STMICROELECTRONICS EMIF11

EMIF11-10002C4
®
9 LINES EMI FILTER
AND ESD PROTECTION
IPADTM
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
Mobile phones and communication systems
■
Computers, printers and MCU Boards
■
DESCRIPTION
The EMIF11-10002C4 is a highly integrated devices
designed to suppress EMI/RFI noise in all systems
subjected to electromagnetic interferences.
This device includes 9 EMI filters & ESD protection
circuitry which prevents the device from destruction when
subjected to ESD surges up 15kV. In addition, the EMIF11
integrates 2 other ESD protection for data and 1 ESD
protection for VCC.
BENEFITS
■
■
■
■
■
■
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
High efficiency in ESD suppression
(IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through integration
& wafer level packaging
QFN 4x4mm package for an easy layout
QFN 4x4mm
PIN CONFIGURATION (ball side)
I1 I2
Level 4
on input pins
15kV
8 kV
(air discharge)
(contact discharge)
I4
I5
I6
GND
01
I7
02
I8
03
I9
GND
04
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
I3
GND
I10
05
I11
06
I12
GND
GND
07 08 09 010 011 012
MIL STD 883E - Method 3015-7 Class 3
BASIC CELL CONFIGURATION
Input 4 to 12
GND
Output 4 to 12
GND
I1/O1
I2/O2
(Vcc)
I3/O3
GND
Ri/o = 100Ω
Cline = 45pF
9 filters
TM : IPAD is a trademark of STMicroelectronics.
October 2003 - Ed: 1A
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EMIF11-10002C4
ABSOLUTE RATINGS (limiting values)
Symbol
Value
Unit
Tj
Maximum junction temperature
Parameter and test conditions
150
°C
TL
Maximum lead temperature for soldering during 10s
260
°C
Top
Operating temperature range
-40 to + 85
°C
Tstg
Storage temperature range
-40 to +85
°C
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C)
Symbol
I
Parameter
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
RI/O
Series resistance between Input & Output
Cline
Input capacitance per line
IF
VF
VCL VBR VRM
V
IRM
IR
IPP
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3V per line
RI/O
Cells 4 to 12
Cline
VR = 0V (Cells 4 to 12)
Min.
Typ.
Max.
Unit
6
7
8
V
1
µA
110
Ω
90
100
45
Fig. 1: S21(dB) attenuation measurement and
Aplac simulation.
0
pF
Fig. 2: Analog crosstalk measurements.
-30
dB
dB
-10
Measurement
-20
-40
-50
Simulation
-30
-60
-40
-70
-50
-80
1
10
100
f/Hz
2/6
1,000 MHz
1
10
100
f/Hz
1,000MHz
EMIF11-10002C4
Fig. 3: Digital crosstalk measurement.
Fig. 4: ESD response to IEC61000-4-2 (+15kV air
discharge) on one input V(in) and on one output
V(out).
Vin
Vin
V(In)
Vout » 1.8mV ->
è Xtalk = -55dB
V(Out)
10V/div
Fig. 5: ESD response to IEC61000-4-2 (-15kV air
discharge) on one input V(in) and on one output
V(out).
100ns/div
Fig. 6: Line capacitance of filter cells versus
applied voltage.
C(pF)
55
V(In)
F = 1MHz
Vosc = 30mVRMS
Tj = 25°C
50
45
40
35
30
25
20
V(Out)
15
10
5
VR(V)
0
0.0
10V/div
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
100ns/div
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EMIF11-10002C4
Aplac model.
Ix_die
Ox_die
R16_04
100
D16
DEMIF22
➡ For each filter cell(filter4 to 12)
D04
DEMIF22
substrate
Vcc
I3_die
R3
10MEG
0
O3_die
D1301
DEMIF30
I1_die
O1_die
D02
DEMIF22
D03
DEMIF22
substrate
substrate
Substrate
Substrate
substrate
Substrate
R95
Rcorner
R96
Rcorner
L126
Lcorner
L127
Lcorner
Substrate
R97
Rpad
R98
Rcorner
L128
Lpad
L129
Lcorner
Substrate
R99
Rcorner
L130
Lcorner
0
Demif30 Model
RS=0.7
CJO=30p
M=.3333
VJ=.6
ISR=100p
BV=7
IBV=1m
TT=100n
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Demif22 Model
RS=0.7
CJO=22p
M=.3333
VJ=.6
ISR=100p
BV=14
IBV=1m
TT=100n
CAP = 0.2pF
RES = 10meg
Lcorner = 0.4nH
Rcorner = 0.15
Lpad = 0.15nH
Rpad = 0.1
EMIF11-10002C4
Aplac model (continued).
0
0
cap
res
I1_die
I3_die
0.4nH
I4
I4_die
cap
res
I5_die
cap
res
cap
res
0.4nH
I11
I6_die
0.4nH
I12
res
O6_die 0.4nH
res
O12_die 0.4nH
I12_die
O5
cap
O11
cap
cap
res
res
O5_die 0.4nH
res
O11_die 0.4nH
I11_die
O4
cap
O10
cap
res
O4_die 0.4nH
res
O10_die 0.4nH
I10_die
cap
res
0.4nH
I6
0.4nH
I10
O3
cap
O9
cap
res
O3_die 0.4nH
res
O9_die 0.4nH
I9_die
cap
res
0.4nH
I5
0.4nH
I9
O1
cap
O8
cap
cap
res
O1_die 0.4nH
res
O8_die 0.4nH
I8_die
res
cap
O7
cap
0.4nH
I8
cap
res
O7_die 0.4nH
cap
res
0.4nH
I3
I7_die
0
res
cap
0.4nH
I7
cap
res
cap
res
0.4nH
I1
0
O6
res
cap
O12
0
0
cap
res
res
cap
0
0
PACKING
Dot identifying Pin A1 location
All dimensions in mm
ST
ST
xxx
yww
xxx
yww
xxx
yww
5.5 +/- 0.05
12 +/- 0.3
1.1 +/- 0.1
ST
1.75 +/- 0.1
Ø 1.5 +/- 0.1
4 +/- 0.1
4 +/- 0.1
User direction of unreeling
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EMIF11-10002C4
PACKAGE MECHANICAL DATA
QFN 4x4mm
DIMENSIONS
REF.
Millimeters
Min.
A
A1
Max.
A
0.80
1.00
0.031
0.040
0
0.05
0
0.002
2
3
E1
A2
0.65
D
4.00
0.157
D1
3.75
0.148
E
4.00
0.157
E1
3.75
Ø
Ø
P
D2
R
1
2
3
0.80
0.026
0.031
E
Ne
Q
Typ.
A1
1
b
Min.
D
Nd
SEATING
PLANE
Inches
Max.
D1
A2
Ø 0.50
Typ.
E2
0.148
12°
12°
P
0.24
0.42
0.60
0.009
0.017
0.024
R
0.13
0.17
0.23
0.005
0.007
0.009
e
0.50
0.020
N
24.00
0.945
Nd
6.00
0.236
Ne
6.00
0.236
L
e
L
0.30
b
0.18
Q
0.40
0.50
0.012
0.30
0.007
0.20
0.45
0.016
0.020
0.008
0.018
0.012
D2
1.95
2.10
2.25
0.077
0.083
0.089
E2
1.95
2.10
2.25
0.077
0.083
0.089
OTHER INFORMATION
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
EMIF11-10002C4
E11U
QFN 4x4mm
235 mg
4000
Tape & reel (7”)
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
© 2003 STMicroelectronics - All rights reserved.
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