EMIF06-SD02F3 IPAD™ 6 line EMI filter and ESD protection for SD card Data Brief Main application ■ Removable memory cards in mobile phones, communication systems, and portable applications ■ Compliant with: SD (standard and high speed) /MiniSD/ µSD and MMC/Trans-flash standards Description Flip-Chip (24 bumps) The EMIF06-SD02F3 is a highly integrated device based on IPAD technology combining 5 functions: ■ ■ ■ ■ ■ ■ ■ ■ Baseband CPU EMI Low-pass-filter and ESD protection (up to 15 kV on external pins) Integrated pull up resistors to prevent bus floating 50 MHz clock frequency compatible with Cline< 40 pF Lead-free package in 400 µm pitch Low power consumption Very low PCB space consumption High reliability offered by monolithic integration Reduction of parasitic elements thanks to CSP integration Pin8 Pin7 2.9 V Pin4 Pin5 Pin6 1.8 V Pin2 Pin3 Benefits Pin1 ■ Power supply LDO ESD protection ■ EMI Filtering ■ Application diagram Signal Conditioning ■ ESD protection (IEC standard) EMI Filtering Level translator Signal conditionning Integrated power supply with thermal shutdown (TSD), under voltage lockout (UVLO), and short-circuit current limitation (ISC) Level Shifter ■ micro SD Complies with the following standards: IEC 61000-4-2, Level 4: External pins 15 kV (air discharge) 8 kV (contact discharge) 2 kV - HBM IEC 61340-3-1: Internal pins 2 kV (air discharge) 2 kV (contact discharge) TM: IPAD is a trademark of STMicroelectronics. March 2007 Rev 1 For further information contact your local STMicroelectronics sales office. 1/3 www.st.com Ordering information 1 EMIF06-SD02F3 Ordering information Part Number Marking Package Weight Base qty Delivery mode EMIF06-SD02F3 HF Flip-Chip 7.45 mg 5000 Tape and reel (7”) Note: More information is available in the application note : AN2348 :"Flip Chip : Package description and recommendations for use" AN1751 : EMI Filters: Recommendations and measurements 2 Revision history 2/3 Date Revision 06-Mar-2007 1 Changes First issue EMIF06-SD02F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 3/3