TC962 High Current Charge Pump DC-to-DC Converter Features: General Description: • • • • • • • • The TC962 is an advanced version of the industry standard TC7662 high voltage DC-to-DC converter. Using improved design techniques and CMOS construction, the TC962 can source as much as 80 mA versus the 7662’s 20 mA capability. Pin Compatible With TC7662/ICL7662/SI7661 High Output Current 80 mA No External Diodes Required Wide Operating Range 3V to 18V Low Output Impedance 28 Typ. No Low Voltage Terminal Required Application Zener On-Chip OSC Frequency Doubling Pin Option for Smaller Output Capacitors Applications: • • • • Laptop Computers Disk Drives Process Instrumentation P-Based Controllers Device Selection Table Operating Temp. Range Part Number Package TC962COE 16-Pin SOIC Wide 0°C to +70°C TC962CPA 8-Pin Plastic DIP 0°C to +70°C TC962EPA 8-Pin Plastic DIP -40°C to +85°C TC962IJA 8-Pin CERDIP -25°C to +85°C TC962MJA 8-Pin CERDIP -55°C to +125°C As an inverter, the TC962 can put out voltages as high as 18V and as low as 3V without the need for external diodes. The output impedance of the device is a low 28 (with the proper capacitors), voltage conversion efficiency is 99.9%, and power conversion efficiency is 97%. The low voltage terminal (pin 6) required in some TC7662 applications has been eliminated. Grounding this terminal will double the oscillator frequency from 12 kHz to 24 kHz. This will allow the use of smaller capacitors for the same output current and ripple, in most applications. Only two external capacitors are required for inverter applications. In the event an external clock is needed to drive the TC962 (such as paralleling), driving this pin directly will cause the internal oscillator to sync to the external clock. Pin 1, which is used as a test pin on the 7662, is a voltage reference Zener on the TC962. This Zener (6.4V at 5 mA) has a dynamic impedance of 12 and is intended for use where the TC962 is supplying current to external regulator circuitry and a reference is needed for the regulator circuit. (See Section 3.0 “Applications Information” Applications Information). The TC962 is compatible with the LTC1044, SI7661 and ICL7662. It should be used in designs that require greater power and/or less input to output voltage drop. It offers superior performance over the ICL7660S. Package Type 16-Pin SOIC Wide Zener Cathode 1 8-Pin DIP 8-Pin CERDIP Zener Cathode 1 • C+ 2 TC962CPA TC962EPA GND 3 TC962IJA C– 4 TC962MJA 2001-2012 Microchip Technology Inc. 8 VDD 7 COSC 6 FREQ x 2 5 VOUT 16 VDD NC 2 C+ 3 15 NC NC 4 13 NC GND 5 14 COSC TC962COE 12 FREQ x 2 NC 6 11 NC C– 7 10 VOUT NC 8 9 NC DS21484D-page 1 TC962 Functional Block Diagram 8 FREQ x 2 – OSC/C Timing 6 I VDD I TC962 7 Level Shift Q + – P SW1 2 F/F C Q Level Shift Comparator with Hysteresis N SW4 CAP + + CP External 3 Zener Cathode GND 1 6.4V VREF + Level Shift 4 Level Shift CR EXT OUT N SW2 CAP – RL N SW3 5 VOUT DS21484D-page 2 2001-2012 Microchip Technology Inc. TC962 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage (VDD to GND) ..............................+18V Input Voltage Any Pin ......................... (VDD +0.3) to (VSS -0.3) (Note 1) Current Into Any Pin........................................... 10 mA ESD Protection ................................................ ±2000V Output Short Circuit ........... Continuous (at 5.5V Input) Package Power Dissipation (TA 70°C) SOIC ....................................................... 760 mW PDIP........................................................ 730 mW CERDIP .................................................. 800 mW Package Thermal Resistance CERDIP, RJ-A ......................................... 90°C/W PDIP, RJ-A ............................................ 140°C/W Operating Temperature Range CPA, COE ....................................... 0°C to +70°C IJA ................................................ -25°C to +85°C EPA .............................................. -40°C to +85°C MJA ............................................ -55°C to +125°C Storage Temperature Range ............. -65°C to +150°C TC962 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD = 15V, TA = 25°C (See Figure ) unless otherwise noted. Symbol Parameter Min Typ Max Units Test Conditions VDD Supply Voltage 3 — 18 V IS Supply Current VDD = 15V — — — — — — — — 510 560 650 190 210 210 — 700 — — — — — A RL = TA = +25°C 0 TA 70°C -55°C TA 125°C TA = +25°C 0 TA 70°C -55°C TA 125°C IL = 20 mA, VDD = 15V IL = 80 mA, VDD = 15V IL = 3 mA, VDD = 5V VDD = 5V RO Output Source Resistance — — — 32 35 — 37 40 50 FOSC Oscillator Frequency — — 12 24 — — kHz PEFF Power Efficiency 93 — 97 — — — % RL = 2 k VDEF Voltage Efficiency 99 — 96 99.9 — — — — — % RL = Over temperature range VZ Zener Voltage 6.0 6.2 6.4 V IZ = 5 mA ZZT Zener Impedance — 12 — IL = 2.5 mA to 7.5 mA Note 1: Pin 6 Open Pin 6 GND Connecting any input terminal to voltages greater than V+ or less than GND may cause destructive latch-up. It is recommended that no inputs from sources operating from external supplies be applied prior to “power-up” of the TC962. 2001-2012 Microchip Technology Inc. DS21484D-page 3 TC962 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin DIP) (8-Pin CERDIP) Symbol 1 Zener Cathode 2 C+ 3 GND 4 C- 5 VOUT 6 FREQ x 2 7 COSC 8 VDD Pin No. (16-Pin SOIC) Symbol 1 Zener Cathode 2 NC 3 C+ Positive side of external CP capacitor (pump cap). 4 NC No connect. 5 GND 6 NC 7 C- Negative side of external CP capacitor (pump cap). 8 NC No connect. 9 NC No connect. 10 VOUT 11 NC 12 FREQ x 2 13 NC Description Cathode of internal Zener diode. Positive side of external CP capacitor (pump cap). Ground terminal. Negative side of external CP capacitor (pump cap). Output voltage. If grounded, frequency doubles. Capacitor to GND will decrease frequency. Input voltage. Description Cathode of internal Zener diode. No connect. Ground terminal. No connect. Output voltage. No connect. If grounded, frequency doubles. No connect. Capacitor to GND will decrease frequency. 14 COSC 15 NC No connect. 16 VDD Input voltage. DS21484D-page 4 2001-2012 Microchip Technology Inc. TC962 3.0 APPLICATIONS INFORMATION 3.1 Theory of Operation current source and double the frequency. This will double the charge current going into the internal capacitor, as well as any capacitor added to pin 7. A Zener diode has been added to the TC962 for use as a reference in building external regulators. This Zener runs from pin 1 to ground. The TC962 is a capacitive pump (sometimes called a switched capacitor circuit), where four MOSFET switches control the charge and discharge of a capacitor. 3.2 The functional block diagram shows how the switching action works. SW1 and SW2 are turned on simultaneously, charging CP to the supply voltage, VIN. This assumes that the on resistance of the MOSFETs in series with the capacitor results in a charging time (3 time constants) that is less than the on time provided by the oscillator frequency as shown: Latch-Up All CMOS structures contain a parasitic SCR. Care must be taken to prevent any input from going above or below the supply rail, or latch-up will occur. The result of latch-up is an effective short between VDD and VSS. Unless the power supply input has a current limit, this latch-up phenomena will result in damage to the device. (See AN763, Latch-up Protection for MOSFET Drivers.) 3 (RDS(ON) CP) < CP/(0.5 fOSC) In the next cycle, SW1 and SW2 are turned off and after a very short interval of all switches being off (this prevents large currents from occurring due to cross conduction), SW3 and SW4 are turned on. The charge in CP is then transferred to CR, but with the polarity inverted. In this way, a negative voltage is now derived. 690 IS NC An oscillator supplies pulses to a flip-flop that is then fed to a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency. CP + 10 μF 1 8 2 7 TC962 3 4 COSC FIGURE 3-1: CP2 7 + 10 μF 3 TC962 6 4 5 + CP1 + 10 μF + Split V+ In Half V+ 8 VOUT (–5V) Test Circuit Combined Negative Converter and Positive Multiplier 1 RL 5 CR The oscillator has two pins that control the frequency of oscillation. Pin 7 can have a capacitor added that is returned to ground. This will lower the frequency of the oscillator by adding capacitance to the timing capacitor internal to the TC962. Grounding pin 6 will turn on a 2 IL V+ (+5V) V+ VD1 VD2 VOUT = –V + C R1 + VOUT = 2V + –2V 1 8 2 + 10 μF CP 3 7 D TC962 4 10 μF 6 5 10 μF CR Lowering Output Resistance by Paralleling Devices + 10 μF V+ VOUT = 2 Positive Voltage Multiplier V+ V+ CP1 + 10 μF 1 8 1 8 1 8 2 7 2 7 2 7 3 TC962 6 3 TC962 6 4 5 4 5 3 TC962 6 4 5 CP2 + 10 μF VOUT CR + FIGURE 3-2: VD1 VD2 CP + 10 μF CP VOUT = 2V +–2V + D 10 μF 10 μF Typical Applications 2001-2012 Microchip Technology Inc. DS21484D-page 5 TC962 4.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Circuit of Figure , CP = CR = 10 F, CPESR CRESR 1. Frequency vs. Temperature Oscillator Frequency vs. C OSC Supply Current vs. Temperature 20 700 FREQUENCY (Hz) 500 V + = 15V 400 300 200 V + = 15V COSC = FREQ x 2 = OPEN 18 FREQUENCY (kHz) 1k 100 10 0 -60 -40 -20 12 10 6 10 1 0 20 40 60 80 100 120 140 100 1000 10,000 Output Resistance vs. Temperature Current vs. Zener Voltage Power Conversion Efficiency vs. I LOAD CURRENT (mA) 60 V+ = 5V IL = 3 mA 40 POWER CONVERSION EFFICIENCY (%) 50 70 TA = +25°C 40 30 20 V+ = 15V IL = 20 mA 10 20 10 -60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C) 0 4.5 0 20 40 60 80 100 120 140 TEMPERATURE (°C) 80 30 -60 -40 -20 CAPACITANCE (pF) TEMPERATURE (°C) OUTPUT RESISTANCE ( Ω) 14 8 100 50 16 TA = +25°C 100 150 135 90 80 EFFICIENCY 120 105 70 SUPPLY CURRENT 60 90 75 50 40 60 30 45 20 30 10 15 0 0 4.0 5.5 6.0 ZENER VOLTAGE (V) 6.5 7.0 SUPPLY CURRENT (mA) SUPPLY CURRENT (μA) TA = +25°C 10k 600 8 16 24 32 40 48 56 64 72 80 LOAD CURRENT (mA) Output Resistance vs. Input Voltage 110 TA = +25°C OUTPUT RESISTANCE (Ω) 100 90 80 70 3 μA 60 50 20 μA 40 30 20 10 0 2 4 6 8 10 12 14 16 18 INPUT VOLTAGE (V) DS21484D-page 6 20 2001-2012 Microchip Technology Inc. TC962 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 16-Pin SOIC (Wide) Devices User Direction of Feed Pin 1 W P Standard Reel Component Orientation for 713 Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 16 mm 12 mm 1000 13 in 16-Pin SOIC (W) 5.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin CDIP (Narrow) .110 (2.79) .090 (2.29) Pin 1 .300 (7.62) .230 (5.84) .020 (0.51) Min. .055 (1.40) Max. .320 (8.13) .290 (7.37) .400 (10.16) .370 (9.40) .200 (5.08) .160 (4.06) .040 (1.02) .020 (0.51) .150 (3.81) Min. .200 (5.08) .125 (3.18) .015 (0.38) .008 (0.20) 3° Min. .400 (10.16) .320 (8.13) .065 (1.65) .020 (0.51) .045 (1.14) .016 (0.41) Dimensions: inches (mm) 2001-2012 Microchip Technology Inc. DS21484D-page 7 TC962 Package Dimensions (Continued) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP Pin 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .015 (0.38) .008 (0.20) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) 3° Min. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 16-Pin SOIC (Wide) Pin 1 .299 (7.59) .419 (10.65) .291 (7.40) .398 (10.10) .413 (10.49) .398 (10.10) .104 (2.64) .097 (2.46) .050 (1.27) Typ. .019 (0.48) .014 (0.36) .012 (0.30) .004 (0.10) 8° Max. .013 (0.33) .009 (0.23) .050 (1.27) .016 (0.40) Dimensions: inches (mm) DS21484D-page 8 2001-2012 Microchip Technology Inc. TC962 6.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. 2001-2012 Microchip Technology Inc. DS21484D-page 9 TC962 NOTES: DS21484D-page 10 2001-2012 Microchip Technology Inc. TC962 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2001-2012 Microchip Technology Inc. DS21484D-page 11 TC962 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: TC962 Literature Number: DS21484D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21484D-page 12 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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