STMICROELECTRONICS L6210

L6210
Dual Schottky diode bridge
Features
■
Monolithic array of eight Schottky diodes
■
High efficiency
■
4 A peak current
■
Low forward voltage
■
Fast recovery
■
Time two separated diode bridges
Description
PDIP 16
The L6210 is a monolithic IC containing eight
Schottky diodes arranged as two separated diode
bridges.
This diodes connection makes this device
versatile in many applications.
They are used particular in bipolar stepper motor
applications, where high efficient operation, due
to low forward voltage drop and fast reverse
recovery time, are required.
The L6210 is available in a 16 pin powerdip
package (12 + 2 + 2) designed for the 0 to 70°C
ambient temperature range.
Table 1. Device summary
April 2008
Order code
Package
Packing
E-L6210
PDIP 16
Tube
Rev 2
1/8
www.st.com
8
Contents
L6210
Contents
1
Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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L6210
1
Block and pin connection diagram
Block and pin connection diagram
Figure 1.
Block diagram
Figure 2.
Pin connection (top view)
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Electrical specifications
L6210
2
Electrical specifications
2.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
2.2
Parameter
Repetitive Forward Current Peak
2
A
VR
Peak Reverse Voltage (per diode)
50
V
TAMB
Operating Ambient Temperature
70
°C
TSTG
Storage Temperature Range
–55 to +150
°C
Thermal data
Thermal data
Symbol
Min.
Typ.
Max.
Unit
Thermal Impedance Junction-case
14
°C/W
RTH J-AMB
Thermal Impedance Junction-ambient without
External Heatsink
65
°C/W
Typ.
Max.
Unit
IF = 100 mA
0.65
0.8
V
IF = 500 mA
0.8
1
V
IF = 1 A
1
1.2
V
1
mA
Electrical characteristics
Symbol
VF
IL
4/8
Parameter
RTH J-CASE
Table 4.
Note:
Unit
IF
Table 3.
2.3
Value
Electrical characteristics
(TJ = 25°C unless otherwise specified)
Parameter
Forward Voltage Drop
Leakage Current
Test conditions
VR = 40 V, TAMB = 25 °C
Min.
At forward currents of greater than 1 A, a parasitic current of approximately 10 mA may be
collected by adiacent diodes.
L6210
3
Mounting instructions
Mounting instructions
The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper
area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4).
During soldering the pin temperature must not exceed 260°C and the soldering time must
not be longer then 12 s. The external heatsink or printed circuit copper area must be
connected to electrical ground.
Figure 3.
Example of PC board copper area which is used as heatsink
Figure 4.
Example of an external heatsink
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Package information
4
L6210
Package information
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 5.
PDIP 16 mechanical data and package dimensions
mm
inch
DIM.
MIN.
TYP.
A
MAX.
MIN.
TYP.
5.330
MAX.
0.2098
A1
0.380
A2
2.920
3.300
4.950 0.1150 0.1299 0.1949
b
0.360
0.460
0.560 0.0142 0.0181 0.0220
b2
1.140
1.520
1.780 0.0449 0.0598 0.0701
c
0.200
0.250
0.360 0.0079 0.0098 0.0142
D(*)
0.0150
18.670 19.180 19.690 0.7350 0.7551 0.7752
E
7.620
7.870
8.260 0.3000 0.3098 0.3252
E1(*)
6.100
6.350
7.110 0.2402 0.2500 0.2799
e
2.540
0.1000
e1
17.780
0.7000
eA
7.620
eB
L
OUTLINE AND
MECHANICAL DATA
0.3000
10.920
2.920
3.300
0.4299
3.810 0.1150 0.1299 0.1500
PDIP 16
(*)“D” and “E1” dimensions do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.25mm.
0015895_E
0015895 E
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L6210
5
Revision history
Revision history
Table 5.
Document revision history
Date
Revision
Changes
31-Jul-2003
1
Initial release.
23-Apr-2008
2
Package information updated.
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L6210
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