STMICROELECTRONICS EMIFYY

EMIF04-VID01C1
®
IPAD™
4 LINES LOW CAPACITANCE EMI FILTER
AND ESD PROTECTION
MAIN APPLICATION
Where EMI filtering in ESD sensitive equipment is
required:
■
■
■
■
LCD and camera for mobile phones
Computers and printers
Communication systems
MCU board
DESCRIPTION
The EMIF04-VID01C1 is a 4 lines highly integrated array designed to suppress EMI / RFI noise in
all systems subjected to electromagnetic interferences.
The EMIF04-VID01C1 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
■ High efficiency EMI filtering (-40db @ 900MHz)
■ Low line capacitance suitable for high speed
data bus
■ Low serial resistance for camera impedance
adaptation
■ Optimized PCB space consuming:
1.92mm x 1.29mm
■ Very thin package: 0.69 mm
■ High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4)
■ High reliability offered by monolithic integration
■ High reducing of parasitic elements through
integration & wafer level packaging
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins 15kV (air discharge)
8kV (contact discharge)
®
Coated Flip-Chip
(10 Bumps)
Table 1: Order Code
Part Number
EMIF04-VID01C1
Marking
GU
Figure 1: Pin Configuration (ball side)
6
5
I4
4
3
I3
I2
Gnd
O4
2
1
I1
Gnd
O3
O2
A
B
O1
C
Figure 2: Configuration
R
Input
MIL STD 883E - Method 3015-6 Class 3
Output
R = 100Ω
CLINE = 16pF typ. @ 3V
TM: IPAD is a trademark of STMicroelectronics.
February 2005
REV. 1
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EMIF04-VID01C1
Table 2: Absolute Ratings (limiting values)
Symbol
Tj
Parameter and test conditions
Value
Unit
125
°C
Maximum junction temperature
Top
Operating temperature range
- 40 to + 85
°C
Tstg
Storage temperature range
- 55 to + 150
°C
Table 3: Electrical Characteristics (Tamb = 25°C)
Symbol
Parameter
VBR
Breakdown voltage
IRM
Leakage current @ VRM
I
VBR
VRM
R
Cline
IR
IRM
IRM
IR
Stand-off voltage
VRM VBR
V
Series resistance between Input &
Output
Input capacitance per line
Symbol
Test conditions
VBR
IR = 1mA
IRM
VRM = 3V per line
R
Cline
2/6
VRM
I = 10mA
VR = 3V DC 1MHz VOSC = 30mV
Min.
Typ.
Max.
Unit
6
8
10
V
500
nA
100
120
Ω
16
19
pF
80
EMIF04-VID01C1
Figure 3: S21 (dB) attenuation measurement
Figure 4: Analog crosstalk measurement
0
0
dB
-10
dB
-10
-20
-30
-20
-40
-50
-30
-60
-40
-70
-80
-50
-90
-100
-60
100k
1M
10M
100M
100k
1G
1M
10M
100M
1G
f/Hz
f/Hz
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input V(in) and on
one output (Vout)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input V(in) and on one
output (Vout)
Input
10V/d
Input
10V/d
Output
10V/d
Output
10V/d
200ns/d
200ns/d
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
CLINE(pF)
28
26
24
22
20
18
16
14
12
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VLINE(V)
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EMIF04-VID01C1
Figure 8: Ordering Information Scheme
EMIF
yy
-
xxx zz
Cx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
C = Coated Flip-Chip
x = 1: 500µm, Bump = 315µm
= 2: Leadfree Pitch = 500µm, Bump = 315µm
Figure 9: FLIP-CHIP Package Mechanical Data
435µm ± 50
315µm ± 50
500µm ± 50
690µm ± 65
50
1µ
m
±5
0
1.29mm ± 50µm
250µm ± 50
1.92mm ± 50µm
Figure 10: Foot Print Recommendations
Dot, ST logo
xx = marking
z = packaging location
yww = date code
(y = year
ww = week)
365
240
365
Copper pad Diameter :
250µm recommended , 300µm max
Figure 11: Marking
Solder stencil opening : 330µm
All dimensions in µm
4/6
x x z
y w w
40
220
Solder mask opening recommendation :
340µm min for 300µm copper pad diameter
EMIF04-VID01C1
Figure 12: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
Ø 1.5 +/- 0.1
1.75 +/- 0.1
4 +/- 0.1
3.5 +/- 0.1
ST
xxx
yww
ST
xxx
yww
ST
xxx
yww
8 +/- 0.3
0.73 +/- 0.05
4 +/- 0.1
User direction of unreeling
All dimensions in mm
Table 4: Ordering Information
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
EMIF04-VID01C1
GU
Flip-Chip
3.9 mg
5000
Tape & reel 7”
Note: More packing informations are available in the application note
AN1235: “Flip-Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Table 5: Revision History
Date
Revision
15-Feb-2005
1
Description of Changes
First issue.
5/6
EMIF04-VID01C1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
© 2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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