NBXDBA015 - ON Semiconductor

NBXDBA015, NBXDBB015
3.3 V, 200.0 MHz/206.9 MHz
Dual Frequency LVPECL
Clock Oscillator
The NBXDBA015/NBXDBB015 dual frequency crystal oscillator
(XO) is designed to meet today’s requirements for 3.3 V LVPECL
clock generation applications. The device uses a high Q fundamental
crystal and Phase Lock Loop (PLL) multiplier to provide selectable
200.0 MHz or 206.9 MHz, ultra low jitter and phase noise LVPECL
differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000. Frequency stability options available as
either 50 PPM NBXDBA015 or 20 PPM NBXDBB015*.
Features
•
•
•
•
•
•
•
•
LVPECL Differential Output
Uses High Q Fundamental Mode Crystal and PLL Multiplier
Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)
Selectable Output Frequency − 200.0 MHz (default)/206.9 MHz
Hermetically Sealed Ceramic SMD Package
RoHS Compliant
Operating Range 3.3 V ±10%
Total Frequency Stability − ±20 PPM* or ±5O PPM
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6 PIN CLCC
LN SUFFIX
CASE 848AB
MARKING DIAGRAMS
NBXDBA015
200.0/206.9
AAWLYYWWG
NBXDBA015
NBXDBB015
200.0/206.9
AA
WL
YY
WW
G
NBXDBB015
200.0/206.9
AAWLYYWWG
= NBXDBA015 (±50 PPM)
= NBXDBB015 (±20 PPM)*
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
Applications
• High−End Servers
• Basestations
• General Purpose Clock Generation and Margining
VDD
6
ORDERING INFORMATION
Device
Package
Shipping†
NBXDBB015LN1TAG*
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDBA015LN1TAG
CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDBA015LNHTAG
CLCC−6
(Pb−Free)
100/
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
CLK CLK
5 4
* Please contact sales office for availability
PLL
Clock
Multiplier
Crystal
1
OE
2
FSEL
3
GND
Figure 1. Simplified Logic Diagram
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 4
1
Publication Order Number:
NBXDBA015/D
NBXDBA015, NBXDBB015
OE
1
6
VDD
FSEL
2
5
CLK
GND
3
4
CLK
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
Pin No.
Symbol
I/O
Description
1
OE
LVTTL/LVCMOS
Control Input
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
2
FSEL
Control Input
Output Frequency Select Pin. Pin will default LOW when left open. See Output Frequency Select Table 3.
3
GND
Power Supply
Ground 0 V.
4
CLK
LVPECL Output
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
5
CLK
LVPECL Output
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
VTT = VDD − 2 V.
6
VDD
Power Supply
Positive power supply voltage. Voltage should not exceed 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
Table 3. OUTPUT FREQUENCY SELECT
OE Pin
Output Pins
FSEL Pin
Output Frequency (MHz)
Open
Active
Open
(pin will float Low)
200
High Level
206.9
Low Level
200
High Level
Active
Low Level
High Z
Table 4. ATTRIBUTES
Characteristic
Value
Input Default State Resistor
ESD Protection
170 kW
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Units
VDD
Positive Power Supply
GND = 0 V
4.6
V
Iout
LVPECL Output Current
Continuous
Surge
25
50
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−55 to +120
°C
Tsol
Wave Solder
260
°C
See Figure 6
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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NBXDBA015, NBXDBB015
Table 6. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C)
Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
82
100
mA
IDD
Power Supply Current (Note 2)
VIH
OE Input HIGH Voltage
2000
VDD
mV
VIL
OE Input LOW Voltage
GND − 300
800
mV
IIH
Input HIGH Current
OE
FSEL
−100
−100
+100
+100
mA
IIL
Input LOW Current
OE
FSEL
−100
−100
+100
+100
mA
VIH
FSEL Input HIGH Voltage
2000
VDD
mV
VIL
FSEL Input LOW Voltage
VOH
Output HIGH Voltage (Note 2)
VOL
VOUTPP
0
800
mV
VDD−945
2355
mV
VDD = 3.3 V
VDD−1195
2105
VDD−1945
1355
VDD−1600
1700
mV
VDD = 3.3 V
Output LOW Voltage (Note 2)
Output Voltage Amplitude (Note 2)
700
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 5.
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3
NBXDBA015, NBXDBB015
Table 7. AC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 3)
Characteristic
Symbol
fCLKOUT
Df
FNOISE
Conditions
Output Clock Frequency
Frequency Stability − NBXDBB015*
Frequency Stability − NBXDBA015
Phase−Noise Performance
fCLKout = 200 MHz/206.9 MHz
(See Figures 3 and 4)
tjit(F)
RMS Phase Jitter
tjitter
Cycle to Cycle, RMS
tDUTY_CYCLE
Typ.
FSEL = HIGH
206.9
FSEL = LOW
200
0°C to +70°C
−60°C to +85°C
(Note 4)
Max.
Units
MHz
±20*
±50
100 Hz of Carrier
ppm
−102
dBc/Hz
1 kHz of Carrier
−119
dBc/Hz
10 kHz of Carrier
−126
dBc/Hz
100 kHz of Carrier
−127
dBc/Hz
1 MHz of Carrier
−135
dBc/Hz
10 MHz of Carrier
−160
dBc/Hz
12 kHz to 20 MHz
0.4
0.9
ps
1000 Cycles
1.5
8
ps
Cycle to Cycle, Peak−to−Peak
tOE/OD
Min.
1000 Cycles
10
30
ps
Period, RMS
10,000 Cycles
1
4
ps
Period, Peak−to−Peak
10,000 Cycles
7
20
ps
200
ns
50
52
%
ps
Output Enable/Disable Time
Output Clock Duty Cycle
(Measured at Cross Point)
48
tR
Output Rise Time (20% and 80%)
250
400
tF
Output Fall Time (80% and 20%)
250
400
ps
1
5
ms
1st Year
3
ppm
Every Year After 1st
1
ppm
tstart
Start−up Time
Aging
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 5.
4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
* Please contact sales office for availability
Figure 3. Typical Phase Noise Plot @ 200 MHz
Figure 4. Typical Phase Noise Plot @ 206.9 MHz
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NBXDBA015, NBXDBB015
Table 8. RELIABILITY COMPLIANCE
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
Parameter
Standard
Method
Shock
Mechanical
MIL−STD−833, Method 2002, Condition B
Solderability
Mechanical
MIL−STD−833, Method 2003
Vibration
Mechanical
MIL−STD−833, Method 2007, Condition A
Solvent Resistance
Mechanical
MIL−STD−202, Method 215
Thermal Shock
Environment
MIL−STD−833, Method 1011, Condition A
Moisture Level Sensitivity
Environment
MSL1 260°C per IPC/JEDEC J−STD−020D
NBXDBA015/NBXDBB015
Zo = 50 W
CLK
D
Receiver
Device
Driver
Device
CLK
D
Zo = 50 W
50 W
50 W
VTT
VTT = VDD − 2.0 V
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
temp. 260°C
20 − 40 sec. max.
peak
Temperature (°C)
260
6°C/sec. max.
3°C/sec. max.
217
ramp−up
175
150
cooling
pre−heat
reflow
60180 sec.
Time
60150 sec.
Figure 6. Recommended Reflow Soldering Profile
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NBXDBA015, NBXDBB015
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
A
D
4X
0.15 C
E2
TERMINAL 1
INDICATOR
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
B
D1
H E1
DIM
A
A1
A2
A3
b
D
D1
D2
D3
E
E1
E2
E3
e
L
R
E
D2
TOP VIEW
A3
A2
0.10 C
A
SIDE VIEW
A1
C
MIN
1.70
0.08
1.30
6.17
6.66
4.37
4.65
1.17
MILLIMETERS
NOM
MAX
1.80
1.90
0.70 REF
0.36 REF
0.10
0.12
1.40
1.50
7.00 BSC
6.20
6.23
6.81
6.96
5.08 BSC
5.00 BSC
4.40
4.43
4.80
4.95
3.49 BSC
2.54 BSC
1.27
1.37
0.70 REF
SEATING
PLANE
D3
3
2
1
R
SOLDERING FOOTPRINT*
e
E3
6X
1.50
0.10 C A B
0.05 C
6X
b
6
5
4
6X
5.06
L
BOTTOM VIEW
2.54
PITCH
6X
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
NBXDBA015/D