STTH1R02 Ultrafast recovery diode Main product characteristics IF(AV) 1.5 A VRRM 200 V Tj (max) 175° C VF (typ) 0.7 V trr (typ) 15 ns A K A A Features and benefits ■ Very low conduction losses ■ Negligible switching losses ■ Low forward and reverse recovery times ■ High junction temperature K DO-41 STTH1R02 K DO-15 STTH1R02Q A A Description The STTH1R02 uses ST's new 200 V planar Pt doping technology, and it is specially suited for switching mode base drive and transistor circuits. K K SMA STTH1R02A SMB STTH1R02U Packaged in DO-41, DO-15, SMA, and SMB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. Order codes March 2007 Part Number Marking STTH1R02 STTH1R02 STTH1R02RL STTH1R02 STTH1R02A R1A STTH1R02Q STTH1R02Q STTH1R02QRL STTH1R02Q STTH1R02U 1R2S Rev 3 1/10 www.st.com Characteristics STTH1R02 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol VRRM Parameter Unit 200 V 30 A 50 A 1.5 A 60 A -65 to + 175 °C 175 °C Value Unit Repetitive peak reverse voltage DO-41(1) IFRM Value DO-15(1) Repetitive peak forward current tp = 5 µs, F = 5 kHz SMA / SMB DO-41 / DO-15 IF(RMS) IF(AV) RMS forward current SMA /SMB Average forward current, δ = 0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj DO-41 Tlead = 110° C DO-15 Tlead = 110° C SMA Tc = 110° C SMB Tc = 110° C tp = 10 ms Sinusoidal Maximum operating junction temperature 1. On infinite heatsink with 10 mm lead length Table 2. Thermal parameters Symbol Rth(j-l) Parameter Junction to lead DO-41 45 DO-15 45 SMA 30 SMB 30 Lead Length = 10 mm on infinite heatsink °C/W Rth(j-c) Table 3. Symbol IR(1) Junction to case Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C VF(2) Forward voltage drop Max. Unit µA 2 IF = 4.5 A 20 1.2 0.89 1 0.76 0.85 0.70 0.80 V IF = 1.5 A Tj = 150° C 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.68 x IF(AV) + 0.08 IF2(RMS) 2/10 Typ 3 VR = VRRM Tj = 25° C Tj = 100° C Min. STTH1R02 Characteristics Table 4. Dynamic characteristics Symbol Parameter trr Test conditions Typ Max. IF = 1 A, dIF/dt = -50 A/µs, VR = 30 V, Tj = 25° C 23 30 IF = 1 A, dIF/dt = -100 A/µs, VR = 30 V, Tj = 25° C 15 20 Reverse recovery current IF = 1.5 A, dIF/dt = -200 A/µs, VR = 160 V, Tj = 125° C 3 4 Forward recovery time IF = 1.5 A, dIF/dt = 100 A/µs VFR = 1.1 x VFmax, Tj = 25° C 50 ns Forward recovery voltage IF = 1.5 A, dIF/dt = 100 A/µs, Tj = 25° C 2.1 V Reverse recovery time IRM tfr VFP Figure 1. Peak current versus duty cycle Figure 2. Min. Unit ns A Forward voltage drop versus forward current (typical values) IFM(A) IM(A) 50 50 T IM 45 δd=tp/T 40 40 tp 35 30 30 P=5W 25 20 20 P=2W Tj=150°C 15 P=1W 10 Tj=25°C 10 5 δ 0 VFM(V) 0 0.0 Figure 3. 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 Forward voltage drop versus forward current (maximum values) 0.5 Figure 4. IFM(A) 1.0 1.5 2.0 2.5 Relative variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-a) /Rth(j-a) 50 1.0 SMA Scu=1cm² 0.9 40 0.8 0.7 30 0.6 0.5 0.4 20 Tj=150°C 0.3 Tj=25°C 0.2 10 Single pulse 0.1 VFM(V) tP(s) 0.0 0 0.0 0.5 1.0 1.5 2.0 2.5 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 3/10 Characteristics Figure 5. STTH1R02 Relative variation of thermal Figure 6. impedance junction to case versus pulse duration (SMB) Relative variation of thermal impedance junction to case versus pulse duration (DO-41) Zth(j-a) /Rth(j-a) Zth(j-a) /Rth(j-a) 1.0 1.0 SMB Scu=1cm² 0.9 DO-41 Lleads=10mm 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 tP(s) 0.1 0.0 tP(s) Single pulse 0.0 1.E-02 1.E-01 Figure 7. 1.E+00 1.E+01 1.E+02 1.E+03 1.E-03 Relative variation of thermal Figure 8. impedance junction to case versus pulse duration (DO-15) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Junction capacitance versus reverse applied voltage (typical values) C(pF) Zth(j-a) /Rth(j-a) 1.0 100 DO-15 Leads =10mm 0.9 F=1MHz Vosc=30mVRMS Tj=25°C 0.8 0.7 0.6 0.5 10 0.4 0.3 0.2 0.1 Single pulse tP(s) VR(V) 0.0 1 1.E-03 1.E-02 Figure 9. 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Reverse recovery charges versus dIF/dt (typical values) 1 10 100 Figure 10. Reverse recovery time versus dIF/dt (typical values) QRR(nC) tRR(ns) 80 80 IF=1.5A VR=160V 70 IF=1.5A VR=160V 70 60 60 50 50 40 Tj=125°C 40 Tj=125°C 30 30 20 20 Tj=25°C 10 Tj=25°C 10 dIF/dt(A/µs) 0 dIF/dt(A/µs) 0 10 4/10 1000 100 1000 10 100 1000 STTH1R02 Characteristics Figure 11. Peak reverse recovery curent versus dIF/dt (typical values) Figure 12. Dynamic parameters versus junction temperature QRR; IRM [T j] / Q RR; IRM [T j=125°C] IRM(A) 1.4 8 IF=1.5A VR=160V 7 IF=1.5A VR=160V 1.2 6 1.0 5 IRM 0.8 4 0.6 3 QRR Tj=125°C 0.4 2 0.2 Tj=25°C 1 Tj(°C) dIF/dt(A/µs) 0 0.0 10 100 1000 25 50 Figure 14. Figure 13. Thermal resistance, junction to ambient, versus copper surface under each lead - SMA (Epoxy FR4, copper thickness = 35 µm) Rth(j-a) (°C/W) 75 100 125 150 Thermal resistance, junction to ambient, versus copper surface under each lead - SMB (Epoxy FR4, copper thickness = 35 µm) Rth(j-a) (°C/W) 120 110 100 100 90 80 80 SMB 70 SMA 60 60 50 40 40 30 20 20 10 SCU(cm²) SCU(cm²) 0 0 0 1 2 3 4 0.0 5 Figure 15. Thermal resistance, junction to ambient, versus copper surface under each lead - DO 15 (Epoxy FR4, copper thickness = 35 µm) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance, junction to ambient, versus copper surface under each lead - DO-41 (Epoxy FR4, copper thickness = 35 µm) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 100 100 90 DO-41 90 80 80 70 70 DO-15 60 60 50 50 40 40 30 30 20 20 10 SCU(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 S(cm²) 0 0 1 2 3 4 5 6 7 8 9 10 5/10 Ordering information scheme 2 STTH1R02 Ordering information scheme STTH 1 R 02 XX Ultrafast switching diode Average forward current 1=1A Model R Repetitive peak reverse voltage 02 = 200 V Package Blank = DO-41 in Ammopack RL = DO-41 in Tape and reel A = SMA in Tape and reel Q = DO-15 in Ammopack QRL = DO-15 in Tape and reel U = SMB in Tape and reel 3 Package information ● Epoxy meets UL94, V0 Table 5. DO-41 dimensions Dimensions Ref. Table 6. C A Inches Min. Max. Min. Max. A 4.1 5.20 0.160 0.205 B 2 2.71 0.080 0.107 C 25.4 D 0.712 ØD ØB C Millimeters 1 0.863 0.028 0.034 DO-15 dimensions Dimensions C C A D B 6/10 Ref. Millimeters Inches Min. Max. Min. Max. A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139 C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035 STTH1R02 Package information Table 7. SMA dimensions DIMENSIONS REF. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.03 0.075 0.080 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 D 2.25 2.95 0.089 0.116 L 0.75 1.60 0.030 0.063 Figure 17. SMA footprint (dimensions in mm) 1.73 1.48 1.73 1.67 4.94 7/10 Package information Table 8. STTH1R02 SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 Figure 18. SMB footprint (dimensions in mm) 2.23 1.64 2.23 2.30 6.10 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STTH1R02 4 5 Ordering information Ordering information Part Number Marking Package Weight Base qty Delivery mode STTH1R02 STTH1R02 DO-41 0.34 g 2000 Ammopack STTH1R02RL STTH1R02 DO-41 0.34 g 5000 Tape and reel STTH1R02A R1A SMA 0.068 g 5000 Tape and reel STTH1R02Q STTH1R02Q DO-15 0.49 g 1000 Ammopack STTH1R02QRL STTH1R02Q DO-15 0.49 g 6000 Tape and reel STTH1R02U 1R2S SMB 0.11 g 2500 Tape and reel Revision history Date Revision Description of changes 03-May-2006 1 First issue 13-Oct-2006 2 Added DO-15 and SMB packages. 08-Mar-2007 3 Replaced Figure 8. Replaced ecu with copper thickness. 9/10 STTH1R02 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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