L6932H1.2 High performance 2A ULDO linear regulator Features ■ 2V to 14V input voltage range ■ 200mΩ rDS(on) max ■ 200µA quiescent current at any load ■ Excellent load and line regulation ■ Adjustable from 1.2V to 5V ■ 1% voltage regulation accuracy ■ Short circuit protection ■ Thermal shut down ■ HSOP8 package HSO-8 Description The L6932 Ultra Low Drop Output linear regulator operates from 2V to 14V and is able to support output current up to 2A. Designed with an internal 50mΩ N-channel Mosfet, it can be used for onboard DC-DC conversions saving in real estate, list of components, low noise generation and power dissipation. L6932H1.2 is available as adjustable version from 1.2V to 5V with a voltage regulation accuracy of 1%. The upper current limit is fixed at 2.5A to control the current in short circuit condition within ±8%. The current is sensed in the power mos in order to limit the power dissipation. Applications ■ Motherboards ■ Mobile PC ■ Hand-held instruments ■ PCMCIA Cards ■ Processors I/O ■ Chipset and RAM supply Figure 1. The device is also provided with a thermal shut down that limits the internal temperature at 150°C with a histeresys of 20°C. L6932H1.2 provides the Enable and the Power good functions. Typical operating circuit Vin=2V to 14V Vout=1.2V to 5V Vin Vout 2 EN 1 4 PGOOD L6932H1.2 5 C1 R3 R1 FB C2 3 6 GND 7 8 NC1 NC2 R2 Table 1. Device summary May 2007 Part number Package Packaging L6932H1.2 HSO-8 Tube L6932H1.2TR HSO-8 Tape and reel Rev 2 1/13 www.st.com 13 Contents L6932H1.2 Contents 1 2 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Typical electrical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Application informations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 6.1 Application circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.2 Demoboard layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.3 Component part list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Components selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.1 Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.2 Output capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.3 Loop Stability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 8 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 L6932H1.2 Pin settings 1 Pin settings 1.1 Pin connection Figure 2. 1.2 Pin connection (top view) EN 1 8 NC2 Vin 2 7 NC1 FB 3 6 GND Vout 4 5 PGOOD Pin description Table 2. Pin description Name Pin N° Description 1 EN Enables the device when connected to Vin and disables it when forced to GND. 2 VIN Supply voltage. This pin is connected to the drain of the internal N-mos. Connect this pin to a capacitor larger than 10µF. 3 FB Connecting this pin to a voltage divider it is possible to program the output voltage between 1.2V and 5V. 4 VOUT Regulated output voltage. This pin is connected to the source of the internal Nmos. Connect this pin to a capacitor of 10µF. 5 PGOOD Power good output. The pin is open drain and detects the output voltage. It is forced low if the output voltage is lower than 90% of the programmed voltage. 6 GND Ground pin 7, 8 NC1NC2 Internally not connected. 3/13 Maximum ratings L6932H1.2 2 Maximum ratings 2.1 Absolute maximum ratings Table 3. Absolute maximum ratings Symbol VIN 2.2 Parameter Value Unit VIN and PGOOD 14.5 V EN, OUT and ADJ -0.3 to (Vin +0.3) V Thermal data Table 4. Thermal data Symbol Parameter RthJA Maximum thermal resistance junction-ambient TMAX Maximum junction temperature TSTG Storage temperature range 1. Package mounted on board 3 Block diagram Figure 3. 4/13 Internal block diagram Value Unit (1) °C/W 34 150 °C -65 to 150 °C L6932H1.2 4 Electrical characteristics Electrical characteristics Table 5. Electrical characteristcs (TJ = 25°C, VIN = 5V unless otherwise specified) Symbol Parameter VIN Operating Supply Voltage VO Output voltage Line Regulation Load Regulation rDS(on) IOCC Test condition Max Unit Typ 14 V 1.212 V VIN = 2.5V ±10%; IO = 10mA 5 mV VIN = 3.3V ±10%; IO = 10mA 5 mV VIN = 5V ±10%; IO = 10mA 5 mV VIN = 3.3V; 0.1A < IO < 2A 15 mV 200 mΩ 2.5 2.7 A 0.2 0.4 mA 25 µA 2 IO = 0.1A; VIN = 3.3V 1.188 1.2 Drain Source ON resistance Current limiting 2.3 Iq Quiescent current Ish Shutdown current 2V < VIN < 14V (1) Ripple Rejection f = 120Hz, IO = 1A VIN = 5V, ∆VIN = 2Vpp Ven Min EN Input Threshold Pgood threshold Vo rise Pgood Hysteresis Pgood saturation Ipgood = 1mA 60 75 0.5 0.65 dB 0.8 V 90 %Vo 10 %Vo 0.2 0.4 V 1. Specification referred to T from -25°C to 125°C. 5/13 Typical electrical performance 5 6/13 L6932H1.2 Typical electrical performance Figure 4. Output voltage vs junction temperature Figure 6. Shutdown current vs junction temperature Figure 5. Quiescent current vs junction temperature L6932H1.2 Application information 6 Application information 6.1 Application circuit Figure 7. Demoboard application circuit Vin=2V to 14V Vout=1.2V to 5V Vin Vout 2 4 EN PGOOD L6932H1.2 1 5 C1 R3 R1 FB C2 3 6 GND 7 8 NC1 NC2 R2 1.2 V OUT = -------- × ( R 1 + R 2 ) R2 6.2 Demoboard layout Figure 8. Demoboard layout 7/13 Components selection 6.3 L6932H1.2 Component part list Table 6. Component par list Reference Part number Description Manufacturer C1 GRM32ER6C226KE20B 22Uf, 16V MURATA C2 GRM32ER6C226KE20B 22Uf, 16V MURATA R1 N.M. R2 0Ω R3 100K 7 Components selection 7.1 Input capacitor The input capacitor value depends on a lot of factors such as load transient requirements, input source (battery or DC/DC converter) and its distance from the input cap. Usually a 47µF is enough for any application but a much lower value can be sufficient in many cases. 7.2 Output capacitor The output capacitor choice depends basically on the load transient requirements. Tantalum, Special Polymer, POSCAP and aluminum capacitors are good and offer very low ESR values. Multilayer ceramic caps have the lowest ESR and can be required for particular applications. Nevertheless in several applications they are ok, the loop stability issue has to be considered (see loop stability section). Below a list of some suggested capacitor manufacturers Table 7. Suggested capacitor 8/13 Manufacturer Type Cap Value (µF) Rated Voltage (V) MURATA CERAMIC 1 to 47 4 to 16 PANASONIC CERAMIC 1 to 47 4 to 16 TAYO YUDEN CERAMIC 1 to 47 4 to 16 TDK CERAMIC 1 to 47 4 to 16 TOKIN CERAMIC 1 to 47 4 to 16 SANYO POSCAP 1 to 47 4 to 16 PANASONIC SP 1 to 47 4 to 16 KEMET TANTALUM 1 to 47 4 to 16 L6932H1.2 7.3 Components selection Loop Stability The stability of the loop is affected by the zero introduced by the output capacitor. The time constant of the zero is given by: T = ESR × C OUT 1 F ZERP = ---------------------------------------------2π × ESR × C OUT This zero helps to increase the phase margin of the loop until the time constant is higher than some hundreds of nsec, depending also on the output voltage and current. So, using very low ESR ceramic capacitors could produce oscillations at the output, in particular when regulating high output voltages (adjustable version). To solve this issue is sufficient to add a small capacitor (e.g. 1nF to 10nF) in parallel to the high side resistor of the external divider, as shown in Figure 9. Figure 9. Compensation network Vin=2V to 14V Vin Vout=1.2V to 5V Vout 2 EN 1 4 PGOOD L6932H1.2 C1 C3 R3 R1 5 FB C2 3 6 GND 7 8 NC1 NC2 R2 The thermal resistance junction to ambient of the demoboard is approximately 34°C/W. This mean that, considering an ambient temperature of 60°C and, a maximum junction temperature of 150°C, the maximum power that the device can handle is 2.7W. This means that the device is able to deliver a DC output current of 2A only with a very low dropout. 9/13 Package mechanical data 8 L6932H1.2 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/13 L6932H1.2 Package mechanical data Table 8. HSO-8 Mechanical data mm. inch Dim. Min Typ Max Min Typ Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.04 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 D1 E 3.1 3.80 0.122 4.00 0.150 0.157 E1 2.4 0.094 e 1.27 0.050 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 k ddd 8° (max.) 0.1 0.04 Figure 10. Package dimensions 11/13 Revision history 9 L6932H1.2 Revision history Table 9. Revision history 12/13 Date Revision Changes 23-Jun-2006 1 First release 07-May-2007 2 Final release, mechanical data pad size updated L6932H1.2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 13/13