STMICROELECTRONICS STP03D200

STP03D200
2kV NPN Darlington transistor
Preliminary Data
Features
■
Extra high voltage capability
■
High gain characteristic
Application
■
Active start-up network in 3 phase S.M.P.S.
(see application note AN2454)
3
1
Description
2
TO-220
The STP03D200 is made by two extra high
voltage NPN transistors in Darlington
configuration housed in a single package. The
resulting device shows high gain performance.
Figure 1.
Table 1.
Internal schematic diagram
Device summary
Order code
Marking
Package
Packaging
STP03D200
P03D200
TO-220
Tube
October 2007
Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
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7
Electrical ratings
1
STP03D200
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Value
Unit
VCBO
Collector-base voltage (IE = 0)
2000
V
VCEO
Collector-emitter voltage (IB = 0)
1200
V
VEBO
Emitter-base voltage (IC = 0)
20
V
Collector current
100
mA
Collector peak current (tP < 5ms)
200
mA
PTOT
Total dissipation at Tc = 25°C
40
W
Tstg
Storage temperature
-65 to 150
°C
150
°C
IC
ICM
TJ
Table 3.
Symbol
RthJ-C
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Parameter
Max. operating junction temperature
Thermal data
Parameter
Thermal resistance junction-case max
Value
Unit
3.13
°C/W
STP03D200
2
Electrical characteristics
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4.
Symbol
Electrical characteristics
Parameter
Test conditions
Min.
Typ.
Max.
Unit
ICBO
Collector cut-off current
(IE = 0)
VCB = 2000 V
100
µA
ICEO
Collector cut-off current
(IB = 0)
VCE = 1200 V
100
µA
V(BR)CEO
VEBO
Collector-emitter
I = 1 mA
breakdown voltage (IB = 0) C
Emitter-base voltage
(IC = 0)
IE = 10 µA
1200
V
20
V
VCE(sat)(1)
Collector-emitter saturation
IC = 50 mA; IB = 500 µA
voltage
2
V
VBE(sat)(1)
Base-emitter saturation
voltage
2
V
hFE
DC current gain
IC = 50 mA; IB = 500 µA
IC = 20 mA;
VCE = 10 V
IC = 30 mA;
VCE = 10 V
400
350
1. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
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Package mechanical data
3
STP03D200
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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STP03D200
Package mechanical data
TO-220 mechanical data
mm
inch
Dim
Min
A
b
b1
c
D
D1
E
e
e1
F
H1
J1
L
L1
L20
L30
∅P
Q
Typ
4.40
0.61
1.14
0.49
15.25
Max
Min
4.60
0.88
1.70
0.70
15.75
0.173
0.024
0.044
0.019
0.6
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
1.27
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Max
0.181
0.034
0.066
0.027
0.62
0.050
16.40
28.90
3.75
2.65
Typ
0.409
0.106
0.202
0.051
0.256
0.107
0.551
0.154
0.645
1.137
3.85
2.95
0.147
0.104
0.151
0.116
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Revision history
4
STP03D200
Revision history
Table 5.
6/7
Document revision history
Date
Revision
22-Oct-2007
1
Changes
Initial release.
STP03D200
Revision history
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