EMIF04-1502QCF ® 4 LINE LOW CAPACITANCE EMI FILTER AND ESD PROTECTION IPAD™ MAIN PRODUCT CHARACTERISTICS: Where EMI filtering in ESD sensitive equipment is required : ■ LCD and camera for Mobile phones ■ Computers and printers ■ Communication systems ■ MCU Boards 8 7 6 5 GND 1 2 3 4 DESCRIPTION The EMIF04-1502QCF is a 4 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. This filter includes an ESD protection circuitry, which prevents the device from destruction when subjected to ESD surges up 15kV on the input pins. QFN 2x2mm 8 pins (Dot on package indicates pin 1) Table 1: Order Code Part Number Marking EMIF04-1502QCF F4 Figure 1: Pin Configuration (back side) BENEFITS Low-pass Filter ■ ■ ■ ■ ■ ■ ■ EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Very low PCB space consuming: 2mm x 2mm Very thin package: 1 mm max. High efficiency in ESD suppression on input pins (IEC61000-4-2 level 4) High reliability offered by monolithic integration High reducing of parasitic elements through integration and wafer level packaging Input Output 1 8 Low-pass Filter Input Output 2 7 Low-pass Filter Input Output 3 6 Low-pass Filter Input COMPLIES WITH THE FOLLOWING STANDARDS: Output 4 5 IEC61000-4-2: Level 4 input pins 15kV (air discharge) 8kV (contact discharge) MIL STD 833E - Method 3015-6 Class 3 Figure 2: Basic Cell Configuration Input 1 Output 2 C1 C2 Typical line capacitance = 13pF @ 3V R = 160Ω TM: IPAD is a trademark of STMicroelectronics. October 2005 REV. 4 1/6 EMIF04-1502QCF Table 2: Absolute Ratings (limiting values) Symbol Tj Parameter Value Unit 125 °C Junction temperature Top Operating temperature range -40 to + 85 °C Tstg Storage temperature range -55 to +150 °C Table 3: Electrical Characteristics (Tamb = 25°C) Symbol Parameter I VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic resistance IPP Peak pulse current RI/O Series resistance between Input & Output Cline Input capacitance per line IF VBR VCL Symbol VF VRM V IRM IR IPP Test conditions Min. Typ. Max. Unit 6 8 10 V 200 nA VBR IR = 1 mA IRM VRM = 3V per line RI/O Tolerance ± 10% 160 Cline VR= 3V 13 Figure 3: S21(dB) attenuation measurement Ω 15 pF Figure 4: Analog cross talk measurements 0.00 0.00 dB - 10.00 - 10.00 - 20.00 dB - 30.00 - 20.00 - 40.00 - 50.00 - 60.00 - 30.00 - 70.00 - 40.00 - 80.00 - 50.00 - 100.00 - 90.00 100.0k 1.0M 10.0M 100.0M f/Hz 2/6 1.0G 100.0k 1.0M 10.0M 100.0M f/Hz 1.0G EMIF04-1502QCF Figure 5: ESD response to IEC61000-4-2 (+15kV air discharge) on one input (Vin) and on one output (Vout) Figure 6: ESD response to IEC61000-4-2 (-15kV air discharge) on one input (Vin) and on one output (Vout) Vin C1=10V/d 100ns/d C1=10V/d Vin 100ns/d Vout C2=5V/d 100ns/d C2=5V/d Vout 100ns/d Figure 7: Line capacitance versus applied voltage (typical value) Cline (pF) 25 20 15 10 5 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Vline (V) Figure 8: Ordering Information Scheme EMIF yy - xxx z QCF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package QCF = QFN 2mm x 2mm 3/6 EMIF04-1502QCF Figure 9: QFN Package Mechanical Data DIMENSIONS REF. A3 A Min. A1 b See detail B e Millimeters See detail A L A 0.50 A1 0.00 Typ. Max Min. Typ. 1.00 0.020 0.03 A3 Max. 0.039 0.05 0.00 0.001 0.002 0.25 0.010 0.30 0.007 0.012 b 0.18 b1 0.17 D 1.90 2.00 2.10 D2 D2 0.88 0.98 1.08 0.035 0.039 0.043 D E 1.90 2.00 2.10 E2 0.46 0.56 0.65 0.018 0.022 0.026 E2 b1 E k m m Detail A e Detail B L1 L1 Inches L 0.44 0.007 0.29 L1 L2 L2 L2 Figure 10: Foot Print dimensions (in millimeters) 0.079 0.50 0.20 0.017 0.079 0.020 0.45 0.008 0.018 0.15 0.006 0.13 k 0.20 m 0.12 0.005 0.008 0.17 0.23 Figure 11: Package marking 0.98 1.01 F4 0.33 0.34 0.56 3.00 0.89 0.50 0.28 Dot on package indicates Pin 1 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4/6 EMIF04-1502QCF Table 4: Ordering Information Part Number Marking Package Weight Base qty Delivery mode EMIF04-1502QCF F4 QFN 8.4 mg 3000 Tape & reel (7”) Note: Further packing information available in the application note - AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History 5/6 Date 06-Dec-2004 Revision 1 16-Mar-2005 2 01-Apr-2005 3 19-Oct-2005 4 Description of Changes First issue. QFN package mechanical data update: 1/ A min: 0.50 mm instead of 0.80 2/ A typ: deleted 3/ b1 max: 0.44 mm instead of 0.30 QFN package mechanical data update: 1/ Reference Details A and B added Added ECOPACK statement. Added Figure 11 to show package marking QFN package mechanical data update: 1/ Added dimension m 2/ Added min and max values for dimensions D and E 3/ Added typical value for dimension L EMIF04-1502QCF Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. 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