Input Frequency 10µF 3.3V –50 7 LTC2355-14 VDD –56 AIN– 2 + 14-BIT ADC S&H – THREESTATE SERIAL OUTPUT PORT SDO 8 14 3 VREF 10 2.5V REFERENCE 10µF 4 GND 5 11 SCK 2355 TA01 EXPOSED PAD –68 THD 2nd –74 3rd –80 –86 –92 –98 –104 9 6 CONV TIMING LOGIC THD, 2nd, 3rd (dB) 1 14-BIT LATCH –62 AIN+ –110 0.1 1 10 FREQUENCY (MHz) 100 2355 G02 2355f 1 LTC2355-12/LTC2355-14 W W W AXI U U ABSOLUTE RATI GS U U W PACKAGE/ORDER I FOR ATIO (Notes 1, 2) Supply Voltage (VDD) ................................................. 4V Analog and VREF Input Voltages (Note 3) ....................................–0.3V to (VDD + 0.3V) Digital Input Voltages ................. – 0.3V to (VDD + 0.3V) Digital Output Voltage .................. – 0.3V to (VDD + 0.3V) Power Dissipation .............................................. 100mW Operation Temperature Range LTC2355C-12/LTC2355C-14 ................... 0°C to 70°C LTC2355I-12/LTC2355I-14 ................ – 40°C to 85°C Storage Temperature Range ................. – 65°C to 150°C Lead Temperature (Soldering, 10 sec).................. 300°C ORDER PART NUMBER TOP VIEW AIN+ AIN– VREF GND GND 1 2 3 4 5 10 9 8 7 6 11 LTC2355CMSE-12 LTC2355IMSE-12 LTC2355CMSE-14 LTC2355IMSE-14 CONV SCK SDO VDD GND MSE PACKAGE 10-LEAD PLASTIC MSOP MSE PART MARKING TJMAX = 125°C, θJA = 150°C/ W EXPOSED PAD IS GND (PIN 11) MUST BE SOLDERED TO PCB LTCVX LTCVX LTCVY LTCVY Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/ Consult factory for parts specified with wider operating temperature ranges. U CO VERTER CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. With internal reference. VDD = 3.3V. PARAMETER LTC2355-12 MIN TYP MAX CONDITIONS LTC2355-14 MIN TYP MAX ● 12 (Notes 4, 5, 18) ● –2 ±0.25 2 –4 Offset Error (Notes 4, 18) ● –10 ±1 10 –20 Gain Error (Note 4, 18) ● –30 ±5 30 –80 Gain Tempco Internal Reference (Note 4) External Reference Resolution (No Missing Codes) Integral Linearity Error 14 UNITS Bits ±0.5 ±15 ±1 4 LSB ±2 20 LSB ±10 80 LSB ±15 ±1 ppm/°C ppm/°C U U A ALOG I PUT The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. With internal reference. VDD = 3.3V. SYMBOL PARAMETER CONDITIONS VIN Analog Differential Input Range (Notes 3, 8, 9) 3.1V ≤ VDD ≤ 3.6V VCM Analog Common Mode + Differential Input Range (Note 10) IIN Analog Input Leakage Current CIN Analog Input Capacitance (Note 19) tACQ Sample-and-Hold Acquisition Time (Note 6) tAP Sample-and-Hold Aperture Delay Time tJITTER Sample-and-Hold Aperture Delay Time Jitter CMRR Analog Input Common Mode Rejection Ratio MIN ● TYP UNITS 0 to 2.5 V 0 to VDD V ● 1 13 ● µA pF 39 1 fIN = 1MHz, VIN = 0V to 3V fIN = 100MHz, VIN = 0V to 3V MAX ns ns 0.3 ps –60 –15 dB dB 2355f 2 LTC2355-12/LTC2355-14 W U DY A IC ACCURACY The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C with external reference = 2.55V. VDD = 3.3V LTC2355-12 MIN TYP MAX LTC2355-14 MIN TYP MAX SYMBOL PARAMETER CONDITIONS SINAD Signal-to-Noise Plus Distortion Ratio 100kHz Input Signal 1.4MHz Input Signal ● Total Harmonic Distortion 100kHz First 5 Harmonics 1.4MHz First 5 Harmonics ● SFDR Spurious Free Dynamic Range 100kHz Input Signal 1.4MHz Input Signal 86 82 86 82 dB dB IMD Intermodulation Distortion 1.25V to 2.5V 1.25MHz into AIN+ , 0V to 1.25V, 1.2MHz into AIN– –82 –82 dB Code-to-Code Transition Noise VREF = 2.5V (Note 18) 0.25 1 THD 69 71.1 71.1 –86 –82 UNITS 74.2 73.8 71 –86 –82 –76 dB dB dB dB –78 LSBRMS Full Power Bandwidth VIN = 2.5VP-P, SDO = 11585LSBP-P (Note 15) 50 50 MHz Full Linear Bandwidth S/(N + D) ≥ 68dB 5 5 MHz U U U I TER AL REFERE CE CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDD = 3.3V PARAMETER CONDITIONS VREF Output Voltage IOUT = 0 MIN VREF Output Tempco TYP MAX UNITS 2.5 V 15 ppm/°C µV/V VREF Line Regulation VDD = 3.1V to 3.6V, VREF = 2.5V 600 VREF Output Resistance Load Current = 0.5mA 0.2 Ω VREF Settling Time CREF = 10µF 2 ms External VREF Input Range 2.55 VDD V U U DIGITAL I PUTS A D DIGITAL OUTPUTS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDD = 3.3V SYMBOL PARAMETER CONDITIONS VIH High Level Input Voltage VDD = 3.6V ● VIL Low Level Input Voltage VDD = 3.1V ● 0.6 V IIN Digital Input Current VIN = 0V to VDD ● ±10 µA CIN Digital Input Capacitance VOH High Level Output Voltage VDD = 3.3V, IOUT = – 200µA ● VOL Low Level Output Voltage VDD = 3.1V, IOUT = 160µA VDD = 3.1V, IOUT = 1.6mA ● VOUT = 0V to VDD ● IOZ Hi-Z Output Leakage DOUT COZ Hi-Z Output Capacitance DOUT ISOURCE Output Short-Circuit Source Current ISINK Output Short-Circuit Sink Current MIN TYP MAX 2.4 2.5 UNITS V 5 pF 2.9 V 0.05 0.10 0.4 V V ±10 µA 1 pF VOUT = 0V, VDD = 3.3V 20 mA VOUT = VDD = 3.3V 15 mA 2355f 3 LTC2355-12/LTC2355-14 U W POWER REQUIRE E TS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 17) SYMBOL VDD IDD PARAMETER Supply Voltage Supply Current PD Power Dissipation CONDITIONS MIN 3.1 ● ● Active Mode Nap Mode Sleep Mode (LTC2355-12) Sleep Mode (LTC2355-14) TYP 3.3 5.5 1.1 4 4 18 MAX 3.6 8 1.5 15 12 UNITS V mA mA µA µA mW UW TI I G CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VDD = 3.3V SYMBOL PARAMETER fSAMPLE(MAX) Maximum Sampling Rate per Channel (Conversion Rate) tTHROUGHPUT Minimum Sampling Period (Conversion + Acquisiton Period) tSCK Clock Period (Note 16) tCONV Conversion Time (Note 6) 16 t1 Minimum High or Low SCLK Pulse Width (Note 6) 2 t2 CONV to SCK Setup Time (Notes 6, 10) 3 ns t3 Nearest SCK Edge Before CONV (Note 6) 0 ns t4 Minimum High or Low CONV Pulse Width (Note 6) 4 ns t5 SCK↑ to Sample Mode (Note 6) 4 ns t6 CONV↑ to Hold Mode (Notes 6, 11) 1.2 ns t7 16th SCK↑ to CONV↑ Interval (Affects Acquisition Period) (Notes 6, 7, 13) 45 ns t8 Delay from SCK to Valid Bits 0 Through 13 (Notes 6, 12) t9 SCK↑ to Hi-Z at SDO (Notes 6, 12) t10 Previous SDO Bit Remains Valid After SCK (Notes 6, 12) t12 VREF Settling Time After Sleep-to-Wake Transition (Note 14) Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to GND. Note 3: When these pins are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents greater than 100mA below GND or greater than VDD without latchup. Note 4: Offset and full-gain specifications are measured for a single-ended AIN+ input with AIN– grounded and using the internal 2.5V reference. Note 5: Integral linearity is tested with an external 2.55V reference and is defined as the deviation of a code from the straight line passing through the actual endpoints of a transfer curve. The deviation is measured from the center of quantization band. Note 6: Guaranteed by design, not subject to test. Note 7: Recommended operating conditions. Note 8: The analog input range is defined for the voltage difference between AIN+ and AIN–. Note 9: The absolute voltage at AIN+ and AIN– must be within this range. Note 10: If less than 3ns is allowed, the output data will appear one clock cycle later. It is best for CONV to rise half a clock before SCK, when running the clock at rated speed. CONDITIONS MIN ● TYP 3.5 UNITS MHz ● ● MAX 15.872 286 ns 10000 ns 18 SCLK cycles ns 2 8 ns 6 ns ns 2 ms Note 11: Not the same as aperture delay. Aperture delay is smaller (1ns) because the 2.2ns delay through the sample-and-hold is subtracted from the CONV to Hold mode delay. Note 12: The rising edge of SCK is guaranteed to catch the data coming out into a storage latch. Note 13: The time period for acquiring the input signal is started by the 16th rising clock and it is ended by the rising edge of convert. Note 14: The internal reference settles in 2ms after it wakes up from Sleep mode with one or more cycles at SCK and a 10µF capacitive load. Note 15: The full power bandwidth is the frequency where the output code swing drops to 3dB with a 2.5VP-P input sine wave. Note 16: Maximum clock period guarantees analog performance during conversion. Output data can be read with an arbitrarily long clock. Note 17: VDD = 3.3V, fSAMPLE = 3.5Msps. Note 18: The LTC2355-14 is measured and specified with 14-bit resolution (1LSB = 152µV) and the LTC2355-12 is measured and specified with 12-bit resolution (1LSB = 610µV). Note 19: The sampling capacitor at each input accounts for 4.1pF of the input capacitance. 2355f 4 LTC2355-12/LTC2355-14 U W TYPICAL PERFOR A CE CHARACTERISTICS THD, 2nd and 3rd vs Input Frequency 77 –50 74 –56 71 –62 68 –68 THD 2nd –74 3rd 65 62 59 80 –86 68 53 –104 –110 0.1 62 56 1 10 FREQUENCY (MHz) 50 0.1 100 2355 G01 74 MAGNITUDE (dB) 71 65 62 59 1.4MHz Sine Wave 8192 Point FFT Plot 0 0 –10 –20 –10 –20 –30 –30 –40 –40 MAGNITUDE (dB) 77 100 2355 G03 100kHz Sine Wave 8192 Point FFT Plot 68 1 10 FREQUENCY (MHz) 2355 G02 SNR vs Input Frequency –50 –60 –70 –80 –50 –60 –70 –80 –90 –90 56 –100 –100 53 –110 –120 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 FREQUENCY (MHz) –110 –120 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 FREQUENCY (MHz) 50 0.1 1 10 FREQUENCY (MHz) 100 2355 G05 2355 G06 2355 G04 Differential Linearity vs Output Code Integral Linearity vs Output Code 1.0 4 0.8 3 0.6 INTEGRAL LINEARITY (LSB) DIFFERENTIAL LINEARITY (LSB) SNR (dB) 74 –92 –98 100 86 –80 56 1 10 FREQUENCY (MHz) SFDR vs Input Frequency 92 SFDR (dB) THD, 2nd, 3rd (dB) SINAD (dB) SINAD vs Input Frequency 50 0.1 TA = 25°C, VDD = 3.3V (LTC2355-14) 0.4 0.2 0 –0.2 –0.4 –0.6 2 1 0 –1 –2 –3 –0.8 –1.0 0 4096 12288 8192 OUTPUT CODE 16384 –4 0 4096 8192 12288 16384 OUTPUT CODE 2355 G07 2355 G08 2355f 5 LTC2355-12/LTC2355-14 U W TYPICAL PERFOR A CE CHARACTERISTICS TA = 25°C, VDD = 3.3V (LTC2355-14) Differential and Integral Linearity vs Conversion Rate SINAD vs Conversion Rate, Input Frequency = 1.4MHz 75 4 3 MAX DNL 1 SINAD (dB) LINEARITY (LSB) 74 MAX INL 2 0 MIN INL –1 73 72 MIN DNL –2 71 –3 –4 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 70 2 2.2 2.4 2.6 2.8 CONVERSION RATE (Msps) 3 3.2 3.4 3.6 3.8 4 CONVERSION RATE (Msps) 2355 G10 2355 G09 TA = 25°C, VDD = 3.3V (LTC2355-12 and LTC2355-14) 2.5VP-P Power Bandwidth PSRR vs Frequency CMRR vs Frequency –25 0 12 –30 6 –20 –35 –40 –40 CMRR (dB) –6 –12 –18 PSRR (dB) AMPLITUDE (dB) 0 –60 –45 –50 –55 –80 –24 –60 –100 –30 –65 –36 1M 10M 100M FREQUENCY (Hz) 1G –120 100 –70 10k 100k 1M FREQUENCY (Hz) 1k 10M 2355 G11 100M 1 2.4902 2.4900 2.4900 VDD Supply Current vs Conversion Rate 6 5.5 VDD SUPPLY CURRENT (mA) 2.4902 VREF (V) VREF (V) 2.4898 2.4896 2.4894 2.4894 2.4892 2.4892 1M 2355 G13 Internal Reference Voltage vs VDD 2.4896 100k 2355 G12 Internal Reference Voltage vs Load Current 2.4898 100 1k 10k FREQUENCY (Hz) 10 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 2.4890 2.4890 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 LOAD CURRENT (mA) 2355 G14 2.6 2.8 3.0 3.2 VDD (V) 3.4 3.6 0 0 0.5 1 1.5 2 2.5 3 3.5 4 CONVERSION RATE (Mps) 2355 G15 2355 G16 2355f 6 LTC2355-12/LTC2355-14 U U U PI FU CTIO S AIN+ (Pin 1): Noninverting Analog Input. AIN+ operates fully differentially with respect to AIN– with a 0V to 2.5V differential swing and a 0V to VDD common mode swing. (or 10µF tantalum in parallel with 0.1µF ceramic). Keep in mind that internal analog currents and digital output signal currents flow through this pin. Care should be taken to place the 0.1µF bypass capacitor as close to Pins 6 and 7 as possible. AIN– (Pin 2): Inverting Analog Input. AIN– operates fully differentially with respect to AIN+ with a – 2.5V to 0V differential swing and a 0V to VDD common mode swing. SDO (Pin 8): Three-State Serial Data Output. Each set of output data words represents the difference between AIN+ and AIN– analog inputs at the start of the previous conversion. VREF (Pin 3): 2.5V Internal Reference. Bypass to GND and to a solid analog ground plane with a 10µF ceramic capacitor (or 10µF tantalum in parallel with 0.1µF ceramic). Can be overdriven by an external reference between 2.55V and VDD. SCK (Pin 9): External Clock Input. Advances the conversion process and sequences the output data on the rising edge. Responds to TTL (≤3.3V) and 3.3V CMOS levels. One or more SCK pulses wakes the ADC from sleep mode. GND (Pins 4, 5, 6, 11): Ground and Exposed Pad. These ground pins and the exposed pad must be tied directly to the solid ground plane under the part. Keep in mind that analog signal currents and digital output signal currents flow through these pins. CONV (Pin 10): Convert Start. Holds the analog input signal and starts the conversion on the rising edge. Responds to TTL (≤3.3V) and 3.3V CMOS levels. Two CONV pulses with SCK in fixed high or fixed low state start Nap mode. Four or more CONV pulses with SCK in fixed high or fixed low state start Sleep mode. VDD (Pin 7): 3.3V Positive Supply. This single power pin supplies 3.3V to the entire device. Bypass to GND and to a solid analog ground plane with a 10µF ceramic capacitor W BLOCK DIAGRA 10µF 3.3V AIN+ 1 + 14-BIT ADC S&H AIN– 2 VDD – 14-BIT LATCH 7 LTC2355-14 THREESTATE SERIAL OUTPUT PORT 8 SDO 10 CONV 9 SCK 14 3 VREF 2.5V REFERENCE 10µF 4 GND 5 6 TIMING LOGIC 11 2355 BD EXPOSED PAD 2355f 7 LTC2355-12/LTC2355-14 WU W TI I G DIAGRA LTC2355-12 Timing Diagram t2 t3 16 17 t7 t1 1 2 3 4 5 6 7 8 9 10 11 12 13 15 14 16 17 18 1 SCK t4 t5 CONV t6 INTERNAL S/H STATUS tACQ SAMPLE HOLD t8 t8 t10 SDO REPRESENTS THE ANALOG INPUT FROM THE PREVIOUS CONVERSION Hi-Z SDO SAMPLE D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X HOLD t9 Hi-Z X 2355 TD01 14-BIT DATA WORD tCONV tTHROUGHPUT *BITS MARKED "X" AFTER D0 SHOULD BE IGNORED. LTC2355-14 Timing Diagram t2 t3 16 17 1 t7 t1 2 3 4 5 6 7 8 9 10 11 12 13 15 14 16 17 18 1 SCK t4 t5 CONV t6 INTERNAL S/H STATUS tACQ SAMPLE HOLD t8 SDO Hi-Z SAMPLE t8 t10 SDO REPRESENTS THE ANALOG INPUT FROM THE PREVIOUS CONVERSION D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 HOLD t9 D0 Hi-Z 2355 TD01b 14-BIT DATA WORD tCONV tTHROUGHPUT Nap Mode and Sleep Mode Waveforms SLK t1 t1 CONV NAP SLEEP t12 VREF 2355 TD02 NOTE: NAP AND SLEEP ARE INTERNAL SIGNALS SCK to SDO Delay SCK VIH SCK VIH t8 t10 SDO t9 VOH 90% SDO VOL 10% 2355 TD03 2355f 8 LTC2355-12/LTC2355-14 U W U U APPLICATIO S I FOR ATIO DRIVING THE ANALOG INPUT The differential analog inputs of the LTC2355-12/LTC2355-14 may be driven differentially or as a single-ended input (i.e., the AIN– input is grounded). Both differential analog inputs, AIN+ and AIN–, are sampled at the same instant. Any unwanted signal that is common to both inputs of each input pair will be reduced by the common mode rejection of the sample-andhold circuit. The inputs draw only one small current spike while charging the sample-and-hold capacitors at the end of conversion. During conversion, the analog inputs draw only a small leakage current. If the source impedance of the driving circuit is low, then the LTC2355-12/LTC2355-14 inputs can be driven directly. As source impedance increases, so will acquisition time. For minimum acquisition time with high source impedance, a buffer amplifier must be used. The main requirement is that the amplifier driving the analog input(s) must settle after the small current spike before the next conversion starts (settling time must be 39ns for full throughput rate). Also keep in mind while choosing an input amplifier the amount of noise and harmonic distortion added by the amplifier. CHOOSING AN INPUT AMPLIFIER Choosing an input amplifier is easy if a few requirements are taken into consideration. First, to limit the magnitude of the voltage spike seen by the amplifier from charging the sampling capacitor, choose an amplifier that has a low output impedance (<100Ω) at the closed-loop bandwidth frequency. For example, if an amplifier is used in a gain of 1 and has a unity-gain bandwidth of 50MHz, then the output impedance at 50MHz must be less than 100Ω. The second requirement is that the closed-loop bandwidth must be greater than 40MHz to ensure adequate small-signal settling for full throughput rate. If slower op amps are used, more time for settling can be provided by increasing the time between conversions. The best choice for an op amp to drive the LTC2355-12/LTC2355-14 will depend on the application. Generally, applications fall into two categories: AC applications where dynamic specifications are most critical and time domain applications where DC accuracy and settling time are most critical. The following list is a summary of the op amps that are suitable for driving the LTC2355-12/LTC2355-14. (More detailed information is available in the Linear Technology Databooks and on the LinearViewTM CD-ROM.) LTC1566-1: Low Noise 2.3MHz Continuous Time Low-Pass Filter. LT®1630: Dual 30MHz Rail-to-Rail Voltage FB Amplifier. 2.7V to ±15V supplies. Very high AVOL, 500µV offset and 520ns settling to 0.5LSB for a 4V swing. THD and noise are –93dB to 40kHz and below 1LSB to 320kHz (AV = 1, 2VP-P into 1kΩ, VS = 5V), making the part excellent for AC applications (to 1/3 Nyquist) where rail-to-rail performance is desired. Quad version is available as LT1631. LT1632: Dual 45MHz Rail-to-Rail Voltage FB Amplifier. 2.7V to ±15V supplies. Very high AVOL, 1.5mV offset and 400ns settling to 0.5LSB for a 4V swing. It is suitable for applications with a single 5V supply. THD and noise are –93dB to 40kHz and below 1LSB to 800kHz (AV = 1, 2VP-P into 1kΩ, VS = 5V), making the part excellent for AC applications where rail-to-rail performance is desired. Quad version is available as LT1633. LT1813: Dual 100MHz 750V/µs 3mA Voltage Feedback Amplifier. 5V to ±5V supplies. Distortion is –86dB to 100kHz and –77dB to 1MHz with ±5V supplies (2VP-P into 500Ω). Excellent part for fast AC applications with ±5V supplies. LT1801: 80MHz GBWP, –75dBc at 500kHz, 2mA/Amplifier, 8.5nV/√Hz. LT1806/LT1807: 325MHz GBWP, –80dBc Distortion at 5MHz, Unity-Gain Stable, R-R In and Out, 10mA/Amplifier, 3.5nV/√Hz. LT1810: 180MHz GBWP, –90dBc Distortion at 5MHz, Unity-Gain Stable, R-R In and Out, 15mA/Amplifier, 16nV/√Hz. LT1818/LT1819: 400MHz, 2500V/µs,9mA, Single/Dual Voltage Mode Operational Amplifier. LT6200: 165MHz GBWP, –85dBc Distortion at 1MHz, UnityGain Stable, R-R In and Out, 15mA/Amplifier, 0.95nV/√Hz. LT6203: 100MHz GBWP, –80dBc Distortion at 1MHz, Unity-Gain Stable, R-R In and Out, 3mA/Amplifier, 1.9nV/√Hz. LT6600-10: Amplifier/Filter Differential In/Out with 10MHz Cutoff. LinearView is a trademark of Linear Technology Corporation. 2355f 9 LTC2355-12/LTC2355-14 U U W U APPLICATIO S I FOR ATIO 51Ω 1 3.5V TO 18V AIN+ 47pF 2 AIN– LTC2355-12/ LTC2355-14 3 VREF 3V LT1790-3 11 GND 2355 F01 Figure 1. RC Input Filter VREF LTC2355-12/ LTC2355-14 10µF 10µF 11 3 GND 2355 F02 Figure 2. Overdriving VREF Pin with an External Reference INPUT FILTERING AND SOURCE IMPEDANCE INPUT RANGE The noise and the distortion of the input amplifier and other circuitry must be considered since they will add to the LTC2355-12/LTC2355-14 noise and distortion. The small-signal bandwidth of the sample-and-hold circuit is 50MHz. Any noise or distortion products that are present at the analog inputs will be summed over this entire bandwidth. Noisy input circuitry should be filtered prior to the analog inputs to minimize noise. A simple 1-pole RC filter is sufficient for many applications. For example, Figure 1 shows a 47pF capacitor from AIN+ to ground and a 51Ω source resistor to limit the input bandwidth to 47MHz. The 47pF capacitor also acts as a charge reservoir for the input sample-and-hold and isolates the ADC input from sampling-glitch sensitive circuitry. High quality capacitors and resistors should be used since these components can add distortion. NPO and silvermica type dielectric capacitors have excellent linearity. Carbon surface mount resistors can generate distortion from self heating and from damage that may occur during soldering. Metal film surface mount resistors are much less susceptible to both problems. When high amplitude unwanted signals are close in frequency to the desired signal frequency, a multiple pole filter is required. High external source resistance, combined with the 13pF of input capacitance, will reduce the rated 50MHz bandwidth and increase acquisition time beyond 39ns. The analog inputs of the LTC2355-12/LTC2355-14 may be driven fully differentially with a single supply. Each input may swing up to 2.5VP-P individually. When using the internal reference, the noninverting input should never be more than 2.5V more positive than the inverting input. The 0V to 2.5V range is also ideally suited for single-ended input use with single supply applications. The common mode range of the inputs extend from ground to the supply voltage VDD. If the difference between the AIN+ and AIN– inputs exceeds 2.5V, the output code will stay fixed at all ones and if this difference goes below 0V, the ouput code will stay fixed at all zeros. INTERNAL REFERENCE The LTC2355-12/LTC2355-14 has an on-chip, temperature compensated, bandgap reference that is factory trimmed to 2.5V to obtain a unipolar 0V to 2.5V input span. The reference amplifier output VREF, (Pin 3) must be bypassed with a capacitor to ground. The reference amplifier is stable with capacitors of 1µF or greater. For the best noise performance, a 10µF ceramic or a 10µF tantalum in parallel with a 0.1µF ceramic is recommended. The VREF pin can be overdriven with an external reference as shown in Figure 2. The voltage of the external reference must be higher than the 2.5V output of the internal reference. The recommended range for an external reference is 2.55V to VDD. An external reference at 2.55V will see a DC quiescent load of 0.75mA and as much as 3mA during conversion. 2355f 10 LTC2355-12/LTC2355-14 U W U U APPLICATIO S I FOR ATIO 0 111...111 –20 UNIPOLAR OUTPUT CODE 111...110 CMRR (dB) –40 –60 –80 111...101 000...010 –100 000...001 –120 100 1k 10k 100k 1M FREQUENCY (Hz) 10M 100M 2355 F03 000...000 0 FS – 1LSB INPUT VOLTAGE (V) 2355 F05 Figure 3. CMRR vs Frequency INPUT SPAN VERSUS REFERENCE VOLTAGE The differential input range has a 0V to VREF unipolar voltage span that equals the difference between the voltage at the reference buffer output VREF at Pin 3, and the voltage at the ground (Exposed Pad Ground). The differential input range of the ADC is 0V to 2.5V when using the internal reference. The internal ADC is referenced to these two nodes. This relationship also holds true with an external reference. DIFFERENTIAL INPUTS The LTC2355-12/LTC2355-14 has a unique differential sample-and-hold circuit that measures input voltages from ground to VDD. The ADC will always convert the unipolar difference of AIN+ – AIN–, independent of the Figure 4. LTC2355-12/LTC2355-14 Transfer Characteristic common mode voltage at the inputs. The common mode rejection holds up at extremely high frequencies, see Figure 3. The only requirement is that both inputs not go below ground or exceed VDD. Integral nonlinearity errors (INL) and differential nonlinearity errors (DNL) are largely independent of the common mode voltage. However, the offset error will vary. The change in offset error is typically less than 0.1% of the common mode voltage. Figure 4 shows the ideal input/output characteristics for the LTC2355-12/LTC2355-14. The code transitions occur midway between successive integer LSB values (i.e., 0.5LSB, 1.5LSB, 2.5LSB, FS – 1.5LSB). The output code is straight binary with 1LSB = 2.5V/16384 = 153µV for the LTC2355-14, and 1LSB = 2.5V/4096 = 610µV for the LTC2355-12. The LTC2355-14 has 1LSB RMS of random white noise. 2355f 11 LTC2355-12/LTC2355-14 U W U U APPLICATIO S I FOR ATIO VREF BYPASS 0805 SIZE OPTIONAL INPUT FILTERING VDD BYPASS 0805 SIZE Figure 5. Recommended Layout Board Layout and Bypassing Wire wrap boards are not recommended for high resolution and/or high speed A/D converters. To obtain the best performance from the LTC2355-12/LTC2355-14, a printed circuit board with ground plane is required. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track. If optimum phase match between the inputs is desired, the length of the two input wires should be kept matched. High quality tantalum and ceramic bypass capacitors should be used at the VDD and VREF pins as shown in the Block Diagram on the first page of this data sheet. For optimum performance, a 10µF surface mount Tantalum capacitor with a 0.1µF ceramic is recommended for the VDD and VREF pins. Alternatively, 10µF ceramic chip ca- pacitors such as Murata GRM235Y5V106Z016 may be used. The capacitors must be located as close to the pins as possible. The traces connecting the pins and the bypass capacitors must be kept short and should be made as wide as possible. Figure 5 shows the recommended system ground connections. All analog circuitry grounds should be terminated at the LTC2355-12/LTC2355-14 GND (Pins 4, 5, 6 and exposed pad). The ground return from the LTC2355-12/ LTC2355-14 (Pins 4, 5, 6 and exposed pad) to the power supply should be low impedance for noise free operation. In applications where the ADC data outputs and control signals are connected to a continuously active microprocessor bus, it is possible to get errors in the conversion results. These errors are due to feedthrough from the microprocessor to the successive approximation comparator. The problem can be eliminated by forcing the microprocessor into a Wait state during conversion or by using three-state buffers to isolate the ADC data bus. POWER-DOWN MODES Upon power-up, the LTC2355-12/LTC2355-14 is initialized to the active state and is ready for conversion. The Nap and Sleep mode waveforms show the power-down modes for the LTC2355-12/LTC2355-14. The SCK and CONV inputs control the power-down modes (see Timing Diagrams). Two rising edges at CONV, without any intervening rising edges at SCK, put the LTC2355-12/ LTC2355-14 in Nap mode and the power consumption drops from 18mW to 4mW. The internal reference remains powered in Nap mode. One or more rising edges at SCK wake up the LTC2355-12/LTC2355-14 very quickly, and CONV can start an accurate conversion within a clock cycle. Four rising edges at CONV, without any intervening rising edges at SCK, put the LTC2355-12/LTC2355-14 in 2355f 12 LTC2355-12/LTC2355-14 U W U U APPLICATIO S I FOR ATIO Sleep mode and the power consumption drops from 18mW to 13µW. One or more rising edges at SCK wake up the LTC2355-12/LTC2355-14 for operation. The internal reference (VREF ) takes 2ms to slew and settle with a 10µF load. Note that, using sleep mode more frequently than every 2ms, compromises the settled accuracy of the internal reference. Note that, for slower conversion rates, the Nap and Sleep modes can be used for substantial reductions in power consumption. DIGITAL INTERFACE The LTC2355-12/LTC2355-14 has a 3-wire SPI-compatible (Serial Protocol Interface) interface. The SCK and CONV inputs and SDO output implement this interface. The SCK and CONV inputs accept swings from 3.3V logic and are TTL compatible, if the logic swing does not exceed VDD. A detailed description of the three serial port signals follows. Conversion Start Input (CONV) The rising edge of CONV starts a conversion, but subsequent rising edges at CONV are ignored by the LTC2355-12/LTC2355-14 until the following 16 SCK rising edges have occurred. It is necessary to have a minimum of 16 rising edges of the clock input SCK between rising edges of CONV. But to obtain maximum conversion speed (with a 63MHz SCK), it is necessary to allow two more clock periods between conversions to allow 39ns of acquisition time for the internal ADC sample-and-hold circuit. With 16 clock periods per conversion, the maximum conversion rate is limited to 3.5Msps to allow 39ns for acquisition time. In either case, the output data stream comes out within the first 16 clock periods to ensure compatibility with processor serial ports. The duty cycle of CONV can be arbitrarily chosen to be used as a frame sync signal for the processor serial port. A simple approach to generate CONV is to create a pulse that is one SCK wide to drive the LTC2355-12/LTC2355-14 and then buffer this signal with the appropriate number of inverters to ensure the correct delay driving the frame sync input of the processor serial port. It is good practice to drive the LTC2355-12/LTC2355-14 CONV input first to avoid digital noise interference during the sample-to-hold transition triggered by CONV at the start of conversion. It is also good practice to keep the width of the low portion of the CONV signal greater than 15ns to avoid introducing glitches in the front end of the ADC just before the sample-and-hold goes into hold mode at the rising edge of CONV. Minimizing Jitter on the CONV Input In high speed applications where high amplitude sine waves above 100kHz are sampled, the CONV signal must have as little jitter as possible (10ps or less). The square wave output of a common crystal clock module usually meets this requirement. The challenge is to generate a CONV signal from this crystal clock without jitter corruption from other digital circuits in the system. A clock divider and any gates in the signal path from the crystal clock to the CONV input should not share the same integrated circuit with other parts of the system. As shown in Figure 6, the SCK and CONV inputs should be driven first, with digital buffers used to drive the serial port interface. Also note that the master clock in the DSP may already be corrupted with jitter, even if it comes directly from the DSP crystal. Another problem with high speed processor clocks is that they often use a low cost, low speed crystal (i.e., 10MHz) to generate a fast, but jittery, phase-locked-loop system clock (i.e., 40MHz). The jitter in these PLL-generated high speed clocks can be several nanoseconds. Note that if you choose to use the frame sync signal generated by the DSP port, this signal will have the same jitter of the DSP’s master clock. 2355f 13 LTC2355-12/LTC2355-14 U W U U APPLICATIO S I FOR ATIO The Typical Application Figure on page 16 shows a circuit for level-shifting and squaring the output from an RF signal generator or other low-jitter source. A single D-type flip flop is used to generate the CONV signal to the LTC2355-12/LTC2355-14. Re-timing the master clock signal eliminates clock jitter introduced by the controlling device (DSP, FPGA, etc.) Both the inverter and flip flop must be treated as analog components and should be powered from a clean analog supply. Serial Clock Input (SCK) The rising edge of SCK advances the conversion process and also udpates each bit in the SDO data stream. After CONV rises, the third rising edge of SCK starts clocking out the 12/14 data bits with the MSB sent first. A simple approach is to generate SCK to drive the LTC2355-12/ LTC2355-14 first and then buffer this signal with the appropriate number of inverters to drive the serial clock input of the processor serial port. Use the falling edge of the clock to latch data from the Serial Data Output (SDO) into your processor serial port. The 14-bit serial data will be received right justified, in a 16-bit word with 16 or more clocks per frame sync. It is good practice to drive the LTC2355-12/LTC2355-14 SCK input first to avoid digital noise interference during the internal bit comparison decision by the internal high speed comparator. Unlike the CONV input, the SCK input is not sensitive to jitter because the input signal is already sampled and held constant. Serial Data Output (SDO) Upon power-up, the SDO output is automatically reset to the high impedance state. The SDO output remains in high impedance until a new conversion is started. SDO sends out 12/14 bits in the output data stream beginning at the third rising edge of SCK after the rising edge of CONV. SDO is always in high impedance mode when it is not sending out data bits. Please note the delay specification from SCK to a valid SDO. SDO is always guaranteed to be valid by the next rising edge of SCK. The 16-bit output data stream is compatible with the 16-bit or 32-bit serial port of most processors. Loading on the SDO line must be minimized. SDO can directly drive most fast CMOS logic inputs directly. However, the general purpose I/O pins on many programmable logic devices (FPGAs, CPLDs) and DSPs have excessive capacitance. In these cases, a 100Ω resistor in series with SDO can isolate the input capacitance of the receiving device. If the receiving device has more than 10pF of input capacitance or is located far from the LTC2355-12/ LTC2355-14, an NC7SVU04P5X inverter can be used to provide more drive. 2355f 14 LTC2355-12/LTC2355-14 U PACKAGE DESCRIPTIO MSE Package 10-Lead Plastic MSOP (Reference LTC DWG # 05-08-1663) BOTTOM VIEW OF EXPOSED PAD OPTION 2.794 ± 0.102 (.110 ± .004) 5.23 (.206) MIN 0.889 ± 0.127 (.035 ± .005) 1 2.06 ± 0.102 (.081 ± .004) 1.83 ± 0.102 (.072 ± .004) 2.083 ± 0.102 3.20 – 3.45 (.082 ± .004) (.126 – .136) 10 0.50 0.305 ± 0.038 (.0197) (.0120 ± .0015) BSC TYP RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 4.90 ± 0.152 (.193 ± .006) 0.254 (.010) DETAIL “A” 0° – 6° TYP 1 2 3 4 5 GAUGE PLANE 0.53 ± 0.152 (.021 ± .006) DETAIL “A” 0.18 (.007) 0.497 ± 0.076 (.0196 ± .003) REF 10 9 8 7 6 SEATING PLANE 0.86 (.034) REF 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.50 (.0197) BSC 0.127 ± 0.076 (.005 ± .003) MSOP (MSE) 0603 NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 2355f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15 LTC2355-12/LTC2355-14 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS 12-Bit, 2.2Msps Serial ADC 5V or ±5V Supply, 4.096V or ±2.5V Span ADCs LTC1402 LTC1403/LTC1403A 12-/14-Bit, 2.8Msps Serial ADC 3V, 15mW, Unipolar Inputs, MSOP Package LTC1403-1/LTC1403A-1 12-/14-Bit, 2.8Msps Serial ADC 3V, 15mW, Bipolar Inputs, MSOP Package LTC1405 12-Bit, 5Msps Parallel ADC 5V, Selectable Spans, 115mW LTC1407/LTC1407A 12-/14-Bit, 3Msps Simultaneous Sampling ADC 3V, 2-Channel Differential, Unipolar Inputs, 14mW, MSOP Package LTC1407-1/LTC1407A-1 12-/14-Bit, 3Msps Simultaneous Sampling ADC 3V, 2-Channel Differential, Bipolar Inputs, 14mW, MSOP Package LTC1411 14-Bit, 2.5Msps Parallel ADC 5V, Selectable Spans, 80dB SINAD LTC1412 12-Bit, 3Msps Parallel ADC ±5V Supply, ±2.5V Span, 72dB SINAD LCT1414 14-Bit, 2.2Msps Parallel ADC ±5V Supply, ±2.5V Span, 78dB SINAD LTC1420 12-Bit, 10Msps Parallel ADC 5V, Selectable Spans, 72dB SINAD LTC1604 16-Bit, 333ksps Parallel ADC ±5V Supply, ±2.5V Span, 90dB SINAD LTC1608 16-Bit, 500ksps Parallel ADC ±5V Supply, ±2.5V Span, 90dB SINAD LTC1609 16-Bit, 250ksps Serial ADC 5V, Configurable Bipolar/Unipolar Inputs LTC1864/LTC1865 16-Bit, 250ksps Serial ADCs 5V Supply, 1 and 2 Channel, 4.3mW, MSOP Package LTC2356-12/LTC2356-14 12-/14-Bit, 3.5Msps Serial ADC 3.3V Supply, ±1.25V Span, MSOP Package 12-/14-/16-Bit, 50Msps DACs 87dB SFDR, 20ns Settling Time DACs LTC1666/LTC1667/LTC1668 16-Bit, Serial SoftSpan IOUT DAC ±1LSB INL/DNL, Software Selectable Spans LT1790-2.5 Micropower Series Reference in SOT-23 0.05% Initial Accuracy, 10ppm Drift LT1461-2.5 Precision Voltage Reference 0.04% Initial Accuracy, 3ppm Drift LT1460-2.5 Micropower Series Voltage Reference 0.1% Initial Accuracy, 10ppm Drift LTC1592 TM References SoftSpan is a trademark of Linear Technology Corporation. U TYPICAL APPLICATIO Low-Jitter Clock Timing with RF Sine Generator Using Clock Squaring/Level Shifting Circuit and Re-Timing Flip-Flop VCC 0.1µF 1k NC7SVU04P5X MASTER CLOCK VCC 50Ω 1k PRE D Q Q CONV CLR NL17SZ74 CONTROL LOGIC (FPGA, CPLD, DSP, ETC.) CONVERT ENABLE CONV LTC2355 SCK NC7SVU04P5X SDO 100Ω 2355 TA03 2355f 16 Linear Technology Corporation LT/LWI 0207 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2007