www.ti.com
SLAS412− DECEMBER 2003
FEATURES
D Low Power High Quality Audio Codec
D Stereo Audio DAC and Mono Audio ADC
D
D
D
D
D
D
D
D
D
D
D
D
Support Rates up to 48 ksps
High Quality 97-dBA Stereo Audio Playback
Performance
Low Power: 11-mW Stereo Audio Playback at
48 ksps
On-Chip 325-mW, 8- Speaker Driver
Stereo Headphone Amplifier With Capless
Output Option
Microphone Preamp and Hardware Automatic
Gain Control
Integrated PLL for Flexible Audio Clock
Generation
Programmable Digital Audio
Bass/Treble/EQ/De-Emphasis
Direct Battery Measurement Accepts up to
6-V Input
On-Chip Temperature Measurement
SPI and I2S Serial Interface
Full Power-Down Control
32-Pin 5y5 mm QFN Package
APPLICATIONS
D Cellular and Smart Phones
D MP3 Players
D Digital Still Cameras
D Digital Video Camcorders
DESCRIPTION
The TLV320AIC26 is a high-performance audio codec with
16/20/24/32-bit 97-dBA stereo playback, mono record
functionality at up to 48 ksps. A microphone input includes
built-in preamp and hardware automatic gain control, with
single-ended or fully-differential input capability.
The audio output drivers on the ’AIC26 are highly flexible,
having software-programmable low or high-power drive
modes to optimize system power dissipation. The outputs
can be configured to supply up to 325 mW into a bridge
terminated 8-Ω load, can support stereo 16-Ω headphone
amplifiers in ac-coupled or capless output configurations,
and can supply a stereo line-level output
A programmable digital audio effects processor enables
bass, treble, midrange, or equalization playback
processing. The digital audio data format is programmable
to work with popular audio standard protocols (I2S, DSP,
Left/Right Justified) in master or slave mode, and also
includes an on-chip programmable PLL for flexible clock
generation capability. Highly configurable software power
control is provided, enabling stereo audio playback at 48
ksps at 11 mW with a 3.3-V analog supply level.
The ’AIC26 offers a 12-bit measurement ADC and internal
reference voltage, as well as two battery measurement
inputs capable of reading battery voltages up to 6 V, while
operating at an analog supply as low as 2.7 V. It includes
an on-chip temperature sensor capable of reading 0.3°C
resolution. The ’AIC26 is available in a 32 lead QFN.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a trademark of Motorola.
I2S is a trademark of Phillips Electronics.
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/ #".)(&'
("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&' '&%.%#. 2%##%&3/
#".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).* &*'&4 "! %-- +%#%$*&*#'/
Copyright 2003, Texas Instruments Incorporated
www.ti.com
SLAS412− DECEMBER 2003
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
OPERATING
TEMPERATURE RANGE
TLV320AIC26
QFN-32
RHB
−40°C to 85°C
ORDERING NUMBER
TRANSPORT MEDIA,
QUANTITY
TLV320AIC26IRHB
Tubes, 74
TLV320AIC26IRHBR
Tape and Reel, 3000
PIN ASSIGNMENTS
QFN
DVDD
BCLK
DOUT
DIN
PWD/ADWS
LRCK
RESET
HPR
(TOP VIEW)
32 31 30 29 28 27 26 25
DVSS
IOVDD
MCLK
SCLK
MISO
MOSI
SS
DAV
1
24
2
23
22
3
4
5
21
20
AIC26
7
19
18
8
17
6
DRVDD
VGND
DRVSS
HPL
AVDD
NC
NC
NC
MICBIAS
MICIN
AUX
VBAT2
VBAT1
VREF
AVSS
NC
9 10 11 12 13 14 15 16
Terminal Functions
QFN
PIN
2
NAME
DESCRIPTION
QFN
PIN
NAME
DESCRIPTION
29
DIN
Audio data input
13
VBAT1
Battery monitor input
30
DOUT
Audio data output
14
VREF
Reference voltage I/O
31
BCLK
Audio bit−clock
15
AVSS
Analog ground
32
DVDD
Digital core supply
16
NC
No connect
1
DVSS
Digital core and IO ground
17
NC
No connect
2
IOVDD
IO supply
18
NC
No connect
3
MCLK
Master clock
19
NC
No connect
4
SCLK
SPI serial clock input
20
AVDD
5
MISO
SPI serial data output
21
HPL
6
MOSI
SPI serial data input
22
DRVSS
Speaker ground
7
SS
SPI slave select input
23
VGND
Virtual ground for audio output
8
DAV
Auxiliary data available output
24
DRVDD
9
MICBIAS
Microphone bias voltage
25
HPR
10
MICIN
Microphone input
26
RESET
Auxiliary input
27
LRCK
Battery monitor input
28
PWD/ADWS
11
AUX
12
VBAT2
Analog power supply
Left channel audio output
Speaker /PLL supply
Right channel audio output
Device reset
Audio DAC word-clock
Hardware powerdown/ADC word clock
www.ti.com
SLAS412− DECEMBER 2003
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)(2)
UNITS
AVDD to AVSS
−0.3 V to 3.9 V
DRVDD to DRVSS
−0.3 V to 3.9 V
IOVDD to DVSS
−0.3 V to 3.9 V
DVDD to DVSS
−0.3 V to 2.5 V
AVDD to DRVDD
−0.1 V to 0.1 V
AVSS to DRVSS to DVSS
−0.1 V to 0.1 V
Analog inputs (except VBAT1 and VBAT2) to AVSS
VBAT1 / VBAT2 to AVSS
−0.3 V to AVDD + 0.3 V
−0.3 V to 6 V
Digital input voltage to DVSS
−0.3 V to IOVDD + 0.3 V
Operating temperature range
−40°C to 85°C
Storage temperature range
−65°C to 105°C
Junction temperature (TJ Max)
Power dissipation
QFN package
Lead temperature
θJA Thermal impedance
Soldering vapor phase (60 sec)
Infrared (15 sec)
105°C
(TJ Max − TA)/θJA
123°C/W
215°C
220°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If the ’AIC26 is used to drive high power levels to an 8-Ω load for extended intervals at ambient temperatures above 70°C, multiple vias should be
used to electrically and thermally connect the thermal pad on the QFN package to an internal heat-dissipating ground plane on the user’s PCB.
3
www.ti.com
SLAS412− DECEMBER 2003
ELECTRICAL CHARACTERISTICS
At +25°C, AVDD,DRVDD,IOVDD = 3.3 V, DVDD = 1.8 V, Int. Vref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
BATTERY MONITOR INPUTS
Input voltage range
0.5
Input leakage current
6.0
±1
Battery conversion not selected
V
µA
AUXILIARY A/D CONVERTER
Resolution
Programmable: 8-, 10-,12-bits
No missing codes
12-bit resolution
12
Bits
11
Bits
Integral nonlinearity
−5
5
LSB
Offset error
−6
6
LSB
−6
6
LSB
Calculated with effect of internal reference
variation removed.
Gain error
Noise
µVrms
53
AUDIO CODEC
ADC DECIMATION FILTER
Sample rate of 48 ksps
Filter gain from 0 to 0.39Fs
Filter gain at 0.4125Fs
Filter gain at 0.45Fs
Filter gain at 0.5Fs
Filter gain from 0.55Fs to 64Fs
Filter group delay
±0.1
dB
−0.25
dB
−3
dB
−17.5
dB
−75
dB
17/Fs
sec
MICROPHONE INPUT TO ADC
1 kHz sine wave input, Fs = 48 ksps
Full scale input voltage (0 dB)
By design, not tested in production
0.707
Vrms
Input common mode
By design, not tested in production
1.35
V
SNR
Measured as idle channel noise, 0-dB gain,
A-weighted
THD
0.63-Vrms input, 0-dB gain
PSRR
1 kHz, 100 mVpp on AVDD.(1)
Mute attenuation
Output code with 0.63-Vrms sine wave input at
1 kHz
80
92
−89
57
dBA
−72
dB
dB
0000H
Input resistance
20
kΩ
Input capacitance
10
pF
D4 = 0 control register 05H/Page2
2.5
V
D4 = 1 control register 05H/Page2
2.0
V
4.7
mA
MICROPHONE BIAS
Voltage
Sourcing current
(1) ADC PSRR measurement is calculated as:
ǒ
PSRR + 20 log 10
4
VSIG sup
V
Ǔ
ADCOUT
www.ti.com
SLAS412− DECEMBER 2003
ELECTRICAL CHARACTERISTICS
At +25°C, AVDD,DRVDD,IOVDD = 3.3 V, DVDD = 1.8 V, Int. Vref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
DAC INTERPOLATION FILTER
Pass band
20
0.45 Fs
±0.06
Pass band ripple
Transition band
Stop band
Hz
dB
0.45 Fs
0.5501 Fs
Hz
0.5501 Fs
7.455 Fs
Hz
Stop band attenuation
Filter group delay
De−emphasis error
65
dB
21/Fs
sec
±0.1
dB
1-kHz sine wave input, 48 ksps, output drivers
in low power mode, load = 10 kΩ, 10 pF
DAC LINE OUTPUT
Full scale output voltage (0 dB)
By design, D10−D9 = 00 in control register
06H/Page2 corresponding to 2-VPP output
swing
0.707
Vrms
Output common mode
By design, D10−D9 = 00 in control register
06H/Page2 corresponding to 2-VPP output
swing
1.35
V
SNR
Measured as idle channel noise, A-weighted
THD
0-dB FS input, 0-dB gain
PSRR
85
97
dBA
−95
dB
1 kHz, 100 mVpp on AVDD(2) VGND powered
down
56
dB
Interchannel isolation
Coupling from ADC to DAC
84
dB
DAC HEADPHONE OUTPUT
1-kHz sine wave input, 48 ksps, output drivers
in high power mode, load = 16 Ω, 10 pF
Full scale output voltage (0 dB)
By design, D10−D9 = 00 in control register
06H/Page2 corresponding to 2-VPP output
swing
SNR
Measured as idle channel noise, A-weighted
THD
−1 dB FS input, 0-dB gain
PSRR
1 kHz, 100 mVpp on AVDD(1) VGND powered
down
Interchannel isolation
Coupling from ADC to DAC
85
D10−D9 = 00 in control register 06H/Page2
Digital volume control gain
Vrms
97
dBA
−91
Mute attenuation
Maximum output power
0.707
dB
dB
85
dB
121
dB
30
−63.5
Digital volume control step size
−55
54
mW
0
dB
0.5
dB
80
dB
Channel separation
Between HPL and HPR
DAC SPEAKER OUTPUT
Output driver in high power mode,
load = 8 Ω,, connected between HPR and HPL
pins. D10−D9 = 10 in control register
06H/Page2 corresponding to 2.402-VPP output
swing
Output power
0 dB input to DAC
325
mW
SNR
Measured as idle channel noise, A-weighted
102
dBA
THD
−1 dB FS input, 0-dB gain
−86
dB
−6 dB FS input, 0-dB gain
−88
dB
(1) DAC PSRR measurement is calculated as:
ǒ
PSRR + 20 log 10
Ǔ
VSIG sup
V
HPRńL
5
www.ti.com
SLAS412− DECEMBER 2003
ELECTRICAL CHARACTERISTICS
At +25°C, AVDD,DRVDD,IOVDD = 3.3 V, DVDD = 1.8 V, Int. Vref = 2.5 V, Fs (Audio) = 48 kHz, unless otherwise noted (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VOLTAGE REFERENCE
Voltage range
VREF output programmed as 2.5 V
2.3
2.5
2.7
VREF output programmed as 1.25 V
1.15
1.25
1.35
Voltage range
External VREF. By design, not tested in
production.
Reference drift
Internal VREF = 1.25 V
Current drain
Extra current drawn when the internal
reference is turned on.
1.2
2.55
V
V
29
ppm/°C
650
µA
8.8
MHz
DIGITAL INPUT / OUTPUT(1)
Internal clock frequency
Logic family
CMOS
Logic level:
VIH
VIL
VOH
VOL
Capacitive load
IIH = +5 µA
IIL = +5 µA
0.7xIOVDD
IOH = 2 TTL loads
IOL = 2 TTL loads
0.8xIOVDD
V
−0.3
0.3xIOVDD
V
V
0.1xIOVDD
10
V
pF
POWER SUPPLY REQUIREMENTS
Power supply voltage
AVDD(2)
2.7
3.6
DRVDD(2)
2.7
3.6
V
IOVDD
1.1
3.6
V
1.95
V
DVDD
1.525
IAVDD
Stereo audio playback
IDRVDD
IDVDD
48 ksps, output drivers in low
power mode, VGND off, PLL
off
IAVDD
Microphone record
IDRVDD
48 ksps, no playback, PLL off
IDVDD
0
mA
1.3
mA
0.9
IAVDD
IDRVDD
mA
2.4
0.1
Additional power consumed
when PLL is enabled.
IDVDD
VGND
0
1.4
IAVDD
IDRVDD
2.2
2.9
IDVDD
PLL
V
0.3
Additional power consumed
when VGND is powered.
0.9
mA
0
Hardware power down
All currents
2
µA
(1) Internal oscillator is designed to give nominally 8-MHz clock frequency. However, due to process variations, this frequency can vary from device
to device. All calculations for delays and wait times in the data sheet assume an 8-MHz oscillator clock.
(2) It is recommended that AVDD and DRVDD be set to the same voltage for the best performance. It is also recommended that these supplies be
separated on the user’s PCB.
6
www.ti.com
SLAS412− DECEMBER 2003
FUNCTIONAL BLOCK DIAGRAM
DRVDD
DRVSS
AVDD
AVSS
DVDD
DVSS
0 to −63.5 dB
(0.5 dB Steps)
Headphone Driver
HPR
IOVDD
Σ
∑−∆
DAC
Σ
∑−∆
DAC
Σ
Vol
Ctl
Σ
Vol
Ctl
PLL
MCLK
PWD/ADWS
Headphone Driver
HPL
VGND
DAC CM
MICBIAS
2.5 V/2 V
Analog Volume
Control −34.5 to
12 dB
Sidetone
−48 to 0 dB
1.5 dB Steps
DOUT
LRCK
Digital
Audio
Processing
and
Serial
Interface
DIN
BCLK
0 to 59.5 dB
(0.5 dB Steps)
MICIN
∑−∆
ADC
AGC
AUX
RESET
VBAT1
Battery
Monitor
VBAT2
Battery
Monitor
SPI
Interface
SAR
ADC
SCLK
SS
MOSI
MISO
DAV
Temperature
Measurement
VREF
Internal 2.5 V/
1.25 V
Reference
OSC
7
www.ti.com
SLAS412− DECEMBER 2003
SPI TIMING DIAGRAM
SS
t
t
t Lead
t Lag
td
s ck
SCLK
t wsck
tf
tr
t wsck
tv
MISO
t ho
MSB OUT
t dis
BIT . . . 1
LSB OUT
ta
MOSI
t hi
t su
MSB OUT
BIT . . . 1
LSB OUT
TYPICAL TIMING REQUIREMENTS
All specifications at 25°C, DVDD = 1.8 V (1)
IOVDD = 1.1 V
PARAMETER
MIN
MAX
IOVDD = 3.3 V
MIN
MAX
UNITS
twsck
tLead
SCLK pulse width
27
18
ns
Enable lead time
18
15
ns
tLag
ttd
Enable lag time
18
15
ns
Sequential transfer delay
18
ta
tdis
Slave MISO access time
tsu
thi
MOSI data setup time
6
6
ns
MOSI data hold time
6
6
ns
tho
tv
MISO data hold time
4
Slave MISO disable time
MISO data valid time
tr
Rise time
tf
Fall time
(1) These parameters are based on characterization and are not tested in production.
8
15
18
18
ns
15
ns
15
ns
4
ns
22
13
ns
6
4
ns
6
4
ns
www.ti.com
SLAS412− DECEMBER 2003
AUDIO INTERFACE TIMING DIAGRAMS
LRCK/ADWS
td (WS)
BCLK
td (DO−WS)
td (DO−BCLK)
DOUT
ts (DI)
th (DI)
DIN
Figure 1. I2S/LJF/RJF Timing in Master Mode
TYPICAL TIMING REQUIREMENTS (FIGURE 1)
All specifications at 25°C, DVDD = 1.8 V (1)
IOVDD = 1.1 V
PARAMETER
MIN
MAX
IOVDD = 3.3 V
MIN
MAX
UNITS
td (WS)
td (DO−WS)
ADWS/LRCK delay
25
15
ns
ADWS to DOUT delay (for LJF mode)
25
15
ns
td (DO−BCLK)
ts(DI)
BCLK to DOUT delay
25
15
ns
DIN setup
6
6
th(DI)
tr
DIN hold
6
6
Rise time
tf
Fall time
(1) These parameters are based on characterization and are not tested in production.
ns
ns
10
6
ns
10
6
ns
LRCK/ADWS
td (WS)
td (WS)
BCLK
td (DO−BCLK)
DOUT
th (DI)
ts (DI)
DIN
Figure 2. DSP Timing in Master Mode
TYPICAL TIMING REQUIREMENTS (FIGURE 2)
All specifications at 25°C, DVDD = 1.8 V(1)
IOVDD = 1.1 V
PARAMETER
MIN
MAX
IOVDD = 3.3 V
MIN
MAX
UNITS
td (WS)
td (DO−BCLK)
ADWS/LRCK delay
25
15
ns
BCLK to DOUT delay
25
15
ns
ts(DI)
th(DI)
DIN setup
6
6
ns
DIN hold
6
6
ns
tr
Rise time
tf
Fall time
(1) These parameters are based on characterization and are not tested in production.
10
6
ns
10
6
ns
9
www.ti.com
SLAS412− DECEMBER 2003
LRCK/ADWS
th (WS)
BCLK
tL(BCLK)
tS (WS)
tH(BCLK)
td(DO−WS)
tP(BCLK)
td(DO−BCLK)
DOUT
th (DI)
ts (DI)
DIN
Figure 3. I2S/LJF/RJF Timing in Slave Mode
TYPICAL TIMING REQUIREMENTS (FIGURE 3)
All specifications at 25°C, DVDD = 1.8 V (1)
IOVDD = 1.1 V
PARAMETER
MIN
MAX
IOVDD = 3.3 V
MIN
MAX
UNITS
tH (BCLK)
tL (BCLK)
BCLK high period
35
35
ns
BCLK low period
35
35
ns
ts(WS)
th(WS)
ADWS/LRCK setup
6
6
ns
ADWS/LRCK hold
6
td (DO−WS)
td (DO−BCLK)
ADWS to DOUT delay (for LJF mode)
25
18
ns
BCLK to DOUT delay
25
15
ns
ts(DI)
th(DI)
DIN setup
6
6
ns
DIN hold
6
6
ns
tr
Rise time
tf
Fall time
(1) These parameters are based on characterization and are not tested in production.
10
6
ns
5
4
ns
5
4
ns
www.ti.com
SLAS412− DECEMBER 2003
LRCK/ADWS
tS (WS)
tH(BCLK)
th(WS)
th(WS)
tS (WS)
tL(BCLK)
BCLK
td(DO−BCLK)
tP(BCLK)
DOUT
th (DI)
ts (DI)
DIN
Figure 4. DSP Timing in Slave Mode
TYPICAL TIMING REQUIREMENTS (FIGURE 4)
All specifications at 25°C, DVDD = 1.8 V (1)
IOVDD = 1.1 V
PARAMETER
MIN
MAX
IOVDD = 3.3 V
MIN
MAX
UNITS
tH (BCLK)
tL (BCLK)
BCLK high period
35
35
ns
BCLK low period
35
35
ns
ts(WS)
th(WS)
ADWS/LRCK setup
6
6
ns
ADWS/LRCK hold
6
6
ns
td (DO−BCLK)
ts(DI)
BCLK to DOUT delay
DIN setup
6
6
ns
th(DI)
tr
DIN hold
6
6
ns
Rise time
tf
Fall time
(1) These parameters are based on characterization and are not tested in production.
25
15
ns
5
4
ns
5
4
ns
11
www.ti.com
SLAS412− DECEMBER 2003
TYPICAL CHARACTERISTICS
1.5
1
LSB
0.5
0
−0.5
−1
−1.5
0
500
1000
1500
2000
CODE
2500
3000
3500
4000
Figure 5. SAR INL (TA = 25°C, Internal Ref = 2.5 V, 12 bit, AVDD = 3.3 V)
1
LSB
0.5
0
s
−0.5
−1
0
500
1000
1500
2000
CODE
2500
3000
3500
4000
Figure 6. SAR DNL (TA = 25°C, Internal Ref = 2.5 V, AVDD = 3.3 V)
0
−20
−40
dB
−60
−80
−100
−120
−140
−160
0
500
1000
1500
2000
2500
3000
3500
4000
Hz
Figure 7. ADC FFT Plot at 8 ksps (TA = 25°C, −1 dB, 1 kHz Input, AVDD = 3.3 V)
12
www.ti.com
SLAS412− DECEMBER 2003
0
−20
−40
dB
−60
−80
−100
−120
−140
−160
0
5000
10000
15000
20000
Hz
Figure 8. ADC FFT Plot at 48 ksps (TA = 25°C, −1 dB, 1 kHz Input, AVDD = 3.3 V)
90
89.5
Dynamic Range − dB
89
88.5
88
87.5
87
86.5
86
8
18
28
38
Sampling Rate − ksps
48
Figure 9. ADC Dynamic Range vs Sampling Speed (TA = 25°C, AVDD = 3.3 V)
0
−20
−40
dB
−60
−80
−100
−120
−140
−160
0
5000
10000
15000
20000
Hz
Figure 10. DAC FFT Plot (TA = 25°C, 48 ksps, 0 dB, 1 kHz Input, AVDD = 3.3 V, RL = 10 kΩ)
13
www.ti.com
SLAS412− DECEMBER 2003
0
−10
−30
dB
−50
−70
−90
−110
−130
−150
0
5000
10000
Hz
15000
20000
Figure 11. DAC FFT Plot (TA = 25°C, 48 ksps, −1 dB, 1 kHz Input, AVDD = DRVDD = 3.3 V, DVDD = 1.8 V,
RL = 16 Ω)
THD − Total Harmonic Distortion − dB
−88
−90
−92
−94
5
15
25
35
Output Power − mW
Figure 12. High Power Output Driver THD vs Output Power
(TA =25°C, AVDD, DRVDD = 3.3 V, RL = 16 )
14
www.ti.com
SLAS412− DECEMBER 2003
OVERVIEW
The ’AIC26 is a highly integrated stereo audio codec for portable computing, communication, and entertainment
applications. The ’AIC26 has a register-based architecture where all functions are controlled through the registers and
onboard state machines.
The ’AIC26 consists of the following blocks (refer to the block diagram):
D
D
D
D
Audio Codec
Battery Monitors
Auxiliary Inputs
Temperature Monitor
Audio data is transferred between the host DSP/µP via a standard 4-wire interface and supports a variety of modes (i.e.,
I2S, DSP, etc).
Control of the ’AIC26 and its functions is accomplished by writing to different registers in the ’AIC26. A simple command
protocol is used to address the 16-bit registers. Registers control the operation of the A/D converter and audio codec. The
control and auxiliary functions are accessed via a SPI bus.
A typical application of the ’AIC26 is shown in Figure 13.
12S Interface
Auxiliary Input
Audio
2.2 k
AUX
MICBIAS
MICIN
8
Speaker
MCLK
ADWS/
PWDZ
DOUT
ADC Word Select
LRCK
DAC Word Select
DIN
BCLK
HPR
HPL
VGND
R1
V1: Main Battery
V2: Secondary Battery
C1: 1 µF − 10 µF (Optional)
C2, C3, C4: 0.1 F
R1, R2: 200 − 300 VBAT1
VBAT2
R2
V1
V2
C3
C4
C1
VREF
C2
Master Clock Input
Serial Output to CPU/DSP
Serial Input From CPU/DSP
Serial Clock Input
SPI Interface
DAV
Auxiliary Data Interrupt Request to CPU
MISO
Serial Output to SPI Master
MOSI
Serial Input From SPI Master
SS
SPI Slave Select Input
SCLK
SPI Serial Clock Input
Figure 13. Typical Circuit Configuration
15
www.ti.com
SLAS412− DECEMBER 2003
OPERATION−AUDIO CODEC
Audio Analog I/O
The ’AIC26 has one mono audio input (MICIN) typically used for microphone recording, and an auxiliary input (AUX) that
can be used as a second microphone or line input. The dual audio output drivers have programmable power level and can
be configured to drive up to 325 mW into an 8-Ω speaker, or to drive 16-Ω stereo headphones at over 30-mW per channel,
or to provide a stereo line-level output. The power level of the output drivers is controlled using bit D12 in control register
REG−05H/Page2. The ’AIC26 also has a virtual ground (VGND) output driver, which can optionally be used to connect
the return terminal of headphones, to eliminate the ac-coupling capacitors needed at the headphone output. The VGND
amplifier is controlled by bit D8 of REG−05H/Page2. A special circuit has also been included in the ’AIC26 to insert a short
keyclick sound into the stereo audio output, even when the audio DAC is powered down. The keyclick sound is used to
provide feedback to the user when a particular button is pressed or item is selected. The specific sound of the keyclick can
be adjusted by varying several register bits that control its frequency, duration, and amplitude.
Audio Digital Interface
Digital audio data samples are transmitted between the ’AIC26 and the audio processor via the serial bus (BCLK, ADWS,
DOUT, LRCK, DIN) that can be configured to transfer digital data in four different formats: right justified, left justified, I2S,
and DSP. The four modes are MSB-first and operate with variable word length of 16, 20, 24, or 32 bits. The digital audio
serial bus of the ’AIC26 can operate in master or slave mode, depending on its register settings. The word-select signals
(ADWS, LRCK) and bit clock signal (BCLK) are configured as outputs when the bus is in master mode. They are configured
as inputs when the bus is in slave mode. The ADWS is representative of the sampling rate of the audio ADC and is
synchronized with DOUT. The LRCK is representative of the audio DAC sampling rate and is synchronized with DIN.
Although the DOUT signal can contain two channels of information (a left and right channel), the ’AIC26 sends the same
ADC data in both channels.
D ADC/DAC SAMPLING RATE
The Audio Control 1 register (Register 00H, Page2) determines the sampling rates of the audio DAC and ADC, which
are scaled down from a reference rate (Fsref). The ADC and DAC can operate with either a common LRCK (equal
sampling rates) or separate ADWS and LRCK (unequal sampling rates). When the audio codec is powered up, it is
configured by default as an I2S slave with both the DAC and ADC operating at Fsref.
D WORD SELECT SIGNALS
The word select signal (LRCK, ADWS) indicates the channel being transmitted:
−
LRCK/ADWS = 0: left channel for I2S mode
−
LRCK/ADWS = 1: right channel for I2S mode
For other modes see the timing diagrams below.
Bitclock (BCLK) Signal
In addition to flexibility as master or slave mode, the BCLK can also be configured in two transfer modes—256−S and
Continuous Transfer Modes. These modes are set using bit D12/REG−06h/Page2.
D 256−S TRANSFER MODE
In the 256−S mode, the BCLK rate always equals 256 times the maximum of the LRCK and ADWS frequencies. In
the 256−S mode, the combination of ADC/DAC sampling rate equal to Fsref (as selected by bit
D5−D0/REG−00h/Page2) and left−justified mode is not supported.
D CONTINUOUS TRANSFER MODE
In the continuous transfer mode, the BCLK rate always equals two times the word length of the maximum of the LRCK
and ADWS frequencies.
16
www.ti.com
SLAS412− DECEMBER 2003
D RIGHT-JUSTIFIED MODE
In right-justified mode, the LSB of the left channel is valid on the rising edge of the BCLK preceding the falling edge of
ADWS or LRCK. Similarly, the LSB of the right channel is valid on the rising edge of the BCLK preceding the rising edge
of ADWS or LRCK.
1/fs
ADWS/
LRCK
BCLK
Left Channel
DIN/
DOUT
0
n
n−1 n−2
Right Channel
2
MSB
1
0
n
n−1 n−2
2
1
0
LSB
Figure 14. Timing Diagram for Right-Justified Mode
D LEFT-JUSTIFIED MODE
In left−justified mode, the MSB of the right channel is valid on the rising edge of the BCLK, following the falling edge of
ADWS or LRCK. Similarly the MSB of the left channel is valid on the rising edge of the BCLK following the rising edge of
ADWS or LRCK.
1/fs
ADWS/
LRCK
BCLK
Left Channel
DIN/
DOUT
n
n−1 n−2
MSB
2
1
Right Channel
0
n
n−1 n−2
2
1
0
n
n−1
LSB
Figure 15. Timing Diagram for Left-Justified Mode
17
www.ti.com
SLAS412− DECEMBER 2003
D I2S MODE
In I2S mode, the MSB of the left channel is valid on the second rising edge of the BCLK after the falling edge of ADWS or
LRCK. Similarly the MSB of the right channel is valid on the second rising edge of the BCLK after the rising edge of
ADWS or LRCK.
1/fs
ADWS/
LRCK
BCLK
1 clock before MSB
Left Channel
DIN/
DOUT
n
n−1 n−2
2
1
MSB
Right Channel
0
n
n−1 n−2
2
1
0
n
LSB
Figure 16. Timing Diagram for I2S Mode
D DSP MODE
In DSP mode, the falling edge of ADWS or LRCK starts the data transfer with the left channel data first and immediately
followed by the right channel data. Each data bit is valid on the falling edge of BCLK.
1/fs
ADWS/
LRCK
BCLK
Left Channel
DIN/
DOUT
1
0
n
n−1 n−2
LSB MSB
2
Right Channel
1
0
n
n−1 n−2
2
LSB MSB
Figure 17. Timing Diagram for DSP Mode
18
1
0
n
n−1 n−2
LSB MSB
www.ti.com
SLAS412− DECEMBER 2003
AUDIO DATA CONVERTERS
The ’AIC26 has a stereo audio DAC and a mono audio ADC. Both ADC and DAC can operate with a maximum sampling
rate of 53 kHz and support all audio standard rates of 8 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz,
44.1 kHz, and 48 kHz. By utilizing the flexible clock generation capability and internal programmable interpolation, a wide
variety of sampling rates up to 53 kHz can be obtained from many possible MCLK inputs. In addition, the DAC and ADC
can independently operate at different sampling rates as indicated in control register REG−00H/Page2.
When the ADC or DAC is operating, the ’AIC26 requires an applied audio MCLK input. The user should also set
bit D13/REG−06H/Page2 to indicate which Fsref rate is being used. If the codec ADC or DAC is powered up, then the
auxiliary ADC uses MCLK and BCLK for its internal clocking, and the internal oscillator is powered down to save power.
Typical audio DACs can suffer from poor out-of-band noise performance when operated at low sampling rates, such as
8 kHz or 11.025 kHz. The ’AIC26 includes programmable interpolation circuitry to provide improved audio performance at
such low sampling rates, by first upsampling low-rate data to a higher rate, filtering to reduce audible images, and then
passing the data to the internal DAC, which is actually operating at the Fsref rate. This programmable interpolation is
determined using bit D5−D3/REG−00H/Page2.
For example, if playback of 11.025-kHz data is required, the ’AIC26 can be configured such that Fsref = 44.1 kHz. Then
using bit D5−D3/REG−00H/Page2, the DAC sampling rate (Fs) can be set to Fsref/4, or Fs = 11.025 kHz. In operation, the
11.025-kHz digital input data is received by the ’AIC26, upsampled to 44.1 kHz, and filtered for images. It is then provided
to the audio DAC operating at 44.1 kHz for playback. In reality, the audio DAC further upsamples the 44.1 kHz data by a
ratio of 128x and performs extensive interpolation filtering and processing on this data before conversion to a stereo analog
output signal.
PLL
The ’AIC26 has an on-chip PLL to generate the needed internal ADC and DAC operational clocks from a wide variety of
clocks available in the system. The PLL supports an MCLK varying from 2 MHz to 50 MHz and is register programmable
to enable generation of required sampling rates with fine precision.
ADC and DAC sampling rates are given by
DAC_FS = Fsref/N1 and ADC_FS = Fsref/N2
where, Fsref must fall between 39 kHz and 53 kHz, and N1, N2 =1, 1.5, 2, 3, 4, 5, 5.5, 6 are register programmable.
The PLL can be enabled or disabled using register programming.
D
When PLL is disabled
Fsref + MCLK
128 Q
Q = 2, 3…17
D
−
Note: For ADC, with N2 = 1.5 or 5.5, odd values of Q are not allowed.
−
In this mode, the MCLK can operate up to 50 MHz, and Fsref should fall within 39 kHz to 53 kHz.
When PLL is enabled
Fsref + MCLK
2048
K
P
P = 1, 2, 3, …, 8
K = J.D
J = 1, 2, 3, ….,64
D = 0, 1, 2, …, 9999
P, J, and D are register programmable, where J is an integer part of K before the decimal point, and D is a four-digit fractional
part of K after the decimal point, including lagging zeros.
Examples:
If K = 8.5, Then J = 8, D = 5000
If K = 7.12, Then J = 7, D = 1200
If K = 7.012, Then J = 7, D = 120
The PLL is programmed through Registers 1BH and 1CH of Page2.
19
www.ti.com
SLAS412− DECEMBER 2003
D
When PLL is enabled and D = 0, the following condition must be satisfied
2 MHz v MCLK v 20 MHz
P
80 MHz v MCLK
P
K v 110 MHz
4 v J v 55
D
When PLL is enabled and D ≠ 0, the following condition must be satisfied
10 MHz v MCLK v 20 MHz
P
80 MHz v MCLK
P
K v 110 MHz
4 v J v 11
Example 1:
For MCLK = 12 MHz and Fsref = 44.1 kHz
P = 1, K = 7.5264 ⇒ J = 7, D = 5264
Example 2:
For MCLK = 12 MHz and Fsref = 48.0 kHz
P = 1, K = 8.192 ⇒ J = 8, D = 1920
MONO AUDIO ADC
Analog Front End
The analog front end of the audio ADC consists of an analog MUX and a programmable gain amplifier (PGA). The MUX
can connect either the MICIN or AUX signal through the PGA to the ADC for audio recording. The ’AIC26 also has an option
of choosing both MICIN and AUX as a differential input pair. The ’AIC26 also includes a microphone bias circuit, which can
source up to 4.7-mA current and is programmable to a 2-V or 2.5-V level. The bias block is powered down when both the
ADC and analog mixer blocks are powered down.
Because of the oversampling nature of the audio ADC and the integrated digital decimation filtering, requirements for
analog antialiasing filtering are very relaxed. The ’AIC26 integrates a second order analog antialiasing filter with 20-dB
attenuation at 1 MHz. This filter, combined with the digital decimal filter, provides sufficient antialiasing filtering without
requiring any external components.
The PGA allows analog gain control from 0 dB to 59.5 dB in steps of 0.5 dB. The PGA gain changes are implemented with
an internal soft-stepping algorithm that only changes the actual volume level by one 0.5-dB step every one or two ADC
output samples, depending on the register programming. This soft-stepping ensures that volume control changes occur
smoothly with no audible artifacts. On reset, the PGA gain defaults to a mute condition, and on power down, the PGA
soft-steps the volume to mute before shutting down. A read-only flag (D0 control register 04H/Page2) is set whenever the
gain applied by PGA equals the desired value set by the register. The soft−stepping control can be disabled by
programming D15=1 in register 1DH of Page02. When soft-stepping is enabled, the MCLK signal to the device should not
be changed until the ADC power-down flag is set. When the flag is set, the internal soft-stepping process and power-down
sequence is complete, and the MCLK can be stopped if desired.
Delta-Sigma ADC
The analog-to-digital converter is a delta-sigma modulator with 128 times oversampling ratio. The ADC can support a
maximum output rate of 53 kHz.
Decimation Filter
The audio ADC includes an integrated digital decimation filter that removes high-frequency content and downsamples the
audio data from an initial sampling rate of 128 times Fs to the final output sampling rate of Fs. The decimation filter provides
a linear phase output response with a group delay of 17/Fs. The −3-dB bandwidth of the decimation filter extends to 0.45
Fs and scales with the sample rate (Fs)
20
www.ti.com
SLAS412− DECEMBER 2003
Automatic Gain Control (AGC)
Automatic gain control (AGC) can be used to maintain nominally constant output signal amplitude when recording speech
signals. This circuitry automatically adjusts the PGA gain as the input signal becomes overly loud or very weak, such as
when a person speaking into a microphone moves closer or farther from the microphone. The AGC algorithm has several
programmable settings, including target gain, attack and decay time constants, noise threshold, and maximum PGA gain
applicable that allow the algorithm to be fine tuned for any particular application. The algorithm uses the absolute average
of the signal (which is the average of the absolute value of the signal) as a measure of the nominal amplitude of the output
signal.
Target gain represents the nominal output level at which the AGC attempts to hold the ADC output signal level. The ’AIC26
allows programming of eight different target gains, which can be programmed from −5.5 dB to −24 dB relative to a full-scale
signal. Since the ’AIC26 reacts to the signal absolute average and not to peak levels, it is recommended that the larger
gain be set with enough margin to avoid clipping at the occurrence of loud sounds.
Attack time determines how quickly the AGC circuitry reduces the PGA gain when the input signal is too loud. It can be
varied from 8 ms to 20 ms.
Decay time determines how quickly the PGA gain is increased when the input signal is too low. It can be varied in the range
from 100 ms to 500 ms.
Noise threshold is the minimum amplitude for the input signal that the AGC considers as a valid signal. If the average
amplitude of the incoming signal falls below this value, the AGC considers it as silence and brings down the gain to 0 dB
in steps of 0.5 dB for every FS. It also sets the noise threshold flag. The gain stays at 0 dB until the average amplitude of
the input signal rises above the noise threshold value. This ensures that noise does not get amplified in the absence of a
valid input speech signal. The noise threshold level is programmable between −60 dB and −90 dB relative to full scale. This
operation includes debounce and hysteresis to avoid having the AGC gain cycle from high gain to 0 dB when the signal
amplitude is close to the noise threshold level. When the noise threshold flag is set, the status of the gain applied by the
AGC and the saturation flag should be ignored.
Maximum input gain applicable allows the user to restrict the maximum gain applied by the AGC. This can be used for
limiting PGA gain in situations where environmental noise is greater than the programmed noise threshold. Depending on
the noise threshold setting, the value of the maximum input gain applicable can be programmed between 0 dB and 59.5
dB in steps of 0.5 dB as shown in Table 1.
Table 1. Input Gain Settings
NOISE THRESHOLD
ALLOWED RANGE FOR THE MAXIMUM INPUT GAIN
−60 dB
0 dB to 59.5 dB
−70 dB
11.5 dB to 59.5 dB
−80 dB
21.5 dB to 59.5 dB
−90 dB
31.5 dB to 59.5 dB
21
www.ti.com
SLAS412− DECEMBER 2003
See Table 2 for various AGC programming options.
Input
Signal
Output
Signal
Target Gain
AGC
Gain
Decay Time
Attack Time
Figure 18. AGC Characteristics
Table 2. AGC Settings
MIC INPUT
BIT
CONTROL REGISTER
AGC enable
D0
01H
Target gain
D7−D5
01H
Time constants (attack and decay time)
D4−D1
01H
Noise threshold
D5−D4
06H
Noise threshold flag
D11
04H
Hysteresis
D10−D9
1DH
Debounce time (normal to silence mode)
D8−D6
1EH
Debounce time (silence to normal mode)
D5−D3
1EH
Max input gain applicable
D15−D9
1EH
Gain applied by AGC
D15−D8
01H
D0
04H
D3
06H
Saturation flag
Clip stepping enable
NOTE: All settings shown in Table 2 are located in Page2 of the control registers.
STEREO AUDIO DAC
Each channel of the stereo audio DAC consists of a digital audio processing block, a digital interpolation filter, digital
delta-sigma modulator, and an analog reconstruction filter. The DAC is designed to provide enhanced performance at low
sample rates through increased oversampling and image filtering, thereby keeping quantization noise generated within the
delta-sigma modulator and signal images strongly suppressed within the audio band to beyond 20 kHz. This is realized
by keeping the upsampled rate constant at 128 x Fsref and changing the oversampling ratio as the input sample rate is
changed. For Fsref of 48 kHz, the digital delta-sigma modulator always operates at a rate of 6.144 MHz. This ensures that
quantization noise generated within the delta-sigma modulator stays low within the frequency band below 20 kHz at all
sample rates. Similarly, for Fsref rate of 44.1 kHz, the digital delta-sigma modulator always operates at a rate of 5.6448
MHz.
Digital Audio Processing
The DAC channel consists of optional filters for de-emphasis and bass, treble, midrange level adjustment, or speaker
equalization. The de-emphasis function is only available for sample rates of 32 kHz, 44.1 kHz, and 48 kHz. The transfer
function consists of a pole with time constant of 50 µs and a zero with time constant of 15 µs. Frequency response plots
are given in the Audio Codec Filter Frequency Responses section of this data sheet. The de-emphasis filter can be enabled
or bypassed depending on bit D0 of register 05H/Page2.
22
www.ti.com
SLAS412− DECEMBER 2003
The DAC digital effects processing block also includes a fourth order digital IIR filter with programmable coefficients (one
set per channel). The filter is implemented as cascade of two biquad sections with frequency response given by:
ǒ
Ǔǒ
N0 ) 2 N1 z *1 ) N2 z *2
32768 * 2 D1 z *1 * D2 z *2
Ǔ
N3 ) 2 N4 z *1 ) N5 z *2
32768 * 2 D4 z *1 * D5 z *2
The N and D coefficients are fully programmable, and the entire filter can be enabled or bypassed depending on bit D1 of
register 05H/Page2. The coefficients for this filter implement a variety of sound effects, with bass-boost or treble boost being
the most commonly used in portable audio applications. The default N and D coefficients in the part are given by:
N0 = N3 = 27619
N1 = N4 = −27034
N2 = N5 = 26461
D1 = D4 = 32131
D2 = D5 = −31506
and implement a shelving filter with 0 dB gain from dc to approximately 150 Hz, at which point it rolls off to a 3-dB attenuation
for higher frequency signals, thus giving a 3-dB boost to signals below 150 Hz. The N and D coefficients are represented
by 16-bit twos complement numbers with values ranging from –32768 to +32767. Frequency response plots are given in
the Audio Codec Filter Frequency Responses section of this data sheet.
Interpolation Filter
The interpolation filter upsamples the output of the digital audio processing block by the required oversampling ratio. It
provides a linear phase output with a group delay of 21/Fs.
In addition, a digital interpolation filter provides enhanced image filtering and reduces signal images caused by the
upsampling process that are below 20 kHz. For example, upsampling an 8-kHz signal produces signal images at multiples
of 8 kHz (i.e., 8 kHz, 16 kHz, 24 kHz, etc). The images at 8 kHz and 16 kHz are below 20 kHz and still audible to the listener;
therefore, they must be filtered heavily to maintain good output quality. The interpolation filter is designed to maintain at
least 65-dB rejection of images that land below 7.455 Fs. In order to utilize the programmable interpolation capability, the
Fsref should be programmed to a higher rate (restricted to be in the range of 39 kHz to 53 kHz when the PLL is in use),
and the actual Fs is set using the dividers in bit D5−D3/REG−00H/Page2. For example, if Fs = 8 kHz is required, then Fsref
can be set to 48 kHz, and the DAC Fs set to Fsref/6. This ensures that all images of the 8-kHz data are sufficiently attenuated
well beyond the ~20-kHz audible frequency range.
Delta-Sigma DAC
The audio digital-to-analog converter incorporates a third order multibit delta-sigma modulator followed by an analog
reconstruction filter. The DAC provides high-resolution, low-noise performance, using oversampling and noise shaping
techniques. The analog reconstruction filter design consists of a 6 tap analog FIR filter followed by a continuous time RC
filter. The analog FIR operates at a rate of 128 x Fsref (6.144 MHz when Fsref = 48 kHz, 5.6448 MHz when Fsref = 44.1 kHz).
Note that the DAC analog performance may be degraded by excessive clock jitter on the MCLK input. Therefore, care must
be taken to keep jitter on this clock to a minimum.
DAC Digital Volume Control
The DAC has a digital volume control block, which implements programmable gain. The volume level can be varied from
0 dB to –63.5 dB in 0.5 dB steps. In addition, there is an independent mute bit for each channel. The volume level of both
channels can also be changed simultaneously by the master volume control. The gain is implemented with a soft-stepping
algorithm, which only changes the actual volume by one step per input sample, either up or down, until the desired volume
is reached. The rate of soft-stepping can be slowed to one step per two input samples through bit D1 of control register
04H/Page2.
Because of soft-stepping, the host does not know when the DAC has been actually muted. This may be important if the
host wishes to mute the DAC before making a significant change, such as changing sample rates. In order to help with this
situation, the ’AIC26 provides a flag back to the host via a read-only register bit (D2−D3 of control register 04H/Page2) that
alerts the host when the part has completed the soft-stepping and the actual volume has reached the desired volume level.
The soft-stepping feature can be disabled by programming D14=1 in register 1DH in Page02. If soft-stepping is enabled,
the MCLK signal to the device should not be changed until the DAC power-down flag is set. When this flag is set, the internal
soft-stepping process and power-down sequence is complete, and the MCLK can be stopped if desired.
23
www.ti.com
SLAS412− DECEMBER 2003
The ’AIC26 also includes functionality to detect when the user switches are on or off the de-emphasis or digital audio
processing functions, to first (1) soft-mute the DAC volume control, (2) change the operation of the digital effects
processing, and (3) soft-unmute the part. This avoids any possible pop/clicks in the audio output due to instantaneous
changes in the filtering. A similar algorithm is used when first powering up or down the DAC. The circuit begins operation
at power up with the volume control muted, then soft-steps it up to the desired volume level. At power down, the logic first
soft-steps the volume down to a mute level, then powers down the circuitry.
DAC Power Down
The DAC power-down flag ( D6 of REG05H/Page2) along with D10 of REG05H/Page2 denotes the power-down status
of the DAC according to Table 3.
Table 3. DAC Powerdown Status
[D10,D6]
POWERUP / DOWN STATE OF DAC
[0,0]
DAC is in stable power-up state
[0,1]
DAC is in the process of powering up. The length of this state is determined by PLL and output driver
power-up delays controlled by register programming.
[1,0]
DAC is in the process of powering down. The length of this state is determined by soft-stepping of volume
control block and DAC pop reduction sequencing controlled by register programming.
[1,1]
DAC is in a stable power-down state.
AUDIO OUTPUT DRIVERS
The ’AIC26 features audio output drivers which can be configured in either low power mode or high power mode depending
on the load and output power required. By default, at reset the output drivers are configured in low power mode. In this mode,
the output drivers can drive a full-scale line-level signal into loads of 10 kΩ minimum or drive moderate amplitude signals
into loads of 16 Ω minimum.
The output drivers can also be configured in high power mode by setting bit D12 of Reg05H/Page2 to 1. In this mode, each
output driver can deliver up to 30 mW per channel into a headphone speaker load of 16 Ω. The headphones can be
connected in a single-ended configuration using ac-coupling capacitors, or the capacitors can be removed and virtual
ground (VGND) powered for a capless output connection. The typical headphone jack configuration for these two modes
is shown in Figure 21. Note that the VGND amplifier must be powered if the capless configuration is used.
In the case of an ac-coupled output, the value of the capacitors is typically chosen based on the amount of low-frequency
cut that can be tolerated. The capacitor in series with the load impedance forms a high-pass filter with −3 dB cutoff frequency
of 1/(2πRC) in Hz, where R is the impedance of the headphones. Use of an overly small capacitor reduces low-frequency
components in the signal output and leads to low-quality audio. When driving 16-Ω headphones, capacitors of 220-µF (a
commonly used value) result in a high-pass filter cutoff frequency of 45 Hz, although reducing these capacitors to 50 µF
results in a cutoff frequency of 199 Hz, which is generally considered noticeable when playing music. The cutoff frequency
is reduced to half of the above values if 32-Ω headphones are used instead of 16 Ω.
The ’AIC26 programmable digital effects block can be used to help reduce the size of capacitors needed by implementing
a low frequency boost function to help compensate for the high-pass filter introduced by the ac-coupling capacitors. For
example, by using 50-µF capacitors and setting the ’AIC26 programmable filter coefficients as shown below, the frequency
response can be improved as shown in Figure 20.
Filter coefficients (use the same for both channels):
N0 = 32767, N1 = −32346, N2 = 31925, N3 = 32767, N4 = 0, N5 = 0
D0 = 32738, D1 = −32708 D4 = 0, D5 = 0
24
www.ti.com
SLAS412− DECEMBER 2003
0
−2
−4
Gain − dB
−6
−8
−10
−12
−14
−16
−18
−20
0
100 200 300 400 500 600 700 800 900 1 k
f − Frequency − Hz
Figure 19. Uncompensated Response For 16- Load and 50-F Decoupling Capacitor
0
Gain − dB
−5
−10
−15
−20
0
100 200 300 400 500 600 700 800 900 1 k
f − Frequency − Hz
Figure 20. Frequency Response For 16- Load and 50-F Decoupling Capacitor After Gain
Compensation Using a Suggested Set of Coefficients for Audio Effects Filter
Using the capless output configuration eliminates the need for these capacitors and removes the accompanying high-pass
filter entirely. However, this configuration does have one drawback – if the RETURN terminal of the headphone jack (which
is wired to the ’AIC26 VGND pin) is ever connected to a ground, that is shorted to the ’AIC26 ground pin, then the VGND
amplifier enters short-circuit protection, and the audio output does not function properly.
25
www.ti.com
SLAS412− DECEMBER 2003
’AIC26
’AIC26
HPR
HPR
HPL
HPL
Headphone Jack
VGND
VGND
Headphone Jack
Figure 21. Headphone Configurations, AC-Coupled (left) and Capless (right)
The audio output drivers in high power mode can also be configured to drive a mono differential signal into a speaker load
of 8-Ω minimum. The speaker load should be connected differentially between the HPR and HPL outputs. Several options
are possible for playback of DAC data in this case. If a stereo digital signal is available, this signal can be sent in normal
stereo fashion to the audio DAC. The programmable digital effects filters can then be used to invert one channel, so that
the signal applied across the speaker load is (LEFT + RIGHT), or effectively a mono-mix of the two channels. A simple
example of how to implement this inversion using the programmable filters is to set the coefficients as follows:
Left−channel coefficients:
N0=32767, N1=0, N2=0, N3=32767, N4=0, N5=0
D1=0, D2=0, D4=0, D5=0
Right−channel coefficients: N0=−32767, N1=0, N2=0, N3=32767, N4=0, N5=0
D1=0, D2=0, D4=0, D5=0
This provides no spectral shaping; it only inverts the right channel relative to the left channel, such that the signals at HPL
and HPR are (LEFT) and (−RIGHT), with the signal across the speaker then being LEFT+ RIGHT. In a general case when
spectral shaping is also desired, the inversion can be accomplished simply by setting N0, N1, and N2 coefficients of one
channel to the negative of the values set for the other channel. Note that the programmable filtering must be enabled by
setting bit D1/REG−05H/Page2 to 1.
To enable the output drivers to deliver higher output power, the DAC output swing should be set to its highest level by setting
bit D10−D9/REG−06H/Page2 to 11. It is possible to increase power even further by disabling the built-in short-circuit
protection by programming bit D8 of Reg1DH/Page2 to 1. In this case care must be taken so a short-circuit at the output
does not occur. Figure 22 shows a typical jack configuration using a capless output configuration. In this configuration, the
’AIC26 drives the loudspeaker whenever headphones are not inserted in the jack and drives the headphones whenever
it is inserted in the jack.
’AIC26
HPR
HPL
VGND
Headphone Jack
Loud Speaker
Figure 22. Speaker Connection
26
www.ti.com
SLAS412− DECEMBER 2003
0
THD − Total Harmonic Distortion − dB
−10
−20
2.402 VPP
−30
−40
−50
2 VPP
−60
−70
−80
−90
−100
0
50
100
150
200
250
300
350
PO − Output Power − mW
Figure 23. THD vs Output Power Delivered to an an 8- Load (255C, AVDD = DRVDD = 3.3 V, DVDD = 1.8
V, DAC Output Swing Set to 2 V and 2.4V, and Short-Circuit Protection Disabled)
0
THD − Total Harmonic Distortion − dB
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
2.7
2.8
2.9
3
3.1
3.2
3.3
3.4
3.5
3.6
AVDD, DRVDD − V
Figure 24. THD vs AVDD, DRVDD Supply Voltage (255C When Driving a −1 dB, 1-kHz Sinewave From the
DAC Into an 8- Load, with DAC Output Swing Set to 2.4 V, and Short-Circuit Protection Disabled)
The ’AIC26 incorporates a programmable short-circuit detection/protection function with different modes of operation.
During the insertion or removal of a headphone plug from the jack, the output pins of the drivers may be accidentally shorted,
causing the part to potentially draw a huge current, which may cause the power supply voltages to dip. Bits D8−D7 of
REG−1DH/Page2 control how the short-circuit detection/protection operates in the ’AIC26. One option is to fully disable
short-circuit protection, which also enables the audio output drivers to deliver more power to a low-impedance load (such
as an 8-Ω speaker). However, care must be taken to prevent any short-circuit from occurring while the part is in this mode.
A second programmable configuration enables current-limiting in the audio output drivers, so that excessive currents
cannot be provided if the outputs are shorted. It also enables the internal short-circuit detection function, which can detect
excess current being drawn from the drivers and set a short-circuit detect flag (Page2, REG−1DH, bit D6). This flag can
be read by the user to power down the drivers if desired. This flag is cleared only if the short-circuit condition is removed.
If the user does not monitor this flag and powers down the drivers when a short-circuit occurs, the current-limiting prevents
excessive currents from being drawn, but power dissipation is higher due to this limited current flowing through the short.
27
www.ti.com
SLAS412− DECEMBER 2003
In a third programmable configuration, the ’AIC26 can be programmed to monitor and automatically power down the audio
output drivers upon detection of a short-circuit condition (Page2, REG−1DH, bit D7), in addition to setting the short-circuit
flag in Page2, REG−1DH, bit−D6. When the device has detected a short and resulted in this condition, the short-circuit flag
is cleared when all the routings to the speaker driver are disabled (i.e., DAC, Analog Mixer, and Keyclick blocks are powered
down by user).
AUDIO OUTPUT DRIVER POWER-ON POP REDUCTION SCHEME
The ’AIC26 implements a pop reduction scheme to reduce audible artifacts during power up and power down of the audio
output drivers. This scheme can be controlled by programming bits D2 and D1 of REG1EH/Page2. By default, the driver
pop reduction scheme is enabled and can be disabled by programming bit D2 of Reg1EH/Page2 to 1. When this scheme
is enabled and the virtual ground connection is not used (VGND amplifier is powered down), the audio output driver slowly
charges up any external ac-coupling capacitors to reduce audible artifacts. Bit D1 of REG1EH/Page2 provides control of
the charging time for the ac-coupling capacitor as either 0.8 sec or 4 sec. When the virtual ground amplifier is powered up
and used, the external ac-coupling capacitor is eliminated, and the power up time becomes 1 ms. This scheme takes effect
whenever the audio output drivers are powered up due to enabling any of the DAC, the Analog Mixer, or the Keyclick
Generator.
Pop Reduction for DAC Routing
Whenever the audio DAC is powered on or off, a slight change in the output dc offset voltage may occur and can be heard
as a weak pop in the output. In order to reduce this artifact, the ’AIC26 implements a DAC pop reduction scheme, which
is programmable using bits D5−D2 in REG−1DH/Page2. Bit D5 enables the scheme, which implements a slow transition
between the starting dc level and the final dc level. For best results, program bits D4−D2 in REG1DH/Page2 to 100.
AUDIO MIXING
Digital Sidetone
The digital sidetone control attenuates the output from the ADCs decimation filter and routes its output to be mixed with
the DAC digital input. If bit D7 of REG−03H/Page2 is reset, the output of the sidetone control is mixed with the stereo DAC
input. Care must be taken while selecting the digital sidetone gain so that the output of the digital mixer is not overloaded.
The digital sidetone block implements gains from 0 dB to –48 dB in steps of 1.5 dB. Gain changes are implemented at
zero-crossings of the signal to avoid any audible artifacts. The digital sidetone block is automatically internally disabled
if ADC and DAC are operating at different sampling rates, or if the DAC is powered down.
Analog Mixer
The analog mixer can be used to route the analog input selected for the ADC (MICIN or AUX) through an analog volume
control and then mix it with the audio DAC output. The analog mixer feature is available only if single-ended MICIN or AUX
is selected as the input to the ADC, not when the ADC input is configured in fully-differential mode. This feature is available
even if the ADC and DAC are powered down. The analog volume control in this path has a gain range from 12 dB to
–34.5 dB in 0.5-dB steps plus mute and includes soft-stepping logic. The internal oscillator is used for soft-stepping
whenever the ADC and DAC are powered down.
KEYCLICK
A special circuit has been included for inserting a square−wave signal into the analog output signal path based on register
control. This functionality is intended for generating keyclick sounds for user feedback. Register 04H/Page2 contains bits
that control the amplitude, frequency, and duration of the square-wave signal. The frequency of the signal can be varied
from 62.5 Hz to 8 kHz and its duration can be programmed from 2 periods to 32 periods. Whenever this register is written,
the square-wave is generated and coupled into the audio output, going to both audio outputs. The keyclick enable bit D15
of control register 04H/Page2 is reset after the duration of keyclick is played out. This capability is available even when
the ADC and DAC are powered down.
28
www.ti.com
SLAS412− DECEMBER 2003
SPI DIGITAL INTERFACE
All ’AIC26 control registers are programmed through a standard SPI bus. The SPI allows full-duplex, synchronous, serial
communication between a host processor (the master) and peripheral devices (slaves). The SPI master generates the
synchronizing clock and initiates transmissions. The SPI slave devices depend on a master to start and synchronize
transmissions.
A transmission begins when initiated by a master SPI. The byte from the master SPI begins shifting in on the slave SPIDIN
(MOSI) pin under the control of the master serial clock. As the byte shifts in on the SPIDIN pin, a byte shifts out on the
SPIDOUT (MISO) pin to the master shift register.
The idle state of the serial clock for the ’AIC26 is low, which corresponds to a clock polarity setting of 0 (typical
microprocessor SPI control bit CPOL = 0). The ’AIC26 interface is designed so that with a clock phase bit setting of 1 (typical
microprocessor SPI control bit CPHA = 1), the master begins driving its MOSI pin and the slave begins driving its SPIDOUT
pin on the first serial clock edge. The SS pin can remain low between transmissions; however, the ’AIC26 only interprets
command words which are transmitted after the falling edge of SS.
OPERATION−AUXILIARY MEASUREMENT
Data Format
The ’AIC26 auxiliary output data is in unsigned binary format and can be read from the registers over the SPI interface.
Reference
The ’AIC26 has an internal voltage reference that can be set to 1.25 V or 2.5 V, through the reference control register.
The internal reference voltage should only be used in the single-ended mode for battery monitoring, temperature
measurement, and for measuring the auxiliary inputs.
An external reference can also be applied to the VREF pin, and the internal reference can be turned off.
Variable Resolution
The ’AIC26 provides three different resolutions for the A/D converter: 8-, 10- or 12-bits. Performing the conversions at lower
resolution reduces the amount of time it takes for the A/D converter to complete its conversion process, which lowers power
consumption.
Conversion Clock and Conversion Time
The ’AIC26 contains an internal 8-MHz clock, which is used to drive the state machines inside the device that perform the
many functions of the part. This clock is divided down to provide a clock to run the A/D converter. The division ratio for this
clock is set in the A/D converter control register. The ability to change the conversion clock rate allows the user to choose
the optimal value for resolution, speed, and power. If the 8-MHz clock is used directly, the A/D converter is limited to 8-bit
resolution; using higher resolutions at this speed may not result in accurate conversions. Using a 4-MHz conversion clock
is suitable for 10-bit resolution; 12-bit resolution requires that the conversion clock run at 1 or 2 MHz.
Regardless of the conversion clock speed, the internal clock runs nominally at 8 MHz. The conversion clock speed,
however, plays an important role in the time it takes for a conversion to complete, as a certain number of internal clock cycles
is needed for proper sampling of the signal. Throughout this data sheet, internal and conversion clock cycles are used to
describe the times that many functions take to execute. Considering the total system design, these times must be taken
into account by the user.
When both the audio ADC and DAC are powered down, the auxiliary A/D uses an internal oscillator for conversions.
However, to save power whenever audio ADC or DAC are powered up, the internal oscillator is powered down and MCLK
and BCLK are used to clock the auxiliary A/D.
The ’AIC26 uses the programmed value of Page2, Reg 06H D13 and the PLL programmability to derive a clock from MCLK.
The various combinations are listed in Table 4.
Table 4. Conversion Clock Frequency
Page2, Reg 06H, D13 = 0
PLL enabled
PLL disabled
MCLK
P
K 13
160
MCLK 13
Q 10
Page2, Reg 06H, D13 = 1
MCLK
P
K 17
192
MCLK 17
Q 12
29
www.ti.com
SLAS412− DECEMBER 2003
Temperature Measurement
In some applications, such as battery recharging, a measurement of ambient temperature is required. The temperature
measurement technique used in the ’AIC26 relies on the characteristics of a semiconductor junction operating at a fixed
current level. The forward diode voltage (VBE) has a well-defined characteristic versus temperature. The ambient
temperature can be predicted in applications by knowing the 25°C value of the VBE voltage and then monitoring the delta
of that voltage as the temperature changes.
The ’AIC26 offers two modes of temperature measurement. The first mode requires a single reading to predict the ambient
temperature. A diode, as shown in Figure 25, is used during this measurement cycle. This voltage is typically 600 mV at
25°C with a 20-µA current through it. The absolute value of this diode voltage can vary a few millivolts. During the final test
of the end product, the diode voltage must be stored at a known temperature. Further calibration can be done to calculate
the precise temperature coefficient of the particular device. This method has a temperature resolution of approximately 0.3
°C/LSB and accuracy of approximately 6°C.
X+
MUX
A/D
Converter
Temperature Select
TEMP0 TEMP1
Figure 25. Functional Block Diagram of Temperature Measurement Mode
The second mode uses a two-measurement (differential) method. This mode requires a second conversion with a current
82 times larger. The voltage difference between the first (TEMP1) and second (TEMP2) conversion, using 82 times the
bias current, is represented by:
ǒkTqǓ
ln(N)
where:
N is the current ratio = 82
k = Boltzmann’s constant (1.38054 • 10−23 electrons volts/degrees Kelvin)
q = the electron charge (1.602189 • 10−19 °C)
T = the temperature in degrees Kelvin
This method provides resolution of approximately 1.5°C/LSB and accuracy of approximately 5°C. The temperature
measured by the ’AIC26 is an approximate number with an accuracy of 5°C to 6°C depending on the method used. Further,
it has been found that the measurement varies significantly from device to device. Therefore, it is recommended that the
user calibrate the temperature measurement during final system test.
30
www.ti.com
SLAS412− DECEMBER 2003
2700
2500
ADC Code
2300
2100
1900
1700
1500
−40
−20
0
20
40
Temperature − °C
60
80
Figure 26. Typical Plot for Single Measurement Method
500
Differential Code
450
400
350
300
−40
−20
0
20
40
60
80
Temperature − °C
Figure 27. Typical Plot for Differential Measurement Method
Battery Measurement
An added feature of the ’AIC26 is the ability to monitor the battery voltage on the other side of a voltage regulator (dc/dc
converter), as shown in Figure 28. The battery voltage can vary from 0.5 V to 6 V while maintaining the analog supply
voltage to the ’AIC26 in the range of 2.7 V to 3.6 V. The input voltage (VBAT1 or VBAT2) is divided by a factor of 6 so that
a 6.0-V battery voltage is represented as 1.0 V to the ADC. In order to minimize the power consumption, the divider is only
on during the sampling of the battery input. If the battery conversion results in a ADC output code of B, the voltage at the
battery pin can be calculated as
Vbat = (B/2N) x 6 x Vref
where N is the programmed resolution of ADC and Vref the programmed value of internal reference or the applied external
reference.
31
www.ti.com
SLAS412− DECEMBER 2003
DC/DC
Converter
+
Battery
−
VDD
VBAT
10 kΩ
2 kΩ
GND
Figure 28. Battery Measurement Functional Block Diagram
For increased protection and robustness, TI recommends a minimum 100-Ω resistor be added in series between the
system battery and the VBAT pin. The 100-Ω resistor causes an approximately 1% gain change in the battery voltage
measurement, which can easily be corrected in software when the battery conversion data is read by the operating system.
See the Conversion Time Calculation for the ’AIC26 section in this data sheet for timing diagrams and conversion time
calculations.
Auxiliary Measurement
The auxiliary voltage input (AUX) can be measured in much the same way as the battery inputs. Applications might include
external temperature sensing, ambient light monitoring for controlling the back-light, or sensing the current drawn from the
battery. The auxiliary input can also be monitored continuously in scan mode.
See the Conversion Time Calculation for the ’AIC26 section in this data sheet for timing diagrams and conversion time
calculations.
Port Scan
If making measurements of BAT1, BAT2, and AUX is desired on a periodic basis, the port scan mode can be used. This
mode causes the ’AIC26 to sample and convert both battery inputs and the auxiliary input. At the end of this cycle, the
battery and auxiliary result registers contain the updated values. Thus, with one write to the ’AIC26, the host can cause
three different measurements to be made.
See the Conversion Time Calculation for the ’AIC26 section and the Port Scan Operation subsection in this data sheet for
timing diagrams and conversion time calculations.
Hardware Reset
The device requires a low-to-high pulse on RESET after power up for correct operation. A hardware reset pulse initializes
all the internal registers, counters, and logic.
Hardware Power Down
By default the PWD/ADWS pin is configured as a hardware power-down (active low) signal. The device powers down all
the internal circuitry to save power. All the register contents are maintained. Some counters maintain their value. The user
can optionally use this pin as ADWS (ADC word select) by register programming.
32
www.ti.com
SLAS412− DECEMBER 2003
’AIC26 COMMUNICATION PROTOCOL
Register Programming
The ’AIC26 is entirely controlled by registers. An SPI master controlls the reading and writing of these registers by the use
of a 16-bit command, which is sent prior to the data for that register. The command is constructed as shown in Figure 29.
The command word begins with a R/W bit, which specifies the direction of data flow on the SPI serial bus. The following
four bits specify the page of memory this command is directed to, as shown in Table 5. The next six bits specify the register
address on that page of memory to which the data is directed. The last five bits are reserved for future use and should be
written only with zeros.
Table 5. Page Addressing
PG3
PG2
PG1
PG0
0
0
0
0
PAGE ADDRESSED
0
0
0
0
1
1
0
0
1
0
2
0
0
1
1
Reserved
0
1
0
0
Reserved
0
1
0
1
Reserved
0
1
1
0
Reserved
0
1
1
1
Reserved
1
0
0
0
Reserved
1
0
0
1
Reserved
1
0
1
0
Reserved
1
0
1
1
Reserved
1
1
0
0
Reserved
1
1
0
1
Reserved
1
1
1
0
Reserved
1
1
1
1
Reserved
To read all the first page of memory, for example, the host processor must send the command 0x8000 to the ’AIC26 – this
specifies a read operation beginning at page 0, address 0. The processor can then start clocking data out of the ’AIC26.
The ’AIC26 automatically increments its address pointer to the end of the page; if the host processor continues clocking
data out past the end of a page, the ’AIC26 sends back the value 0xFFFF.
Likewise, writing to page 1 of memory consists of the processor writing the command 0x0800, which specifies a write
operation, with PG0 set to 1, and all the ADDR bits set to 0. This results in the address pointer pointing at the first location
in memory on Page 1. See the section on the ’AIC26 memory map for details of register locations
BIT 15
MSB
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
LSB
R/W*
PG3
PG2
PG1
PG0
ADDR5
ADDR4
ADDR3
ADDR2
ADDR1
ADDR0
0
0
0
0
0
Figure 29. ’AIC26 Command Word
33
www.ti.com
SLAS412− DECEMBER 2003
SS
SCLK
MOSI
COMMAND WORD
DATA
DATA
Figure 30. Write Operation for ’AIC26 SPI Interface
SS
SCLK
MOSI
MISO
COMMAND WORD
DATA
Figure 31. Read Operation for ’AIC26 SPI Interface
34
DATA
www.ti.com
SLAS412− DECEMBER 2003
’AIC26 MEMORY MAP
The ’AIC26 has several 16-bit registers which allow control of the device as well as providing a location for results from
the ’AIC26 to be stored until read by the host microprocessor. These registers are separated into three pages of memory
in the ’AIC26: a data page (Page 0) and control pages (Page 1 and Page 2). The memory map is shown in Table 6.
Table 6. Memory Map
Page 0: Auxiliary Data Registers
ADDR
Page 1: Auxiliary Control Registers
REGISTER
ADDR
REGISTER
Page 2: Audio Control Registers
ADDR
REGISTER
00
Reserved
00
AUX ADC
00
Audio Control 1
01
Reserved
01
Status
01
Codec ADC Gain
02
Reserved
02
Reserved
02
Codec DAC Gain
03
Reserved
03
Reference
03
Codec Sidetone
04
Reserved
04
Reset
04
Audio Control 2
05
BAT1
05
Reserved
05
Codec Power Control
06
BAT2
06
Reserved
06
Audio Control 3
07
AUX
07
Reserved
07
Digital Audio Effects Filter Coefficients
08
Reserved
08
Reserved
08
Digital Audio Effects Filter Coefficients
09
TEMP1
09
Reserved
09
Digital Audio Effects Filter Coefficients
0A
TEMP2
0A
Reserved
0A
Digital Audio Effects Filter Coefficients
0B
Reserved
0B
Reserved
0B
Digital Audio Effects Filter Coefficients
0C
Reserved
0C
Reserved
0C
Digital Audio Effects Filter Coefficients
0D
Reserved
0D
Reserved
0D
Digital Audio Effects Filter Coefficients
0E
Reserved
0E
Reserved
0E
Digital Audio Effects Filter Coefficients
0F
Reserved
0F
Reserved
0F
Digital Audio Effects Filter Coefficients
10
Reserved
10
Reserved
10
Digital Audio Effects Filter Coefficients
11
Reserved
11
Reserved
11
Digital Audio Effects Filter Coefficients
12
Reserved
12
Reserved
12
Digital Audio Effects Filter Coefficients
13
Reserved
13
Reserved
13
Digital Audio Effects Filter Coefficients
14
Reserved
14
Reserved
14
Digital Audio Effects Filter Coefficients
15
Reserved
15
Reserved
15
Digital Audio Effects Filter Coefficients
16
Reserved
16
Reserved
16
Digital Audio Effects Filter Coefficients
17
Reserved
17
Reserved
17
Digital Audio Effects Filter Coefficients
18
Reserved
18
Reserved
18
Digital Audio Effects Filter Coefficients
19
Reserved
19
Reserved
19
Digital Audio Effects Filter Coefficients
1A
Reserved
1A
Reserved
1A
Digital Audio Effects Filter Coefficients
1B
Reserved
1B
Reserved
1B
PLL Programmability
1C
Reserved
1C
Reserved
1C
PLL Programmability
1D
Reserved
1D
Reserved
1D
Audio Control 4
1E
Reserved
1E
Reserved
1E
Audio Control 5
1F
Reserved
1F
Reserved
1F
Reserved
35
www.ti.com
SLAS412− DECEMBER 2003
’AIC26 CONTROL REGISTERS
This section describes each of the registers shown in the memory map of Table 6. The registers are grouped according
to the function they control. In the ’AIC26, bits in control registers can refer to slightly different functions depending on
whether you are reading the register or writing to it.
’AIC26 Data Registers (Page 0)
The data registers in Page 0 of the ’AIC26 hold data results from auxiliary ADC. All of these registers default to 0000H on
reset. These registers are read only.
BAT1, BAT2, AUX, TEMP1 and TEMP2 Registers
The results of all A/D conversions are placed in the appropriate data register. The data format of the result word, R, of these
registers is right-justified, as follows:
BIT 15
MSB
BIT 14
BIT 13
BIT 12
BIT 11
BIT 10
BIT 9
BIT 8
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
LSB
0
0
0
0
R11
MSB
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0
LSB
All the updated data registers should be read back either with a single SPI transaction as shown in Figure 31 or by reading
in descending order of address (i.e., higher address data first and lower address data next). For example, read the updated
registers in order of AUX, BAT2, and then BAT1 instead of BAT1, BAT2, and then AUX.
PAGE 1 CONTROL REGISTER MAP
REGISTER 00H: ADC Control
BIT
NAME
D15
READ/
WRITE
RESET VALUE
R
0
D14
ADST
R/W
1(for read status)
0(for write status)
D13−10
ADSCM
R/W
0000
D9−D8
RESOL
R/W
00
36
FUNCTION
Reserved.
Note: The value of this bit should always be set to zero.
A/D Status.
READ
0 => ADC is busy
1 => ADC is not busy (default)
WRITE
0 => Normal mode. (default)
1 => Stop conversion and power down. Power down happens immediately
A/D Scan Mode.
0000 => No scan
0001 => Reserved
0010 => Reserved
0011 => Reserved
0100 => Reserved
0101 => Reserved
0110 => BAT1 input is converted, and the result is returned to the BAT1 data register.
0111 => BAT2 input is converted, and the result is returned to the BAT2 data register.
1000 => AUX input is converted, and the result is returned to the AUX data register.
1001 => Scan function: AUX input is converted and the result is returned to the AUX data
register. Scan continues until stop bit is sent.
1010 => TEMP1 is converted, and the result is returned to the TEMP1 data register.
1011 => Port scan function: BAT1, BAT2, and AUX inputs are measured and the results
returned to the appropriate data registers.
1100 => TEMP2 is converted, and the result is returned to the TEMP2 data register.
1101 => Reserved
1110 => Reserved
1111 => Reserved
Resolution Control. The A/D converter resolution is specified with these bits.
00 => 12−bit resolution
01 => 8−bit resolution
10 => 10−bit resolution
11 => 12−bit resolution
www.ti.com
SLAS412− DECEMBER 2003
BIT
NAME
READ/
WRITE
RESET VALUE
FUNCTION
D7−D6
ADAVG
R/W
00
Converter Averaging Control. These two bits allow you to specify the number of averages
the converter performs selected by bit D0, which selects either mean filter or
median filter.
Mean Filter
Median filter
00 => No average
No average
01 => 4−data average
5-data average
10 => 8−data average
9-data average
11 => 16−data average
15-data average
D5−D4
ADCR
R/W
00
Conversion Rate Control. These two bits specify the internal clock rate which the A/D
converter uses to perform a single conversion. These bits are the same whether
reading or writing.
tconv + N ) 4
ƒ
INTCLK
where fINTCLK is the internal clock frequency. For example, with 12-bit resolution and a
2-MHz internal clock frequency, the conversion time is 8.0 µs. This yields an effective
throughput rate of 125 kHz.
00 => 8-MHz internal clock rate (use for 8-bit resolution only)
01 => 4-MHz internal clock rate (use for 8-bit/10-bit resolution only)
10 => 2-MHz internal clock rate
11 => 1-MHz internal clock rate
D3−D1
D0
AVGFS
R
000
R/W
0
Reserved.
Average Filter select
0 => Mean filter
1 => Median filter
37
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 01H: Status Register
BIT
NAME
READ/
WRITE
RESET
VALUE
D15−D14
DAV
R/W
10
Data Available. These two bits program the function of the DAV pin.
00 => Reserved
01 => Acts as data available (Active Low) only. The DAV goes low as soon as one set of ADC
conversion is completed. For scan mode, DAV remains low as long as all the appropriate
registers have not been read out.
10 => Reserved
11 => Reserved
Note: D15−D14 should be programmed to 01 for the ’AIC26 to operate correctly.
D13
PWRDN
R
0
AUX−ADC Power down status
0 => AUX−ADC is active
1 => AUX−ADC stops conversion and powers down
R
0
Reserved
R
0
Data Available Status
0 => No data available.
1 => Data is available(i.e., one set of conversion is done).
Note:− This bit is cleared only after all the converted data has been completely read out.
R
0000
R
0
D12
D11
DAVAIL
D10−D7
D6
B1STAT
FUNCTION
Reserved
BAT1 Data Register Status
0 => No new data is available in BAT1 data register
1 => New data is available in BAT1 data register
Note: This bit is cleared only after the converted data of BAT1 has been completely read out of the
register.
D5
B2STAT
R
0
BAT2 Data Register Status
0 => No new data is available in BAT2 data register
1 => New data is available in BAT2 data register
Note: This bit is cleared only after the converted data of BAT2 has been completely read out of the
register.
D4
AXSTAT
R
0
AUX Data Register Status
0 => No new data is available in AUX data register
1 => New data is available in AUX data register
Note: This bit is cleared only after the converted data of AUX has been completely read out of the
register.
D3
D2
T1STAT
R
0
Reserved
R
0
TEMP1 Data Register Status
0 => No new data is available in TEMP1 data register
1 => New data is available in TEMP1 data register
Note: This bit is cleared only after the converted data of TEMP1 has been completely read out of the
register.
D1
T2STAT
R
0
TEMP2 Data Register Status
0 => No new data is available in TEMP2 data register
1 => New data is available in TEMP2 data register
Note: This bit is cleared only after the converted data of TEMP2 has been completely read out of the
register.
D0
38
R
0
Reserved
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 02H: Reserved
BIT
NAME
D15−D0
READ/
WRITE
RESET
VALUE
R
FFFFH
FUNCTION
Reserved
REGISTER 03H: Reference Control
NAME
READ/
WRITE
RESET
VALUE
R
000H
D4
VREFM
R/W
0
Voltage Reference Mode. This bit configures the VREF pin as either external reference or internal
reference.
0 => External reference
1 => Internal reference
D3−D2
RPWUDL
R/W
00
Reference Power Up Delay. These bits allow a delay time for measurements to be made after the
reference powers up, thereby ensuring that the reference has settled
00 => 0 µs
01 => 100 µs
10 => 500 µs
11 => 1000 µs
Note: This is valid only when the device is programmed for internal reference and bit D1 = 1, i.e.,
reference is powered down between the conversions if not required.
D1
RPWDN
R/W
1
Reference Power Down. This bit controls the power down of the internal reference voltage.
0 => Powered up at all times.
1 => Powered down between conversions.
Note: when D4 = 0, i.e., device is in external reference mode, then the internal reference is powered
down always.
D0
IREFV
R/W
0
Internal Reference Voltage. This bit selects the internal voltage reference level for the TSC ADC.
0 => VREF = 1.25 V
1 => VREF = 2.50 V
BIT
D15−D5
FUNCTION
Reserved
REGISTER 04H: Reset Control
BIT
NAME
READ/
WRITE
RESET
VALUE
D15−D0
RSALL
R/W
FFFFH
FUNCTION
Reset All. Writing the code 0xBB00, as shown below, to this register causes the ’AIC26 to reset all
its registers to their default, power−up values.
1011101100000000 => Reset all registers
Others
=> Do not write other sequences to this register.
REGISTER 05H: Reserved
BIT
D15−D0
NAME
READ/
WRITE
RESET
VALUE
R
0000H
FUNCTION
Reserved
39
www.ti.com
SLAS412− DECEMBER 2003
PAGE 2 CONTROL REGISTER MAP
REGISTER 00H: Audio Control 1
BIT
NAME
READ/
WRITE
RESET
VALUE
D15−D14
ADCHPF
R/W
00
ADC High Pass Filter
00 => Disabled
01 => −3dB point = 0.0045 x Fs
10 => −3dB point = 0.0125 x Fs
11 => −3dB point = 0.025 x Fs
Note: Fs is ADC sample rate
D13−D12
ADCIN
R/W
00
ADC Input Mux
00 => ADC Input = Single-ended input MIC
01 => ADC Input = Single-ended input AUX
10 => ADC Input = Differential input MICIN and AUX
11 => ADC Input = Differential input MICIN and AUX
D11−D10
WLEN
R/W
00
Codec Word Length
00 => Word length = 16 bit
01 => Word length = 20 bit
10 => Word length = 24 bit
11 => Word length = 32 bit
D9−D8
DATFM
R/W
00
Digital Data Format
00 => I2S mode
01 => DSP mode
10 => Right justified
11 => Left justified
Note: Right justified, valid only when the ratio between DAC and ADC sample rate is an integer.
e.g., ADC = 32 kHz and DAC = 24 kHz or vice-versa is invalid for right-justified mode.
R
00
Reserved
D5−D3
DACFS
R/W
000
DAC Sampling Rate
000 => DAC FS = Fsref/1
001 => DAC FS = Fsref/(1.5)
010 => DAC FS = Fsref/2
011 => DAC FS = Fsref/3
100 => DAC FS = Fsref/4
101 => DAC FS = Fsref/5
110 => DAC FS = Fsref/(5.5)
111 => DAC FS = Fsref/6
Note: Fsref can be set between 39 kHz and 53 kHz
D2−D0
ADCFS
R/W
000
ADC Sampling Rate
000 => ADC FS = Fsref/1
001 => ADC FS = Fsref/(1.5)
010 => ADC FS = Fsref/2
011 => ADC FS = Fsref/3
100 => ADC FS = Fsref/4
101 => ADC FS = Fsref/5
110 => ADC FS = Fsref/(5.5)
111 => ADC FS = Fsref/6
Note: Fsref can be set between 39 kHz and 53 kHz
D7−D6
40
FUNCTION
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 01H: CODEC ADC Gain Control
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
ADMUT
R/W
1
FUNCTION
ADC Channel Mute
1 => ADC channel muted
0 => ADC channel not muted
Note: If AGC is enabled, then D15−D8 reflects gain being applied by AGC.
If AGC is on, the decoding for read values is as follows:
01110111 => +59.5 dB
01110110 => +59.0 dB
−−−−−
00000000 => 0 dB
−−−−−
11101001 => −11.5 dB
11101000 => −12 dB
D14−D8
ADPGA
R/W
0000000
ADC PGA Settings
0000000 => ADC PGA = 0 dB
0000001 => ADC PGA = 0.5 dB
0000010 => ADC PGA = 1.0 dB
−−−−−
1110110 => ADC PGA = 59.0 dB
1110111 => ADC PGA = 59.5 dB
1111000 => ADC PGA = 59.5 dB
−−−−−
1111110 => ADC PGA = 59.5 dB
1111111 => ADC PGA = 59.5 dB
Note: If AGC is enabled, then D15−D8 reflects gain being applied by AGC. If AGC is
on, the decoding for read values is as follows
01110111 => +59.5 dB
01110110 => +59.0 dB
−−−−−
00000000 => 0 dB
−−−−−
11101001 => −11.5 dB
11101000 => −12 dB
D7−D5
AGCTG
R/W
000
AGC Target Level. These three bits set the AGC’s targeted ADC output level.
000 => −5.5 dB
001 => −8.0 dB
010 => −10 dB
011 => −12 dB
100 => −14 dB
101 => −17 dB
110 => −20 dB
111 => −24 dB
41
www.ti.com
SLAS412− DECEMBER 2003
BIT
NAME
READ/
WRITE
RESET
VALUE
D4−D1
AGCTC
R/W
0000
FUNCTION
AGC Time Constant. These four bits set the AGC attack and decay time constants.
Time constants remain the same irrespective of any sampling frequency.
Attack Time (ms)
0000
8
0001
11
0010
16
0011
20
0100
8
0101
11
0110
16
0111
20
1000
8
1001
11
1010
16
1011
20
1100
8
1101
11
1110
16
1111
20
D0
AGCEN
R/W
0
AGC Enable
0 => AGC is off
1 => AGC is on
Decay Time (ms)
100
100
100
100
200
200
200
200
400
400
400
400
500
500
500
500
(ADC PGA is controlled by D15−D8 ADC PGA Control)
(ADC PGA is controlled by AGC)
REGISTER 02H: CODEC DAC Gain Control
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
DALMU
R/W
1
D14−D8
DALVL
R/W
1111111
FUNCTION
DAC Left Channel Muted
1 => DAC left channel muted
0 => DAC left channel not muted
DAC Left Channel Volume Control
0000000 => DAC left channel volume control = 0 dB
0000001 => DAC left channel volume control = −0.5 dB
0000010 => DAC left channel volume control = −1.0 dB
−−−−−
1111110 => DAC left channel volume control = −63.0 dB
1111111 => DAC left channel volume control = −63.5 dB
D7
DARMU
R/W
1
D6−D0
DARVL
R/W
1111111
DAC Right Channel Muted
1 => DAC right channel muted
0 => DAC right channel not muted
DAC Right Channel Volume Control
0000000 => DAC right channel volume control = 0 dB
0000001 => DAC right channel volume control = −0.5 dB
0000010 => DAC right channel volume control = −1.0 dB
−−−−−
1111110 => DAC right channel volume control = −63.0 dB
1111111 => DAC right channel volume control = −63.5 dB
42
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 03H: CODEC Sidetone Control
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
ASTMU
R/W
1
D14−D8
ASTG
R/W
1000101
FUNCTION
Analog Sidetone Mute Control
1 => Analog sidetone muted
0 => Analog sidetone not muted
Analog Sidetone Gain Setting
0000000 => Analog sidetone gain setting = −34.5 dB
0000001 => Analog sidetone gain setting = −34 dB
0000010 => Analog sidetone gain setting = −33.5 dB
−−−−−
1000101 => Analog sidetone gain setting = 0 dB
1000110 => Analog sidetone gain setting = 0.5 dB
−−−−−
1011100 => Analog sidetone gain setting = 11.5 dB
1011101 => Analog sidetone gain setting = 12 dB
1011110 => Analog sidetone gain setting = 12 dB
1011111 => Analog sidetone gain setting = 12 dB
−−−−−
11xxxxx => Analog sidetone gain setting = 12 dB
D7
DSTMU
R/W
1
D6−D1
DSTG
R/W
000000
Digital Sidetone Mute Control
1 => Digital sidetone muted
0 => Digital sidetone not muted
Digital Sidetone Setting
000000 => Digital sidetone gain = 0 dB
000001 => Digital sidetone gain = −1.5 dB
000010 => Digital sidetone gain = −3.0 dB
−−−−−
1xxxxx => Digital sidetone gain = −48 dB
Note: Digital sidetone setting applied at zero cross over
D0
ASTGF
R
0
Analog Sidetone PGA Flag ( Read Only )
0 => Gain applied /= PGA register setting
1 => PGA applied = PGA register setting.
Note: Analog sidetone gain is implemented at zero crossings of the signal.
43
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 04H: Audio Control 2
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
KCLEN
R/W
0
D14−D12
KCLAC
R/W
100
FUNCTION
Keyclick Enable
0 => Keyclick disabled
1 => Keyclick enabled
Note: This bit is automatically cleared after giving out the keyclick signal length equal to the
programmed value.
Keyclick Amplitude Control
000 => Lowest amplitude
100 => Medium amplitude
111 => Highest amplitude
D11
APGASS
R/W
0
ADC Channel PGA Soft-Stepping Control
0 => 0.5dB change every ADWS
1 => 0.5dB change every 2 ADWS
Note: When AGC is enabled, this bit is read only. The read values indicate the following
0 => signal power greater than noise threshold
1 => signal power is less than noise threshold
D10−D8
KCLFRQ
R/W
100
Keyclick Frequency
000 => 62.5 Hz
001 => 125 Hz
010 => 250 Hz
011 => 500 Hz
100 => 1 kHz
101 => 2 kHz
110 => 4 kHz
111 => 8 kHz
D7−D4
KCLLN
R/W
0001
Keyclick Length
0000 => 2 periods key click
0001 => 4 periods key click
0010 => 6 periods key click
−−−−−
1110 => 30 periods key click
1111 => 32 periods key click
44
D3
DLGAF
R
0
DAC Left Channel PGA Flag ( Read Only )
0 => Gain applied /= PGA register setting
1 => Gain applied = PGA register setting
Note: This flag indicates when the soft-stepping for DAC left channel is completed
D2
DRGAF
R
0
DAC Right Channel PGA Flag ( Read Only )
0 => Gain applied /= PGA register setting
1 => Gain applied = PGA register setting
Note: This flag indicates when the soft-stepping for DAC right channel is completed
D1
DASTC
R/W
0
DAC Channel PGA Soft-Stepping Control
0 => 0.5dB change every LRCK
1 => 0.5dB change every 2 LRCK
D0
ADGAF
R
0
ADC Channel PGA Flag ( Read Only )
1 => Gain applied = PGA register setting
0 => Gain applied /= PGA register setting
Note: This flag indicates when the soft-stepping for ADC channel is completed. When AGC is
enabled the read value of this bit indicates the following:
0 => AGC is not saturated.
1 => AGC is saturated.
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 05H: CODEC Power Control
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
PWDNC
R/W
1
Codec Power-Down Control
0 => Codec powered up
1 => Codec powered down
R
0
Reserved (During read the value of this bit is 0. Write only 0 into this location.)
D13
ASTPWD
R/W
1
Analog Sidetone Power-down Control
0 => Analog sidetone powered up
1 => Analog sidetone powered down
D12
DAODRC
R/W
0
Audio Output Driver Control
0 => Output driver in low power mode
1 => Output driver in high power mode
D11
ASTPWF
R
1
Analog Sidetone Power-Down Flag
0 => Analog sidetone powered down is not complete.
1 => Analog sidetone powered down is complete.
D10
DAPWDN
R/W
1
DAC Power-Down Control
0 => Power up the DAC
1 => Power down the DAC
D9
ADPWDN
R/W
1
ADC Power-Down Control
0 => Power up the ADC
1 => Power down the ADC
D8
VGPWDN
R/W
1
Driver Virtual Ground Power Down
0 => Power up the VGND amp
1 => Power down the VGND amp
D7
ADPWDF
R
1
ADC Power-Down Flag
0 => ADC power down is not complete.
1 => ADC power down is complete.
D6
DAPWDF
R
1
DAC Power-Down Flag (See DAC Power down section of this data sheet)
0 => DAC power down is not complete.
1 => DAC power down is complete.
D5
ADWSF
R/W
0
ADWS Pin Function
0 => ADWS pin acts as hardware power down.
1 => ADWS pin acts as ADC Word−Select.
D14
FUNCTION
Note: ADWS pin should be programmed as hardware power down only if the ADC channel is
powered down or both the ADC and DAC channels have the same sampling rate. If both the ADC
and DAC channels have the same sampling rates, then LRCK can act as a common word select
signal for the ADC and DAC.
D4
VBIAS
D3−D2
R/W
0
VBIAS Voltage
0 => VBIAS output = 2.5 V
1 => VBIAS output = 2.0 V
R
00
Reserved. Write only 00 into this location.
D1
EFFCTL
R/W
0
Digital Audio Effects Filter Control
0 => Disable digital audio effects filter
1 => Enable digital audio effects filter
D0
DEEMPF
R/W
0
De−Emphasis Filter Enable
0 => Disable de-emphasis filter
1 => Enable de-emphasis filter
45
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 06H: Audio Control 3
BIT
NAME
READ/
WRITE
RESET
VALUE
D15−D14
DMSVOL
R/W
00
DAC Channel Master Volume Control
00 => Left channel and right channel have independent volume controls
01 => Left channel volume control is the programmed value of the right channel volume control.
10 => Right channel volume control is the programmed value of the left channel volume control.
11 => same as 00
D13
REFFS
R/W
0
Reference Sampling Rate. This setting controls the coefficients in the de-emphasis filter, the
time-constants in AGC, and internal divider values that generate a clock for the measurement
ADC. If an Fsref above 48 kHz is being used, then it is recommended to set this to the 48-kHz
setting, otherwise either setting can be used.
0 => Fsref = 48.0 kHz
1 => Fsref = 44.1 kHz
D12
DAXFM
R/W
0
Master Transfer Mode
0 => Continuous data transfer mode
1 => 256−s data transfer mode
D11
SLVMS
R/W
0
Codec Master Slave Selection
0 => ’AIC26 is slave codec
1 => ’AIC26 is master codec
D10−D9
DAPK2PK
R/W
00
D8
ADCOVF
R
0
DAC Max Output Signal Swing and Common Mode Voltage
00 => DAC max output signal swing = 2.0 V, VCM = 1.35 V
01 => DAC max output signal swing = 2.192 V (only recommended for analog supply of 3.0 V
and digital supply of 1.65 V and above), VCM = 1.48 V
10 => DAC max output signal swing = 2.402 V (only recommended for analog supply of 3.3 V
and digital supply of 1.8 V and above), VCM = 1.62 V
11 => DAC max output signal swing = 2.633 V (only recommended for analog supply of 3.6 V
and digital supply of 1.95 V), VCM = 1.78 V
ADC Channel Overflow Flag ( Read Only )
0 => ADC channel data is within saturation limits.
1 => ADC channel data has exceeded saturation limits.
Note : This flag is reset only on register read.
D7
DALOVF
R
0
DAC Left Channel Overflow Flag ( Read Only )
0 => DAC left channel data is within saturation limits.
1 => DAC left channel data has exceeded saturation limits.
Note : This flag is reset only on register read.
D6
DAROVF
R
0
DAC Right Channel Overflow Flag ( Read Only )
0 => DAC right channel data is within saturation limits.
1 => DAC right channel data has exceeded saturation limits.
Note : This flag is reset only on register read.
D5−D4
AGCNL
R/W
00
AGC Noise Threshold.
00 => −60 dB
01 => −70 dB
10 => −80 dB
11 => −90 dB
FUNCTION
Note: AGC does not try to achieve the programmed ADC output levels if the input signal is below
the programmed noise thresholds. This feature helps to avoid amplifying noise during silence
periods.
D3
CLPST
R/W
0
D2−D0
REVID
R
XXX
46
AGC Clip Stepping Enable
0 => Not enabled
1 => Enabled
Reserved
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 07H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N0
R/W
27619
FUNCTION
Left channel digital audio effects filter coefficient N0
REGISTER 08H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N1
R/W
−27034
FUNCTION
Left channel digital audio effects filter coefficient N1
REGISTER 09H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N2
R/W
26461
FUNCTION
Left channel digital audio effects filter coefficient N2
REGISTER 0AH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N3
R/W
27619
FUNCTION
Left channel digital audio effects filter coefficient N3
REGISTER 0BH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N4
R/W
−27034
FUNCTION
Left channel digital audio effects filter coefficient N4
REGISTER 0CH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_N5
R/W
26461
FUNCTION
Left channel digital audio effects filter coefficient N5
REGISTER 0DH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_D1
R/W
32131
FUNCTION
Left channel digital audio effects filter coefficient D1
REGISTER 0EH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_D2
R/W
−31506
FUNCTION
Left channel digital audio effects filter coefficient D2
REGISTER 0FH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_D4
R/W
32131
FUNCTION
Left channel digital audio effects filter coefficient D4
REGISTER 10H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
L_D5
R/W
−31506
FUNCTION
Left channel digital audio effects filter coefficient D5
REGISTER 11H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N0
R/W
27619
FUNCTION
Right channel digital audio effects filter coefficient N0
REGISTER 12H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N1
R/W
−27034
FUNCTION
Right channel digital audio effects filter coefficient N1
47
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 13H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N2
R/W
26461
FUNCTION
Right channel digital audio effects filter coefficient N2
REGISTER 14H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N3
R/W
27619
FUNCTION
Right channel digital audio effects filter coefficient N3
REGISTER 15H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N4
R/W
−27034
FUNCTION
Right channel digital audio effects filter coefficient N4
REGISTER 16H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_N5
R/W
26461
FUNCTION
Right channel digital audio effects filter coefficient N5
REGISTER 17H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_D1
R/W
32131
FUNCTION
Right channel digital audio effects filter coefficient D1
REGISTER 18H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_D2
R/W
−31506
FUNCTION
Right channel digital audio effects filter coefficient D2
REGISTER 19H: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_D4
R/W
32131
FUNCTION
Right channel digital audio effects filter coefficient D4
REGISTER 1AH: Digital Audio Effects Filter Coefficients
BIT
NAME
READ/
WRITE
RESET VALUE
(IN DECIMAL)
D15−D0
R_D5
R/W
−31506
48
FUNCTION
Right channel digital audio effects filter coefficient D5
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 1BH: PLL Programmability
BIT
NAME
READ/
WRITE
RESET VALUE
D15
PLLSEL
R/W
0
D14−D11
QVAL
R/W
0010
FUNCTION
PLL Enable
0 => Disable PLL
1 => Enable PLL
Q value. Valid only if PLL is disabled.
0000 => 16
0001 => 17
0010 => 2
0011 => 3
−−−−−
1100 => 12
1101 => 13
1110 => 14
1111 => 15
D10−D8
PVAL
R/W
000
P value. Valid when PLL is enabled
000 => 8
001 => 1
010 => 2
011 => 3
100 => 4
101 => 5
110 => 6
111 => 7
D7−D2
JVAL
R/W
000001
J value. Valid only if PLL is enabled.
000000 => Not valid
000001 => 1
000010 => 2
−−−−−
111110 => 62
111111 => 63
D1−D0
Reserved
R
00
Reserved (write only 00)
REGISTER 1CH: PLL Programmability
BIT
NAME
READ/
WRITE
RESET VALUE
D15−D2
DVAL
R/W
0 (in decimal)
D1−D0
Reserved
R
00
FUNCTION
D value. Used when PLL is enabled.
D value is valid from 0000 to 9999 in decimal.
Programmed value greater than 9999 is treated as 9999.
00000000000000 => 0 decimal
00000000000001 => 1 decimal
Reserved (write only 00)
49
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 1DH: Audio Control 4
BIT
NAME
READ/
WRITE
RESET
VALUE
D15
ASTPD
R/W
0
ADC PGA Soft-Stepping Control
0 => Soft-stepping enabled
1 => Soft-stepping disabled
D14
DASTPD
R/W
0
DAC PGA Soft-Stepping Control
0 => Soft-stepping enabled
1 => Soft-stepping disabled
D13
ASSTPD
R/W
0
Analog Sidetone Soft-Stepping Control
0 => Soft-stepping enabled
1 => Soft-stepping disabled
D12
DSTPD
R/W
0
Digital Sidetone Zero Cross Control
0 => Zero cross enabled
1 => Zero cross disabled
D11
Reserved
R
0
Reserved
D10−D9
AGC_HYST
R/W
00
AGC Hysteresis Control
00 =>1-dB hysteresis
01 => 2-dB hysteresis
10 => 4-dB hysteresis
11 => No hysteresis
D8
SHCKT_DIS
R/W
0
Disable Short Circuit Detection
0 => Short circuit detection enabled
1 => Short circuit detection disabled
D7
SHCKT_PD
R/W
0
Power Down Drivers if Short Circuit Detected
0 => No auto power down of drivers on short circuit.
1 => Auto power down drivers on short circuit.
D6
SHCKT_FLAG
R
0
Short Circuit Detected Flag
0 => Short circuit not detected
1 => Short circuit detected
D5
DAC_POP_RED
R
0
DAC POP Reduction Enable
0 => Disable POP reduction
1 => Enable POP reduction
D4
DAC_POP_RED_
SET1
R/W
0
DAC POP Reduction Setting 1
0 => Fast setting
1 => Slow setting
D3−D2
DAC_POP_RED_
SET2
R/W
00
DAC POP Reduction Setting 2
00 => Long setting
11 => Short setting
D1−D0
PGID
R
XX
50
FUNCTION
www.ti.com
SLAS412− DECEMBER 2003
REGISTER 1EH: Audio Control 5
BIT
NAME
READ/
WRITE
RESET
VALUE
D15−D9
MAX_AGC_PGA
R/W
1111111
D8−D6
AGC_NOI_DEB
R/W
000
AGC Debounce Time for Speech Mode to Silence Mode Transition
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
−−−−−
110 => 16.0 ms
111 => 32.0 ms
D5−D3
AGC_SIG_DEB
R/W
000
AGC Debounce Time for Silence Mode to Speech Mode Transition
000 => 0 ms
001 => 0.5 ms
010 => 1.0 ms
−−−−−
110 => 16.0 ms
111 => 32.0 ms
D2
DRV_POP_DIS
R/W
0
Audio Output Driver POP Reduction Enable
0 => Enabled
1 => Disabled
D1
DRV_POP_LEN
R/W
0
Audio Output Driver POP Reduction Duration
0 => Output driver ramps to final voltage in approximately 0.8 sec, if VGND is
powered down (1 msec otherwise).
1 => Output driver ramps to final voltage in approximately 4 sec, if VGND is powered
down (1 msec otherwise).
D0
Reserved
R
0
Reserved. Do not write 1 to this location.
FUNCTION
MAX Input Gain Applicable for AGC
0000000 => 0 dB
0000001 => 0.5 dB
0000010 => 1.0 dB
−−−−−
1110110 => 59.0 dB
1110111 => 59.5 dB
1111000 => 59.5 dB
−−−−−
1111111 => 59.5 dB
LAYOUT
The following layout suggestions should provide optimum performance from the ’AIC26. However, many portable
applications have conflicting requirements concerning power, cost, size, and weight. In general, most portable devices
have fairly clean power and grounds because most of the internal components are very low power. This situation means
less bypassing for the converter power and less concern regarding grounding. Still, each situation is unique and the
following suggestions should be reviewed carefully.
For optimum performance, care must be taken with the physical layout of the ’AIC26 circuitry. The SAR architecture of the
auxiliary converter is sensitive to glitches or sudden changes on the power supply, reference, ground connections, and
digital inputs that occur just prior to latching the output of the analog comparator. Therefore, during any single conversion
for an n-bit SAR converter, there are n windows in which large external transient voltages can easily affect the conversion
result. Such glitches might originate from switching power supplies, nearby digital logic, and high power devices. The
degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external event.
The error can change if the external event changes in time with respect to the timing of the critical n windows.
With this in mind, power to the ’AIC26 must be clean and well bypassed. A 0.1-µF ceramic bypass capacitor must be placed
as close to the device as possible. A 1-µF to 10-µF capacitor may also be needed if the impedance between the ’AIC26
supply pins and the system power supply is high.
A bypass capacitor on the VREF pin is generally not needed because the reference is buffered by an internal op amp,
although it can be useful to reduce reference noise level. If an external reference voltage originates from an op amp, make
sure that it can drive any bypass capacitor that is used without oscillation.
51
www.ti.com
SLAS412− DECEMBER 2003
The ’AIC26 architecture offers no inherent rejection of noise or voltage variation in regards to using an external reference
input. This is of particular concern when the reference input is tied to the power supply. Any noise and ripple from the supply
appears directly in the digital results. While high frequency noise can be filtered out, voltage variation due to line frequency
(50 Hz or 60 Hz) can be difficult to remove.
The ground pins must be connected to a clean ground point. In many cases, this is the analog ground. Avoid connections
which are too near the grounding point of a microcontroller or digital signal processor. If needed, run a ground trace directly
from the converter to the power supply entry or battery connection point. The ideal layout includes an analog ground plane
dedicated to the converter and associated analog circuitry.
CONVERSION TIME CALCULATION FOR THE ’AIC26
Auxiliary Measurement Operation
The time needed to make temperature, auxiliary, or battery measurements is given by:
t+
NJ ƪǒ
N
AVG
N
BITS
Ǔ
)1
ƫ Nj
8 MHz ) n ) n ) 1
1
2
ƒ conv
t
OSC
) 15
t
OSC
) n3
t
OSC
where:
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 24 ; if measurement is for TEMP1 case
12 ; if measurement is for other than TEMP1 case
n3 = 0 ; if external reference mode is selected
3 ; if tREF = 0 µs or reference is programmed for power up all the time.
1 + tREF /125 ns; if tREF ≠ 0 µs and reference needs to power down between conversions.
tREF is the reference power up delay time.
REG−00 of
PAGE−01
is updated
for
BAT1 Scan
Mode
Waiting for Host to write
into REG−00 of PAGE−01
Reading
BAT1−Data
Register
SS Deactivated
Wait for Reference Powerup Delay in case
of internal ref. mode if applicable.
Sample,Conversion & Waiting for Host to
Averaging for
write into REG−00
BAT1 input
of PAGE−01
DAV
(PAGE01H,REG01H,
[D15−D14 = 01])
The time needed for continuous AUX conversion in scan mode is given by:
t+
NJ ƪǒ
N
AVG
N
BITS
Ǔ
)1
ƫ Nj
8 MHz ) n ) 12 ) 1
1
ƒ conv
where:
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
NOTE: The above equation is valid only from second conversion onwards.
52
t
OSC
)8
t
OSC
www.ti.com
SLAS412− DECEMBER 2003
REG−00 of
PAGE−01
is updated
for Continous
AUX SCAN
Mode
Waiting for Host to
write into REG−00
of PAGE−01
SS Deactivated
Wait for Reference Powerup Delay in case
of internal ref. mode if applicable
Reading
AUX−Data
Register
Reading
AUX−Data
Register
Sample,Conversion & Sample,Conversion &
Averaging for
Averaging for
AUX input
AUX input
Sample,Conversion &
Averaging for
AUX input
DAV
(PAGE01H,REG01H
[D15−D14 = 01])
Port Scan Operation
The time needed to complete one set of port scan conversions is given by:
t+3
NJ ƪǒ
N
AVG
N
BITS
Ǔ
)1
ƫ Nj
8 MHz ) n ) 12 ) 1
1
ƒ conv
t
OSC
) 31
t
OSC
) n2
t
OSC
where:
n1 = 6 ; if ƒconv = 8 MHz
7 ; if ƒconv ≠ 8 MHz
n2 = 0 ; if external reference mode is selected
3 ; if tREF = 0 µs or reference is programmed for power up all the times.
1 + tREF /125 ns; if tREF ≠ 0 µs and reference needs to power down between conversions.
tREF is the reference power up delay time.
53
www.ti.com
SLAS412− DECEMBER 2003
AUDIO CODEC FILTER FREQUENCY RESPONSES
Pass-Band Frequency Response of ADC Digital Filter
Frequency Response of Full ADC Channel Digital Filter at Fs = 48 kHz
0.02
0
Magnitude − dB
−0.02
−0.04
−0.06
−0.06
−0.1
−0.12
−0.14
−0.16
−0.18
0.2
0.4
0.6
0.8
1
1.2
Frequency − Hz
1.4
1.6
1.8
x 104
Frequency Response of ADC High-Pass Filter (Fcut-off = 0.0045 Fs)
Frequency Response of ADC HPF at Fs = 48 kHz With −3 dB at 0.0045 Fs
0
−2
Magnitude − dB
−4
−6
−8
−10
−12
−14
0
54
500
1000
1500 2000 2500 3000 3500 4000
Frequency − Hz
4500
www.ti.com
SLAS412− DECEMBER 2003
Frequency Response of ADC High-Pass Filter (Fcut-off = 0.0125 Fs)
Frequency Response of ADC HPF at Fs = −48 kHz With −3 dB at 0.0125 Fs
0
−2
−4
Magnitude − dB
−6
−8
−10
−12
−14
−16
−18
0
1000
2000
3000
4000
Frequency − Hz
5000
6000
Frequency Response of ADC High-Pass Filter (Fcut-off = 0.025 Fs)
Frequency Response of ADC HPF at Fs = 48 kHz With −3 dB at 0.025 Fs
0
−2
−4
Magnitude − dB
−6
−8
−10
−12
−14
−16
−18
0
1000 2000 3000 4000 5000 6000 7000 8000
Frequency − Hz
9000
55
www.ti.com
SLAS412− DECEMBER 2003
DAC CHANNEL DIGITAL FILTER
DAC Channel Digital Filter Frequency Response
Frequency Response of Full DAC Channel Digital Filterat Fs = 48 kHz
0
−20
Magnitude − dB
−40
−60
−80
−100
−120
−140
−160
0
0.5
1
1.5
2
Frequency − Hz
2.5
3
3.5
x 105
DAC Channel Digital Filter Pass-Band Frequency Response
Frequency Response of Full DAC Channel Digital Filter at Fs = 48 kHz
0.04
0.02
Magnitude − dB
0
−0.02
−0.04
−0.06
−0.08
−0.1
−0.12
−0.14
0.5
56
1
1.5
Frequency − Hz
2
x 104
www.ti.com
SLAS412− DECEMBER 2003
DEFAULT DIGITAL AUDIO EFFECTS FILTER RESPONSE AT 48 ksps
Frequency Response of 4th Order Effects Filter With Default Coefficients Set
0
Magnitude − dB
−0.5
−1
−1.5
−2
−2.5
−3
100
101
102
103
Frequency − Hz
104
DE-EMPHASIS FILTER FREQUENCY RESPONSE
De-Emphasis Filter Response at 32 ksps
Digital De-Emphasis Frequency Response at Fs = 32 kHz
0
−1
−2
Gain − dB
−3
−4
−5
−6
−7
−8
−9
−10
0
2000
4000
6000
8000 10000 12000 14000 16000
Frequency − Hz
57
www.ti.com
SLAS412− DECEMBER 2003
De-Emphasis Error at 32 ksps
De-Emphasis Error With Respect to Ideal Frequency Response For Fs = 33 kHz
0.3
0.25
0.2
Gain − dB
0.15
0.1
0.05
0
−0.05
−0.1
0
2000
4000
6000 8000 10000 12000
Frequency − Hz
14000
16000
De-Emphasis Filter Frequency Response at 44.1 ksps
Digital De-Emphasis Frequency Response For Fs = 44.1 kHz
0
−1
−2
Gain − dB
−3
−4
−5
−6
−7
−8
−9
−10
0
58
0.5
1
1.5
Frequency − Hz
2
x 104
www.ti.com
SLAS412− DECEMBER 2003
De-Emphasis Error at 44.1 ksps
De-Emphasis Error With Respect to Ideal Frequency Response For Fs = 44.1 kHz
0.3
0.25
0.2
Gain − dB
0.15
0.1
0.05
0
−0.05
−0.1
0
0.5
1
1.5
Frequency − Hz
2
2.5
x 104
De-Emphasis Frequency Response at 48 ksps
Digital De-Emphasis Frequency Response at Fs = 48 kHz
0
−1
−2
Gain − dB
−3
−4
−5
−6
−7
−8
−9
−10
0
0.5
1
1.5
Frequency − Hz
2
2.5
x 104
59
www.ti.com
SLAS412− DECEMBER 2003
De-Emphasis Error at 48 ksps
De-Emphasis Error With Respect to Ideal Frequency Response For Fs = 48 kHz
0.3
0.25
0.2
Gain − dB
0.15
0.1
0.05
0
−0.05
−0.1
0
0.5
1
1.5
Frequency − Hz
2
2.5
x 104
PLL PROGRAMMING
The on-chip PLL in the ’AIC26 can be used to generate sampling clocks from a wide range of MCLK’s available in a system.
The PLL works by generating oversampled clocks with respect to Fsref (44.1 kHz or 48 kHz). Frequency division generates
all other internal clocks. The table below gives a sample programming for PLL registers for some standard MCLK’s when
PLL is required. Whenever the MCLK is of the form of N x 128 x Fsref (N=2,3…,17), PLL is not required.
Fsref = 44.1 kHz
MCLK (MHz)
P
J
D
ACHIEVED FSREF
% ERROR
2.8224
1
32
0
44100.00
0.0000
5.6448
1
16
0
44100.00
0.0000
12
1
7
5264
44100.00
0.0000
13
1
6
9474
44099.71
0.0007
16
1
5
6448
44100.00
0.0000
19.2
1
4
7040
44100.00
0.0000
19.68
1
4
5893
44100.30
−0.0007
48
4
7
5264
44100.00
0.0000
Fsref = 48 kHz
60
MCLK (MHz)
P
J
D
ACHIEVED FSREF
% ERROR
2.048
1
48
0
48000.00
0.0000
3.072
1
32
0
48000.00
0.0000
4.096
1
24
0
48000.00
0.0000
6.144
1
16
0
48000.00
0.0000
8.192
1
12
0
48000.00
0.0000
12
1
8
1920
48000.00
0.0000
13
1
7
5618
47999.71
0.0006
16
1
6
1440
48000.00
0.0000
19.2
1
5
1200
48000.00
0.0000
19.68
1
4
9951
47999.79
0.0004
48
4
8
1920
48000.00
0.0000
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
26-Mar-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TLV320AIC26IRHB
ACTIVE
QFN
RHB
32
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC26IRHBG4
ACTIVE
QFN
RHB
32
73
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TLV320AIC26IRHBR
ACTIVE
QFN
RHB
32
Call TI
Level-2-260C-1 YEAR
3000 Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
TLV320AIC26IRHBR
21-May-2007
Package Pins
RHB
32
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
TAI
330
12
5.3
5.3
1.5
8
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TLV320AIC26IRHBR
RHB
32
TAI
407.0
336.6
97.0
Pack Materials-Page 2
W
Pin1
(mm) Quadrant
12
Q2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated