STMICROELECTRONICS LIS331ALTR

LIS331AL
MEMS inertial sensor:
3-axis - ±2g analog output “nano” accelerometer
Features
■
Single voltage supply operation
■
±2.0g full-scale
■
Output voltage, offset and sensitivity are
ratiometric to the supply voltage
■
Factory trimmed device sensitivity and offset
■
Embedded self test
■
ECOPACK® lead-free compliant
■
High shock survivability (10000g)
LGA 16 (3x3x1.0mm)
process developed by ST to produce inertial
sensors and actuators in silicon.
The IC interface is manufactured using a CMOS
process that allows high level of integration to
Applications
■
Mobile terminals
■
Gaming and virtual reality input devices
■
Antitheft systems and Inertial Navigation
■
Appliance and robotics
Description
The LIS331AL is the smallest consumer lowpower three-axis linear accelerometer that
includes a sensing element and an IC interface
able to take the information from the sensing
element and to provide an analog signal to the
external world.
design a dedicated circuit which is trimmed to
better match the sensing element characteristics.
The LIS331AL is capable of measuring
accelerations over a maximum bandwidth of
2.0kHz. The device bandwidth may be reduced by
using external capacitances. A self-test capability
allows the user to check the functioning of the
system.
The LIS331AL is available in Land Grid Array
package (LGA) and it is guaranteed to operate
over an extended temperature range of -40°C to
+85°C.
The sensing element, capable of detecting the
acceleration, is manufactured using a dedicated
Table 1.
Note:
Device summary
Order code
Temp range, ° C
Package
Packing
LIS331AL
-40°C to +85°C
LGA-16
Tray
LIS331ALTR
-40°C to +85°C
LGA-16
Tape & Reel
Tape & Reel parts are compliant to International Standard EIA-481.
September 2007
Rev 1
1/16
www.st.com
16
Contents
LIS331AL
Contents
1
2
3
4
Block diagram & pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Mechanical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.1
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.2
IC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.3
Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1
Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2
Output Response vs. Orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/16
LIS331AL
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
LIS331AL Electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output Response vs. Orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
LGA 16: Mechanical data & package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3/16
List of tables
LIS331AL
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
4/16
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Filter capacitor selection, Cload (x,y,z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
LIS331AL
Block diagram & pins description
1
Block diagram & pins description
1.1
Block diagram
Figure 1.
Block diagram
X+
CHARGE
AMPLIFIER
Y+
Z+
a
MUX
Routx
Voutx
Routy
Vouty
Routz
Voutz
S/H
DEMUX
S/H
ZYX-
S/H
Pd
TRIMMING
SELF TEST
REFERENCE
CLOCK
CIRCUIT
ST
1.2
Pin description
Figure 2.
Pin connection
13
Y
X
Z
Direction of the detectable
accelerations
1
Voutx
NC
Vouty
NC
Voutz
res
res
NC
ST
PD
9
5
GND
NC
NC
(Top view)
Vdd
res
NC
1
(Bottom view)
5/16
Block diagram & pins description
Table 2.
6/16
LIS331AL
Pin description
Pin #
Pin name
Function
1
res
Connect to Vdd
2
res
Connect to Vdd
3
NC
Not Connected
4
ST
Self Test (Logic 0: normal mode; Logic 1: Self-Test mode)
5
PD
6
GND
0V supply
7
NC
Not connected
8
NC
Not connected
9
Voutz
Output voltage Z channel
10
NC
Not connected
11
Vouty
Output voltage Y channel
12
NC
Not connected
13
Voutx
Output voltage X channel
14
NC
Not connected
15
res
Connect to Vdd
16
Vdd
Power supply
Power Down (Logic 0: normal mode; Logic 1: Power-Down mode)
LIS331AL
Mechanical and electrical specifications
2
Mechanical and electrical specifications
2.1
Mechanical characteristics.
Table 3.
Mechanical characteristics(1) (2)
Symbol
Parameter
Ar
Acceleration range(4)
So
Sensitivity(5)
SoDr
Sensitivity change vs
temperature
Voff
Zero-g level(5)
OffDr
NL
Test condition
Typ.(3)
Min.
Max.
Unit
±2.0
0.145*Vdd 5%
0.145*Vdd
g
0.145Vdd+
5%
V/g
±0.01
Delta from +25°C
Vdd/2-6%
Vdd/2
%/°C
Vdd/2+6%
V
Zero-g level change Vs
Delta from +25°C
Temperature
0.5
mg/°C
Non linearity(6)
±0.5
% FS
±2
%
300
µg/ Hz
+150
mV
+150
mV
+150
mV
CrossAx Cross-axis
Best fit straight line
(7)
An
Acceleration noise
density
Vt
X axis
Self test output voltage
Y axis
change(8)
Z axis
Fres
Sensing element
resonant frequency(9)
Top
Operating temperature
range
Wh
Product weight
X,Y,Z axis
2.0
kHz
-40
+85
0.030
°C
gram
1. The product is factory calibrated at 3.3V. The operational power supply range is from 3.0V to 3.6V. Voff, So and Vt
parameters will vary with supply voltage.
2. Temperature range -40°C to +85°C. All the parameters are specified @ Vdd =3.3V, T = 25°C unless otherwise noted
3. Typical specifications are not guaranteed
4. Guaranteed by wafer level test and measurement of initial offset and sensitivity
5. Zero-g level and sensitivity are essentially ratiometric to supply voltage at the calibration level ±8%
6. Guaranteed by design
7. Contribution to the measuring output of an inclination/acceleration along any perpendicular axis
8. “Self test output voltage change” is defined as Vout(Vst=Logic1)-Vout(Vst=Logic0)
9. Minimum resonance frequency Fres=2.0kHz. Sensor bandwidth=1/(2*π*32kΩ*Cload)
7/16
Mechanical and electrical specifications
2.2
Electrical characteristics
Table 4.
Electrical characteristics (1) (2)
Symbol
Parameter
Test condition
LIS331AL
Min.
Typ(3).
Max.
Unit
3.0
3.3
3.6
V
Vdd
Supply voltage
Idd
Supply current
Mean value
PD pin connected to GND
0.65
mA
Supply current in
power down mode
PD pin connected to Vdd
1
µA
IddPdn
Vst
Logic 0 level
0
0.8
V
Logic 1 level
2.0
Vdd
V
Self test input
Rout
Output impedance of
Voutx, Vouty, Voutz
Ton
Turn-On time at exit
from power down
mode
Cload in µF
32
kΩ
160*Cload+0.3
ms
1. The product is factory calibrated at 3.3V
2. Temperature range -40°C to +85°C. All the parameters are specified @ Vdd =3.3V, T=25°C unless otherwise noted
3. Typical specifications are not guaranteed
Note:
8/16
Minimum resonance frequency Fres=2.0kHz. Device bandwidth=1/(2*π*32kΩ*Cload)
LIS331AL
2.3
Mechanical and electrical specifications
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 5.
Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin (ST,PD)
Maximum value
Unit
-0.3 to 6
V
-0.3 to Vdd +0.3
V
3000g for 0.5 ms
APOW
Acceleration (any axis, powered, Vdd=3.3V)
AUNP
Acceleration (any axis, not powered)
10000g for 0.1 ms
3000g for 0.5 ms
ESD
TSTG
10000g for 0.1 ms
Electrostatic discharge protection
Storage temperature range
4.0 (HBM)
kV
1.5 (CDM)
kV
400 (MM)
V
-40 to +125
°C
This is a mechanical shock sensitive device, improper handling can cause permanent
damages to the part
This is an ESD sensitive device, improper handling can cause permanent damages to
the part
2.4
Terminology
Sensitivity describes the gain of the sensor and can be determined by applying 1g
acceleration to it. As the sensor can measure DC accelerations this can be done easily by
pointing the axis of interest towards the center of the earth, note the output value, rotate the
sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1g
acceleration to the sensor. Subtracting the larger output value from the smaller one and
dividing the result by 2 will give the actual sensitivity of the sensor. This value changes very
little over temperature (see sensitivity change vs. temperature) and also very little over time.
The Sensitivity Tolerance describes the range of Sensitivities of a large population of
sensors.
Zero-g level describes the actual output signal if there is no acceleration present. A sensor
in a steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis whereas
the Z axis will measure +1g. The output is ideally for a 3.3V powered sensor Vdd/2 =
1650mV. A deviation from ideal 0-g level (1650mV in this case) is called Zero-g offset. Offset
of precise MEMS sensors is to some extend a result of stress to the sensor and therefore
the offset can slightly change after mounting the sensor onto a printed circuit board or
exposing it to extensive mechanical stress. Offset changes little over temperature - see
“Zero-g level change vs. temperature” - the Zero-g level of an individual sensor is very stable
9/16
Mechanical and electrical specifications
LIS331AL
over lifetime. The Zero-g level tolerance describes the range of Zero-g levels of a population
of sensors.
Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic
mass to be moved by means of an electrostatic test-force. The Self Test function is off when
the ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force is applied
to the sensor, simulating a definite input acceleration. In this case the sensor outputs will
exhibit a voltage change in their DC levels which is depending on the Supply Voltage
through the device sensitivity. When ST is activated, the device output level is given by the
algebraic sum of the signals produced by the acceleration acting on the sensor and by the
electrostatic test-force. If the output signals change within the amplitude specified inside
Table 3, than the sensor is working properly and the parameters of the interface chip are
within the defined specification.
Output impedance describes the resistor inside the output stage of each channel. This
resistor is part of a filter consisting of an external capacitor of at least 2.5nF and the internal
resistor. Due to the resistor level, only small inexpensive external capacitors are needed to
generate low corner frequencies. When interfacing with an ADC it is important to use high
input impedance input circuitries to avoid measurement errors. Note that the minimum load
capacitance forms a corner frequency close to the resonance frequency of the sensor. In
general the smallest possible bandwidth for a particular application should be chosen to get
the best results.
10/16
LIS331AL
3
Functionality
Functionality
The LIS331AL is a nano low-power, analog output three-axis linear accelerometer packaged
in a LGA package. The complete device includes a sensing element and an IC interface
able to take the information from the sensing element and to provide an analog signal to the
external world.
3.1
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The
technology allows to carry out suspended silicon structures which are attached to the
substrate in a few points called anchors and are free to move in the direction of the sensed
acceleration. To be compatible with the traditional packaging techniques a cap is placed on
top of the sensing element to avoid blocking the moving parts during the moulding phase of
the plastic encapsulation.
When an acceleration is applied to the sensor the proof mass displaces from its nominal
position, causing an imbalance in the capacitive half-bridge. This imbalance is measured
using charge integration in response to a voltage pulse applied to the sense capacitor.
At steady state the nominal value of the capacitors are few pF and when an acceleration is
applied the maximum variation of the capacitive load is in fF range.
3.2
IC Interface
The complete signal processing uses a fully differential structure, while the final stage
converts the differential signal into a single-ended one to be compatible with the external
world.
The first stage is a low-noise capacitive amplifier that implements a Correlated Double
Sampling (CDS) at its output to cancel the offset and the 1/f noise. The produced signal is
then sent to three different S&Hs, one for each channel, and made available to the outside.
All the analog parameters (output offset voltage and sensitivity) are ratiometric to the
voltage supply. Increasing or decreasing the voltage supply, the sensitivity and the offset will
increase or decrease linearly. The feature provides the cancellation of the error related to
the voltage supply along an analog to digital conversion chain.
3.3
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).
The trimming values are stored inside the device by a non volatile structure. Any time the
device is turned on, the trimming parameters are downloaded into the registers to be
employed during the normal operation. This allows the user to employ the device without
further calibration.
11/16
Application hints
4
LIS331AL
Application hints
Figure 3.
LIS331AL electrical connection
Vdd
GND
GND
100nF
10µF
1
Pin 1 indicator
Y
X
16 15 14
Cload x
13
1
2
3
ST
PD
LIS331AL
(top view)
12 Cload y
11
4
10
5
9
7
6
Vout x
Optional
Z
Vout y
Cload z
Vout z
(Top view)
Direction of the
detectable
accelerations
8
GND
Digital signals
Power supply decoupling capacitors (100 nF ceramic or polyester + 10 µF aluminum) should
be placed as near as possible to the device (common design practice).
The LIS331AL allows to band limit Voutx, Vouty and Voutz through the use of external
capacitors. The recommended frequency range spans from DC up to 2.0 kHz. In particular,
capacitors are added at output Voutx, Vouty, Voutz pins to implement low-pass filtering for
antialiasing and noise reduction. The equation for the cut-off frequency (ft) of the external
filters is in this case:
1
f t = -----------------------------------------------------------------------2π ⋅ R out ⋅ C load ( x, y, z )
Taking into account that the internal filtering resistor (Rout) has a nominal value equal to 32
kΩ, the equation for the external filter cut-off frequency may be simplified as follows:
5µF
f t = --------------------------------------- [ Hz ]
C load ( x, y, z )
The tolerance of the internal resistor can vary typically of ±20% within its nominal value of 32
kΩ; thus the cut-off frequency will vary accordingly. A minimum capacitance of 2.5 nF for
Cload(x, y, z) is required.
Table 6.
12/16
Filter capacitor selection, Cload (x,y,z)
Cut-off frequency
Capacitor value
1 Hz
5 µF
10 Hz
0.5µF
20 Hz
250nF
50 Hz
100nF
LIS331AL
Application hints
Table 6.
4.1
Filter capacitor selection, Cload (x,y,z)
Cut-off frequency
Capacitor value
100 Hz
50nF
200 Hz
25nF
500 Hz
10nF
Soldering information
The LGA package is compliant with the ECOPACK®, RoHs and “Green” standard. Pin1
indicator is electrically connected to pin 1. Leave pin 1 indicator unconnected during
soldering.
4.2
Output response vs. orientation
Figure 4.
Output Response vs. Orientation
X=1.65V (0g)
Y=2.13V (+1g)
Z=1.65V (0g)
Bottom
X=2.13V (+1g)
Y=1.65V (0g)
Z=1.65V (0g)
TOP VIEW
X=1.65V (0g)
Y=1.17V (-1g)
Z=1.65V (0g)
X=1.17V (-1g)
Y=1.65V (0g)
Z=1.65V (0g)
Top
Top
X=1.65V (0g)
Y=1.65V (0g)
Z=2.13V (+1g)
X=1.65V (0g)
Y=1.65V (0g)
Bottom Z=1.17V (-1g)
Earth’s Surface
Figure 4 refers to LIS331AL powered at 3.3V.
13/16
Package information
5
LIS331AL
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK® is an ST trademark.
ECOPACK® specifications are available at: www.st.com.
Figure 5.
LGA 16: mechanical data & package dimensions
DIMENSIONS
REF.
MIN.
A1
mm
inch
TYP. MAX. MIN.
TYP.
1
A2
0.031
0.20
0.008
D1
2.850
3
3.150
0.111
0.117
0.123
E1
2.850
3
3.150
0.111
0.117
0.123
L1
Outline and
mechanical data
0.039
0.80
A3
MAX.
1
0.039
L2
2
0.078
N1
0.50
0.019
N2
1
0.039
T1
0.350
0.013
T2
0.250
0.001
M
0.10
0.0039
P1
0.875
0.034
P2
1.275
0.05
k
0.05
0.0019
LGA 16 (3x3x1.0mm)
7983231E
14/16
LIS331AL
6
Revision history
Revision history
Table 7.
Document revision history
Date
Revision
28-Sep-2007
1
Changes
Initial release.
15/16
LIS331AL
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