19-0782; Rev 0; 4/07 LED Light Management IC in 2.5mm x 2.5mm UCSP Features The MAX8830 light management IC integrates a 280mA PWM DC-DC step-up converter, a 200mA white LED camera flash current sink, and four programmable LED current sinks. The internal 1MHz step-up converter features an internal switching MOSFET and synchronous rectifier to improve efficiency and minimize external component count. The camera flash output current and maximum timer is programmable through I2C. Each LED current is individually regulated to a programmable level (from off to 10mA in 32 steps) and is completely independent of each other. ♦ Step-Up DC-DC Converter 280mA Guaranteed Output Current Over 90% Efficiency On-Chip FET and Synchronous Rectifier Fixed 1MHz PWM Switching Small 2.2µH to 10µH Inductor I2C-Programmable VOUT (3.8V to 5.2V and Off in 16 Steps) An I2C interface controls individual on/off of all outputs, step-up output voltage setting, movie/flash current, flash timer duration settings, and individual LED current sink settings. The MAX8830 is available in a 16-bump UCSP™ package (2.5mm x 2.5mm). Applications Cell Phones and Smartphones PDAs and MP3 Players Typical Operating Circuit 2.2μH TO 10μH INPUT 2.7V TO 5.5V PROGRAMMABLE OUTPUT 3.8V TO 5.2V UP TO 280mA LX OUT IN CIN COUT GND ♦ Flash LED Current Sink I2C-Programmable Flash Output Current (Off to 200mA in 16 Steps) I2C-Programmable Flash Maximum Timer (0.5s, 1.0s, 1.5s, or 2.0s) I2C-Programmable Movie Output Current (Off to 200mA in 16 Steps) Movie Enabled by I2C or Logic Input Flash Enabled by Logic Input Low Dropout (75mV typ) ♦ Four LED Current Sinks Individually I2C-Programmable Output Current Off to 10mA in 32 Steps Low LED Sink Current Dropout Voltage (30mV typ) ♦ I2C Interface Write Address (0x94), Read Address (0x95) Individual On/Off and LED Current Settings Simple Register Mapping ♦ < 1µA Shutdown Current ♦ Open/Short LED Detection ♦ Thermal-Shutdown Protection ♦ 16-Bump, 2.5mm x 2.5mm UCSP Package PGND MAX8830 COMP Ordering Information 200mA FLASH FLED MOVIE ON FLASH ON MVON FLEN LED1 SCL LED2 IC TEMP RANGE PIN-PACKAGE MAX8830EWE+T -40°C to +85°C 16-bump 2.5mm x 2.5mm UCSP PKG CODE W162A2-1 +Denotes a lead-free package. SDA VLOGIC PART LED3 VDD LED4 Pin Configuration appears at the end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX8830 General Description MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP ABSOLUTE MAXIMUM RATINGS IN, OUT to GND………………………....…………..-0.3V to +6.0V IN, OUT to GND (maximum of 1µs) ....................................+7.0V VDD to GND ...........................................................-0.3V to +4.0V SCL, SDA, MVON, FLEN to GND..................-0.3V to VDD + 0.3V COMP, FLED, LED_ to GND .......................-0.3V to VOUT + 0.3V PGND to GND .......................................................-0.3V to +0.3V Continuous ILX Current...............................................600mARMS Continuous Power Dissipation (TA = +70°C) 16-Bump 2.5mm x 2.5mm UCSP (derate 105.7mW/°C above +70°C) .............................750mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature* (soldering) ......................................+235°C *This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Preheating is required. Hand or wave soldering is not allowed. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER DESCRIPTION IN Operating Voltage 1.7 VDD falling 1.35 VDD UVLO Hysteresis IN UVLO Threshold TYP 2.7 VDD Operating Range VDD Undervoltage Lockout (UVLO) Threshold MIN 1.5 MAX UNITS 5.5 V 3.6 V 1.65 V 50 VIN rising 2.25 IN UVLO Hysteresis 2.45 mV 2.65 50 VDD Standby Supply Current SCL = SDA = VDD, I2C ready TA = +25°C 3 TA = +85°C 4 IN Standby Supply Current SCL = SDA = VDD, I2C ready TA = +25°C 5 TA = +85°C 5 IN Shutdown Supply Current All outputs off, VDD = 0 TA = +25°C 0.1 TA = +85°C 1 Thermal-Shutdown Hysteresis Thermal-Shutdown V mV 10 15 5 µA µA µA 20 °C +160 °C LOGIC AND I2C INTERFACE MVON, FLEN Logic Input-High Voltage VDD = 1.7V to 3.6V Logic Input-Low Voltage VDD = 1.7V to 3.6V Logic Input Current VIL = 0V or VIH = 3.6V SDA Output Low Voltage ISDA = 3mA SCL, SDA 1.6 V 0.7 x VDD MVON, FLEN 0.4 0.3 x VDD SCL, SDA TA = +25°C -1 TA = +85°C 0.01 +1 0.1 0.03 I2C Clock Frequency V µA 0.4 V 400 kHz Bus-Free Time Between START and STOP tBUF 1.3 Hold Time Repeated START Condition tHD_STA 0.6 0.1 µs SCL Low Period tLOW 1.3 0.2 µs 2 µs _______________________________________________________________________________________ LED Light Management IC in 2.5mm x 2.5mm UCSP (VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER DESCRIPTION MIN TYP MAX UNITS SCL High Period tHIGH 0.6 0.2 µs Setup Time Repeated START Condition tSU_STA 0.6 0.1 µs µs SDA Hold Time tHD_DAT 0 -0.01 SDA Setup Time tSU_DAT 100 50 ns Setup Time for STOP Condition tSU_STO 0.6 0.1 µs STEP-UP DC-DC CONVERTER IN Supply Current 1MHz switching, VOUT = 5V OUT Voltage Range 100mV steps OUT Voltage Accuracy IOUT = 100mA Line Regulation VIN = 2.7V to 4.2V Load Regulation IOUT = 0 to 280mA Maximum OUT Current VIN ≥ 3.2V, VOUT = 5.0V 4 3.8 TA = +25°C -1.5 TA = +85°C -3 280 nFET Current Limit ±0.3 7.5 mA 5.2 V +1.5 +3 % 0.1 %/V 0.5 %/A 500 mA 2.2 A LX nFET On-Resistance LX to PGND, ILX = 100mA 0.1 Ω LX pFET On-Resistance LX to OUT, ILX = 100mA 0.15 Ω LX Leakage VLX = 5.5V Operating Frequency TA = -40°C to +85°C TA = +25°C 0.1 TA = +85°C 1 Maximum Duty Cycle 0.75 1.00 65 75 Minimum Duty Cycle 4 5 1.25 µA MHz % 8 % COMP Transconductance VCOMP = 1.5V 60 µS COMP Discharge Resistance During shutdown or UVLO, from COMP to GND 180 Ω OUT Discharge Resistance During shutdown or UVLO, from OUT to IN 10 kΩ FLED CURRENT SINK DRIVER IN Supply Current Maximum Current Setting Current Accuracy Step-up off, FLED on 0.35 Flash (enabled by FLEN) 100 Movie (enabled by MVON or I2C) 50 50mA setting, Movie Current-Regulator Dropout FLED Leakage in Shutdown TA = +25°C TA = -40°C to +85°C -3.0 ±0.5 -5 50mA setting (Note 2) 0.6 mA +3.0 +5 75 TA = +25°C 0.01 TA = +85°C 0.1 0.5 mA % mV 5 2.0 µA Flash Duration Timer Range In 500ms steps (Note 3) Open-LED Detection Threshold FLED enabled 100 mV s Shorted-LED Detection Threshold FLED enabled VOUT 1V V _______________________________________________________________________________________ 3 MAX8830 ELECTRICAL CHARACTERISTICS (continued) MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP ELECTRICAL CHARACTERISTICS (continued) (VIN = 3.6V, VGND = VPGND = 0V, VDD = 3.0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1) PARAMETER DESCRIPTION MIN TYP MAX UNITS 0.2 0.5 mA LED1–LED4 CURRENT SINK DRIVER IN Supply Current Step-up off, all current sinks on Maximum Current Setting Current Accuracy 10 LED1–LED4 = 10mA setting, VOUT = VIN 3/32 setting, TA = +25°C Current Regulator Dropout Leakage in Shutdown Open-LED Detection Threshold Shorted-LED Detection Threshold 10mA setting (Note 2) ±0.3 mA TA = +25°C -2 +2 TA = 0°C to +85°C -5 +5 TA = -40°C to +85°C -8 +8 % ±7 30 125 TA = +25°C 0.01 5 TA = +85°C 0.1 mV µA LED_ enabled 100 mV LED_ enabled VOUT 1V V Note 1: All devices are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by design. Note 2: LED current sink dropout voltage is defined as the voltage at which current drops 10% from the current level measured at 0.6V. Note 3: Flash duration is from rising edge of FLEN until IFLED turns off (or returns to the movie current setting if MVON is high). 4 _______________________________________________________________________________________ LED Light Management IC in 2.5mm x 2.5mm UCSP 98 100 90 VOUT = 5V 92 90 INPUT CURRENT (μA) EFFICIENCY (%) 94 70 60 50 0 30 3.5 3.9 4.3 4.7 5.5 5.1 10 1 INPUT VOLTAGE (V) 100 2.7 1000 3.1 INPUT STANDBY SUPPLY CURRENT vs. TEMPERATURE 3.5 3.9 4.3 4.7 5.1 5.5 INPUT VOLTAGE (V) OUTPUT CURRENT (mA) SWITCHING WAVEFORMS (VOUT = 3.8V, IOUT = 280mA) MAX8830 toc05 30 MAX8830 toc04 VOUT = VIN ALL LEDs OFF I2C READY 25 20 ILX 200mA/div VLX 2V/div 15 10 5 0 -40 -15 10 35 60 400ns/div 85 TEMPERATURE (°C) SWITCHING WAVEFORMS (VOUT = 5V, IOUT = 280mA) OSCILLATOR FREQUENCY vs. TEMPERATURE MAX8830 toc06 200mA/div ILX VLX 2V/div MAX8830 toc07 1.20 OSCILLATOR FREQUENCY (MHz) 3.1 10 40 86 2.7 15 5 L1 = 10μH TOKO 1098AS-100M DE2812C SERIES 88 VOUT = VIN ALL LEDs OFF I2C READY 20 80 INPUT CURRENT (μA) EFFICIENCY (%) 96 25 MAX8830 toc02 IOUT = 200mA MAX8830 toc01 100 VOUT = 3.8V INPUT STANDBY SUPPLY CURRENT vs. INPUT VOLTAGE STEP-UP CONVERTER EFFICIENCY vs. OUTPUT CURRENT MAX8830 toc03 STEP-UP CONVERTER EFFICIENCY vs. INPUT VOLTAGE 1.15 1.10 1.05 1.00 0.95 0.90 400ns/div -40 -15 10 35 60 85 TEMPERATURE (°C) _______________________________________________________________________________________ 5 MAX8830 Typical Operating Characteristics (VIN = 3.6V, VOUT = 3.8V, VDD = 3.0V, circuit of Figure 1, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (VIN = 3.6V, VOUT = 3.8V, VDD = 3.0V, circuit of Figure 1, TA = +25°C, unless otherwise noted.) 1.05 1.00 0.95 0.90 3.80 5.05 3.79 5.04 VOUT = 3.8V 3.78 5.03 3.77 5.02 3.76 5.01 VOUT = 5V 3.75 5.00 3.74 4.99 3.73 4.98 3.72 3.1 3.5 3.9 4.3 4.7 5.1 ILED1 -0.5 ILED4 -1.0 -1.5 ILED2 -2.5 2.7 10 25 35 50 60 70 85 3.1 3.5 3.9 4.7 5.1 5.5 TEMPERATURE (°C) INPUT VOLTAGE (V) LED CURRENT ACCURACY vs. TEMPERATURE FLED CURRENT-REGULATOR DROPOUT VOLTAGE vs. FLED CURRENT LED_ CURRENT-REGULATOR DROPOUT VOLTAGE vs. LED_ CURRENT 160 0.2 0 -0.2 -0.4 45 40 DROPOUT VOLTAGE (mV) 0.4 50 140 120 100 80 60 35 30 25 20 15 -0.6 40 10 -0.8 20 5 -1.0 0 -15 10 35 60 85 MAX8830 toc13 180 DROPOUT VOLTAGE (mV) 0.6 200 MAX8830 toc12 ILED = 10mA 0.8 0 0 TEMPERATURE (°C) 50 100 150 200 0 4 2 FLED CURRENT (mA) STARTUP WAVEFORMS SOFT-START MAX8830 toc15 5V/div VIN VIN 2V/div VOUT = 5V 500mV/div VOUT = 3V 500mV/div 5V/div VOUT 2V/div VLX VCOMP 20.0μs/div 6 LED_ CURRENT (mA) MAX8830 toc14 6 4.3 INPUT VOLTAGE (V) 1.0 -40 ILED3 0 -2.0 4.97 -40 -25 -15 0 5.5 MAX8830 toc11 2.7 0.5 5.06 LED CURRENT ACCURACY (%) 1.10 5.07 3.81 OUTPUT VOLTAGE (V) 1.15 MAX8830 toc09 3.82 MAX8830 toc08 1.20 OSCILLATOR FREQUENCY (MHz) LED CURRENT ACCURACY AND MATCHING vs. INPUT VOLTAGE (ILED_ = 10mA) OUTPUT VOLTAGE vs. TEMPERATURE MAX8830 toc10 OSCILLATOR FREQUENCY vs. INPUT VOLTAGE LED CURRENT ACCURACY (%) MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP 100ms/div _______________________________________________________________________________________ 8 10 LED Light Management IC in 2.5mm x 2.5mm UCSP UCSP BUMP NAME FUNCTION A1 FLED Flash LED Current-Sink Regulator. Current flowing into FLED is based on the internal I2C registers. Connect FLED to the cathode of an external flash LED or LED module. FLED is high impedance during shutdown. If unused, FLED may be shorted to ground or left unconnected. A2 PGND Power Ground. Connect PGND to GND and to the input capacitor ground. Connect PGND to the PCB ground plane. A3 LX Inductor Connection. Connect LX to the switched side of the inductor. LX is internally connected to the drains of the internal MOSFETs. LX is high impedance in shutdown. A4 OUT Regulator Output. Connect OUT to the anodes of the external LEDs. OUT can also be used to supply other circuits, such as audio amplifiers. Bypass OUT to PGND with a 10µF or larger ceramic capacitor. During shutdown, VOUT is one diode drop below the VIN. C1 B1 B2 D1 LED1 LED2 LED3 LED4 LED Current-Sink Regulators. Current flowing into LED_ is based on the internal I2C registers. Connect LED_ to the cathodes of external LEDs. LED_ is high impedance during shutdown. If unused, LED_ can be shorted to ground or left unconnected. B3 MVON Movie On Logic Input. Connect to VDD or drive with logic 1 to enable the movie mode. The FLED movie current is set in the I2C registers. Connect to GND or drive with logic 0 to turn off the movie mode. The movie mode is also enabled through the I2C interface. B4 IN Analog Supply Voltage Input. The input voltage range is 2.7V to 5.5V. Bypass IN to GND and PGND with a 10µF ceramic capacitor as close as possible to the IC. IN is high impedance during shutdown. C2 FLEN Flash Enable Logic Input. A transition from logic 0 to logic 1 on FLEN initiates the flash mode. The flash duration and FLED flash current are set in I2C registers. The flash mode terminates when either FLEN transitions back to logic 0 or after the flash-duration timer expires. C3 SCL I2C Clock Input. Data is read on the rising edge of SCL. C4 COMP D2 GND Analog Ground. Connect GND to PGND and to the input capacitor ground. Connect GND to the PCB ground plane. D3 SDA I2C Data Input. Data is read on the rising edge of SCL. D4 VDD Logic Input Supply Voltage. Connect VDD to the logic supply driving SCL, SDA, MVON, and FLEN. Bypass VDD to GND with a 0.1µF ceramic capacitor. Setting VDD = 0 places the part in shutdown. Compensation Input. See the COMP Network Selection section for details. _______________________________________________________________________________________ 7 MAX8830 Pin Description MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP L1* 10μH VIN 2.7V TO 5.5V OUT nFET IN CIN 10μF GND CHIP POWER AND REFERENCE COUT 10μF pFET PWM BOOST CONVERTER + PGND RCOMP VREF COMP 4 1MHz CCOMP 4 MOVIE ON /OFF IOUT 280mA MAX8830 LX MVON FLED 200mA FLASH LED 5 FLASH ON /OFF FLEN FLASH MAX TIMER (0.5/1.0/1.5/2.0s) LED1 2 5 REGISTERS AND LOGIC SCL SERIAL INTERFACE VLOGIC SDA I2C PORT 8 LED2 5 LED3 VDD 5 CVDD 0.1μF LED4 *L1 = TOKO 1098AS-100M Figure 1. Block Diagram and Typical Application Circuit Detailed Description The MAX8830 light management IC integrates a 280mA PWM step-up DC-DC converter, a 200mA white LED camera flash current sink, and four programmable LED current sinks. An I2C interface controls individual on/off of all outputs, step-up output voltage setting, movie/ flash current and flash timer-duration settings, and individual current sink settings. Figure 1 shows the block diagram and typical application circuit. 8 Step-Up Converter (LX, OUT, COMP, PGND) The MAX8830 includes a fixed-frequency, PWM step-up converter that supplies power to the LEDs and additional loads, such as audio amplifiers. The output voltage is programmable from 3.8V to 5.2V (in 100mV steps) through the I2C port. If the output voltage is not programmed, the step-up converter remains off; however, if any of the current regulators are programmed, the boost converter p-channel synchronous rectifier is turned on. The step-up converter switches an internal power MOSFET and synchronous rectifier at a constant 1MHz frequency with varying duty cycle up to 75% to maintain constant output voltage as VIN and load vary. Internal circuitry prevents any unwanted subharmonic switching by forcing a minimum 4% duty cycle. _______________________________________________________________________________________ LED Light Management IC in 2.5mm x 2.5mm UCSP A low-dropout linear current regulator from FLED to PGND sinks current from an external flash LED cathode terminal. The FLED current is regulated to I2C-programmable levels for movie mode (up to 200mA) and flash mode (up to 200mA). The movie mode provides continuous lighting when enabled through I2C (see Table 1). The flash mode is enabled only when FLEN goes high. A flash maximum timer, programmable from 0.5s to 2.0s through I2C, limits the duration of the flash mode in case FLEN remains high. The flash mode has priority over the movie mode. Current-Sink Regulators (LED1–LED4) Four low-dropout linear current regulators from LED_ to GND sink current from external LED cathode terminals. The LED_ currents are individually regulated to an I2Cprogrammable level from off to 10mA in 32 steps, independently set for each LED_. Undervoltage Lockout The IC contains undervoltage lockout (UVLO) circuitry that disables the device until VIN is greater than 2.45V (typ). Once VIN rises above 2.45V (typ), the UVLO circuitry does not disable the IC until VIN falls below the UVLO threshold hysteresis. Soft-Start The MAX8830 soft-starts by charging CCOMP with a 100µA current source. During this time, the internal MOSFET is switching at the minimum duty cycle. Once VCOMP rises above 1V, the duty cycle increases until the output voltage reaches the desired regulation level. COMP is pulled to GND with a 80Ω internal resistor during UVLO or shutdown. See the Typical Operating Characteristics for an example of soft-start operation. Shutdown and Standby The MAX8830 is in shutdown when VDD = 0. In shutdown, supply current is reduced to 0.1µA (typ). The MAX8830 is in standby when the step-up converter and all LED outputs are turned off through I 2C (and by keeping MVON and FLEN at logic 0). During this time, the I2C port remains in standby (ready) state as long as logic-high voltage is supplied to VDD. CCOMP is discharged whenever the step-up converter is turned off, allowing the device to reinitiate soft-start when it is enabled. The internal MOSFET and synchronous rectifier are also high impedance when the step-up converter is off; however, OUT is one diode drop below the input. FLED and LED_ are high impedance in shutdown, so the external LEDs are all off, but any external circuitry on OUT (such as an audio amplifier) is not disconnected, and therefore, should include its own shutdown capability. Parallel Connection of Current-Sink Regulators The LED current-sink regulators (FLED and LED_) can be connected in parallel in any combination to allow the use of higher current LEDs or any other desired effects. Unused current regulators may be left unconnected or shorted to ground. The LED regulators must be disabled through I2C to avoid a fault detection from an open or short. Open/Short LED Detection The MAX8830 includes 10 comparators to detect open or shorted LEDs on the FLED and LED1–LED4 pins. One comparator on each pin detects when the voltage falls below 100mV, indicating an open LED fault. Another comparator on each pin detects when the voltage rises above VOUT - 1V, indicating a shorted LED fault. The fault-detection comparators are enabled only when the corresponding current sink is enabled (and not set to zero current). Once a fault is detected the two comparators provide a single bit output (1 = fault, 0 = no fault) corresponding to the appropriate pin. When a read command (address 0x95) is issued to the MAX8830, the status of each pin is latched into the status register (see Table 6) and subsequently written to the I2C bus by the MAX8830. Thermal Shutdown Thermal shutdown limits total power dissipation in the MAX8830. When the junction temperature exceeds +160°C, the device turns off, allowing the IC to cool. The IC turns on and begins soft-start after the junction temperature cools by 20°C. This results in a pulsed output during continuous thermal-overload conditions. _______________________________________________________________________________________ 9 MAX8830 Flash Current-Sink Regulator (FLED, MVON, FLEN) MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP I2C Serial Interface The I2C serial interface consists of a serial-data line (SDA) and a serial-clock line (SCL). Standard I2C writebyte commands are used. Figure 2 shows a timing diagram for the I2C protocol. The MAX8830 is a slave-only device, relying upon a master to generate a clock signal. The master (typically a microprocessor) initiates data transfer on the bus and generates SCL to permit data transfer. A master device communicates to the MAX8830 by transmitting the proper 8-bit address (0x94) followed by the 8-bit control byte. Each 8-bit control byte consists of a command code (usually 3-bits) with the remaining bits (usually 5 bits) as data (see Table 1). Each transmit sequence is framed by a START (A) condition and a STOP (L) condition. Each word transmitted over the bus is 8 bits long and is always followed by an acknowledge clock pulse. The step-up converter OUT voltage, FLED flash current and duration, FLED movie current, and LED_ individual currents are set using the I2C serial interface. Each current level is individually programmable (including off) with a single command (see Tables 1, 2, and 3). While the flash current is set through I2C, current does not flow until the FLEN input is logic 1, as described in the Flash Current-Sink Regulator (FLED, MVON, FLEN) section. By default, the movie current is turned on when a nonzero setting is programmed through I 2 C. Alternately, by setting a bit in the “other” register, the movie mode current may also be gated by logic 1 at the MVON input. A tLOW B tHIGH C D E F G H I J K L M SCL SDA tSU_STA tHD_STA A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE E = SLAVE PULLS SMBDATA LINE LOW tSU_DAT tHD_DAT F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO SLAVE (OP/SUS BIT) H = LSB OF DATA CLOCKED INTO SLAVE I = SLAVE PULLS SMBDATA LINE LOW tSU_STO J = ACKNOWLEDGE CLOCKED INTO MASTER K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION, DATA EXECUTED BY SLAVE M = NEW START CONDITION Figure 2. I2C Timing Diagram 10 ______________________________________________________________________________________ tBUF LED Light Management IC in 2.5mm x 2.5mm UCSP MAX8830 Table 1. Control Data Byte SDA CONTROL BYTE FUNCTION COMMAND DATA C2 C1 C0 D4 Step-Up OUT Voltage 0 0 0 0 3.8V to 5.2V and off in 16 steps D3 Unused 0 0 0 0 Reserved for future use LED1 Current 0 0 1 0 Off to 10mA in 32 steps LED2 Current 0 1 0 0 Off to 10mA in 32 steps LED3 Current 0 1 1 0 Off to 10mA in 32 steps LED4 Current 1 0 0 0 Off to 10mA in 32 steps Unused 1 0 1 0 Off to 10mA in 32 steps Flash Current 1 1 0 0 Off to 200mA in 16 steps Movie Current 1 1 1 0 Off to 200mA in 16 steps Other 1 1 1 1 0 D2 MVON enable D1 D0 Flash duration Note: C2 is MSB and D0 is LSB. Table 2. Control Register Data Default Settings SDA CONTROL BYTE FUNCTION Step-Up OUT Voltage COMMAND DATA C2 C1 C0 D4 D3 0 0 0 0 Off (0000) D2 Unused 0 0 0 0 Reserved for future use LED1 Current 0 0 1 0 Off (00000) LED2 Current 0 1 0 0 Off (00000) LED3 Current 0 1 1 0 Off (00000) LED4 Current 1 0 0 0 Off (00000) Unused 1 0 1 0 Reserved for future use Flash Current 1 1 0 0 Off (00000) Movie Current 1 1 1 0 Off (0000) Other 1 1 1 1 0 MV by I2C (0) D1 D0 0.5s (00) Note: C2 is MSB and D0 is LSB. ______________________________________________________________________________________ 11 MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP Table 3. Step-Up Voltage and LED Current Settings OUT VOLTAGE (V) OR LED CURRENT (mA) DATA OUT LED1 LED2 LED3 LED4 FLASH MOVIE D4 D3 D2 D1 D0 OFF OFF OFF OFF OFF OFF OFF 0 0 0 0 0 3.8 0.63 0.63 0.63 0.63 25.0 25.0 0 0 0 0 1 3.9 0.94 0.94 0.94 0.94 37.5 37.5 0 0 0 1 0 4.0 1.25 1.25 1.25 1.25 50.0 50.0 0 0 0 1 1 4.1 1.56 1.56 1.56 1.56 62.5 62.5 0 0 1 0 0 4.2 1.88 1.88 1.88 1.88 75.0 75.0 0 0 1 0 1 4.3 2.19 2.19 2.19 2.19 87.5 87.5 0 0 1 1 0 4.4 2.50 2.50 2.50 2.50 100.0 100.0 0 0 1 1 1 4.5 2.81 2.81 2.81 2.81 112.5 112.5 0 1 0 0 0 4.6 3.13 3.13 3.13 3.13 125.0 125.0 0 1 0 0 1 4.7 3.44 3.44 3.44 3.44 137.5 137.5 0 1 0 1 0 4.8 3.75 3.75 3.75 3.75 150.0 150.0 0 1 0 1 1 4.9 4.06 4.06 4.06 4.06 162.5 162.5 0 1 1 0 0 5.0 4.38 4.38 4.38 4.38 175.0 175.0 0 1 1 0 1 5.1 4.69 4.69 4.69 4.69 188.0 188.0 0 1 1 1 0 5.2 5.00 5.00 5.00 5.00 200.0 200.0 0 1 1 1 1 5.31 5.31 5.31 5.31 1 0 0 0 0 5.63 5.63 5.63 5.63 1 0 0 0 1 5.94 5.94 5.94 5.94 1 0 0 1 0 6.25 6.25 6.25 6.25 1 0 0 1 1 6.56 6.56 6.56 6.56 1 0 1 0 0 6.88 6.88 6.88 6.88 1 0 1 0 1 7.19 7.19 7.19 7.19 1 0 1 1 0 7.50 7.50 7.50 7.50 1 0 1 1 1 7.81 7.81 7.81 7.81 1 1 0 0 0 8.13 8.13 8.13 8.13 1 1 0 0 1 8.44 8.44 8.44 8.44 1 1 0 1 0 8.75 8.75 8.75 8.75 1 1 0 1 1 9.06 9.06 9.06 9.06 1 1 1 0 0 9.38 9.38 9.38 9.38 1 1 1 0 1 9.69 9.69 9.69 9.69 1 1 1 1 0 10.00 10.00 10.00 10.00 1 1 1 1 1 Note: Defaults in bold italics. 12 ______________________________________________________________________________________ LED Light Management IC in 2.5mm x 2.5mm UCSP For the latest application details on UCSP construction, dimensions, tape carrier information, PCB techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, go to the Maxim website at www.maxim-ic.com/ucsp for the Application Note: UCSP-A Wafer-Level Chip-Scale Package. Table 4. MVON Control Setting SDA CONTROL BYTE FUNCTION COMMAND C2 C1 DATA C0 D4 D3 D2 D1 D0 Movie Enabled Through I 2C 1 1 1 1 X 0 X X Movie Enabled Through MVON Pin 1 1 1 1 X 1 X X Note: Defaults in bold italics. Table 5. Flash Duration Settings SDA CONTROL BYTE FUNCTION COMMAND DATA C2 C1 C0 D4 D3 D2 D1 D0 0.5s Flash 1 1 1 1 X X 0 0 1.0s Flash 1 1 1 1 X X 0 1 1.5s Flash 1 1 1 1 X X 1 0 2.0s Flash 1 1 1 1 X X 1 1 Note: Defaults in bold italics. Table 6. Read (0x95) Status Register SDA READ BYTE FUNCTION Fault Status DATA D7 D6 D5 D4 D3 D2 D1 D0 X X X FLED LED4 LED3 LED2 LED1 Note: 1 = fault, 0 = no fault ______________________________________________________________________________________ 13 MAX8830 UCSP Applications Information Table 4 lists the MVON control settings; Table 5 lists flash duration settings. Table 6 shows the read (0x95) status register. MAX8830 LED Light Management IC in 2.5mm x 2.5mm UCSP Table 7. Suggested Inductors MANUFACTURER Cooper (Coiltronics) FDK TDK TOKO SERIES INDUCTANCE (µH) DCR (mΩ) ISAT (A) SD3114 2.2 110 1.74 3.0 x 3.0 x 1.45 = 13mm3 MIPF2520 2.2 80 1.3A 2.5 x 2.0 x 1.0 = 5mm3 MIPW3226 2.2 100 1.1 3.2 x 2.6 x 1.0 = 8mm3 VLF3012AT 2.2 10 88 360 1.0 0.49 2.8 x 2.6 x 1.2 = 9mm3 2.7 75 1.8 3.0 x 3.2 x 1.2 = 12mm3 10 325 0.78 3.0 x 3.2 x 1.2 = 12mm3 DE2812C DIMENSIONS (LTYP x WTYP x HMAX = VOLUME) Inductor Selection PCB Layout The MAX8830 is designed to use a 2.2µH to 10µH inductor. To prevent core saturation, ensure that the inductor-saturation current rating exceeds the peak inductor current for the application. Calculate the worstcase peak inductor current with the following formula: Due to fast switching waveforms and high-current paths, careful PCB layout is required. Connect GND and PGND directly to the ground plane. The IN bypass capacitor should be placed as close as possible to the IC. RCOMP and CCOMP should be connected between COMP and GND as close as possible to the IC. Minimize trace lengths between the IC and the inductor, the input capacitor, and the output capacitor; keep these traces short, direct, and wide. The ground connections of CIN and COUT should be as close together as possible and connected to PGND. The traces from the input to the inductor and from the output capacitor to the LEDs may be longer. A sample layout is available in the MAX8830 evaluation kit. IPEAK = VOUT × IOUT(MAX) VIN(MIN) × 0.5μs + 0.9 × VIN(MIN) 2 ×L Table 7 provides a list of suggested inductors. Capacitor Selection Bypass the input to GND and PGND using a ceramic capacitor. A ceramic capacitor with X5R and X7R dielectrics are recommended for their low ESR and tighter tolerances over a wide temperature range. Place the capacitor as close as possible to the IC. The recommended minimum value for the input capacitor is 10µF; however, larger value capacitors can be used to reduce input ripple at the expense of size and higher cost. The output capacitance required depends on the maximum output current. A 10µF ceramic capacitor works well in most situations, but a 4.7µF capacitor is acceptable for lower load currents. COMP Network Selection The step-up converter is compensated for stability through an external compensation network from COMP to GND. See Table 8 for recommended compensation components. Table 8. Suggested Compensation Networks MAX8830 1 2 3 4 FLED PGND LX OUT LED2 LED3 MVON IN LED1 FLEN SCL COMP LED4 GND SDA VDD + A B C D RCOMP (kΩ) CCOMP (pF) 2.2µH Inductor (Dynamic Loads) 4.3 2200 4.7µH Inductor (Dynamic Loads) 3 4700 10µH Inductor (Dynamic Loads) 3 6800 Only LED Loads (2.2µH to 10µH) 0 (short) 22000 14 Pin Configuration UCSP (2.5mm x 2.5mm) Chip Information PROCESS: BiCMOS ______________________________________________________________________________________ LED Light Management IC in 2.5mm x 2.5mm UCSP 16L WAFER LEVEL.EPS Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 © 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. MAX8830 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)