BULD1101E High voltage fast-switching NPN Power Transistor General features ■ High voltage capability ■ Low spread of dynamic parameters ■ Minimum lot-to-lot spread for reliable operation ■ Very high switching speed ■ In compliance with the 2002/93/EC European Directive 3 1 Description The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and high voltage capability. Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown condition, without using the transil protection usually necessary in typical converters for lamp ballast. 1 DPAK IPAK TO-252 TO-251 2 3 Internal schematic diagram Applications ■ Electronic ballast for fluorescent lighting Order codes Part number Marking Package Packaging BULD1101ET4 BULD1101E DPAK Tape & reel BULD1101E-1 BULD1101E IPAK Tube May 2007 Rev 2 1/11 www.st.com 11 Electrical ratings 1 BULD1101E Electrical ratings Table 1. Absolute maximum rating Symbol Parameter Value Unit VCES Collector-emitter voltage (V BE = 0) 1100 V VCEO Collector-emitter voltage (IB = 0) 450 V VEBO Emitter-base voltage (IC = 0) 12 V Collector current 3 A Collector peak current (tP < 5ms) 6 A 1.5 A IC ICM IB IBM Base peak current (tP < 5ms) 3 A Ptot Total dissipation at T c = 25°C 35 W Tstg Storage temperature -65 to 150 °C 150 °C Value Unit 3.57 100 °C/W °C/W TJ Table 2. Symbol Rthj-case Rthj-amb 2/11 Base current Max. operating junction temperature Thermal data Parameter Thermal resistance junction-case Thermal resistance junction-amb __max __max BULD1101E 2 Electrical characteristics Electrical characteristics (Tcase = 25°C unless otherwise specified) Table 3. Symbol ICES V(BR)EBO Electrical characteristics Parameter Emitter-base breakdown voltage (IC = IE =1mA 0) VCE(sat) (1) Collector-emitter saturation voltage VBE(sat) (1) Base-emitter saturation voltage ts tf Ear Min. Typ. Max. Collector cut-off current VCE =1100V (VBE =0V) Collector-emitter VCEO(sus) (1) sustaining voltage (IB = 0) hFE Test conditions DC current gain 12 Unit 100 µA 24 V IC =100mA 450 IC =1A IB =0.2A IC =1A IB =0.2A IC =1A IB =0.2A V 0.25 0.6 TJ=125°C 1 1.5 V V 1.5 V IC =0.25A VCE =5V IC =0.25A VCE =5V T J=125°C VCE =5V IC =2A 20 38 80 23 44 85 6 10 18 IC =2A 4 7 16 VCE =5V T J=125°C VCC =125V IC =2.5A Resistive load Storage time Fall time VBE(off) =-5V (see fig.10) Repetitive avalanche energy L =2mH IBR ≤2.5A C =1.8nF (see fig.11) IB1 = -IB2 =0.5A tp = 300µs 400 6 2 µs 700 ns mJ Note (1) Pulsed duration = 300µs, duty cycle ≤1.5% 3/11 Electrical characteristics 2.1 4/11 BULD1101E Typical characteristic Figure 1. Safe operating area Figure 2. Derating curve Figure 3. Output characteristics Figure 4. Collector-emitter saturation voltage Figure 5. Base-emitter saturation voltage Figure 6. DC current gain BULD1101E Electrical characteristics Figure 7. DC current gain Figure 9. Reverse biased safe operating area Figure 8. Resistive load switching times 5/11 Electrical characteristics 2.2 Test circuit Figure 10. Resistive load switching test circuit Figure 11. Energy rating test circuit 6/11 BULD1101E BULD1101E 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 7/11 Package mechanical data BULD1101E TO-252 (DPAK) MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 L2 0.8 0.398 0.031 L4 0.60 1.00 0.024 0.039 V2 0o 8o 0o 0o P032P_B 8/11 BULD1101E Package mechanical data TO-251 (IPAK) MECHANICAL DATA DIM. mm MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A3 0.70 1.30 0.028 0.051 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 B3 0.85 B5 0.033 0.30 B6 0.012 0.95 0.037 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.237 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 15.90 16.30 0.626 0.642 L 9.00 9.40 0.354 0.370 L1 0.80 1.20 0.031 0.047 L2 0.80 V1 10o 1.00 0.031 0.039 10o P032N_E 9/11 Revision history 4 BULD1101E Revision history Table 4. 10/11 Revision history Date Revision Changes 20-Apr-2003 1 Initial release. 07-May-2007 2 The document has been reformatted. BULD1101E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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