MICREL SY69753LHITR

SY69753L
3.3V, 125Mbps, 155Mbps Clock
and Data Recovery
General Description
Features
The SY69753L is a complete Clock Recovery and Data
Retiming integrated circuit for OC-3/STS-3 applications
at 155Mbps NRZ. The device is ideally suited for
SONET/SDH/ATM applications and other high-speed
data transmission systems.
Clock recovery and data retiming is performed by
synchronizing the on-chip VCO directly to the incoming
data stream. The VCO center frequency is controlled by
the reference clock frequency and the selected divide
ratio. On-chip clock generation is performed through the
use of a frequency multiplier PLL with a byte rate source
as reference.
The SY69753L also includes a link fault detection circuit.
Datasheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
• 3.3V power supply
• SONET/SDH/ATM compatible
• Clock and data recovery for 125Mbps/155Mbps NRZ
data stream
• Two on-chip PLLs: one for clock generation and
another for clock recovery
• Selectable reference frequencies
• Differential PECL high-speed serial I/O
• Line receiver input: no external buffering needed
• Link fault indication
• 100k ECL compatible I/O
• Industrial temperature range (–40°C to +85°C)
• Complies with Bellcore, ITU/CCITT and ANSI
specifications for OC-3 applications
• Available in 32-pin EPAD-TQFP
Applications
• Ethernet media converter(m)
• SONET/SDH/ATM OC-3
• Proprietary architecture at 135Mbps to 180Mbps
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
November 2006
M9999-111406-D
[email protected] or (408) 955-1690
Micrel, Inc.
SY69753L
Ordering Information(1)
Part Number
SY69753LHI
SY69753LHITR
SY69753LHG
(2)
(3)
SY69753LHGTR(2, 3)
Package
Type
Operating
Range
Package
Marking
Lead
Finish
H32-1
Industrial
SY69753LHI
Sn-Pb
H32-1
Industrial
SY69753LHI
Sn-Pb
H32-1
Industrial
SY69753LHG with
Pb-Free bar-line indicator
NiPdAu
Pb-Free
H32-1
Industrial
SY69753LHG with
Pb-Free bar-line indicator
NiPdAu
Pb-Free
Notes:
1.
Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals only.
2.
Tape and Reel.
3.
Recommended for new designs.
Pin Configuration
32-Pin EPAD-TQFP (H32-1)
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SY69753L
Pin Description
Inputs
Pin Number
Pin Name
Type
2
3
RDINP
RDINN
Differential
PECL
Serial Data Input: These built-in line receiver inputs are connected to the differential receive
serial data stream. An internal receive PLL recovers the embedded clock (RCLK) and data
(RDOUT) information.
Pin Name
5
REFCLK
TTL Input
Reference Clock: This input is used as the reference for the internal frequency synthesizer
and the "training" frequency for the receiver PLL to keep it centered in the absence of data
coming in on the RDIN inputs.
26
CD
PECL Input
32
25
DIVSEL1
DIVSEL2
TTL Input
Divider Select: These inputs select the ratio between the output clock frequency
(RCLK/TCLK) and the REFCLK input frequency as shown in the “Reference Frequency
Selection” table.
16
CLKSEL
TTL Input
Clock Select: This input is used to select either the recovered clock of the receiver PLL
(CLKSEL = HIGH) or the clock of the frequency synthesizer (CLKSEL = LOW) to the TCLK
outputs.
Carrier Detect: This input controls the recovery function of the Receive PLL and can be driven
by the carrier detect output of optical modules or from external transition detection circuitry.
When this input is HIGH, the input data stream (RDIN) is recovered normally by the Receive
PLL. When this input is LOW the data on the inputs RDIN will be internally forced to a
constant LOW, the data outputs RDOUT will remain LOW, the Link Fault Indicator output
LFIN forced LOW and the clock recovery PLL forced to look onto the clock frequency
generated from REFCLK.
Outputs
Pin Number
Pin Name
Type
31
LFIN
TTL Output
Link Fault Indicator: This output indicates the status of the input data stream RDIN. Active
HIGH signal is indicating when the internal clock recovery PLL has locked onto the incoming
data stream. LFIN will go HIGH if CD is HIGH and RDIN is within the frequency range of the
Receive PLL (1000ppm) and will be alternating if not. LFIN is an asynchronous output.
Pin Name
23
24
RDOUTN
RDOUTP
Differential
PECL
Receive Data Output: These ECL 100K outputs represent the recovered data from the input
data stream (RDIN). This recovered data is specified against the rising edge of RCLK.
20
21
RCLKN
RCLKP
Differential
PECL
Clock Output: These ECL 100K outputs represent the recovered clock used to sample the
recovered data (RDOUT).
18
17
TCLKP
TCLKN
Differential
PECL
Clock Output: These ECL 100K outputs represent either the recovered clock (CLKSEL =
HIGH) used to sample the recovered data (RDOUT) or the transmit clock of the frequency
synthesizer (CLKSEL = LOW).
9
10
PLLSP
PLLSN
Clock Synthesis PLL Loop Filter: External loop filter pins for the clock synthesis PLL.
14
15
PLLRN
PLLRP
Clock Recovery PLL Loop Filter: External loop filter pins for the receiver PLL.
Power and Ground
Pin Number
Pin Name
27, 28
VCC
Type
Pin Name
29
30
VCCA
Analog Power Supply Voltage.(1)
19, 22
VCCO
Output Supply Voltage.(1)
12, 13
GND
1, 4, 6, 7, 8
NC
11
GNDA
Power Supply.(1)
Ground.
No connect.
Analog Ground.
Note:
1. VCC, VCCA, VCCO must be the same value.
November 2006
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SY69753L
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) ................................... -0.5V to +5.0V
Input Voltage (VIN) ........................................... -0.5V to VCC
Output Current (IOUT)
Continuous........................................................ ±50mA
Surge .............................................................. ±100mA
Lead Temperature (soldering, 20sec.) ................... +260°C
Storage Temperature (Ts) ........................-65°C to +150°C
Input Voltage (VCC)............................ +3.15V to +3.45V
Ambient Temperature (TA) ................... –40°C to +85°C
Junction Temperature (TJ) ................................ +125°C
Package Thermal Resistance(3)
EPAD-TQFP (θJA)
Still-air .................................................... 28°C/W
500lfpm .................................................. 20°C/W
EPAD-TQFP (θJC)........................................... 4°C/W
DC Electrical Characteristics
TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
VCC
Power Supply Voltage
ICC
Power Supply Current
Condition
Min
Typ
Max
Units
3.15
3.3
3.45
V
170
230
mA
PECL 100K DC Electrical Characteristics
VCC = VCCO = VCCA = 3.3V ±5%; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VOH
Output HIGH Voltage
VOL
Output LOW Voltage
IIL
Input LOW Current
Condition
Min
Typ
Max
Units
VCC-1.165
VCC-0.880
V
VCC-1.810
VCC-1.475
V
50Ω to VCC-2V
VCC-1.075
VCC-0.830
V
50Ω to VCC-2V
VCC-1.860
VCC-1.570
V
VIN = VIL (Min)
0.5
µA
TTL DC Electrical Characteristics
VCC = VCCO = VCCA = 3.3V ±5%; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
VOH
Output HIGH Voltage
IOH = -0.4mA
VOL
Output LOW Voltage
IOL = 4mA
IIH
Input HIGH Current
VIN = 2.7V, VCC = Max.
VIN = VCC, VCC = Max.
-125
IIL
Input LOW Voltage
VIN = 0.5V, VCC = Max.
-300
IOS
Output Short Circuit Current
VOUT = 0V, (max., 1 sec.)
-15
Typ
2.0
Max
Units
VCC
V
0.8
V
0.5
V
+100
µA
µA
2.0
V
µA
-100
mA
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Numbers valid with proper thermal design of PCB and exposed pad soldered to island on PCB. Refer to Figure on page 13.
November 2006
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SY69753L
AC Electrical Characteristics
VCC = VCCO = VCCA = 3.3V ±5%; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
fVCO
VCO Center Frequency
fREFCLK x Byte Rate
800
Typ
Max
Units
1250
MHz
∆fVCO
VCO Center Frequency
Tolerance
Nominal
tACQ
Acquisition Lock Time
50Ω to VCC-2V
tCPWH
REFCLK Pulse Width HIGH
50Ω to VCC-2V
4
ns
tCPWL
REFCLK Pulse Width LOW
VIN = VIL (Min)
4
ns
5
%
15
µs
tDV
Data Valid
1/(2xfRCLK) -200
ps
tDH
Data Hold
1/(2xfRCLK) -200
ps
tir
REFCLK Input Rise Time
tODC
Output Duty Cycle (RCLK/TCLK)
tRSKEW
Recovered Clock Skew
tr, tf
ECL Output Rise/Fall Time
(20% to 80%)
0.5
50Ω to VCC-2
2
ns
45
55
% of
UI
-200
+200
ps
100
400
ps
Timing Waveforms
November 2006
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SY69753L
Functional Block
The total loop dynamic of the clock recovery PLL
provides jitter tolerance which is better than the
specified tolerance in GR-253-CORE.
Lock Detect
The SY69753L contains a link fault indication circuit,
which monitors the integrity of the serial data inputs. If
the received serial data fails the frequency test, then
the PLL will be forced to lock to the local reference
clock. This will maintain the correct frequency of the
recovered clock output under loss of signal or loss of
lock conditions. If the recovered clock frequency
deviates from the local reference clock frequency by
more than approximately 1000ppm, the PLL will be
declared out of lock. The lock detect circuit will poll the
input data stream in an attempt to reacquire lock to
data. If the recovered clock frequency is determined to
be within approximately 1000ppm, the PLL will be
declared in lock and the lock detect output will go
active.
Performance
The SY69753L PLL complies with the jitter
specifications proposed for SONET/SDH equipment
defined by the Bellcore Specifications: GR-253CORE, Issue 2, December 1995 and ITU-T
Recommendations: G.958 document, when used with
differential inputs and outputs.
Functional Description
Clock Recovery
Clock Recovery, as shown in the block diagram,
generates a clock that is at the same frequency as the
incoming data bit rate at the Serial Data input. The
clock is phase aligned by a PLL so that it samples the
data in the center of the data eye pattern.
The phase relationship between the edge transitions
of the data and those of the generated clock are
compared by a phase/frequency detector. Output
pulses from the detector indicate the required
direction of phase correction. These pulses are
smoothed by an integral loop filter. The output of the
loop filter controls the frequency of the Voltage
Controlled Oscillator (VCO), which generates the
recovered clock.
Frequency stability, without incoming data, is
guaranteed by an alternate reference input (REFCLK)
that the PLL locks onto when data is lost. If the
Frequency of the incoming signal varies by greater
than approximately 1000ppm with respect to the
synthesizer frequency, the PLL will be declared out of
lock, and the PLL will lock to the reference clock.
The loop filter transfer function is optimized to enable
the PLL to track the jitter, yet tolerate the minimum
transition density expected in a received SONET data
signal. This transfer function yields a 30µs data
stream of continuous 1's or 0's for random incoming
NRZ data.
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SY69753L
Jitter Transfer
Input Jitter Tolerance
Input jitter tolerance is defined as the peak-to-peak
amplitude of sinusoidal jitter applied on the input
signal that causes an equivalent 1dB optical/electrical
power penalty. SONET input jitter tolerance
requirement condition is the input jitter amplitude that
causes an equivalent of 1dB power penalty.
Jitter transfer function is defined as the ratio of jitter on
the output OC-N/STS-N signal to the jitter applied on
the input OC-N/STS-N signal versus frequency. Jitter
transfer requirements are shown in Figure 2.
Jitter Generation
The jitter of the serial clock and serial data outputs
shall not exceed .01 U.I. rms when a serial data input
with no jitter is presented to the serial data inputs.
OC/STS-N
Level
f0
(Hz)
f1
(Hz)
f2
(Hz)
f3
(Hz)
ft
(Hz)
OC/STS-N
Level
fc
(kHz)
P
(dB)
3
10
30
300
6.5
65
3
130
0.1
Figure 1. Input Jitter Tolerance
November 2006
Figure 2. Jitter Transfer
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SY69753L
Loop Filter Components(1)
R1 = 80Ω
C1 = 1.5µF (X7R Dielectric)
R2 = 50Ω
C2 = 1.0µF (X7R Dielectric)
Note:
1. Suggested values. Values may vary for different applications.
Reference Frequency Selection
DIVSEL1
DIVSEL2
fRCLK/fREFCLK
0
0
8
0
1
10
1
0
16
1
1
20
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SY69753L
Application Example
Note:
C3, C4 are optional.
C1 = 1.5µF
C2 = 1.0µF
R1 = 80Ω
R2 = 50Ω
R3 through R10 = 5kΩ
R12 = 12kΩ
R13 = 130Ω
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SY69753L
Bill of Materials
Item
Part Number
Manufacturer
Description
Qty.
(1)
1.5µF Ceramic Capacitor, Size 1206, X7R Dielectric,
Loop Filter, Critical
1
C1
ECU-V1H104KBW
Panasonic
C2
ECU-V1H104KBW
Panasonic(1)
1.0µF Ceramic Capacitor, Size 1206, X7R Dielectric,
Loop Filter, Critical
1
C3, C4
ECU-V1H104KBW
Panasonic(1)
0.47µF Ceramic Capacitor, Size 1206, X7R Dielectric,
Loop Filter, Optional
2
C5
ECS-T1ED226R
Panasonic(1)
22µF Tantalum Electrolytic Capacitor, Size D
1
C6
ECU-V1H104KBW
Panasonic(1)
0.1µF Ceramic Capacitor, Size 1206, X7R Dielectric
Power Supply Decoupling
1
C7, C8, C9, C10
ECS-T1EC685R
Panasonic(1)
6.8µF Tantalum Electrolytic Capacitor, Size C
4
C19
ECJ-3YB1E105K
Panasonic(1)
0.1µF Ceramic Capacitor, Size 1206, X7R Dielectric
VEEA Decoupling
1
C11, C13
ECU-V1H104KBW
Panasonic(1)
0.1µF Ceramic Capacitor, Size 1206, X7R Dielectric
VCCO/VCC Decoupling
1
C15, C17
ECU-V1H104KBW
Panasonic(1)
0.1µF Ceramic Capacitor, Size 1206, X7R Dielectric
VCCA/VEEA Decoupling
1
C20
ECU-V1H104KBW
Panasonic(1)
0.1µF Ceramic Capacitor, Size 1206, X7R Dielectric
VEEA Decoupling
1
C12, C14
ECU-V1H103KBW
Panasonic(1)
0.01µF Ceramic Capacitor, Size 1206, X7R Dielectric
VCCO/VCC Decoupling
1
C16, C18
ECU-V1H103KBW
Panasonic(1)
0.01µF Ceramic Capacitor, Size 1206, X7R Dielectric
VCCA/VEEA Decoupling
1
C21
ECU-V1H103KBW
Panasonic(1)
0.01µF Ceramic Capacitor, Size 1206, X7R Dielectric
VEEA Decoupling
1
D1
1N4148
Diode
1
D2
P300-ND/P301-ND
Panasonic(1)
T-1 3/4, Red LED
1
J1, J2, J3, J4, J5,
J6, J7, J8, J9,
J10, J11, J12
142-0701-851
Johnson
Components(2)
Gold Plated, Jack, SMA, PCB Mount
12
L1, L2, L3
BLM21A102F
Murata(3)
Ferrite Beads, Power Noise Suppression
3
Q1
NTE123A
NTE
(4)
2N2222A Buffer/Driver Transistor, NPN
1
R1
80Ω Resistor, 2%, Size 1206, Loop Filter Component,
Critical
1
R2
50Ω Resistor, 2%, Size 1206, Loop Filter Component,
Critical
1
R3, R4, R5, R6,
R7, R8, R9, R10
5kΩ Pull-up Resistor, 2%, Size 1206
8
R11
1kΩ Pull-down Resistor, 2%, Size 1206
1
R12
12kΩ Resistor, 2%, Size 1206
1
R13
SW1
206-7
CTS(5)
130Ω Pull-up Resistor, 2%, Size 1206
1
SPST, Gold Finish, Sealed Dip Switch
1
Notes:
1.
Panasonic: www.panasonic.com.
2.
Johnson Components: www.johnson-components.com.
3.
Murata: www.murata.com.
4.
NTE: www.nte.com.
5.
CTS: www.cts.com.
November 2006
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Appendix A
SY69753L
6.
Layout and General Suggestions
1.
2.
3.
4.
5.
Establish controlled impedance stripline, microstrip, or
coplanar construction techniques.
Signal paths should have approximately the same width
as the device pads.
All differential paths are critical timing paths, where
skew should be matched to within ±10ps.
Signal trace impedance should not vary more than
±5%. If in doubt, perform TDR analysis of all high-speed
signal traces.
Maintain compact filter networks as close to filter pins
as possible. Provide ground plane relief under filter path
to reduce stray capacitance. Be careful of crosstalk
coupling into the filter network.
November 2006
7.
8.
11
Maintain low jitter on the REFCLK input. Isolate the
XTAL oscillator from power supply noise by adequately
decoupling. Keep XTAL oscillator close to device, and
minimize capacitive coupling from adjacent signals.
Higher speed operation may require use of
fundamental-tone (third-overtone typically has more
jitter) crystal-based oscillator for optimum performance.
Evaluate and compare candidates by measuring
TXCLK jitter.
All unused outputs require termination. To conserve
power, unused PECL outputs can be terminated with a
1kΩ resistor to VEE.
M9999-111406-D
[email protected] or (408) 955-1690
Micrel, Inc.
SY69753L
Package Information
32-Pin EPAD-TQFP (H32-1)
November 2006
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Micrel, Inc.
SY69753L
PCB Thermal Consideration for 32-Pin EPAD-TQFP Package
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for
its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant
injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk
and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
November 2006
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