2STA1694 High power PNP epitaxial planar bipolar transistor Features ■ High breakdown voltage VCEO = -120 V ■ Complementary to 2STC4467 ■ Fast-switching speed ■ Typical ft = 20 MHz ■ Fully characterized at 125 oC 3 2 Applications ■ 1 TO-3P Audio power amplifier Description The device is a PNP transistor manufactured using new BiT-LA (Bipolar transistor for linear amplifier) technology. The resulting transistor shows good gain linearity behaviour. Table 1. Figure 1. Internal schematic diagram Device summary Order code Marking Package Packaging 2STA1694 2STA1694 TO-3P Tube May 2008 Rev 2 1/7 www.st.com 7 2STA1694 Electrical ratings 1 Electrical ratings Table 2. Absolute maximum rating Symbol Value Unit VCBO Collector-base voltage (IE = 0) -120 V VCEO Collector-emitter voltage (IB = 0) -120 V VEBO Emitter-base voltage (IC = 0) -6 V Collector current -8 A Collector peak current (tP < 5ms) -16 A PTOT Total dissipation at Tc = 25 °C 80 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 1.563 °C/W IC ICM TJ Table 3. Symbol Rthj-case 2/7 Parameter Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case _________ __max 2STA1694 2 Electrical characteristics Electrical characteristics (Tcase = 25 °C; unless otherwise specified) Table 4. Symbol Electrical characteristics Parameter Test conditions Min. Typ. Max. Unit ICBO Collector cut-off current (IE = 0) VCB = -120 V -10 µA IEBO Emitter cut-off current (IC = 0) VEB = -6 V -10 µA Collector-emitter breakdown V(BR)CEO(1) voltage (I = 0) B V(BR)CBO Collector-base breakdown voltage (IE = 0) Emitter-base breakdown V(BR)EBO(1) voltage (I = 0) C VCE(sat) (1) hFE fT IC = -50 mA -120 V IC = -100 µA -120 V -6 V IE = -1 mA Collector-emitter saturation voltage IC = -3 A IB = -300 mA DC current gain IC = -3 A VCE = -4 V Transition frequency IC = -0.5 A VCE = -12 V -1.5 70 V 140 20 MHz 1. Pulsed duration = 300 µs, duty cycle ≤ 1.5% 3/7 Package mechanical data 3 2STA1694 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 4/7 2STA1694 Package mechanical data TO-3P Mechanical data DIM. A A1 A2 b b1 b2 c D D1 E E1 E2 e L L1 L2 P Q Q1 MIN. 4.6 1.45 1.20 0.80 1.80 2.80 0.55 19.70 mm. TYP 1.50 1.40 1 0.60 19.90 13.90 15.40 5.15 19.50 18.20 3.10 MAX. 5 1.65 1.60 1.20 2.20 3.20 0.75 20.10 15.80 13.60 9.60 5.45 20 3.50 18.40 5.75 20.50 18.60 3.30 5 3.80 5/7 2STA1694 Revision history 4 Revision history Table 5. 6/7 Document revision history Date Revision Changes 23-Nov-2007 1 Initial release 15-May-2008 2 Document status promoted from preliminary data to datasheet. 2STA1694 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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