BUL704 High voltage fast-switching NPN Power Transistor General features ■ NPN Transistor ■ High voltage capability ■ Low spread of dynamic parameters ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed ■ In compliance with the 2002/93/EC European Directive 1 2 3 TO-220 Description The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and medium voltage capability. It uses a Cellular Emitter structure with planar edge termination to enhance switching speeds while maintaining the wide RBSOA. Internal schematic diagram Applications ■ Electronic ballast for fluorescent lighting ■ Dedicated for PFC solution in HF ballast halfbridge voltage fed Order codes Part Number Marking Package Packing BUL704 BUL704 TO-220 Tube May 2006 Rev 1 1/11 www.st.com 11 BUL704 Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2/11 BUL704 1 Electrical ratings Electrical ratings Table 1. Absolute maximum rating Symbol Parameter Value Unit VCES Collector-emitter voltage (V BE = 0) 700 V VCEO Collector-emitter voltage (IB = 0) 400 V VEBO Emitter-base voltage (IC = 0) 10 V Collector current 4 A Collector peak current (tP < 5ms) 8 A Base current 2 A IBM Base peak current (tP < 5ms) 4 A Ptot Total dissipation at T c = 25°C 70 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 1.78 62.5 °C/W °C/W IC ICM IB TJ Table 2. Symbol Rthj-case Rthj-amb Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-amb __max __max 3/11 Electrical characteristics 2 BUL704 Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 3. Symbol Electrical characteristics Parameter Test Conditions Collector cut-off current (VBE =-1.5V) ICEO Collector cut-off current (IB =0) VCE =400V VEBO Emitter-base voltage (IC = 0) IE =10mA Tj =125°C VCE =700V IC =100mA Max. Unit 100 500 µA µA 250 µA 10 V 400 V L =25mH VCE(sat) (1) Collector-emitter saturation voltage IC =1A IB =0.2A IC =2.5A IB =0.5A VBE(sat) (1) Base-emitter saturation voltage IC =1A IB =0.2A IC =2.5A IB =0.5A IC =10mA V CE =5V 10 IC =2A V CE =5V 14 28 1.5 3 µs 0.2 0.4 µs 0.6 1 µs 0.1 0.2 µs hFE ts tf ts tf DC current gain Resistive load Storage time Fall time Inductive load Storage time Fall time VCC =125V tp = 30µs 0.5 0.8 V V 1.1 1.2 V V IC =2A IB1 = -IB2 =0.4A (see fig.12 ) IC =2A IB1 =0.4A VBE(off) =-5V R BB =0Ω Vclamp=200V (see fig.13) Note (1) Pulsed duration = 300 µs, duty cycle ≤1.5% 4/11 Typ. VCE =700V ICES Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) Min. BUL704 2.1 Electrical characteristics Electrical characteristics (curves) Figure 1. Safe operating area Figure 2. Derating Curve Figure 3. DC current gain Figure 4. DC current gain Figure 5. Collector-emitter saturation voltage Figure 6. Base-emitter saturation voltage 5/11 Electrical characteristics Figure 7. Inductive load fall time Figure 8. Figure 9. Resistive load fall time Figure 10. Resistive load storage time Figure 11. Reverse biased safe operating area 6/11 BUL704 Inductive load storage time BUL704 2.2 Electrical characteristics Test circuits Figure 12. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor Figure 13. Inductive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor 3) Fast recovery rectifier 7/11 Package mechanical data 3 BUL704 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 8/11 BUL704 Package mechanical data TO-220 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 9/11 Revision history 4 BUL704 Revision history Table 4. 10/11 Revision history Date Revision 30-May-2006 1 Changes Initial release. BUL704 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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