STMICROELECTRONICS STTH802D

STTH802
Ultrafast recovery diode
Main product characteristics
IF(AV)
8A
VRRM
200 V
Tj (max)
175° C
VF (typ)
0.8 V
trr (typ)
17 ns
K
A
K
A
Features and benefits
■
Very low conduction losses
■
Negligible switching losses
■
Low forward and reverse recovery time
■
High junction temperature
A
K
K
TO-220AC
STTH802D
TO-220FPAC
STTH802FP
K
K
A
A
Description
NC
DPAK
STTH802B
The STTH802 uses ST's new 200 V planar Pt
doping technology, and is specially suited for
switching mode base drive and transistor circuits.
NC
D2PAK
STTH802G
Packaged in TO-220AC, TO-220FPAC, DPAK,
and D2PAK this device is intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection.
Order codes
September 2006
Part Number
Marking
STTH802D
STTH802
STTH802FP
STTH802
STTH802B
STTH802
STTH802B-TR
STTH802
STTH802G
STTH802
STTH802G-TR
STTH802
Rev 2
1/11
www.st.com
Characteristics
STTH802
1
Characteristics
Table 1.
Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol
Parameter
Unit
VRRM
Repetitive peak reverse voltage
200
V
IF(RMS)
RMS forward current
16
A
8
A
100
A
-65 to + 175
°C
175
°C
IF(AV)
Average
TO-220A, DPAK, D2PAK
forward
current, δ = 0.5 TO-220FPAC
IFSM
Surge non
repetitive
tp = 10 ms Sinusoidal
forward current
Tstg
Storage temperature range
Tj
Table 2.
Tc = 145° C
Tc = 125° C
Maximum operating junction temperature
Thermal parameters
Symbol
Parameter
Value
TO-220AC, DPAK,
Rth(j-c)
Table 3.
Symbol
D2PAK
Unit
3.2
Junction to case
° C/W
TO-220FPAC
5.5
Static electrical characteristics
Parameter
IR(1)
Reverse leakage current
VF(2)
Forward voltage drop
Test conditions
Tj = 25° C
Tj = 125° C
Tj = 25° C
Tj = 150° C
Min.
Typ
Max.
Unit
6
VR = VRRM
IF = 8 A
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.73 x IF(AV) + 0.021 IF2(RMS)
2/11
Value
µA
6
60
0.95
1.05
0.8
0.90
V
STTH802
Characteristics
Table 4.
Dynamic characteristics
Symbol
Parameter
trr
Test conditions
Typ
Max.
Unit
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25 °C
25
30
ns
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25 °C
17
22
Reverse recovery current
IF = 8 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125 °C
5.5
7
Forward recovery time
IF = 8 A, dIF/dt = 50 A/µs
VFR = 1.1 x VFmax, Tj = 25 °C
150
ns
Forward recovery voltage
IF = 8 A, dIF/dt = 50 A/µs,
Tj = 25 °C
1.5
V
Reverse recovery time
IRM
tfr
VFP
Figure 1.
Peak current versus duty cycle
Figure 2.
Min.
A
Forward voltage drop versus
forward current (typical values)
IM(A)
IFM(A)
100
200
T
IM
180
δd=tp/T
80
tp
160
140
60
120
100
P=5W
80
40
Tj=150°C
60
P=2W
P=1W
Tj=25°C
40
20
δ
20
VFM(V)
0
0
0.0
0.0
0.1
Figure 3.
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.5
1.0
1.5
2.0
2.5
3.0
1.0
Forward voltage drop versus
forward current (maximum values)
Figure 4.
Relative variation of thermal
impedance, junction to case,
versus pulse duration (TO-220AC,
DPAK, D2PAK)
Zth(j-c)/Rth(j-c)
IFM(A)
200
1.0
Single pulse
TO-220AC
DPAK
D2PAK
180
160
140
120
100
80
Tj=150°C
60
40
Tj=25°C
20
VFM(V)
tp(s)
0
0.1
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.E-03
1.E-02
1.E-01
1.E+00
3/11
Characteristics
Figure 5.
STTH802
Figure 6.
Relative variation of thermal
impedance, junction to case,
versus pulse duration
(TO-220FPAC)
Zth(j-c)/Rth(j-c)
Junction capacitanceversus
reverse applied voltage (typical
values)
C(pF)
1.0
100
Single pulse
TO-220FPAC
F=1MHz
Vosc=30mVRMS
Tj=25°C
0.1
VR(V)
tp(s)
10
0.0
1.E-03
1.E-02
Figure 7.
1.E-01
1.E+00
1
1.E+01
Reverse recovery charges versus
dIF/dt (typical values)
10
1000
Reverse recovery time versus dIF/dt
(typical values)
Figure 8.
QRR(nC)
100
tRR(ns)
160
80
IF=8A
VR=160V
140
IF=8A
VR=160V
70
120
60
100
50
Tj=125°C
80
Tj=125°C
40
60
30
Tj=25°C
40
20
Tj=25°C
20
10
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
10
100
Figure 9.
1000
Peak reverse recovery current
versus dIF/dt (typical values)
10
100
1000
Figure 10. Dynamic parameters versus
junction temperature
IRM(A)
QRR; IRM [T j] / Q RR; IRM [T j=125°C]
1.4
12
IF=8A
VR=160V
IF=8A
VR=160V
1.2
10
1.0
8
IRM
0.8
Tj=125°C
6
0.6
QRR
4
0.4
2
Tj=25°C
0.2
0.0
0
10
4/11
Tj(°C)
dIF/dt(A/µs)
100
1000
25
50
75
100
125
150
STTH802
Ordering information scheme
Figure 11. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, eCU = 35 µm (D2PAK )
Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, eCU = 35 µm (DPAK)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
100
100
D2PAK
90
80
80
70
70
60
60
50
50
40
40
30
30
20
20
10
10
SCU(cm²)
SCU(cm²)
0
0
0
2
DPAK
90
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Ordering information scheme
STTH
8 02 XXX
Ultrafast switching diode
Average forward current
8=8A
Repetitive peak reverse voltage
02 = 200 V
Package
D = TO-220AC in Tube
FP = TO-220FPAC in Tube
B = DPAK in Tube
B-TR = DPAK in Tape and reel
G = D2PAK in Tube
G-TR = D2PAK in Tape and reel
5/11
Package information
3
STTH802
Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Recommended torque value: 0.8 Nm
Maximum torque value: 1.0 Nm
Table 5.
T0-220AC dimensions
DIMENSIONS
REF.
A
H2
ØI
C
L5
L7
L6
L2
F1
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
H2
10.00
10.40
0.393
0.409
D
L9
L4
L2
F
M
E
16.40 typ.
0.645 typ.
L4
13.00
14.00
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
G
M
Diam. I
6/11
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
STTH802
Package information
Table 6.
T0-220FPAC dimensions
DIMENSIONS
REF
A
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.4
4.6
0.173
0.181
B
2.5
2.7
0.098
0.106
D
2.5
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
B
H
Dia
L6
L2
L7
L3
L5
F1
D
L4
L2
F
G1
G
E
16 Typ.
0.63 Typ.
L3
28.6
30.6
1.126
1.205
L4
9.8
10.6
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.9
16.4
0.626
0.646
L7
9.00
9.30
0.354
0.366
Dia.
3.00
3.20
0.118
0.126
7/11
Package information
Table 7.
STTH802
DPAK dimensions
DIMENSIONS
REF
.
E
A
B2
C2
L2
D
R
H
L4
A1
B
R
G
C
A2
Millimeters
Inches
Min.
Max
Min.
Max.
A
2.20
2.40
0.086
0.094
A1
0.90
1.10
0.035
0.043
A2
0.03
0.23
0.001
0.009
B
0.64
0.90
0.025
0.035
B2
5.20
5.40
0.204
0.212
C
0.45
0.60
0.017
0.023
C2
0.48
0.60
0.018
0.023
D
6.00
6.20
0.236
0.244
E
6.40
6.60
0.251
0.259
G
4.40
4.60
0.173
0.181
H
9.35
10.10
0.368
0.397
0.60 MIN.
L2
V2
0.80 typ.
L4
0.60
1.00
0.023
0.039
V2
0°
8°
0°
8°
Figure 13. DPAK footprint (dimensions in mm)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
8/11
0.031 typ.
STTH802
Package information
Table 8.
D2PAK dimensions
Dimensions
Ref.
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Figure 14. D2PAK footprint (dimensions in mm)
16.90
10.30
5.08
1.30
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
4
Ordering information
Part Number
Marking
Package
Weight
Base qty
Delivery mode
STTH802D
STTH802
TO-220AC
1.86 g
50
Tube
STTH802FP
STTH802
TO-220FPAC
2.2 g
50
Tube
STTH802B
STTH802
DPAK
0.3 g
75
Tube
STTH802B-TR
STTH802
DPAK
STTH802G
STTH802G-TR
5
10/11
STTH802
0.3 g
2500
Tape and reel
STTH802
2
D PAK
1.48 g
50
Tube
STTH802
D2
1.48 g
1000
Tape and reel
PAK
Revision history
Date
Revision
Description of Changes
03-May-2006
1
First issue
22-Sep-2006
2
Added D2PAK package
STTH802
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
11/11