SANYO LC822152

Ordering number : ENN*8075
LC822152
CMOS IC
CCD-LCD Interface ASIC
Overview
LC822152 is a chip which compresses and expands the image inputted from the CCD/CMOS by JPEG format,
interfacing the LCD controller equipped with built-in CCD/CMOS sensor module and display memory for DSCPHONEs. Since the I2C master device circuit is embedded in the chip and the signal required for the CCD/CMOS
module is supplied from this chip, regarding the CPU, it is not necessary to concern the interface with the CCD/CMOS
module. In addition, the zooming function using the H/V scaling circuit allows an effective LCD display. The functions
comprises the following blocks :
• Image-processing unit where the 8-bit video image data in YUV422 (211) format from CCD/CMOS is scaling
processed, performed scaling down and cropping (to cut the four sides) to any size, converted to the RGB565 format
and then sent to the LCD controller.
• JPEG processing unit where the YUV422 (211) image data (VGA size) input from CCD/CMOS or the image data
which has been processed by scaling or cropping is compressed to the JPEG format, and the sign data is output.
Or JPEG processing unit where the sign data input from the host is processed with JPEG decryption and sent to the
image processing unit.
• Thumbnail image processing unit where the image data output to the LCD controller is thinned out and reduced to a
maximum 40×40 sized image.
• Host control unit where CPU interface, register control, LCD bus switching, JPEG code data transfer, and thumbnail
image data transfer are performed.
• I2C interface unit for the CCD/CMOS module access.
• LCD controller interface processing unit allows the RGB666 output (260,000 colors) supporting the 18-bit parallel and
various split transfer.
Features
• CCD/CMOS Interface
• CPU Interface
• LCD Interface
YUV422 (8-bit) format. Maximum VGA size : 640×480.
MCKI : System clock supplied to the CCD/CMOS module.
PCLK : Dot clock output from the CCD/CMOS module.
80-system 16-bit bus (D15-D0, WR, RD, A2-0, CS)
Accessible to the JPEG controller, control register including I2C master, JPEG code buffer,
thumbnail image buffer, OSD display buffer, and LCD command buffer.
Connects the chip to the LCD controller system bus with the 80-system 16-bit bus interface.
It is accessible by switching automatically the two masters, host CPU or LSI imageprocessing unit. Output image from LSI is RGB565 (16-bit) or RGB666
(18-bit, 9-bit×2, etc.). Maximum display size is 320×240 (without OSD)
or 320×200 (with OSD). Camera image display to the sub LCD is possible.
Continued on next page.
91004 JO IM No.8075-1/11
LC822152
Continued from preceding page.
• I2C Interface
• Scaling function
• JPEG codec
• Thumbnail
• Clock system
• Package
• Process
• Power source voltage
Built-in I2C master for CCD/CMOS module control. Without paying attention to the
I2C from the CPU, it is accessible to the CCD/CMOS module as well as the normal
register (write/read).
CCD output is a VGA size (640×480). The output is reduced/cropped to meet the LCD
display range with a scaler. Low-pass filter and enhancer are equipped.
The YUV422/YUV420 image data is compressed into JPEG code, and the JPEG code
data is expanded to the YUV422/YUV420 image data.
It performs thinning out, scaling down and cropping the LCD output images to an
image size of maximum 40×40.
LSI includes PLL and it multiplies the clock input from outside to make a main clock.
It divides this multiplied frequency to output to CCD/CMOS module as the clock.
FBGA96K
0.18µm E/A
Internal 1.8V±0.18V, I/O 3.0V±0.3V
Specifications
Absolute Maximum Ratings at VSS = 0V
Parameter
Symbol
Source Voltage
Input/Output Voltage
Conditions
Ratings
Unit
VDD30 max
-0.3 to 3.3
V
VDD18 max
-0.3 to 1.98
V
VI, VO
-0.3 to *VDD3 max
*+0.3 (max 3.3V)
V
Input/Output Current
I I, IO
*1
Allowable Power Dissipation
Pd max
Ta≤70°C *2
Operating Temperature
Topr
-30 to +70
°C
Storage Temperature
Tstg
-55 to +125
°C
±20
mA
650
mW
*1 : Absolute maximum rating per input/output reference cell
*2 : This value is assured when the conditions for substrate mounting are as follows.
In other conditions, the assured value will be changed accordingly. (Conditions for substrate mounting)
Substrate size : FR4 (50mm×108mm×1.27mm)
Cu trace rate : 250%
Allowable Operating Range at Ta = -30 to +70°C, VSS = 0V
Parameter
Symbol
Power Source Voltage (I/O unit)
VDD30
Input Voltage Range (I/O unit)
VIN30
Source Voltage
VDD18
Conditions
1.62
VIN18
0
AVDD
1.62
(Analog part)
Input Voltage Range
3.0
0
(Internal logic unit)
Power Source Voltage
typ
2.7
(Internal logic unit)
Input Voltage Range
Ratings
min
AVIN
1.8
1.8
0
(Analog part)
max
Unit
3.3
V
VDD30
V
1.98
V
VDD18
V
1.98
V
AVDD
V
Input/Output Pin Capacitance at Ta = 25°C, VDD18 = VDD33 = VIN18 = VIN30 = 0V
Parameter
Symbol
Conditions
Ratings
min
typ
max
Unit
Input Pin
CIN
f = 1MHz
10
pF
Output Pin
COUT
f = 1MHz
10
pF
Input/Output Pin
CI/O
f = 1MHz
10
pF
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LC822152
Electric Characteristics
D.C. Characteristics : Input/Output Levels at Ta = -30 to +70°C, VDD30 = 2.7 to 3.3V, VSS = 0V
Parameter
Symbol
Input High Level Voltage
VIH
Input Low Level Voltage
VIL
Input High Level Voltage
VIH
Input Low Level Voltage
VIL
Input High Level Current
IIH
Ratings
Conditions
min
CMOS support
typ
Unit
max
0.7VDD30
Pins
V
0.2VDD30
CMOS support Schmidt
Applicable
2
V
V
0.75VDD30
0.15VDD30
V
1
VI = VDD30
-10
10
µA
7
VI = VDD30,
-10
100
µA
6
-10
10
with pull-down resistor
Input Low Level Current
IIL
VI = VSS
µA
6, 7
Output High Level Voltage
VOH
IOH = -2mA
VDD30-0.8
V
3
IOH = -4mA
VDD30-0.8
V
8
IOH = -8mA
VDD30-0.8
V
4
3
Output Low Level Voltage
VOL
Output Leak Current
IOZ
Pull-down Resistor
RDN
Non-operating Current Dissipation
IDD
IOL = 1.8mA
0.4
V
IOL = 3.6mA
0.4
V
8
IOL = 7.2mA
0.4
V
4
At HiZ Output
-10
50
100
Output release
VI=VSS or VDD30
10
µA
5
200
kΩ
6
300
µA
1 : TEST[3:0], XRST, CLKSEL, STBY, SCANEN, SCANMOD
2 : Input pin and dual-directional pin except 1.
3 : Output pin except MCKI and dual-directional pin except 8.
4 : MCKI
5 : Dual-directional pin
6 : PCLK, HREF, VREF, CD[7:0]
7 : Input pin and dual-directional pin except 6.
8 : D[15:0]
Input Clock
When CLKSEL input is “H”.
Clock Pin
Maximum Input Frequency (MHz)
Duty
CKI
60
50±10%
Note : The internal operation clock would be 30MHz at a maximum. For 60MHz input, the clock divided by
at least 2 must be used as the internal operation clock.
When CLKSEL input is “0” (PLL is used).
Clock Pin
Maximum Input Frequency (MHz)
Duty
CKI
100
50±10%
In addition, setup here must satisfy the following PLL input/output specifications.
Parameter
Maximum VCO Oscillation Frequency
Symbol
min
typ
max
f max
180
Minimum VCO Oscillation Frequency
f min
60
Phase Contrast Frequency
f ref
Unit
MHz
MHz
30.0
MHz
No.8075-3/11
LC822152
Package Dimensions
unit : mm
3306
Pin Description
No.
Pin Number
Pin Names
1
B1
VSS
2
B2
AVDD
3
C1
VCNT
4
D4
AVSS
5
C2
TEST3
6
D1
VDD1.8
7
D3
VSS
8
D2
VDD3
I/O
Pin Description
Initial Value
GND
Analog system VDD 1.8V power source
O
PLL VCNT pin
Analgo VSS
I
Test input 3
L
1.8V power source
GND
3V power source
9
E1
CKI
I
Clock input
10
E4
CLKSEL
I
Clock dividing select
11
E3
STBY
I
Stand by
12
E2
TEST0
I
Test input 0
13
F2
XRST
I
Reset
14
F3
VSS
15
F4
VDD3
16
F1
CAMPWR
O
CCD power down
O
17
G2
REGRES
O
CCD reset
O
18
G3
MCKI
O
CCD master clock
O
19
G1
TEST1
I
Test input 1
L
20
H2
TEST2
I
Test input 2
L
21
H3
SDA
B
I2C data
O
22
H1
SCL
O
I2C clock
O
23
J1
VDD1.8
24
K1
VSS
25
K2
VDD3
L
GND
3V power source
1.8V power source
GND
3V power source
26
J2
PCLK
I
CCD pixel clock
PD
27
K3
HREF
I
Horizontal synchronous signal input
PD
28
G4
VREF
I
Vertical synchronous signal input
PD
29
J3
CD7
I
CCD data input
PD
30
K4
CD6
I
CCD data input
PD
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No.8075-4/11
LC822152
Continued from preceding page.
No.
Pin Number
Pin Names
I/O
31
H4
CD5
I
CCD data input
Pin Description
Initial Value
32
J4
CD4
I
CCD data input
PD
33
K5
CD3
I
CCD data input
PD
34
G5
CD2
I
CCD data input
PD
35
H5
CD1
I
CCD data input
PD
36
J5
CD0
I
CCD data input
PD
37
J6
VDD1.8
PD
1.8V power source
38
H6
VSS
39
G6
VDD3
GND
40
K6
EX1
B
Expanded LCD data bus
41
J7
EX0
B
Expanded LCD data bus
42
H7
LCS2
O
Chip select output for sub LCD
43
K7
LA
O
LCD address output
-
44
J8
LCS
O
LCD chip select output
1
45
H8
LWR
O
LCD write signal output
1
46
K8
LRD
O
LCD read signal output
1
47
K9
VDD1.8
48
K10
VSS
49
J10
VDD3
50
J9
LD15
B
LCD data bus
51
H10
LD14
B
LCD data bus
-
52
G7
LD13
B
LCD data bus
-
53
H9
LD12
B
LCD data bus
-
54
G10
LD11
B
LCD data bus
-
55
G8
LD10
B
LCD data bus
-
56
G9
LD9
B
LCD data bus
-
57
F10
LD8
B
LCD data bus
-
58
F7
LD7
B
LCD data bus
-
59
F8
LD6
B
LCD data bus
-
60
F9
LD5
B
LCD data bus
-
61
E9
VDD3
62
E8
VSS
63
E7
VDD1.8
64
E10
LD4
B
LCD data bus
-
65
D9
LD3
B
LCD data bus
-
66
D8
LD2
B
LCD data bus
-
67
D10
LD1
B
LCD data bus
-
68
C9
LD0
B
LCD data bus
-
69
C8
CS
I
Chip select input
H
70
C10
CS2
I
Chip select input for sub LCD
H
71
B10
A1
I
Address input
-
72
A10
VSS
73
A9
VDD3
3V power source
1
1.8V power source
GND
3V power source
-
3V power source
GND
1.8V power source
GND
3V power source
74
B9
A0
I
Address input
-
75
A8
WR
I
Write signal input
H
76
D7
RD
I
Read signal input
H
77
B8
INT
O
Interrupt output
1
78
A7
D15
B
Host data bus
-
79
C7
D14
B
Host data bus
-
80
B7
D13
B
Host data bus
-
81
A6
D12
B
Host data bus
-
82
D6
D11
B
Host data bus
-
83
C6
D10
B
Host data bus
-
Continued on next page.
No.8075-5/11
LC822152
Continued from preceding page.
No.
Pin Number
Pin Names
I/O
84
B6
D9
B
Pin Description
85
B5
VDD1.8
86
C5
VSS
87
D5
D8
B
Host data bus
-
88
A5
D7
B
Host data bus
-
89
B4
D6
B
Host data bus
-
90
C4
D5
B
Host data bus
-
91
A4
D4
B
Host data bus
-
92
B3
D3
B
Host data bus
-
93
C3
D2
B
Host data bus
-
94
A3
D1
B
Host data bus
-
95
A2
D0
B
Host data bus
-
96
A1
VDD3
Host data bus
Initial Value
-
1.8V power source
GND
3V power source
No.8075-6/11
LC822152
Block Diagram
ILC05546
No.8075-7/11
LC822152
AC Characteristics
Host Interface Timing
ILC05547
Symbol
Contents
min
max
Unit
tAs
ADRESS setup time to CS↓
5*1
ns
tAh
ADRESS hold time from CS↑
5*2
ns
tCSh
CS hold time from RD/WR↑
0
ns
tRDWRs
RD/WR(CS↓)setup time from RD/WR↑
5*1
ns
tRDWRh
RD/WR(CS↑)hold time from RD/WR↓
5
ns
tRwidth
RD pulse width
T+5
ns
tWwidth
WR pulse width
20
ns
tDIs
Input DATA setup time to WR↑
20
ns
tDIh
Input DATA hold time from WR↑
0
ns
tAcc
Output DATA access time from RD↓
tDOh
Output DATA hold time from RD↑
50
2
ns
ns
*1 : Operation at times under 5 ns is also possible by delaying the internal CS with the CS delay setting
(CSCHOP register). However, since incorrect operation may occur if an access is performed before the setting is
changed, the application must change the setting immediately after power is first applied.
*2 : Operation with an internal command access of 0ns minimum is possible. However, if this signal is input
at 0ns when the LCD controller is accessed directly, it is possible that small pulses, such as LCS and LCS2, may
be generated.
No.8075-8/11
LC822152
ILC05548
Symbol
tNACC
Contents
RD/WR No Access time
min
Unit
JPEG Q-Table Write
3T
ns
JPEG Q-Table Read
7T
ns
Code/Thumbnail buffer Read
4T
ns
Other access
2T
ns
Note1 : T is a cycle of ASIC internal clock. (1, 2, 4, or 8 times the cycle of CKI input clock)
Note2 : Write access of JPEG Huffman table is subject to the data where access prohibited period is written.
CCD Interface Timing
ILC05549
Symbol
Contents
ts
Setup time to PCLK
th
Hold time from PCLK
min
typ
max
Unit
10
ns
5
ns
No.8075-9/11
LC822152
LCD Interface Timing
ILC05550
Symbol
Contents
tLWRs
LCD access setup time to LWR↓
tLWRwidth
min
max
Unit
T-5
ns
LWR pulse width
T*n-5
ns
tLWRh
LCD access hold time from LWR↑
T*m-5
tLAdly
LA delay from cycle start
tLDdly
LD delay from cycle start
tLDh
LD hold time from LWR↑
ns
5
10
0 (When m = 0 setup)
tLWRh+5
ns
Note1 : T is a cycle of ASIC internal clock. (1, 2, 4, or 8 times the cycle of CKI input clock)
Note2 : n is an ASIC register setting value. Minimum value is 1 (zero).
Note3 : m is an ASIC register setting value. Minimum value is 0 (zero).
Host-LCD Through Timing
ILC05551
Symbol
Contents
min
max
Unit
tLCDdly
HOST to LCD control signal delay
30
ns
tLD_h2ldly
HOST to LCD data delay
35
ns
tLD_l2hdly
LCD to HOST data delay
30
ns
No.8075-10/11
LC822152
PS No.8075-11/11