GS-BT2416C2.H Bluetooth class 2 module with embedded HCI FW Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Bluetooth specification V.1.2 compliant Transmission rate up to 721 Kbps Output power class 2 ( 0 dBm typical) Working distance up to 10 meters ACL & SCO links AFH interferance resistance Supports USB (1.1) /UART/PCM (Pulse Code Modulation)/SPI/ I²C interfaces Optimized link manager and control Support wireless LAN coexistence in collocated scenario Integrated 4Mbit Flash, 64Kbytes RAM, 4KBytes ROM 3.3V single supply voltage Hardware based UART flow control Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Serial cable replacement Industrial control Laptops POS terminals Data acquisition equipment Internet access points Machine control Sensor monitoring Robotic and bionic control Security control Patient monitoring Audio gateway applications Hands-free sets Wireless printers Cordless terminals Laptops, PCs and accessories Hand held devices and accessories HID devices (keyboard, mouse, joystick, game controller...) September 2007 Description ST Bluetooth Modules are highly integrated for easy implementation in embedded applications. Class 2 modules enable wireless communication with other Bluetooth enabled devices up to 10 m away. The GS-BT2416C2.H integrates on a unique FR4 PCB support: BT 1.2 radio and baseband, memory, 32 KHz and 13 MHz oscillator as well Vreg. The Module embeds Customer Framework up to HCI level allowing interoperability with HCI Top resident on Host. The antenna has not been included in order to grant a degree of freedom to the user in selecting the most suitable design and placement between external and integrated antenna that could be SMA aerial or a low cost antenna trace designed on PCB. For more details pleas refer to GS-BT2416C2DB Application Note. The GS-BT2416C2.H is the HCI module of the GS-BT2416C2.xx series. GS-BT2416C2.H is BQB qualified. Conformance testing through Bluetooth qualification program enables a fast time to market after system integration by ensuring a high degree of compliance and interoperability. Rev 1 1/18 www.st.com 18 Contents GS-BT2416C2.H Contents 1 Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 4 Bluetooth section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4.1 5 6 DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.2 Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5.3 Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.1 Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 8.2 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2/18 GS-BT2416C2.H 1 Certifications Certifications ● CE Compliant (IMQ Exp.Opinion 0081-AREF00017 – Safety EN60950-1 (2001) – EMC EN301 489 17V1.2.1 – Radio ES 300 328 V1.6. ● FCC certified on GS-BT2416C2DB (for a more exhaustive explanation, please refer to GS-BT2416C2DB Application Note) ● FCC ID: S9N16C2 ● BQB qualified device BQB ID: B012535 3/18 Maximum ratings GS-BT2416C2.H 2 Maximum ratings 2.1 Absolute maximum ratings Absolute maximum ratings (see table 2) indicate limits beyond which damage to the device may occur. Sustained exposure to these limits will adversely affect device reliability. Operating ranges (see table 3) define the limits for functional operation and parametric characteristics of the module. Functionality outside these limits is not implied Table 1. Absolute maximum ratings Values Symbol Parameter Unit Min 2.2 VDD Module supply voltage VIN Input voltage on any digital pin Tstg Storage temperature Tsold Soldering temperature Max 4 Vss1-0.5 Vdd+0.3 -40 +85 V V °C 240 Operating ranges Table 2. Operating ranges Values Symbol 4/18 Parameter VDD Module supply voltage Tstg Operating ambient temperature Conditions - 20°C < T < 70 °C Unit Min Typ Max 3.13 3.3 3.47 V +70 °C -20 GS-BT2416C2.H Electrical characteristics 3 Electrical characteristics 3.1 DC I/O specification Table 3. DC Input / Output specification Values Symbol Parameter Conditions Unit Min 4 Typ Max Vil Low level input voltage 3.13 V < VDD < 3.47 V Vih High level input voltage 3.13 V < VDD < 3.47 V 2 V Vhyst Schmitt trigger hysteresis 3.13 V < VDD < 3.47 V 0.4 V Vol Low level output voltage Io load = pin drive capability Voh High level output voltage Io load = pin drive capability 0.8 0.15 VDD0.15 V V V Bluetooth section Table 4. Bluetooth section Values Symbol Parameter Conditions Unit Min CHs Channel space Hop Hopping 13M CK System clock System clock stability LP CK - 20°C to 70°C Max 1 MHz 1600 Hops/ sec 13 MHZ - 20 Low power clock Low power clock accuracy Typ 20 32 - 200 ppm kHz 200 ppm Tra Transmission rate asynchronous 721 kbits/ sec Trs Transmission rate synchronous 432 kbits/ sec Operation current TX mode 90 mA Operation RX mode 50 mA Iop 5/18 Bluetooth section 4.1 GS-BT2416C2.H RF performance characteristics In the performance characteristics table the following applies: ● Test condition: nominal – Voltage typical Vdd 3.3V – Temperature typical Tamb 25°C Parameters are given at antenna pin Table 5. Symbol TX Pout ACP RX sens Table 6. Symbol Parameter TX Output power TX output spectrum adjacent channel power Receiver sensitivity Parameter Input & Output frequency range TX out TX output spectrum at -20 dB Bandwidth l∆F –pn l l∆F/50µsl Conditions Min Typ Max Unit 2.402 GHz 0 dBm 2.441 GHz 0 dBm 2.480 GHz 0 dBm lM-Nl = 2 - 36 dBm lM-Nl ≥ 3 - 50 dBm @BER 0.1% - 74 dBm Synthesizer performance characteristics RF in RF out ∆F 6/18 Transmitter and receiver performance characteristics Conditions Max Unit Typ 2480 MHz 1000 kHz 75 kHz DH1 data packet 25 kHz DH3 data packet 40 kHz DH5 data packet 40 kHz Drift rate 20 Hz 2402 920 TX initial carrier frequency tolerance TX carrier frequency drift Min - 75 GS-BT2416C2.H 5 Integrate firmware Integrate firmware The GS-BT2416C2.H includes Customer Framework up to HCI (Host Control Interface) Figure 1. HCI firmware implementation HCI Top resident on the Host HCI Physical HCI Bottom Serial Interface Layer UART, USB, … SCO channels – Synchronous Connection Oriented 5.1 AUDIO resident on the Host Controller HCI FIRMWARE LINK MANAGER Hardware Layer BASEBAND HW Set up the physical connection RF H W Host Control Interface Between lower and upper levels Set up, manage and secure the link: it’s responsible for paging, including ACL, SCO, inquiry, authentication, encryption, low consumption... Features The module with HCI embedded is interoperable with qualified BT stack protocols and suitable for any BT applications. 5.2 Command interface The HCI commands are accessible through the Serial Port using the Host Control SW or any HCI SW for example Bluesoleil (most popular Bluetooth PC open SW). 5.3 Usage scenarios The module with embedded HCI FW is completely open to any Custom implementation, strictly depending on the BT stack and profiles that will be added. Module can be configured both as master or slave. Master can support point to point connection or standard point to multi point Pico net up to seven points. 7/18 Application information 6 GS-BT2416C2.H Application information Here below there are some suggestions to better implement the module in the final application. ● Module is usually put on a motherboard, avoid that traces with switching signals are routed below the module. The best would be to have a ground plane underneath the module. ● Connect the supply voltage ground of the module with the other grounds present on the motherboard in a star way. ● Keep the RF ground separate from the module supply voltage ground; the two grounds are already connected inside the module in one point, see below a possible implementation. Figure 2. Module foot print Module foot print Supply voltage GND 8/18 RF gnd GS-BT2416C2.H 6.1 Application information Antenna reference RF output pin must be connected to an antenna which could be: Figure 3. ● Antenna directly printed on the pcb (Figure 4) ● Integrated antenna as, for example, Antenova 30-30-A5839-01 , Murata ANCV12G44SAA127, Pulse W3008 , Yageo CAN4311153002451K. (Figure 5) ● External antenna connected by means a SMA connector (Figure 6) Antenna on PCB Figure 4. Antenna examples Figure 5. SMA connector for external antenna ● Despite of the type of antenna chosen, the connection between the RF out pin and the antenna must be executed in such a way that the connection trace must be matched to have characteristic impedance (Z0) of 50 ohm to get the maximum power transfer. ● Matching for 50ohm is depending on the various factors , elements to be taken into consideration are: – Type of material, i.e. FR4 – The electrical characteristics of the material ,i.e. the εr , electric constant at 2.4GHz – Mechanical dimensions of the PCB and traces ,i.e. pcb thickness , trace/ reference ground thickness, trace width , trace thickness – Just to give an example , using a 1mm thick FR4 board , with an εr = 4.3 at 2.4GHz , with Cu thickness of 41 µm, the resulted width of 50ohm strip-line is 1.9 mm ( Microstrip type calculation). Figure 6. Parameters for trace matching Trace width PCB thickness Trace thickness εr (Dielectric constant) Reference ground Tools for calculating the characteristic impedance, based on the physical and mechanical characteristics of the pcb , can be easily found on the web. 9/18 Block diagram 7 GS-BT2416C2.H Block diagram Figure 7. UART Block diagram 32kHz XTAL 32kHz XTAL STLC2416 Baseband ARM7 proc STLC2150 Radio chip RF antenna USB PCM SPI I²C GPIO 10/18 Filter balun GS-BT2416C2.H Pin settings 8 Pin settings 8.1 Pin connections Figure 8. 8.2 Pin connection diagram Pin descriptions Table 7. Pin N° Pin descriptions Name I/O Description Power, Ground and system signal 42 Vss1 --- GND 41 Vdd --- Module supply voltage- Single 3.3V 23 RESET I Reset pin (active low) 24 BOOT I External downloading Enable (active low) internally pullupped to 1.8V by 10kohm 35 LP CLOCK OUT O 32kHz Out 6 INT1 I External Interrupt signal internally connected to VSS1 with 10K. / If not used connect to VSS1 General purpose signals 25 GPIO0 I/O General purpose I/O line 26 GPIO1 I/O General purpose I/O line 27 GPIO2 I/O General purpose I/O line 28 GPIO3 I/O General purpose I/O line 29 GPIO4 I/O General purpose I/O line 30 GPIO5 I/O General purpose I/O line 11/18 Pin settings GS-BT2416C2.H Table 7. Pin descriptions (continued) Pin N° Name I/O Description 31 GPIO6 I/O General purpose I/O line 32 GPIO7 I/O General purpose I/O line 33 GPIO8 I/O General purpose I/O line 34 GPIO9 I/O General purpose I/O line 36 GPIO11 I/O General purpose I/O line 37 GPIO12 I/O General purpose I/O line 38 GPIO13 I/O General purpose I/O line 39 GPIO14 I/O General purpose I/O line 40 GPIO15 I/O General purpose I/O line Test interface signals 1 TDI --- JTAG pin 4 TDO --- JTAG pin 2 TMS --- JTAG pin 3 NTRST --- JTAG pin 5 TCK --- JTAG pin If not used connect to VSS1 I2C interface signals 7 I2C_dat I/O I2C bus interface data To be connected to VDD with 10 K. resistor 8 I2C_clk I/O I2C bus interface clock To be connected to VDD with 10 K. resistor PCM interface signals 10 PCM_SYNC I/O PCM 8kHz synch 9 PCM_CLK 12 PCM_A I/O PCM Data In/Out 11 PCM_B I/O PCM Data In//Out I/O PCM clock USB interface signals 21 USB_DN I/O USB data - If not used connect to VSS1 22 USB_DP I/O USB data + If not used connect to VSS1 UART interface signals 12/18 13 UART2_RXD I UART2 data input If not used connect to VDD 14 UART2_TXD O UART2 data output 15 UART2_I1 I UART2 clear to send input If not used connect to VDD GS-BT2416C2.H Pin settings Table 7. Pin descriptions (continued) 16 UART2_02 O Pin N° Name I/O UART2 ready to send output Description SPI interface signals 17 SPI_FRM I/O Synchronous Serial Interface frame synch 18 SPI_CLK I/O Synchronous Serial Interface clock 19 SPI_TXD O/T Synchronous Serial Interface transmit data 20 SPI_RXD I 43 Vss2 ( RF GND) --- RF GND 44 +ANTENNA --- Antenna out 45 Vss2 (RF GND) --- RF GND Synchronous Serial Interface receive data If not used connect to VSS1 Antenna signals 13/18 Mechanical dimensions 9 GS-BT2416C2.H Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 9. 14/18 Mechanical dimensions GS-BT2416C2.H Mechanical dimensions Figure 10. Land pattern and connection diagram 15/18 Ordering information scheme 10 GS-BT2416C2.H Ordering information scheme Table 8. Ordering information scheme GS-BT Bluetooth modules V 1.2 compliant Class 2 HCI firmware 16/18 2416 C2 H GS-BT2416C2.H 11 Revision history Revision history Table 9. Document revision history Date Revision 04-Sep-2007 1 Changes First release 17/18 GS-BT2416C2.H Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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