NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 3.3 V, 156.25 MHz / 312.5MHz LVPECL Clock Oscillator The single and dual frequency crystal oscillator (XO) is designed to meet today’s requirements for 3.3 V LVPECL clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide selectable 156.25 MHz or 312.5 MHz, ultra low jitter and phase noise LVPECL differential output. This device is a member of ON Semiconductor’s PureEdget clock family that provides accurate and precision clock solutions. Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1,000. Frequency stability options available as either 50 PPM NBXDBA017, NBXSBA017, NBXHBA017 (Industrial Temperature Range) or 20 PPM NBXDBB017 (Commercial Temperature Range). http://onsemi.com 6 PIN CLCC LN SUFFIX CASE 848AB MARKING DIAGRAMS NBXDBA017 156.25/312.50 AAWLYYWWG NBXDBB017 156.25/312.50 AAWLYYWWG NBXSBA017 312.5 AAWLYYWWG NBXHBA017 156.25 AAWLYYWWG Features • • • • • • • • • LVPECL Differential Output Uses High Q Fundamental Mode Crystal and PLL Multiplier Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz) Selectable Output Frequency − 156.25 MHz (default) / 312.5 MHz Hermetically Sealed Ceramic SMD Package RoHS Compliant Operating Range 3.3 V ±10% Total Frequency Stability − ±20 PPM or ±50 PPM This is a Pb−Free Device Applications 156.25/312.5 AA WL YY WW G = Output Frequency (MHz) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION • Networking • 10 Gigabit Ethernet See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. VDD 6 CLK CLK 5 4 PLL Clock Multiplier Crystal 1 OE 2 FSEL/NC* 3 GND Figure 1. Simplified Logic Diagram * NBXSBA017 and NBXHBA017 only © Semiconductor Components Industries, LLC, 2009 October, 2009 − Rev. 3 1 Publication Order Number: NBXDBB017/D NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 OE 1 6 VDD OE 1 6 VDD FSEL 2 5 CLK NC 2 5 CLK GND 3 4 CLK GND 3 4 CLK NBXDBA017/NBXDBB017 NBXSBA017/NBXHBA017 Figure 2. Pin Connections (Top View) Table 1. PIN DESCRIPTION ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Pin No. Symbol I/O 1 OE LVTTL/LVCMOS Control Input Output Enable Pin. When left floating pin defaults to logic HIGH and output is active. See OE pin description Table 2. Description 2 FSEL/ NC* LVTTL/LVCMOS Control Input Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output Frequency Select pin description Table 3. 3 GND Power Supply 4 CLK LVPECL Output Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to VTT = VDD − 2 V. 5 CLK LVPECL Output Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to VTT = VDD − 2 V. 6 VDD Power Supply Ground 0 V Positive power supply voltage. Voltage should not exceed 3.3 V ±10%. *NBXSBA017 and NBXHBA017 only. Table 2. OUTPUT ENABLE TRI−STATE FUNCTION Table 3. OUTPUT FREQUENCY SELECT OE Pin Output Pins FSEL Pin Output Frequency (MHz) Open Active Open (pin will float high) 156.25 HIGH Level 156.25 LOW Level 312.5 HIGH Level Active LOW Level High Z Table 4. ATTRIBUTES Characteristic Value Input Default State Resistor ESD Protection 170 kW Human Body Model Machine Model 2 kV 200 V Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test 1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D. Table 5. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units VDD Positive Power Supply GND = 0 V 4.6 V Iout LVPECL Output Current Continuous Surge 25 50 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −55 to +120 °C Tsol Wave Solder 260 °C See Figure 6 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com 2 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 Table 6. DC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 2) Symbol Characteristic Conditions Min. Typ. Max. Units 78 100 mA IDD Power Supply Current (Note 2) VIH OE and FSEL Input HIGH Voltage 2000 VDD mV VIL OE and FSEL Input LOW Voltage GND − 300 800 mV IIH Input HIGH Current OE FSEL −100 −100 +100 +100 mA IIL Input LOW Current OE FSEL −100 −100 +100 +100 mA VDD−1195 2105 VDD−945 2355 mV VDD = 3.3 V VDD−1945 1355 VDD−1600 1700 mV VDD = 3.3 V VOH VOL VOUTPP Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Output Voltage Amplitude (Note 2) 660 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 5. http://onsemi.com 3 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 Table 7. AC CHARACTERISTICS (VDD = 3.3 V ± 10%, GND = 0 V, TA = −40°C to +85°C) (Note 3) Characteristic Symbol fCLKOUT Df FNOISE Output Clock Frequency Frequency Stability − NBXDBB017 − NBXDBA017/NBXSBA017/NBXHBA017 Phase−Noise Performance fCLKout = 156.25 MHz/312.5 MHz (See Figures 3 and 4) tjit(F) RMS Phase Jitter tjitter Cycle−to−Cycle, RMS Cycle−to−Cycle, Peak−to−Peak tOE/OD tDUTY_CYCLE Conditions Min. Typ. FSEL = HIGH 156.25 FSEL = LOW 312.5 0°C to +70°C −40°C to +85°C (Note 4) Max. Units MHz ±20 ±50 ppm 100 Hz of Carrier −108/−102 dBc/Hz 1 kHz of Carrier −122/−115 dBc/Hz 10 kHz of Carrier −129/−122 dBc/Hz 100 kHz of Carrier −129/−122 dBc/Hz 1 MHz of Carrier −137/−131 dBc/Hz 10 MHz of Carrier −161/−159 dBc/Hz 12 kHz to 20 MHz 0.4 0.9 ps 1000 Cycles 1 8 ps 1000 Cycles 7 30 ps Period, RMS 10,000 Cycles 0.6 4 ps Period, Peak−to−Peak 10,000 Cycles 5 20 ps 200 ns 50 52 % Output Enable/Disable Time Output Clock Duty Cycle (Measured at Cross Point) 48 tR Output Rise Time (20% and 80%) 250 400 ps tF Output Fall Time (80% and 20%) 250 400 ps 1 5 ms 3 ppm 1 ppm tstart Start−up Time 1st Aging Year Every Year After 1st NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 3. Measurement taken with outputs terminated with 50 ohm to VDD−2 V. See Figure 5. 4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging. http://onsemi.com 4 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 Figure 3. Typical Phase Noise Plot at 156.25 MHz Figure 4. Typical Phase Noise Plot at 312.5 MHz http://onsemi.com 5 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 Table 8. RELIABILITY COMPLIANCE ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Parameter Standard Method Shock Mechanical MIL−STD−833, Method 2002, Condition B Solderability Mechanical MIL−STD−833, Method 2003 Vibration Mechanical MIL−STD−833, Method 2007, Condition A Solvent Resistance Mechanical MIL−STD−202, Method 215 Thermal Shock Environment MIL−STD−833, Method 1011, Condition A Moisture Level Sensitivity Environment MSL1 260°C per IPC/JEDEC J−STD−020D NBXxxxxxx Zo = 50 W CLK D Receiver Device Driver Device CLK D Zo = 50 W 50 W 50 W VTT VTT = VDD − 2.0 V Figure 5. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) temp. 260°C 20 − 40 sec. max. peak Temperature (°C) 260 6°C/sec. max. 3°C/sec. max. 217 ramp−up 175 150 cooling pre−heat reflow 60180 sec. Time 60150 sec. Figure 6. Recommended Reflow Soldering Profile http://onsemi.com 6 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 ORDERING INFORMATION Package Type Shipping† NBXDBB017LN1TAG CLCC−6 (Pb−Free) 1000 / Tape & Reel NBXDBA017LN1TAG CLCC−6 (Pb−Free) 1000 / Tape & Reel NBXSBA017LN1TAG CLCC−6 (Pb−Free) 1000 / Tape & Reel NBXHBA017LN1TAG* CLCC−6 (Pb−Free) 1000 / Tape & Reel NBXDBB017LNHTAG CLCC−6 (Pb−Free) 100 / Tape & Reel NBXDBA017LNHTAG CLCC−6 (Pb−Free) 100 / Tape & Reel NBXSBA017LNHTAG CLCC−6 (Pb−Free) 100 / Tape & Reel NBXHBA017LNHTAG* CLCC−6 (Pb−Free) 100 / Tape & Reel Device Order Number †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *Please contact sales office for availability http://onsemi.com 7 NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017 PACKAGE DIMENSIONS 6 PIN CLCC, 7x5, 2.54P CASE 848AB−01 ISSUE C A D 4X D1 0.15 C E2 TERMINAL 1 INDICATOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. B H E1 DIM A A1 A2 A3 b D D1 D2 D3 E E1 E2 E3 e H L R E D2 TOP VIEW A2 A3 0.10 C A SIDE VIEW A1 C SEATING PLANE 3 2 0.08 1.30 6.17 6.66 4.37 4.65 1.17 MILLIMETERS NOM MAX 1.80 1.90 0.70 REF 0.36 REF 0.10 0.12 1.40 1.50 7.00 BSC 6.20 6.23 6.81 6.96 5.08 BSC 5.00 BSC 4.40 4.43 4.80 4.95 3.49 BSC 2.54 BSC 1.80 REF 1.27 1.37 0.70 REF SOLDERING FOOTPRINT* D3 1 MIN 1.70 e 6X R E3 0.10 C A B 0.05 C 1.50 6X b 6 5 4 6X L 2.54 PITCH BOTTOM VIEW 5.06 6X 1.50 DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PureEdge is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 8 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NBXDBB017/D