ZARLINK NJ8820BAMP

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RECOMMENDED FOR NEW DESIGNS
NJ8820
DS3277-1.2
NJ8820
FREQUENCY SYNTHESISER (PROM INTERFACE)
The NJ8820 is a synthesiser circuit fabricated on the GPS
CMOS process and is capable of achieving high sideband
attenuation and low noise performance. It contains a reference
oscillator, 11-bit programmable reference divider, digital and
sample-and-hold comparators, 10-bit programmable ‘M’ counter,
7-bit programmable ‘A’ counter and the necessary control and
latch circuitry for accepting and latching the input data.
Data is presented as eight 4-bit words read from an external
memory, with the necessary timing signals generated internally.
It is intended to be used in conjunction with a two-modulus
prescaler such as the SP8710 series to produce a universal
binary coded synthesiser.
The NJ8820 is available in Plastic DIL (DP) and Miniature
Plastic DIL (MP) packages, both with operating temperature
range of 230°C to 170°C. The NJ8820MA is available only in
Ceramic DIL package with operating temperature range of
240°C to 185°C.
PDA
1
20
CH
PDB
2
19
RB
LD
3
18
MC
FIN
4
17
DS2
VSS
5
16
DS1
VDD
6
15
DS0
OSC IN
7
14
PE
OSC OUT
8
13
ME
D0
9
12
D3
D1
10
11
D2
FEATURES
■
■
■
■
NJ8820
DP20, MP20,
DG20
Fig.1 Pin connections - top view
Low Power Consumption
Direct Interface to ROM or PROM
ABSOLUTE MAXIMUM RATINGS
High Performance Sample and Hold Phase Detector
20·5V to 7V
Supply voltage, VDD2VSS
Input voltage
7V
Open drain outputs, pins 3 and 13
VSS20·3V to VDD10·3V
All other pins
Storage temperature
265°C to 1150°C
(DG package, NJ8820MA)
255°C to 1125°C
Storage temperature
(DP and MP packages, NJ8820)
>10MHz Input Frequency
ORDERING INFORMATION
NJ8820 BA DP Plastic DIL Package
NJ8820 BA MP Miniature Plastic DIL Package
NJ8820 MA DG Ceramic DIL Package
MEMORY ENABLE
(ME)
DATA SELECT
OUTPUTS
DS0 DS1 DS2
15
13
PROGRAM
ENABLE (PE)
OSC IN
OSC OUT
14
7
PULSE
DETECT
16
RB
17
19
FIN
REFERENCE COUNTER
(11BITS)
42
fr
8
VDD
9
10
11
12
4
SAMPLE/HOLD
PHASE
DETECTOR
1
FREQUENCY/
PHASE
DETECTOR
2
3
LATCH 4 LATCH 5
LATCH 1 LATCH 2 LATCH 3
‘A’ COUNTER
(7 BITS)
‘M’ COUNTER
(10 BITS)
PDA
PDB
LOCK DETECT (LD)
VSS
fv
6
CONTROL LOGIC
VSS
20
TO
INTERNAL
LATCHES
SEQUENCE
COUNTER
LATCH 6 LATCH 7 LATCH 8
 D0
DATA
D1
INPUTS  D2
 D3
CH
5
Fig.2 Block diagram
18
MODULUS
CONTROL
OUTPUT (MC)
NJ8820
ELECTRICAL CHARACTERISTICS AT VDD = 5V
Test conditions unless otherwise stated:
VDD–VSS=5V ±0·5V. Temperature range NJ8820 BA: –30°C to +70°C; NJ8820 MA: –40°C to +85°C
DC Characteristics
Value
Min.
Supply current
OUTPUT LEVELS
Memory Enable Output (ME)
Low level
Open drain pull-up voltage
Data Select Outputs (DS0-DS2)
High level
Low level
Modulus Control Output (MC)
High level
Low level
Lock Detect Output (LD)
Low level
Open drain pull-up voltage
PDB Output
High level
Low level
3-state leakage current
INPUT LEVELS
Data Inputs (D0-D3)
High level
Low level
Program Enable Input (PE)
Trigger level
Units
Conditions
Typ.
Max.
3·5
0·7
5·5
1·5
mA
mA
0·4
7
V
V
ISINK = 4mA
0·4
V
V
ISOURCE = 1mA
ISINK = 2mA
0·4
V
V
ISOURCE = 1mA
ISINK = 1mA
0·4
7
V
V
ISINK = 4mA
0·4
60·1
V
V
µA
ISOURCE = 5mA
ISINK = 5mA
0·75
V
V
TTL compatible
See note 1
V
VBIAS = self-bias point of PE
(nominally VDD/2)
4·6
4·6
4·6
4·25
VBIAS
6100mV
fosc, fFIN = 10MHz
fosc, fFIN = 1·0MHz



Characteristic
0 to 5V
square
wave
AC Characteristics
Value
Characteristic
Min.
FIN and OSC IN input level
Max. operating frequency, fFIN and fosc
Propagation delay, clock to MC
PE pulse length, tW
Data set-up time, tDS
Data hold time, tDH
Digital phase detector propagation delay
Gain programming resistor, RB
Hold capacitor, CH
Output resistance, PDA
Digital phase detector gain
Power supply rise time
Typ.
Units
Max.
200
10·6
30
50
5
1
10
500
5
1
5
0·4
100
Conditions
mVRMS 10MHz AC-coupled sinewave
MHz
Input squarewave VDD to VSS,
See note 5.
See note 2.
ns
Pulse to VSS or VDD.
µs
µs
ns
ns
kΩ
See note 3.
nF
kΩ
V/Rad
10% to 90%, see note 4.
µs
NOTES
1. Data inputs have internal pull-up resistors to enable them to be driven from TTL outputs.
2. All counters have outputs directly synchronous with their respective clock rising edges.
3. The finite output resistance of the internal voltage follower and ‘on’ resistance of the sample switch driving this pin will add a finite time constant
to the loop. An external 1nF hold capacitor will give a maximum time constant of 5µs, typically.
4. To ensure correct operation of power-on programming.
5. Operation at up to 15MHz is possible with a full logic swing but is not guaranteed.
2
NJ8820
PIN DESCRIPTIONS
Pin no.
Name
Description
1
PDA
Analog output from the sample and hold phase comparator for use as a ‘fine’ error signal. Output at
(VDD2VSS)/2 when the system is in lock. Voltage increases as fv phase lead increases; voltage
decreases as fr phase lead increases. Output is linear over only a narrow phase window, determined
by gain (programmed by RB).
2
PDB
Three-state output from the phase/frequency detector for use as a ‘coarse’ error signal.
fv. fr or fv leading: positive pulses with respect to the bias point VBIAS
fv , fr or fr leading: negative pulses with respect to the bias point VBIAS
fv = fr and phase error within PDA window: high impedance.
3
LD
An open-drain lock detect output at low level when phase error is within PDA window (in lock); high
impedance at all other times.
4
FIN
The input to the main counters, normally driven from a prescaler, which may be AC-coupled or, when
a full logic swing is available, may be DC-coupled.
5
VSS
Negative supply (ground).
6
VDD
Positive supply.
OSC IN/ These pins form an on-chip reference oscillator when a series resonant crystal is connected across
OSC OUT them. Capacitors of appropriate value are also required between each end of the crystal and ground
to provide the necessary additional phase shift. An external reference signal may, alternatively, be
applied to OSC IN. This may be a low-level signal, AC-coupled, or if a full logic swing is available it may
be DC-coupled. The program range of the reference counter is 3 to 2047, with the division ratio being
twice the programmed number.
7, 8
9,10, 11, 12
D0-D3
Information on these inputs is transferred to the internal data latches during the appropriate data read
time slot. D3 is MSB, D0 is LSB.
13
ME
An open drain output for use in controlling the power supply to an external ROM or PROM. ME is low
during the data read period and high impedance at other times.
14
PE
A positive or negative pulse or edge AC-coupled into this pin initiates the single-shot data read
procedure. Grounding this pin repeats the data read procedure in a cyclic manner.
15, 16, 17
DS0-DS2
Internally generated three-state data select outputs, which may be used to address external memory.
18
MC
Modulus control output for controlling an external dual-modulus prescaler. MC will be low at the beginning
of a count cycle and will remain low until the ‘A’ counter completes its cycle. MC then goes high and
remains high until the ‘M’ counter completes its cycle, at which point both ‘A’ and ‘M’ counters are reset.
This gives a total division ratio of MP1A, where P and P11 represent the dual-modulus prescaler
values. The program range of the ‘A’ counter is 0-127 and therefore can control prescalers with a
division ratio up to and including 4128/129. The programming range of the ‘M’ counter is 8-1023
and, for correct operation, M>A. Where every possible channel is required, the minimum total division
ratio should be P 22P.
19
RB
An external sample and hold phase comparator gain programming resistor should be connected
between this pin and VSS.
20
CH
An external hold capacitor should be connected between this pin and VSS.
2·0
8
VDD = 5V
FIN = LOW FREQUENCY
0V TO 5V SQUARE WAVE
7
1·5
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
VDD = 5V
OSC IN, FIN = 0V TO 5V SQUARE WAVE
OSC IN
1·0
FIN
0·5
6
5
10MHz
4
1MHz
3
2
TOTAL SUPPLY CURRENT IS
THE SUM OF THAT DUE TO FIN
AND OSC IN
1
2
3
4
5
6
7
INPUT FREQUENCY (MHz)
8
9
Fig. 3 Typical supply current v. input frequency
1
10
0·2
0·4
0·6
0·8
1·0
1·2
INPUT LEVEL (V RMS)
1·4
1·6
Fig. 4 Typical supply current v. input level, OSC IN
3
NJ8820
PROGRAMMING
Program information can be obtained from an external
ROM or PROM under the control of the NJ8820. Twenty-eight
data bits are required per channel arranged as eight 4-bit
words leaving four redundant bits, two of which are available
on the data bus driving the data transfer time slot and may be
used for external control purposes. A suitable PROM would be
the 74S287, giving up to 32 channel capability as shown in Fig.
5. Note that the choice of PNP transistor and supply bypass
capacitor on the ROM should be such that the ROM will power
up in time: for example, at 10MHz oscillator frequency, the
ROM must be powered up in less than 25µs.
Reading this data is normally done in single shot mode, with
the data read cycle started by either a positive or negative
pulse on the program enable (PE) pin. The data read cycle is
generated from a program clock at 1/64 of the reference
oscillator frequency. A memory enable signal (ME) is supplied
to allow power-down of the ROM when it is not in use. Data
select outputs (DS0-DS2) remain in a high impedance state
when the program cycle is completed to allow the address bus
to be used for other functions if desired. The data map, data
read cycle and timing diagram are shown in Figs. 6 to 8. Data
is latched internally during the portions of the program cycle
shown shaded in Fig. 7 and all data is transferred to the
counters and latched during the data transfer time slot.
Alternatively, the PE pin may be grounded, causing the data
read cycle to repeat cyclically to allow continuous up-dating of
the program information. In this mode, external memory will be
enabled continuously (ME low) and the data read cycle will
repeat every sixteen cycles of the internal program clock, i.e.
every 1024/fosc seconds. This programming method is not
recommended because the higher power consumption and
the possibilities of noise into the loop from the digital data lines.
Power-on Programming
On power-up, the data read cycle is automatically initiated,
making it unnecessary to provide a PE pulse. The circuit
detects the power supply rising above a threshold point
(nominally 1·5V) and, after an internally generated delay to
allow the supply to rise fully, the circuit is programmed in the
normal way. This delay is generated by counting reference
oscillator pulses and is therefore dependent on the crystal
used. The delay consists of 53248 reference oscillator cycles,
giving a delay of about 5ms at 10MHz.
To ensure correct operation of this function, the power
supply rise time should be less than 5ms (at 10MHz), rising
smoothly through the threshold point.
15V
A4-A7
(CHANNEL SWITCH)
100k
1·5k
16
1
0·1µ
1
20
2
15
2
19
3
14
3
18
4
13
4
17
12
5
6
11
6
15
7
10
7
14
8
9
8
13
9
12
10
11
5
74S287
10µ
D0
D1
NJ8820
16
C2B
22p
DS2
DS1
DS0
C2A
22p
PE
C1
47p
ME
D3
C1 > C2A 1 C2B 1...
D2
Fig. 5 Programming via PROM
WORD
DS2
DS1
DS0
D3
D2
D1
D0
1
2
3
4
5
6
7
8
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
M1
M5
M9
A3
R3
R7
-
M0
M4
M8
A2
A6
R2
R6
R10
M3
M7
A1
A5
R1
R5
R9
M2
M6
A0
A4
R0
R4
R8
Fig. 6 Data map
4
NJ8820
PROGRAM
CLOCK
PE
ME
DATA
TRANSFER
ON 2VE
CYCLE OF
PROGRAM
CLOCK
DS0
DS1
DS2
DATA
TRANSFER
4 PROGRAM CLOCK
CYCLES FROM SETTLING
WORD WORD WORD WORD WORD WORD WORD WORD
1
2
3
4
5
6
7
8
Fig.7 Data selection
PE
DS0
tW
(PE INTERNAL)
D0 - D3
tDS
tDH
(DATA - INTERNAL
MODE)
Fig.8 Timing diagram
PHASE COMPARATORS
The digital phase/frequency detector drives a three-state
output, PDB, which provides a ‘coarse’ error signal to enable
fast switching between channels. The PDB output is active
until the phase error is within the sample and hold phase
detector, PDA, window, when PDB becomes high impedance.
Phase-lock is indicated at this point by a low level on LD. The
sample and hold phase detector provides a ‘fine’ error signal
to give further phase adjustment and to hold the loop in lock.
An internally generated ramp, controlled by the digital
output from both the reference and main divider chains, is
sampled at the reference frequency to give the ‘fine’ error
signal, PDA. When in phase lock, this output would be typically
at (VDD2VSS)/2 and any offset from this would be proportional
to phase error. The relationship between this offset and the
phase error is the phase comparator gain, which is
programmable with an external resistor, RB. An internal 50pF
capacitor is used in the sample and hold comparator.
CRYSTAL OSCILLATOR
When using the internal oscillator, the stability may be
enhanced at high frequencies by the inclusion of a resistor
between pin 8 (OSC OUT) and the other components. A value
of 2·2kΩ is advised.
PROGRAMMING/POWER UP
Data and signal input pins should not have input applied to
them prior to the application of VDD, as otherwise latch-up may
occur.
5
NJ8820
HEADQUARTERS OPERATIONS
GEC PLESSEY SEMICONDUCTORS
Cheney Manor, Swindon,
Wiltshire SN2 2QW, United Kingdom.
Tel: (0793) 518000
Fax: (0793) 518411
GEC PLESSEY SEMICONDUCTORS
P.O. Box 660017
1500 Green Hills Road,
Scotts Valley, California 95067-0017,
United States of America.
Tel: (408) 438 2900
Fax: (408) 438 5576
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These are supported by Agents and Distributors in major countries world-wide.
 GEC Plessey Semiconductors 1992
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior knowledge the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information
and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
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This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
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