STMICROELECTRONICS EMIF02

EMIF02-MIC03F2
®
2 LINE EMI FILTER
AND ESD PROTECTION
IPAD™
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
■ Mobile phones and communication systems
■ Computers, printers and MCU Boards
DESCRIPTION
The EMIF02-MIC03 is a highly integrated device
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences. The
EMIF02 Flip-Chip packaging means the package
size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents damage to the application when
subjected to ESD surges up 15 kV.
Flip-Chip package
BENEFITS
■ EMI symmetrical (I/O) low-pass filter
■ High efficiency in EMI filtering
■ Very low PCB space consuming:
1.07 mm x 1.47 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging
PIN CONFIGURATION (bump side)
3 2 1
I2
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2
Level 4 on input pins 15 kV (air discharge)
8 kV (contact discharge)
Level 1 on output pins 2 kV (air discharge)
2 kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
I1
B
GND
O2
A
O1
C
BASIC CELL CONFIGURATION
Low-pass Filter
Input
Output
Ri/o = 68 Ω
Cline = 100 pF
GND
GND
GND
TM: IPAD is a trademark of STMicroelectronics.
October 2004
REV. 1
1/6
EMIF02-MIC03F2
ABSOLUTE RATINGS (limiting values)
Symbol
Tj
Parameter and test conditions
Value
Unit
125
°C
Maximum junction temperature
Top
Operating temperature range
- 40 to + 85
°C
Tstg
Storage temperature range
- 55 to 150
°C
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C)
Symbol
Parameter
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
I
IPP
VCL VBR VRM
VCL
Clamping voltage
Rd
Dynamic impedance
IPP
Peak pulse current
RI/O
Series resistance between Input & Output
Cline
Input capacitance per line
Symbol
IR
IRM
IRM
IR
VRM VBR VCL
V
IPP
Test conditions
Min.
Typ.
6
8
Max.
Unit
VBR
IR = 1 mA
IRM
VRM = 3 V per line
RI/O
Tolerance ± 20 %
68
Ω
Cline
VR = 0 V
100
pF
V
500
Fig. 1: S21 (dB) attenuation measurements and
Aplac simulation.
nA
Fig. 2: Analog crosstalk measurements.
0.00
dB
-10.00
0.00
dB
-5.00
-10.00
-20.00
-15.00
-30.00
-20.00
-25.00
-40.00
-30.00
-50.00
-35.00
-60.00
-40.00
-70.00
-45.00
-50.00
100.0k
2/6
1.0M
10.0M
f/Hz
100.0M
1.0G
-80.00
100.0k
1.0M
10.0M
100.0M
1.0G
f/Hz
®
EMIF02-MIC03F2
Fig. 3: ESD response to IEC61000-4-2 (+15kV air
discharge) on one input V(in) and one output V(out).
Fig. 4: ESD response to IEC61000-4-2 (–15kV air
discharge) on one input V(in) and one output V(out).
Fig. 5: Line capacitance versus applied voltage.
C(pF)
140
120
F=1MHz
Vosc=30mVRMS
Tj=25°C
100
80
60
40
20
VR(V)
0
0
®
1
2
3
4
5
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EMIF02-MIC03F2
Aplac model
IN1
Rmic
Rbump Lbump
Lmic
Lbump Rbump
GND
OUT1
Lsub
model = D1
model = D2
Rsub
Rbump
GND
model = D3
Lbump
model = D1
model = D2
Lgnd
Cgnd
IN2
Rgnd
OUT2
Rbump Lbump
Rmic
Lmic
Lbump Rbump
Ground return
EMIF02-MIC03F1 model
Aplac parameters
Model D1
Model D3
Model D2
aplacvar Rmic 68
CJO=Cdiode1
CJO=Cdiode3
CJO=Cdiode2
aplacvar Lmic 10p
BV=7
BV=7
BV=7
aplacvar Cdiode1 100pF
IBV=1u
IBV=1u
IBV=1u
aplacvar Cdiode2 3.6pF
IKF=1000
IKF=1000
IKF=1000
aplacvar Cdiode3 1.17nF
IS=10f
IS=10f
IS=10f
aplacvar Lbump 50pH
ISR=100p
ISR=100p
ISR=100p
aplacvar Rbump 20m
N=1
N=1
N=1
aplacvar Rsub 0.5m
M=0.3333
M=0.3333
M=0.3333
aplacvar Rgnd 10m
RS=0.7
RS=0.12
RS=0.3
aplacvar Lgnd 50pH
VJ=0.6
VJ=0.6
VJ=0.6
aplacvar Cgnd 0.15pF
TT=50n
TT=50n
TT=50n
aplacvar Lsub 10pH
ORDER CODE
EMIF
yy
-
xxx
zz
F
x
1: Pitch = 500µm
Bump = 315µm
2: Leadfree Pitch = 500µm
Bump = 315µm
EMI Filter
Number of lines
Flip Chip
x: resistance value (Ohms) z: capacitance value / 10(pF)
or
Application (3 letters) and Version (2 digits)
4/6
®
EMIF02-MIC03F2
PACKAGE MECHANICAL DATA
FLIP CHIP
500µm ± 10
650µm ± 50
315µm ± 50
50
0µ
m
±
15
1.47mm ± 50µm
250µm ± 10
1.07mm ± 50µm
FOOT PRINT RECOMMENDATIONS
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
MARKING
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
x x z
y ww
®
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EMIF02-MIC03F2
PACKING
Dot identifying Pin A1 location
Ø 1.5 ± 0.1
1.75 ± 0.1
ST E
ST E
ST E
xxz
yww
xxz
yww
xxz
yww
0.73 ± 0.05
3.5 ± 0.1
8 ± 0.3
4 ± 0.1
4 ± 0.1
User direction of unreeling
All dimensions in mm
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These
packages have a Lead-free second level interconnect . The category of second level interconnect is
marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
OTHER INFORMATION
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
EMIF02-MIC03F2
FW
Flip-Chip
2.1 mg
5000
Tape & reel (7”)
Note: More packing informations are available in the application notes
AN1235: ''Flip-Chip: Package description and recommendations for use''
AN1751: "EMI Filters: Recommendations and measurements"
REVISION HISTORY
Date
Revision
14-Oct-2005
1
Changes
Initial release.
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics GROUP OF COMPANIES
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®