TI TPIC8101DW

SLIS110A − APRIL 2003 − REVISED MAY 2005
features
D Dual-Channel Knock Sensor Interface
D Programmable Input Frequency Prescaler
D
D
D
D
D
D
(OSCIN)
Serial Interface With Microprocessor (SPI)
Programmable Gain
Programmable Band-Pass Filter Center
Frequency
External Clock Frequencies up to 24 MHz
− 4, 5, 6, 8, 10, 12, 16, 20, and 24 MHz
Programmable Integrator Time Constants
Operating Temperature Range −40°C to
125°C
DW PACKAGE
(TOP VIEW)
VDD
GND
Vref
OUT
NC
NC
INT/HOLD
CS
XIN
XOUT
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
CH1P
CH1N
CH1FB
CH2FB
CH2N
CH2P
TEST
SCLK
SDI
SDO
applications
D Engine Knock Detector Signal Processing
D Analog Signal Processing With Filter
Characteristics
description
The TPIC8101 is a dual-channel signal processing IC for detection of premature detonation in combustion
engine. The two sensor channels are selectable through the SPI bus. The knock sensor typically provides an
electrical signal to the amplifier inputs. The sensed signal is processed through a programmable band-pass filter
to extract the frequency of interest (engine knock or ping signals). The band-pass filter eliminates any engine
background noise associated with combustion. The engine background noise is typically low in amplitude
compared to the predetonation noise.
The detected signal is full-wave rectified and integrated by use of the INT/HOLD signal. The digital output from
the integration stage is either converted to an analog signal, passed through an output buffer, or be read directly
by the SPI.
This analog buffered output may be interfaced to an A/D converter and read by the microprocessor. The digital
output may be directly interfaced to the microprocessor.
The data from the A/D enables the system to analyze the amount of retard timing for the next spark ignition timing
cycle.
With the microprocessor closed-loop system, advancing and retarding the spark timing optimize the load/RPM
conditions for a particular engine (data stored in RAM).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003 − 2005, Texas Instruments Incorporated
! "#
" $ % "" &'# " ( " !' !"
( !! #
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLIS110A − APRIL 2003 − REVISED MAY 2005
functional block diagram
Vref
VDD/2
+
−
CH1P
+
CH1N
−
Mux
CH1FB
SAR
<1:10>
10-Bit ADC
fs = 200 kHz
3rd Order AAF
CH2P
+
CH2N
−
CH2FB
Programmable
Band-Pass
Filter
Programmable
Gain
Rectifier
Programmable
Integrator
DSP
R2R
10-Bit DAC
fs = 200 kHz
SPI
Test Mode
DSP Control
+
−
VDD
2
GND
OUT
SDO SDI
POST OFFICE BOX 655303
SCLK
CS
• DALLAS, TEXAS 75265
TEST
INT/HOLD XIN
XOUT
SLIS110A − APRIL 2003 − REVISED MAY 2005
Terminal Functions
TERMINAL
DESCRIPTION
NO.
TERMINAL TYPE
(PULLUP/PULLDOWN)
VDD
GND
1
I
5-V input supply
2
I
Ground connection
Vref
3
O
Supply reference generator with external bypass capacitor
OUT
NC†
4
O
Buffered integrator output
NAME
5, 6
No connection
INT/HOLD
7
I / Pulldown
CS
8
I / Pullup
Selectable for integrate (high) or hold (low) mode (with internal pulldown)
Chip select for SPI communications (active low with internal pullup)
XIN
9
I
Inverter input for oscillator
XOUT
10
O
Inverter output for oscillator
Serial data output for SPI bus
SDO
11
O
SDI
12
I / Pullup
Serial data input line
SCLK
13
I / Pullup
SPI clock
TEST
14
I / Pullup
Test mode (active low), open for normal operation
CH2P
15
I
Positive input for amplifier #2
CH2N
16
I
Negative input for amplifier #2
CH2FB
17
O
Output of amplifier #2, for feedback connection
CH1FB
18
O
Output of amplifier #1, for feedback connection
CH1N
19
I
Negative input for amplifier #1
CH1P
20
I
Positive input for amplifier #1
† These terminals are to be used for test purposes only and are no connected in the system application. No signal traces should be connected
to the NC terminals.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SLIS110A − APRIL 2003 − REVISED MAY 2005
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Regulated input voltage (see Notes 1 and 2), VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Output voltage (see Notes 1 and 2), VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Input voltage (see Notes 1 and 2), VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
DC input current on terminals CH1P, CH1N, CH2P, and CH2N (see Notes 1 and 2), IIN . . . . . . . . . . . . 2 mA
DC input voltage on terminals CH1P, CH1N, CH2P and CH2N (see Notes 1 and 2), VDCIN . . . . . . . . . . 14 V
Thermal impedance junction to ambient, θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
Continuous power dissipation, PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mW
Electrostatic discharge susceptibility (see Note 3), V(HBMESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
Operating ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature (soldering, 10 sec), TLEAD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. Absolute negative voltage on these terminals is not to go below –0.5 V.
3. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each terminal.
recommended operating conditions
MIN
MAX
Regulated input voltage, VDD
−0.3
5.5
V
Output voltage, VO
−0.3
5.5
V
Input voltage, VIN
0.05
VDD − 0.05
1
µA
DC input current on terminals CH1P, CH1N, CH2P, and CH2N, IIN
−1
DC input voltage on terminals CH1P, CH1N, CH2P, and CH2N, VDCIN
Continuous power dissipation, PD
4
Vref, (VDD/2)
100
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNITS
V
V
mW
SLIS110A − APRIL 2003 − REVISED MAY 2005
dc electrical characteristics, VDD = 5 V ±5%, input frequency before prescaler = 4 MHz to 20 MHz
(±0.5%), TA = −40°C to 125°C (unless otherwise specified)
PARAMETER
TEST CONDITIONS
IDD(Q)
IDD(OP)
Quiescent current
Vmid0
Vmid1
Midpoint voltage
Vmid2
Rpull0
Midpoint voltage
Rpull1
Internal pulldown resistor INT/HOLD
Ilkg
Input leakage current CS, SDI, SCLK,
INT/HOLD, TEST
VIL
Low-level input voltage INT/HOLD, CS,
TEST, SDI, SCLK
VIH
High-level input voltage INT/HOLD, CS,
TEST, SDI, SCLK
VOL
VOH
Operating current
Midpoint voltage
Internal pullup resistor CS, SDI, SCLK, TEST
Low-level output voltage SDO
Low-level leakage current SDO
VOL(XOUT)
VOH(XOUT)
Low-level output voltage
Vhyst
MAX
7.5
UNITS
mA
20
mA
2.3
2.5
2.55
V
2.4
2.5
2.7
V
VDD = 5 V, IL = 0 mA
VIN = GND
2.4
2.5
2.6
30
kΩ
VIN = VDD
Measured at GND and VDD,
VDD = 5.5 V = VIN
20
kΩ
±3
V
µA
30% of
VDD
70% of
VDD
Measured at GND and VDD = 5 V,
SDO in high impedance
ISink = 500 µA, VDD = 4.5 V
ISource = 500 µA, VDD = 5 V
High-level output voltage
TYP
VDD = 5 V, ISource = 2 mA
VDD = 5 V, ISink = 2 mA
ISink = 4 mA, VDD = 5 V
ISource = 100 µA, VDD = 5 V
High-level output voltage SDO
Ilkg(OL)
MIN
VDD = 5 V
VDD = 5 V, XIN = 8 MHz
Hysteresis voltage INT/HOLD, CS, XIN, SDI,
SCLK, TEST
0.7
4.4
V
V
−10
10
µA
1.5
V
4.4
V
0.4
V
Input Amplifiers
VOH(1)
VDD = 5 V, ISource = 100 µA
VDD –
0.05
VDD = 5 V, ISource = 2 mA
VDD –
0.5
CH1FB and CH2FB high-level output voltage
ISink = 100 µA
ISink = 2 mA
fin max(ch1) = 20 kHz, measured on
channel 2
VDD –
0.02
V
15
50
VOL(1)
CH1FB and CH2FB low-level output voltage
CATTEN
Cross-coupling attenuation CH1FB and
CH2FB
Av
Open-loop gain
GBW
Gain bandwidth product
VIN
Input voltage range
V(offset)
CMRR
Offset voltage at input
Common-mode rejection ratio
Inputs at Vmid fin = 0 to 20 kHz
60
PM
Phase margin
Gain = 1, CL = 200 pF, RL = 100 kΩ
45
deg
150
mV
Input range 0.5 V to 4.5 V
500
40
mV
dB
60
100
dB
1
2.6
MHz
VDD –
0.05
0.05
−10
10
80
V
mV
dB
Prescaler, XIN
VOSC
Minimum input peak amplitude(1)
VDD = Vmin, oscillator inverter biased
feedback resistor 1 MΩ, fosc = 24 MHz
CIN
Input capacitance
Assured by design
7
pF
Ilkg(XIN)
Leakage current
−1
1
µA
NOTE 1: 150-mV input amplitude on the 4-MHz clock input only applies if the feedback network is completed. Without the feedback network, the
4-MHz signal should be at 0−5V levels.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLIS110A − APRIL 2003 − REVISED MAY 2005
dc electrical characteristics, VDD = 5 V ±5%, input frequency before prescaler = 4 MHz to 20 MHz
(±0.5%), TA = −40°C to 125°C (unless otherwise specified) (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Multiplexer
CATTEN
Cross-coupling attenuation (assured by
design)
fin max(ch1) = 20 kHz, measured on
channel 2
Anti-Aliasing Filter
fc‡
Cut-off frequency at –3 dB
40
dB
35
45
55
kHz
1
dB
BW
Response 1 kHz to 20 kHz referenced to
1 kHz
70-mV RMS, input: CH1FB or CH2FB,
output: OUT
−1
−0.5
ATTEN
Attenuation at 100 kHz referenced to 1 kHz
70-mV RMS, input: CH1FB or CH2FB,
output: OUT
−10
−15
For all frequencies stated
198
200
dB
Analog-to-Digital Converter
fs
AR
Sampling frequency
ADNL
Differential linearity error (DNL)
1
Bit
AINL
Linearity error (INL)
1
Bit
Analog resolution
202
10
kHz
Bit
Digital-to-Analog Converter
fs(DA)
DR
Sampling frequency
198
DDNL
Differential linearity error (DNL)
(Vreset < DACout < 0.98 VDD)
−1
1
LSB
DINL
Linearity error (INL)
(Vreset < DACout < 0.98 VDD)
−2.5
2.5
LSB
DRNIL
Repeatability (for characterization purposes
only)
−1
1
LSB
Resolution at 200 kHz
200
202
10
kHz
Bit
Output Buffer
VOH
High-level output voltage
VDD = 5 V, ISource = 2 mA
VOL
Av
Low-level output voltage
VDD = 5 V, ISink = 2 mA
IO = ±2 mA
G
Output gain
Vripple
Ripple voltage
ts
Settling time
Open-loop gain
IO = ±2 mA
CL = 0 to 22 nF, max slew rate,
12 mV/µs from Vreset to 4 V
CL = 0 to 22 nF, max slew rate,
12 mV/µs from Vreset to 4 V,
output: ±0.5 LSB
‡ fc is programmable (see Table 1).
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VDD –
0.2
VDD –
0.15
120
60
V
175
100
mV
dB
1
10
mV
20
µs
SLIS110A − APRIL 2003 − REVISED MAY 2005
ac electrical characteristics, VDD = 5 V ±5%, TA = −40°C to 125°C (unless otherwise specified)
DESCRIPTION
MIN
TYP
MAX
5
UNITS
fSPI
t1
SPI frequency
Time from CS falling edge to SCLK rising edge
10
ns
t2
Time from CS falling edge to SCLK falling edge
80
ns
t3
Time for SCLK to go high
60
ns
t4
Time for SCLK to go low
60
ns
t5
Time from last SCLK falling edge to CS rising edge
80
ns
t6
Time from SDI valid to falling edge of SCLK
60
ns
t7
Time for SDI valid after falling edge of SCLK
10
ns
t8
Time after CS rises until INT/HOLD to go high
8
ns
t9
Time between two words for transmitting
t10
Time for SDO valid after SDI on bus, at VDD = 5 V and load = 20 pF
170
ns
40
t2
MHz
ns
t9
t8
t3
t1
t5
t1
t4
CS
SCLK
SDI
XXX MSB
6
5
4
3
5
4
3
2
1
LSB
1
LSB
t7
t6
INT/HOLD
SDO
XXX
MSB
6
2
t10
Figure 1. Serial Peripherial Interface (SPI)
This is an 8-bit SPI protocol used to communicate with the microcontroller in the system for setting various
operating parameters.
When CS is held high, the signals on the SCLK and SDI lines are ignored and SDO is forced into a
high-impedance state. SCLK must be low when CS is asserted low.
On each falling edge of the SCLK pulse after CS is asserted low, the new byte is serially shifted into the register.
The most significant bit (MSB) is shifted first. Only eight bits in a frame are acceptable. When a number of bits
shifted is different than the value eight, the information is ignored and the register retains the old setting.
The shift register transfers the data into a latch register after the eighth SCLK clock pulse and when CS
transitions from low to high (see Figure 1).
The function of the integration mode is to ignore any SPI frame transmission when the INT/HOLD bit = 1. In the
hold mode with INT/HOLD = 0, all necessary bytes may be transmitted.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SLIS110A − APRIL 2003 − REVISED MAY 2005
function principle
The TPIC8101 is designed for knock sensor signal conditioning in automotive applications. The device is an
analog interface between the engine acoustical sensors or accelerometers and the fuel management systems
of a gasoline engine. The two wide-band amplifiers process signals from the piezoelectric sensors. Outputs of
the amplifiers feed a channel select mux switch and then a 3rd order antialiasing filter. This signal is converted
using an analog-to-digital conversion (10 bits with a sampling frequency of 200 kHz) prior to the gain stage.
The gain stage is adjustable via the SPI to compensate for the knock energies. The gain setting is selectable
up to 64 values ranging from 0.111 to 2.0.
The output of the gain stage feeds a band-pass filter circuit to process the particular frequency component
associated with the engine and transducer.
The band-pass filter has a gain of two and a center frequency range between 1.22 kHz and 19.98 kHz (64-bit
selection). The output from this stage is internally clamped.
The output from the band-pass filter is full-wave rectified with its output clamped below VDD.
The full-wave rectified signals are integrated using an integrator time constant set by the SPI and integration
time window set by the pulse width of INT/HOLD. At the start of each knock window, the integrator output is reset.
The output of the integrator is internally clamped and the digital output may be directly interfaced to the
microprocessor.
The integrated signal is converted to an analog format by a 10-bit DAC. The microprocessor may interface to
this signal, reads this data, and adjusts the spark ignition timing to optimize fuel efficiency related to load versus
engine RPM.
description of the functional terminals
supply voltage (VDD)
The VDD terminal is the input supply for the IC, typically 5 V ±5% tolerant. A noise filter capacitor of 4.7 µF (typ)
is required on this terminal to ensure stability of the internal circuits.
ground (GND)
The GND terminal is connected to the system ground rail.
reference supply (Vref)
The Vref is an internally generated supply reference voltage for biasing the amplifier inputs. The terminal is used
to decouple any noise in the system by placing an external capacitor of 22 nF (typ).
buffered integrator output (OUT)
The OUT terminal is the output of the integrated signal. This is an analog signal interfaced to the microprocessor
A/D channel for data acquisition. A capacitor of 2.2 nF is used to stabilize the signal output.
integration/hold mode selection (INT/HOLD)
The INT/HOLD is an input control signal from the microprocessor to select either to integrate the sensed signal
or to hold the data for acquisition. There is an internal pulldown on this terminal (default HOLD mode).
chip select for SPI (CS)
The CS terminal allows serial communication to the IC through the SPI from a master controller. The chip select
is active low with an internal pullup (default inactive).
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLIS110A − APRIL 2003 − REVISED MAY 2005
description of the functional terminals (continued)
oscillator input (XIN)
The XIN terminal is the input to the inverter used for the oscillator circuit. An external clock signal from the MCU,
crystal, or ceramic resonator is configured with resistors and capacitors. To bias the inverter, a resistor (1 MΩ
typ) is placed across XIN and XOUT.
This clock signal is prescaled to set the internal sampling frequency of the A/D converter.
oscillator output (XOUT)
The XOUT terminal is the output of the inverter used for the oscillator circuit.
data output (SDO)
The SDO output is the SPI data bus reporting information back to the microprocessor. This is a 3-state output
with the output set to high-impedance mode when CS is pulled to VDD. The high-impedance state can also be
programmed by setting a bit in the prescale word which takes precedence over the CS setting. The output is
disabled when the CS terminal is pulled high (VDD).
data input (SDI)
The SDI terminal is the communication interface for data transfer between the master and slave components.
The SDI has an internal pullup to VDD; the data stream is in 8-bit word format.
serial clock (SCLK)
The SCLK output signal is used for synchronous communication of data. Typically, the output from the master
clock is low with the IC having an internal pullup resistor to VDD. The data is clocked to the internal shift register
on the falling clock edge.
test (TEST)
The TEST terminal, when pulled low, allows the IC to enter the test mode. During normal operation, this terminal
is left open or tied high (VDD). There is an internal pullup to VDD (default).
feedback output for amplifiers (CH1FB and CH2FB)
The CHXFB are amplifier outputs for the sensor signals. The gain of the respective amplifiers is set using the
CHXFB and CHX input terminals (see Figure 1).
input amplifiers (CH1P, CH1N, CH2P, and CH2N)
CH1P, CH1N, CH2P, and CH2N are the inputs for the two amplifiers which interface to the external knock
sensors.
The gain is set by external resistors R1 and R2. The inputs and outputs of the amplifier are rail-to-rail compatible
to the supply VDD.
An internal multiplexer selects the desired sensor signal to process programmable through the SPI.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLIS110A − APRIL 2003 − REVISED MAY 2005
R2
C
CH1N
−
R1
Knock Sensor 1
CH1P
+
CH1FB
+
CH2FB
Vref
CH2P
C
R1
−
CH2N
Knock Sensor 2
R2
NOTE: The series capacitor C is not mandatory and may be removed in some application circuits.
Figure 2. Input Signal Configuration
Table 1. Integrator Programming
DECIMAL
VALUE (D4…D0)
INTEGRATOR TIME
CONSTANT
(µSEC)
BAND-PASS
FREQUENCY
(kHz)
0
40
1
45
2
3
10
GAIN
DECIMAL VALUE
(D5…D0)
BAND-PASS
FREQUENCY
(kHz)
GAIN
1.22
2
32
4.95
0.421
1.26
1.882
33
5.12
0.4
50
1.31
1.778
34
5.29
0.381
55
1.35
1.684
35
5.48
0.364
4
60
1.4
1.6
36
5.68
0.348
5
65
1.45
1.523
37
5.9
0.333
6
70
1.51
1.455
38
6.12
0.32
7
75
1.57
1.391
39
6.37
0.308
8
80
1.63
1.333
40
6.64
0.296
9
90
1.71
1.28
41
6.94
0.286
10
100
1.78
1.231
42
7.27
0.276
11
110
1.87
1.185
43
7.63
0.267
12
120
1.96
1.143
44
8.02
0.258
13
130
2.07
1.063
45
8.46
0.25
14
140
2.18
1
46
8.95
0.236
15
150
2.31
0.944
47
9.5
0.222
16
160
2.46
0.895
48
10.12
0.211
17
180
2.54
0.85
49
10.46
0.2
18
200
2.62
0.81
50
10.83
0.19
19
220
2.71
0.773
51
11.22
0.182
20
240
2.81
0.739
52
11.65
0.174
21
260
2.92
0.708
53
12.1
0.167
22
280
3.03
0.68
54
12.6
0.16
23
300
3.15
0.654
55
13.14
0.154
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLIS110A − APRIL 2003 − REVISED MAY 2005
Table 1. Integrator Programming (Continued)
DECIMAL
VALUE (D4…D0)
INTEGRATOR TIME
CONSTANT
(µSEC)
BAND-PASS
FREQUENCY
(kHz)
GAIN
DECIMAL VALUE
(D5…D0)
BAND-PASS
FREQUENCY
(kHz)
GAIN
24
320
25
360
3.28
0.63
56
13.72
0.148
3.43
0.607
57
14.36
0.143
26
27
400
3.59
0.586
58
15.07
0.138
440
3.76
0.567
59
15.84
0.133
28
480
3.95
0.548
60
16.71
0.129
29
520
4.16
0.5
61
17.67
0.125
30
560
4.39
0.471
62
18.76
0.118
31
600
4.66
0.444
63
19.98
0.111
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
SLIS110A − APRIL 2003 − REVISED MAY 2005
PRINCIPLES OF OPERATION
system transfer equation
The output voltage may be derived from:
V
O
+V
t
IN
A
IN
A
A
P
BP
A
INT
INT
t
C
A
O
)V
RESET
where:
VIN = Input voltage peak (amplitude)
VO = Output voltage
AIN = Input amplifier gain setting
AP = Programmable gain setting
ABP = Gain of band-pass filter
AINT = Gain of integrator
tINT = Integration time from 0.5 ms to 10 ms
AO = Output buffer gain
τC = Programmable integrator time constant
VRESET = Reset voltage from which the integration operation starts
If ABP = AINT = 2 and AIN = AO = 1,
then
V
O
+V
IN
A
P
8
P
t
INT ) V
t
RESET
C
programming in normal mode (TEST = 1)
To enable programming in the normal mode, the TEST terminal must be high. Communication is through the
SPI and the CS terminal is used to enable the IC. The information on the SDI line consists of two parts: address
and data.
After power up, the SPI is in default mode (see Table 2).
default SPI mode
The SPI is in the default mode on the power up sequence. In this case, the SDO directly equals the SDI (echo
function). In this mode, five commands can be transmitted by the master controller to configure the IC (see
Table 2).
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLIS110A − APRIL 2003 − REVISED MAY 2005
PRINCIPLES OF OPERATION
Table 2. Default SPI Mode
NO.
1
CODE
010 D[4:0]
COMMAND (t)
Set the prescaler and SDO status
DATA
OSCIN frequency
D[4:1]=0000=> 4 MHz
D[4:1]=0001=> 5 MHz
D[4:1]=0010=> 6 MHz
D[4:1]=0011=> 8 MHz
D[4:1]=0100=> 10 MHz
D[4:1]=0101=> 12 MHz
D[4:1]=0110=> 16 MHz
D[4:1]=0111=> 20 MHz
D[4:1]=1000=> 24 MHz
RESPONSE (t)
SDI
(010 D[4:0] )
D[0]=0 => SDO active
D[1]=1=> SDO high impedance
2
1110 000 D[0]
Select the channel
D[0]=0 => Channel 1 selected
D[1]=1=> Channel 2 selected
SDI
(1110 000 D[0])
3
00 D[5:0]
Set the band-pass center frequency
D[5:0] (see Table 1)
SDI
(00 D[5:0])
4
10 D[5:0]
Set the gain
D[5:0] (see Table 1)
SDI
(10 D[5:0])
5
110 D[4:0]
Set the integration time constant
D[4:0] (see Table 1)
SDI
(100 D[4:0])
6
0111 0001
Set SPI configuration to the advanced mode
None
SDI
(0111 0001)
NOTE: Command #6 is to enter into the advanced mode.
advanced SPI mode
The advanced SPI mode has additional features to the default SPI mode. A control byte is written to the SDI
and shifted with the MSB first. The response byte on the SDO is shifted out with the MSB first. The response
byte corresponds to the previous command. Therefore, the SDI shifts in a control byte n and shifts out a
response command byte n−1. Each control/response pair of commands requires two full 8-bit shift cycles to
complete a transmission. The control bytes with the expected response are shown in Table 3.
In the advanced SPI mode, only a power-down condition may reset the SPI mode to the default state on the
subsequent power-up cycle.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
SLIS110A − APRIL 2003 − REVISED MAY 2005
PRINCIPLES OF OPERATION
Table 3. Advanced SPI Mode
NO.
1
CODE
010 D[4:0]
COMMAND (t)
Set the prescaler and SDO status
DATA
OSCIN frequency
D[4:1]=0000=> 4 MHz
D[4:1]=0001=> 5 MHz
D[4:1]=0010=> 6 MHz
D[4:1]=0011=> 8 MHz
D[4:1]=0100=> 10 MHz
D[4:1]=0101=> 12 MHz
D[4:1]=0110=> 16 MHz
D[4:1]=0111=> 20 MHz
D[4:1]=1000=> 24 MHz
RESPONSE (t)
Byte 1 (D7 to D0) of the digital
integrator output
D[0]=0 => SDO active
D[1]=1=> SDO high impedance
2
1110 000 D[0]
Select the channel
D[0]=0 => Channel 1 selected
D[1]=1=> Channel 2 selected
D9 to D8 of digital integrator
output followed by six zeros
3
00 D[5:0]
Set the band-pass center
frequency
D[5:0] (see Table 1)
Byte 1 (MSB) of the 00000001
4
10 D[5:0]
Set the gain
D[5:0] (see Table 1)
Byte 2 (LSB) 11100000
5
110 D[4:0]
Set the integration time constant
D[4:0] (see Table 1)
SPI configuration
(MSB)01110001(LSB)
6
0111 0001
Set SPI configuration to the
advanced mode
None
Inverted SPI configuration
(MSB)10001110(LSB)
digital data output from the TPIC8101
digital output
D Digital integrator output (10 bits, D[9:0])
D First response byte (MSB): 8 bits for D7 to D0 of the integrator output
D Second response byte (LSB): 2 bits for D9 to D8 of the integrator output followed by six zeros
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLIS110A − APRIL 2003 − REVISED MAY 2005
programming examples
prescaler/SDO status
D 01000101 programs an input frequency of 6 MHz with SDO terminal in high impedance.
channel selection
D 1110001 selects channel 2.
band-pass frequency
D 00100111 programs a band-pass filter with center frequency of 6.37 kHz.
gain control
D 10010100 programs the gain with attenuation of 0.739.
integrator time constant
D 11000011 programs integrator time constant of 55 µs. The binary values are in Table 1 through Table 3.
programming in TEST mode (TEST = 0)
To enter test mode, the TEST terminal must be low. See Table 4 for the signal that may be accessed in this mode.
Table 4. Programming in TEST Mode
NO.
TEST DESCRIPTION
SDI COMMAND
MSB…….LSB
RESPONSE
NOTE
T1
AAF individual test
1111 0000
ADC clock
Deactivates the input and output op amps
AAF input connected to CH1FB terminal
AAF output connected to OUT terminal
T2
In-line test to AAF output
1111 0000
None
Deactivates the output op amp
AAF output connected to OUT terminal
T3
Output buffer individual test
1111 0010
None
Opens the feedback loop of the output buffer and
deactivates the input op amp and AAF
CH1FB connected to positive input terminal of op amp
CH2FB connected to negative input terminal of op amp
T4
ADC/DAC individual test
(with the output buffer)
1111 0011
ADC data
Deactivates the input op amps and AAF
INT/HOLD = ADC_Sync
OSCIN = ADC_SCLK
DAC shifted in from SDI terminal
T5
ADC/DAC individual test
(without the output buffer)
1111 0100
ADC data
Deactivates the input op amps, AAF, and output buffer
INT/HOLD = ADC_Sync
OSCIN = ADC_SCLK
DAC is shifted in from SDI terminal
T6
In-line test to ADC output
1111 0011
ADC data
INT/HOLD = ADC_Sync
OSCIN = ADC_SCLK
DAC shifted in from SDI terminal
T7
Reading of digital clamp flag
1111 1000
Clamp flag D[2:0]
Implies command 6 (advanced SPI mode)
D[0]: Gain stage clamp status
D[1]: BPF stage clamp status
D[2]: INT stage clamp status
D=0 => No clamp activated
D=1 => Clamp activated
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
SLIS110A − APRIL 2003 − REVISED MAY 2005
TYPICAL CHARACTERISTICS
Input Signal
Int/Hold Signal
Output Signal
Figure 3. Amplified Input Signal Process
Input Signal
Int/Hold Signal
Output Signal
Figure 4. Input Signal Processing
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLIS110A − APRIL 2003 − REVISED MAY 2005
application schematic
VDD
OUT
4.7 µF
A/D
R2
CH1FB
3.3 nF
CS
CH1N
SCLK
R1
Knock Sensor 1
TPIC8101
CH1P
SDI
SDO
Microprocessor
TEST
Vref
100 nF
CH2P
INT/HOLD
R2
CH2FB
3.3 nF
470 pF
XIN
CH2N
1 kΩ
XOUT
1 MΩ
R1
Knock Sensor 2
GND
NOTE: R1 is greater than 25 kΩ.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
25
Green (RoHS
& no Sb/Br)
Eco Plan
(2)
TPIC8101DW
ACTIVE
SOIC
DW
20
TPIC8101DWG4
ACTIVE
SOIC
DW
20
TPIC8101DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
TPIC8101DWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
TBD
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-3-260C-168
Level-1-235C-UNLIM
HR/
Contact TI Distributor
or Sales Office
CU NIPDAU Level-3-260C-168
Level-1-235C-UNLIM
HR/
Request Free Samples
CU NIPDAU Level-3-260C-168
Level-1-235C-UNLIM
HR/
Request Free Samples
Call TI
Call TI
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated