Obsolete Device TC3682/TC3683/TC3684 Inverting Charge Pump Voltage Doublers with Active Low Shutdown Features General Description • • • • • • • The TC3682/TC3683/TC3684 are CMOS charge pump converters that provide an inverted doubled output from a single positive supply. An on-board oscillator provides the clock and only three external capacitors are required for full circuit implementation. Switching frequencies are 12kHz for the TC3682, 35kHz for the TC3683, and 125kHz for the TC3684. When the SHDN pin is held at a logic low, the device goes into a very low power mode of operation consuming less than 1μA (typ) of supply current. Small 8-Pin MSOP Package Operates from 1.8V to 5.5V 120 Ohms (typ) Output Resistance 99% Voltage Conversion Efficiency Only 3 External Capacitors Required Power-Saving Shutdown Mode Low Active Supply Current - 95μA (typ) for TC3682 - 225μA (typ) for TC3683 - 700μA (typ) for TC3684 • Fully Compatible with 1.8V Logic Systems Applications • • • • • LCD Panel Bias Cellular Phones PA Bias Pagers PDAs, Portable Data Loggers Battery-Powered Devices The minimum external part count, small physical size and shutdown mode feature make this family of products useful for a wide variety of negative bias power supply applications. Device Selection Table Osc. Freq. (kHz) Operating Temp. Range TC3682EUA 8-Pin MSOP 12 -40°C to +85°C TC3683EUA 8-Pin MSOP 35 -40°C to +85°C TC3684EUA 8-Pin MSOP 125 -40°C to +85°C Part Number Package Package Type 1 C2+ 2 C2– 3 VOUT 4 Functional Block Diagram + C1 C1+ TC3682 TC3683 TC3684 © 2005 Microchip Technology Inc. VIN C1– C2+ + C2 C2– SHDN TC3682 TC3683 TC3684 Input ON OFF VOUT = -(2 x VIN) GND 8-Pin MSOP C1– Low output source impedance (typically 120Ω), provides output current up to 10mA. The TC3682/TC3683/ TC3684 feature a 1.8V to 5.5V operating voltage range and high efficiency, which make them an ideal choice for a wide variety of applications requiring a negative doubled voltage derived from a single positive supply (for example: generation of -7.2V from a +3.6V lithium cell or -10V generated from a +5V logic supply). VOUT 8 SHDN 7 C1+ 6 VIN 5 GND – C OUT + C1 must have a voltage rating ≥ VIN C2 and COUT must have a voltage rating ≥ 2VIN DS21556C-page 1 TC3682/TC3683/TC3684 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage (VIN to GND)....................... +6.0V, -0.3V Output Voltage (VOUT to GND)............... -12.0V, +0.3V Current at VOUT Pin.............................................20mA Short-Circuit Duration VOUT to GND ..............Indefinite Power Dissipation (TA ≤ 70°C) 8-Pin MSOP .............................................320mW Operating Temperature Range.............-40°C to +85°C Storage Temperature (Unbiased) .......-65°C to +150°C TC3682/TC3683/TC3684 ELECTRICAL SPECIFICATIONS Electrical Characteristics: TA = -40°C to +85°C, VIN = +5V, C1 = C2 = 3.3μF (TC3682), C1 = C2 = 1μF (TC3683), C1 = C2 = 0.33μF (TC3684), SHDN = GND, Typical values are at TA = +25°C Symbol Parameter IDD Supply Current Min Typ Max Units — — — 95 225 700 160 480 1500 μA Device TC3682 TC3683 TC3684 Test Conditions SHDN = VIN SHDN = VIN SHDN = VIN ISHDN Shutdown Supply Current — 0.5 2 μA All SHDN = GND, VIN = +5V VMIN Minimum Supply Voltage 1.8 — — V All RLOAD = 1kΩ VMAX Maximum Supply Voltage — — 5.5 V All RLOAD = 1kΩ FOSC Oscillator Frequency 8.4 24.5 65 12 35 125 15.6 45.5 170 kHz VIH SHDN Input Logic High 1.4 — — V All VIN = VMIN to VMAX VIL SHDN Input Logic Low — — 0.4 V All VIN = VMIN to VMAX VEFF Voltage Conversion Efficiency 95 99 — % All RLOAD = ∞ ROUT Output Resistance — 120 170 Ω All ILOAD = 0.5mA to 10mA (Note 1) TWK Wake-up Time From Shutdown Mode — — — 1800 600 200 — — — μsec TC3682 TC3683 TC3684 RLOAD = 2kΩ Note 1: TC3682 TC3683 TC3684 Capacitor contribution is approximately 20% of the output impedance (ESR = 1/ pump frequency x capacitance). DS21556C-page 2 © 2005 Microchip Technology Inc. TC3682/TC3683/TC3684 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (8-Pin MSOP) Symbol 1 C1– C1 commutation capacitor negative terminal. 2 C2+ C2 commutation capacitor positive terminal. 3 C2– C2 commutation capacitor negative terminal. 4 VOUT Doubling inverting charge pump output (-2 x VIN). 5 GND Ground. Description 6 VIN Positive power supply input. 7 C1+ C1 commutation capacitor positive terminal. 8 SHDN © 2005 Microchip Technology Inc. Shutdown input (active low). DS21556C-page 3 TC3682/TC3683/TC3684 3.0 DETAILED DESCRIPTION The TC3682/TC3683/TC3684 inverting charge pumps perform a -2x multiplication of the voltage applied to the VIN pin. Conversion is performed using two synchronous switching matrices and three external capacitors. When the shutdown input is held at a logic low, the device goes into a very low power mode of operation consuming less than 1μA of supply current. Figure 3-1 is a block diagram representation of the TC3682/TC3683/TC3684 architecture. The first switching stage inverts the voltage present at VIN and the second stage uses the ‘-VIN’ output generated from the first stage to produce the ‘-2X’ output function from the second stage switching matrix. FIGURE 3-1: Each device contains an on-board oscillator that synchronously controls the operation of the charge pump switching matrices. The TC3682 synchronously switches at 12kHz, the TC3683 synchronously switches at 35kHz, and the TC3684 synchronously switches at 125kHz. The different oscillator frequencies for this device family allow the user to trade-off capacitor size versus supply current. Faster oscillators can use smaller external capacitors, but will consume more supply current (see Section 1.0 Electrical Characteristics). When the shutdown input is in a low state, the oscillator and both switch matrices are powered off placing the TC3682/TC3683/TC3684 in the shutdown mode. When the VIN supply input is powered from an external battery, the shutdown mode minimizes power consumption, which in turn will extend the life of the battery. TC3682/TC3683/TC3684 ARCHITECTURE VIN + -VIN C1 Switch Matrix (1st Stage) COUT1 + ENABLE Oscillator ENABLE + -2VIN C2 Switch Matrix (2nd Stage) COUT2 + ENABLE SHDN DS21556C-page 4 © 2005 Microchip Technology Inc. TC3682/TC3683/TC3684 4.0 APPLICATIONS INFORMATION 4.3 4.1 Output Voltage Considerations The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. It is recommended that a large value capacitor (at least equal to C1) be connected from VIN to GND for optimal circuit performance. The TC3682/TC3683/TC3684 perform inverting voltage conversions but do not provide any type of regulation. The output voltage will droop in a linear manner with respect to the output load current. The value of the equivalent output resistance of the ‘-VIN’ output is approximately 50Ω nominal at +25°C and VIN = +5V. The value of the ‘-2VIN’ output is approximately 140Ω nominal at +25°C and VIN = +5V. In this particular case, ‘-VIN’ is approximately -5V and ‘-2VIN’ is approximately -10V at very light loads and each stage will droop according to the equation below: VDROOP = IOUT x ROUT 4.2 4.4 In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 and C2 will lower the output resistance and larger values of COUT will reduce output ripple. For proper charge pump operation, C1 must have a voltage rating greater than or equal to VIN, while C2 and COUT must have a voltage rating greater than or equal to 2VIN. Table 4-1 shows various values of C1/C2 and the corresponding output resistance values for VIN = 5V @ +25°C. The TC3682/TC3683/TC3684 is enabled when SHDN is high, and disabled when SHDN is low. This input cannot be allowed to float. (If SHDN is not required, see the TC2682/TC2683/TC2684 data sheet.) The SHDN input should be limited to 0.3V above VIN. Note: FIGURE 4-1: VIN CIN INVERTING VOLTAGE DOUBLER TEST CIRCUIT + + 7 C1+ 1 C1– 6 VIN TC3682 TC3683 2 C2+ TC3684 + TC3683 ROUT(Ω) TC3684 ROUT(Ω) 0.33 633 184 120 1 262 120 102 3.3 120 95 84 OUTPUT VOLTAGE RIPPLE VS. COUT (ESR = 0.1Ω) IOUT = 1mA COUT (μF) TC3682 VRIPPLE (mV) TC3683 VRIPPLE (mV) TC3684 VRIPPLE (mV) 0.33 192 60 27 1 63 21 16 3.3 17 8 7 8 SHDN C1 C2 TC3682 ROUT(Ω) © 2005 Microchip Technology Inc. A power supply bypass capacitor is recommended. The output is equal to -2VIN plus any voltage drops due to loading. Refer to Table 4-1 and Table 4-2 for capacitor selection guidelines. OUTPUT RESISTANCE VS. C1/C2 (ESR = 0.1Ω) C1, C2 (μF) TABLE 4-2: Inverting Voltage Doubler The most common application for the TC3682/TC3683/ TC3684 devices is the inverting voltage doubler (Figure 4-1). This application uses three external capacitors: C1, C2 and COUT. Table 4-2 shows the output voltage ripple for various values of COUT (again assuming VIN = 5V @ +25°C). The VRIPPLE values assume a 1mA output load current and a 0.1Ω ESRCOUT. TABLE 4-1: Shutdown Input 4.5 Capacitor Selection Note: Input Supply Bypassing -2VIN 3 Device TC3682 TC3683 TC3684 4.6 C2– CIN 3.3μF 1μF 0.33μF 4 VOUT COUT C1 3.3μF 1μF 0.33μF RL + GND 5 C2 3.3μF 1μF 0.33μF COUT 3.3μF 1μF 0.33μF Layout Considerations As with any switching power supply circuit, good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. DS21556C-page 5 TC3682/TC3683/TC3684 5.0 PACKAGING INFORMATION 5.1 Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP 5.3 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Package Dimensions 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) .008 (0.20) .005 (0.13) 6° MAX. .028 (0.70) .016 (0.40) Dimensions: inches (mm) DS21556C-page 6 © 2005 Microchip Technology Inc. TC3682/TC3683/TC3684 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. © 2005 Microchip Technology Inc. DS21556C-page7 TC3682/TC3683/TC3684 NOTES: DS21556C-page8 © 2005 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2005 Microchip Technology Inc. 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