STMICROELECTRONICS BAS69

BAS69 Series
Low capacitance small signal Schottky diodes
Main product characteristics
IF
BAS69KFILM
(Single)
10 mA
VRRM
15 V
C (typ)
<1 pF
Tj (max)
150° C
SOD-523
Features and benefits
BAS69WFILM
(Single)
■
Low diode capacitance
■
Designed for RF applications
■
Low profile packages
■
Very low parasitic inductor and resistor
SOT-323
BAS69-06WFILM
(Common anode)
Description
BAS69-04WFILM
(Series)
The BAS69 series use 15V barrier, with extremely
low junction capacitance, suitable for the
detection of an RF signal and the compensation
of the voltage drift with the temperature. The
presented packages make the device ideal in
applications where space saving is critical.
BAS69-07P6FILM
(2 parallel diodes)
The low junction capacitance will reduce the
disturbance on the RF signal.
SOT-666
Order codes
BAS69-09P6FILM
(2 opposite diodes)
Configurations in top view
Part Number
Marking
BAS69WFILM
23
BAS69-04WFILM
24
BAS69-05WFILM
25
BAS69-06WFILM
26
BAS69KFILM
65
BAS69-09P6FILM
69
BAS69-07P6FILM
67
July 2006
BAS69-05WFILM
(Common cathode)
Rev 1
1/9
www.st.com
Characteristics
BAS69 Series
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
VRRM
IF
Parameter
Value
Unit
Repetitive peak reverse voltage
15
V
Continuous forward current
10
mA
2
A
IFSM
Surge non repetitive forward current
Tstg
Storage temperature range
Tj
TL
Half wave, single phase 60 Hz
-65 to +150
Maximum operating junction temperature
Maximum soldering
(1)
°C
150
temperature(1)
260
1. Pulse test: tp = 380 µs, δ < 2 %
Table 2.
Thermal parameters
Symbol
Rth(j-a)
Parameter
Value
Junction to ambient(1)
SOT-323
550
SOD-523, SOT-666
600
Unit
° C/W
1. Epoxy printed circuit board with recommended pad layout
Table 3.
Symbol
Static electrical characteristics
Parameter
Test conditions
Tj = 25° C
IR(1)
Reverse leakage current
Tj = 125° C
Tj = 25° C
Tj = 125° C
Tj = 25° C
VF(1)
Forward voltage drop
Tj = 125° C
Tj = 25° C
Tj = 125° C
Min.
Typ
Max.
Unit
0.035
VR = 1 V
6
30
µA
0.23
VR = 15 V
IF = 1 mA
10
100
350
380
230
260
500
570
460
510
mV
IF = 10 mA
1. Pulse test: tp ≤ 250 ms, δ ≤ 2 %
Table 4.
Dynamic characteristics
Symbol
Parameter
2/9
Test conditions
C
Diode capacitance
VR = 0 V, F = 1 MHz
RF
Forward resistance
IF = 5 mA, F = 100 MHz
LS
Series inductance
Min.
Typ
Max.
Unit
1.0
pF
15
Ω
1.5
nH
BAS69 Series
Figure 1.
1.E+02
Characteristics
Forward voltage drop versus
forward current (typical values)
Figure 2.
IFM(mA)
1.E+02
Reverse leakage current versus
reverse voltage applied (typical
values)
IR(µA)
Tj=125°C
1.E+01
1.E+01
Tj=85°C
1.E+00
Tj=125°C
1.E-01
1.E+00
Tj=85°C
Tj=25°C
1.E-02
Tj=25°C
Tj=-40°C
VFM(V)
VR(V)
1.E-03
1.E-01
0.0
0.2
Figure 3.
100
0.4
0.6
0.8
1.0
0.0
1.2
Differential forward resistance
versus forward current (typical
values)
RF(Ω)
2.5
Figure 4.
5.0
7.5
10.0
12.5
15.0
Junction capacitance versus
reverse voltage applied (typical
values)
C(pF)
1.0
F=10kHz
Tj=25°C
F=1MHz
Vosc=30mVRMS
Tj=25°C
0.9
0.8
0.7
0.6
10
0.5
0.4
0.3
0.2
0.1
IF(mA)
1
VR(V)
0.0
1.0
10.0
Figure 5.
100.0
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-323)
0.0
2.5
Figure 6.
Zth(j-a) /Rth(j-a)
5.0
7.5
10.0
12.5
15.0
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-666)
Zth(j-a) /Rth(j-a)
1.E+00
1.E+00
Single pulse
SOT-666
Single pulse
SOT-323
1.E-01
1.E-01
1.E-02
Epoxy FR4
SCU=2.25 mm²
eCU=35 µm
tP(s)
tP(s)
1.E-02
1.E-03
1.E-03
Epoxy FR4
eCU=35 µm
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
3/9
Ordering information scheme
Figure 7.
BAS69 Series
Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-523)
Figure 8.
Zth(j-a) /Rth(j-a)
1.E+00
600
Thermal resistance junction to
ambient versus copper surface
under each lead (printed circuit
board, epoxy FR4 - SOT-323)
Rth(j-a)
Single pulse
SOD-523
550
500
1.E-01
450
400
1.E-02
1.E-03
1.E-03
2
350
Epoxy FR4
eCU=35 µm
tP(s)
SCU(mm²)
300
1.E-02
1.E-01
1.E+00
0
1.E+01
10
15
20
Ordering information scheme
BAS69
Signal Schottky diodes
VRRM = 15 V
Configuration
No letter = Single diode
04 = Series diodes
05 = Common cathode
06 = Common anode
07 = Parallel diodes
09 = Opposite diodes
Package
W = SOT-323
K = SOD-523
P6 = SOT-666
Packing
FILM = Tape and reel
4/9
5
xx
xx FILM
25
30
35
40
45
50
BAS69 Series
3
Package information
Package information
Epoxy meets UL94, V0
Table 5.
SOD-523 dimensions
Dimensions
E
Ref.
0.15 M C A B
E1
B
D
2xb
0.20 M C A B
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.50
0.60
0.70
0.020 0.024 0.028
E
1.50
1.60
1.70
0.059 0.063 0.067
E1
1.10
1.20
1.30
0.043 0.047 0.051
D
0.70
0.80
0.90
0.028 0.031 0.035
b
0.25
0.35
0.010
0.014
c
0.07
0.20
0.003
0.008
L
0.15
0.25
0.006 0.008 0.010
L1
0.10
0.20
0.004
A
8°
R0.1
A
c
SEATING PLANE
C
7°
L
L1
Figure 9.
0.20
0.008
SOD-523 footprint (dimensions in mm)
0.7
0.3
2
5/9
Package information
BAS69 Series
Table 6.
SOT-323 dimensions
Dimensions
Ref.
Millimeters
Inches
A
Min.
E
e
Typ.
Max.
Min.
Typ.
Max.
A
0.8
1.1
0.031
0.043
A1
0.0
0.1
0.0
0.004
b
0.25
0.4
0.010
0.016
c
0.1
0.26
0.004
0.010
D
1.8
2.0
2.2
0.071
0.079
0.086
E
1.15
1.25
1.35
0.045
0.049
0.053
D
b
A1
c
e
θ
0.65
H
H
1.8
2.1
2.4
0.071
0.083
0.094
L
0.1
0.2
0.3
0.004
0.008
0.012
q
0
30°
0
Figure 10. SOT-323 footprint (dimensions in mm)
0.95
1.0
0.8
6/9
0.026
L
0.50
2.9
30°
BAS69 Series
Package information
Table 7.
SOT-666 dimensions
Dimensions
b1
Ref.
Millimeters
Inches
L1
Min.
L3
Typ.
Max.
Min.
Typ.
Max.
A
0.45
0.60 0.018
0.024
A3
0.08
0.18 0.003
0.007
b
0.17
0.34 0.007
0.013
b1
0.19
D
1.50
1.70 0.059
0.067
E
1.50
1.70 0.059
0.067
E1
1.10
1.30 0.043
0.051
b
D
E1
0.27
0.34 0.007 0.011 0.013
A
L2
E
A3
e
0.50
0.020
L1
0.19
0.007
L2
0.10
0.30 0.004
0.012
e
L3
0.10
0.004
Figure 11. SOT-666 footprint (dimensions in mm)
0.50
0.62
2.60
0.99
0.30
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
7/9
Ordering information
4
5
8/9
BAS69 Series
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
BAS69WFILM
23
SOT-323 Single
6 mg
3000
Tape and reel
BAS69-04WFILM
24
SOT-323 Series
6 mg
3000
Tape and reel
BAS69-05WFILM
25
SOT-323
Common cathode
6 mg
3000
Tape and reel
BAS69-06WFILM
26
SOT-323
Common anode
6 mg
3000
Tape and reel
BAS69KFILM
65
SOD-523 Single
1.4 mg
3000
Tape and reel
BAS69-09P6FILM
69
SOT-666 Opposite
2.9 mg
3000
Tape and reel
BAS69-07P6FILM
67
SOT-666 Parallel
2.9 mg
3000
Tape and reel
Revision history
Date
Revision
24-Jul-2006
1
Description of Changes
First issue
BAS69 Series
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