MITSUBISHI CM75DU-24F

MITSUBISHI IGBT MODULES
CM75DU-24F
HIGH POWER SWITCHING USE
CM75DU-24F
¡IC ..................................................................... 75A
¡VCES ......................................................... 1200V
¡Insulated Type
¡2-elements in a pack
APPLICATION
General purpose inverters & Servo controls, etc
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
Tc measured point
94
80 ±0.25
12
4
4 11
18
E2 G2
4
G1E1
27
24
48
24
CM
C1
E2
C2E1
2–φ6.5
MOUNTING HOLES
23
23
24
17
13
7
13.5
2.5 16
TAB #110. t=0.5
RTC
C2E1
C1
E2
LABEL
21.2
+1
30 –0.5
RTC
G1 E1
25
7.5
16 2.5
E2 G2
3–M5NUTS
12mm deep
CIRCUIT DIAGRAM
Sep.2000
MITSUBISHI IGBT MODULES
CM75DU-24F
HIGH POWER SWITCHING USE
MAXIMUM RATINGS (Tj = 25°C)
Symbol
VCES
VGES
IC
ICM
IE (Note 1)
IEM (Note 1)
PC (Note 3)
Tj
Tstg
Viso
Parameter
Collector-emitter voltage
Gate-emitter voltage
Collector current
Emitter current
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
—
Torque strength
—
Weight
Conditions
G-E Short
C-E Short
TC = 25°C
Pulse
TC = 25°C
Pulse
TC = 25°C
Ratings
1200
±20
75
150
75
150
450
–40 ~ +150
–40 ~ +125
2500
2.5 ~ 3.5
3.5 ~ 4.5
310
(Note 2)
(Note 2)
Charged part to base plate, AC 1 min.
Main Terminal M5
Mounting holes M6
Typical value
Unit
V
V
A
A
A
A
W
°C
°C
V
N•m
N•m
g
ELECTRICAL CHARACTERISTICS (Tj = 25°C)
Symbol
Parameter
Test conditions
Limits
Typ.
—
Max.
1
Unit
ICES
Collector cutoff current
VCE = VCES, VGE = 0V
Min.
—
VGE(th)
Gate-emitter threshold voltage
IC = 7.5mA, VCE = 10V
5
6
7
V
IGES
Gate leakage current
Collector-emitter saturation voltage
Cies
Coes
Cres
QG
td(on)
tr
td(off)
tf
trr (Note 1)
Qrr (Note 1)
VEC(Note 1)
Rth(j-c)Q
Rth(j-c)R
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Rth(c-f)
Rth(j-c’)Q
RG
Contact thermal resistance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.2
—
1.8
1.9
—
—
—
825
—
—
—
—
—
3.1
—
—
—
0.07
—
—
20
2.4
—
29
1.3
0.75
—
100
50
400
300
150
—
3.2
0.28
0.47
—
µA
VCE(sat)
VGE = VCES, VCE = 0V
Tj = 25°C
IC = 75A, VGE = 15V
Tj = 125°C
Thermal resistance*1
Thermal resistance
External gate resistance
VCE = 10V
VGE = 0V
VCC = 600V, IC = 75A, VGE = 15V
VCC = 600V, IC = 75A
VGE1 = VGE2 = 15V
RG = 4.2Ω, Inductive load switching operation
IE = 75A
IE = 75A, VGE = 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compound applied *2 (1/2 module)
Tc measured point is just under the chips
0.22 *3
42
mA
V
nF
nF
nF
nC
ns
ns
ns
ns
ns
µC
V
°C/W
°C/W
°C/W
°C/W
Ω
Note 1. IE, VEC, t rr, Q rr, die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode (FWDi).
2. Pulse width and repetition rate should be such that the device junction temp. (T j) does not exceed Tjmax rating.
3. Junction temperature (Tj) should not increase beyond 150°C.
*1 : Tc measured point is indicated in OUTLINE DRAWING.
*2 : Typical value is measured by using Shin-etsu Silicone “G-746”.
*3 : If you use this value, Rth(f-a) should be measured just under the chips.
Sep.2000
MITSUBISHI IGBT MODULES
CM75DU-24F
HIGH POWER SWITCHING USE
PERFORMANCE CURVES
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
125
VGE=20V
9.5
9
100
75
8.5
50
8
25
0
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
15
11
10
Tj=25°C
0
0.5
1
1.5
2
2.5
3
3.5
4
VGE = 15V
2.5
2
1.5
1
Tj = 25°C
Tj = 125°C
0.5
0
0
50
100
150
COLLECTOR CURRENT IC (A)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
5
103
Tj = 25°C
4
3
IC = 150A
IC = 75A
2
IC = 30A
1
0
6
8
10
12
14
16
18
Tj = 25°C
102
7
5
3
2
101
7
5
3
2
1
1.5
2
2.5
3
3.5
GATE-EMITTER VOLTAGE VGE (V)
EMITTER-COLLECTOR VOLTAGE VEC (V)
CAPACITANCE–VCE
CHARACTERISTICS
(TYPICAL)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
103
3
2
Cies
101
7
5
3
2
100
7
5
Cres
Coes
VGE = 0V
10–1 –1
10 2 3 5 7 100 2 3 5 7 101 2 3 5 7 102
COLLECTOR-EMITTER VOLTAGE VCE (V)
SWITCHING TIMES (ns)
7
5
3
2
7
5
3
2
100
0.5
20
102
CAPACITANCE Cies, Coes, Cres (nF)
3
COLLECTOR-EMITTER VOLTAGE VCE (V)
EMITTER CURRENT IE (A)
COLLECTOR CURRENT IC (A)
150
COLLECTOR-EMITTER
SATURATION VOLTAGE VCE (sat) (V)
OUTPUT CHARACTERISTICS
(TYPICAL)
7
5
tf
3
2
td(off)
102
7
5
3
2
101
7
5
3
2
100 0
10
td(on)
tr
Conditions:
VCC = 600V
VGE = ±15V
RG = 4.2Ω
Tj = 125°C
Inductive load
2
3
5 7 101
2
3
5 7 102
COLLECTOR CURRENT IC (A)
Sep.2000
MITSUBISHI IGBT MODULES
CM75DU-24F
HIGH POWER SWITCHING USE
102
7
5
Irr
trr
3
2
101
7
5
Conditions:
VCC = 600V
VGE = ±15V
RG = 4.2Ω
Tj = 25°C
Inductive load
3
2
100 0
10
2
3
5 7 101
2
5 7 102
3
EMITTER CURRENT IE (A)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Zth (j–c) (°C/W)
REVERSE RECOVERY TIME trr (ns)
REVERSE RECOVERY CURRENT lrr (A)
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
10–3 2 3 5 710–2 2 3 5 710–1 2 3 5 7 100 2 3 5 7 101
101
7 IGBT part:
5 Per unit base = Rth(j–c) = 0.28°C/W
3 FWDi part:
2 Per unit base = Rth(j–c) = 0.47°C/W
100
7
5
3
2
3
2
10–1
10–1
10–2
10–2
7
5
3
2
7
5
3
2
10–3
7
5
3
2
7
5
3
2
Single Pulse
TC = 25°C
10–3
10–5 2 3 5 710–4 2 3 5 7 10–3
TMIE (s)
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE VGE (V)
20
IC = 75A
18
16
VCC = 400V
14
VCC = 600V
12
10
8
6
4
2
0
0
200
400
600
800
1000 1200
GATE CHARGE QG (nC)
Sep.2000