TI TPIC6C595

TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
D
D
D
D
D
D
D
D
Low rDS(on) . . . 7 Ω Typ
Avalanche Energy . . . 30 mJ
Eight Power DMOS Transistor Outputs of
100-mA Continuous Current
250-mA Current Limit Capability
ESD Protection . . . 2500 V
Output Clamp Voltage . . . 33 V
Devices Are Cascadable
Low Power Consumption
D OR N PACKAGE
(TOP VIEW)
VCC
SER IN
DRAIN0
DRAIN1
DRAIN2
DRAIN3
CLR
G
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
GND
SRCK
DRAIN7
DRAIN6
DRAIN5
DRAIN4
RCK
SER OUT
description
The TPIC6C595 is a monolithic, medium-voltage,
low-current power 8-bit shift register designed for
use in systems that require relatively moderate
load power such as LEDs. The device contains a
built-in voltage clamp on the outputs for inductive
transient protection. Power driver applications
include relays, solenoids, and other low-current or
medium-voltage loads.
logic symbol†
G
RCK
CLR
SRCK
SER IN
8
EN3
10
7
15
2
C2
R
SRG8
C1
1D
2
3
4
DRAIN0
DRAIN1
This device contains an 8-bit serial-in, parallel-out
5
DRAIN2
shift register that feeds an 8-bit D-type storage
6
DRAIN3
register. Data transfers through both the shift and
11
storage registers on the rising edge of the shift
DRAIN4
12
register clock (SRCK) and the register clock
DRAIN5
13
(RCK), respectively. The device transfers data out
DRAIN6
the serial output (SER OUT) port on the rising
14
DRAIN7
2
edge of SRCK. The storage register transfers data
9
SER OUT
to the output buffer when shift register clear (CLR)
is high. When CLR is low, the input shift register is
† This symbol is in accordance with ANSI/IEEE Std 91-1984
cleared. When output enable (G) is held high, all
and IEC Publication 617-12.
data in the output buffers is held low and all drain
outputs are off. When G is held low, data from the storage register is transparent to the output buffers. When
data in the output buffers is low, the DMOS transistor outputs are off. When data is high, the DMOS transistor
outputs have sink-current capability. The SER OUT allows for cascading of the data from the shift register to
additional devices.
This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These
circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C,
Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated
voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device
should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level,
preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for
Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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1
TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
description (continued)
Outputs are low-side, open-drain DMOS transistors with output ratings of 33 V and 100 mA continuous
sink-current capability. Each output provides a 250-mA maximum current limit at TC = 25°C. The current limit
decreases as the junction temperature increases for additional device protection. The device also provides up
to 2500 V of ESD protection when tested using the human-body model and 200 V machine model.
The TPIC6C595 is characterized for operation over the operating case temperature range of – 40°C to 125°C.
logic diagram (positive logic)
G 8
10
RCK
7
CLR
3
D
SRCK
SER IN
15
2
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
C1
D
C2
CLR
CLR
D
D
C2
CLR
C1
CLR
4
5
6
11
12
13
14
16
9
2
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SER OUT
DRAIN0
DRAIN1
DRAIN2
DRAIN3
DRAIN4
DRAIN5
DRAIN6
DRAIN7
GND
TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
schematic of inputs and outputs
EQUIVALENT OF EACH INPUT
TYPICAL OF ALL DRAIN OUTPUTS
VCC
DRAIN
33 V
Input
25 V
20 V
12 V
GND
GND
absolute maximum ratings over recommended operating case temperature range (unless
otherwise noted)†
Logic supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Logic input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 7 V
Power DMOS drain-to-source voltage, VDS (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Continuous source-to-drain diode anode current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mA
Pulsed source-to-drain diode anode current (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA
Pulsed drain current, each output, all outputs on, ID, TC = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . 250 mA
Continuous drain current, each output, all outputs on, ID, TC = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Peak drain current single output, IDM,TC = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mA
Single-pulse avalanche energy, EAS (see Figure 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mJ
Avalanche current, IAS (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mA
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C
Operating case temperature range, TC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to GND.
2. Each power DMOS source is internally connected to GND.
3. Pulse duration ≤ 100 µs and duty cycle ≤ 2%.
4. DRAIN supply voltage = 15 V, starting junction temperature (TJS) = 25°C, L = 1.5 H, IAS = 200 mA (see Figure 4).
DISSIPATION RATING TABLE
PACKAGE
TC ≤ 25°C
POWER RATING
D
N
DERATING FACTOR
ABOVE TC = 25°C
TC = 125°C
POWER RATING
1087 mW
8.7 mW/°C
217 mW
1470 mW
11.7 mW/°C
294 mW
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
recommended operating conditions
Logic supply voltage, VCC
High-level input voltage, VIH
MIN
MAX
4.5
5.5
UNIT
V
0.85 VCC
Low-level input voltage, VIL
V
0.15 VCC
V
250
mA
Pulsed drain output current, TC = 25°C, VCC = 5 V, all outputs on (see Notes 3 and 5 and Figure 11)
Setup time, SER IN high before SRCK↑, tsu (see Figure 2)
20
ns
Hold time, SER IN high after SRCK↑, th (see Figure 2)
20
ns
Pulse duration, tw (see Figure 2)
40
Operating case temperature, TC
– 40
ns
°C
125
electrical characteristics, VCC = 5 V, TC = 25°C (unless otherwise noted)
PARAMETER
V(BR)DSX
VSD
TEST CONDITIONS
Drain-to-source breakdown voltage
Source-to-drain diode forward voltage
ID = 1 mA
IF = 100 mA
TYP
33
37
0.85
VOH
High level output voltage,
voltage SER OUT
High-level
IOH = – 20 µA,
IOH = – 4 mA,
VOL
Low level output voltage,
Low-level
voltage SER OUT
IOL = 20 µA,
IOL = 4 mA,
VCC = 4.5 V
VCC = 4.5 V
IIH
IIL
High-level input current
VCC = 5.5 V,
VCC = 5.5 V,
VI = VCC
VI = 0
Low-level input current
MIN
VCC = 4.5 V
VCC = 4.5 V
4.4
4.49
4
4.2
0.5
150
500
5
1.2
IN
Nominal current
VDS(on) = 0.5 V,
TC = 85°C,
VDS = 30 V,
IN = ID,
See Notes 5, 6, and 7
90
IDSX
Off-state drain current
VCC = 5.5 V
VCC = 5.5 V,
ID = 50 mA,
VCC = 4.5 V
See Notes 5 and 6
and Figures 7 and 8
ID = 100 mA,
VCC = 4.5 V
NOTES: 3.
5.
6.
7.
4
µA
All outputs on
CL = 30 pF,
See Figures 2 and 6
ID = 50 mA,
TC = 125°C,
VCC = 4.5 V
µA
200
fSRCK = 5 MHz,
All outputs off,
Static drain-source on-state resistance
1
20
Logic supply current at frequency
V
–1
All outputs off
ICC(FRQ)
V
V
0.1
5V
VCC = 5
5.5
rDS(on)
1.2
0.3
Logic supply current
UNIT
V
0.005
ICC
VDS = 30 V,
TC = 125°C
MAX
µA
mA
mA
0.1
5
0.15
8
6.5
9
9.9
12
6.8
10
µA
Ω
Pulse duration ≤ 100 µs and duty cycle ≤ 2%.
Technique should limit TJ – TC to 10°C maximum.
These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.
Nominal current is defined for a consistent comparison between devices from different sources. It is the current that produces a
voltage drop of 0.5 V at TC = 85°C.
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
switching characteristics, VCC = 5 V, TC = 25°C
PARAMETER
TEST CONDITIONS
tPLH
tPHL
Propagation delay time, low-to-high-level output from G
tpd
Propagation delay time, SRCK to SEROUT
tr
tf
ta
trr
Reverse-recovery-current rise time
MIN
TYP
MAX
UNIT
80
ns
50
ns
20
ns
Rise time, drain output
100
ns
Fall time, drain output
80
ns
Propagation delay time, high-to-low-level output from G
CL = 30 pF,
F
ID = 75 mA,
A
See Figures 1
1, 2,
2 and 9
IF = 100 mA,,
di/dt = 10 A/µs,
µ ,
See Notes 5 and 6 and Figure 3
Reverse-recovery time
100
ns
120
NOTES: 5. Technique should limit TJ – TC to 10°C maximum.
6. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.
thermal resistance
PARAMETER
RθJA
TEST CONDITIONS
D package
Thermal resistance,
resistance junction-to-ambient
junction to ambient
MIN
115
All 8 outputs with equal power
N package
MAX
85
UNIT
°C/W
PARAMETER MEASUREMENT INFORMATION
5V
15 V
7
1
7
15
Word
Generator
(see Note A)
2
10
8
CLR
SRCK
5
4
3
2
1
0
DRAIN
3 – 6,
11 –14
Output
G
0V
5V
SER IN
CL = 30 pF
(see Note B)
RCK
5V
G
RL = 200 Ω
DUT
5V
0V
ID
VCC
SER IN
6
SRCK
0V
5V
RCK
0V
5V
CLR
0V
GND
16
15 V
DRAIN1
0.5 V
VOLTAGE WAVEFORMS
TEST CIRCUIT
NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 300 ns, pulsed repetition rate (PRR) = 5 kHz,
ZO = 50 Ω.
B. CL includes probe and jig capacitance.
Figure 1. Resistive-Load Test Circuit and Voltage Waveforms
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
PARAMETER MEASUREMENT INFORMATION
5V
G
5V
50%
50%
0V
15 V
tPLH
tPHL
1
7
15
Word
Generator
(see Note A)
2
10
8
VCC
CLR
SRCK
Output
ID
RL = 200 Ω
3 – 6,
11 –14
DUT
10%
tr
Output
0.5 V
tf
SWITCHING TIMES
CL = 30 pF
(see Note B)
RCK
G
10%
DRAIN
SER IN
24 V
90%
90%
GND
5V
50%
SRCK
0V
tsu
16
th
5V
TEST CIRCUIT
SER IN
50%
50%
0V
tw
INPUT SETUP AND HOLD WAVEFORMS
NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, tw = 300 ns, pulsed repetition rate (PRR) = 5 kHz,
ZO = 50 Ω.
B. CL includes probe and jig capacitance.
Figure 2. Test Circuit, Switching Times, and Voltage Waveforms
TP K
DRAIN
0.1 A
2500 µF
250 V
Circuit
Under
Test
di/dt = 10 A/µs
+
L = 0.85 mH
IF
(see Note A)
15 V
IF
–
TP A
0
25% of IRM
t2
t1
t3
Driver
IRM
RG
VGG
(see Note B)
ta
50 Ω
trr
TEST CIRCUIT
CURRENT WAVEFORM
NOTES: A. The DRAIN terminal under test is connected to the TP K test point. All other terminals are connected together and connected to the
TP A test point.
B. The VGG amplitude and RG are adjusted for di/dt = 10 A/µs. A VGG double-pulse train is used to set IF = 0.1 A, where t1 = 10 µs,
t2 = 7 µs, and t3 = 3 µs.
Figure 3. Reverse-Recovery-Current Test Circuit and Waveforms of Source-to-Drain Diode
6
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
PARAMETER MEASUREMENT INFORMATION
5V
15 V
tw
1
7
CLR
30 Ω
VCC
Word
Generator
(see Note A)
2
10
8
DUT
See Note B
1.5 H
SER IN
3 – 6,
11 –14
0V
IAS = 200 mA
ID
VDS
DRAIN
RCK
G
5V
Input
ID
15 SRCK
tav
GND
V(BR)DSX = 33 V
MIN
VDS
16
VOLTAGE AND CURRENT WAVEFORMS
SINGLE-PULSE AVALANCHE ENERGY TEST CIRCUIT
NOTES: A. The word generator has the following characteristics: tr ≤ 10 ns, tf ≤ 10 ns, ZO = 50 Ω.
B. Input pulse duration, tw, is increased until peak current IAS = 200 mA.
Energy test level is defined as EAS = IAS × V(BR)DSX × tav/2 = 30 mJ.
Figure 4. Single-Pulse Avalanche Energy Test Circuit and Waveforms
TYPICAL CHARACTERISTICS
PEAK AVALANCHE CURRENT
vs
TIME DURATION OF AVALANCHE
SUPPLY CURRENT
vs
FREQUENCY
1
6
VCC = 5 V
TC = – 40°C to 125°C
5
0.4
I CC – Supply Current – mA
IAS – Peak Avalanche Current – A
TC = 25°C
0.2
0.1
0.04
3
2
1
0.02
0.01
0.1
4
0.2
0.4
1
2
4
10
0
0.1
tav – Time Duration of Avalanche – ms
1
10
100
f – Frequency – MHz
Figure 5
Figure 6
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
TYPICAL CHARACTERISTICS
STATIC DRAIN-TO-SOURCE ON-STATE RESISTANCE
vs
LOGIC SUPPLY VOLTAGE
30
VCC = 5 V
See Note A
25
TC = 125°C
20
15
10
TC = 25°C
5
TC = – 40°C
0
50
70
90
110
130
150
170
250
190
r DS(on) – Static Drain-to-Source On-State Resistance – Ω
r DS(on) – Drain-to-Source On-State Resistance – Ω
DRAIN-TO-SOURCE ON-STATE RESISTANCE
vs
DRAIN CURRENT
12
TC = 125°C
10
8
TC = 25°C
6
4
TC = – 40°C
2
0
4
4.5
5
5.5
Figure 8
Figure 7
SWITCHING TIME
vs
CASE TEMPERATURE
140
ID = 75 mA
See Note A
tr
Switching Time – ns
120
100
tr
80
tPLH
60
tPHL
40
20
0
–50
6
6.5
VCC – Logic Supply Voltage – V
ID – Drain Current – mA
–25
50
75
100
0
25
TC – Case Temperature – °C
Figure 9
NOTE A: Technique should limit TJ – TC to 10°C maximum.
8
ID = 50 mA
See Note A
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7
TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
THERMAL INFORMATION
MAXIMUM PEAK DRAIN CURRENT
OF EACH OUTPUT
vs
NUMBER OF OUTPUTS CONDUCTING
SIMULTANEOUSLY
I D – Maximum Continuous Drain Current
of Each Output – A
0.25
VCC = 5 V
0.2
0.15
0.1
0.05
TC = 25°C
TC = 100°C
TC = 125°C
0
1
2
3
4
5
6
7
8
N – Number of Outputs Conducting Simultaneously
I D – Maximum Peak Drain Current of Each Output – A
MAXIMUM CONTINUOUS
DRAIN CURRENT OF EACH OUTPUT
vs
NUMBER OF OUTPUTS CONDUCTING
SIMULTANEOUSLY
0.3
d = 10%
0.25
d = 20%
0.2
d = 50%
0.15
d = 80%
0.1
VCC = 5 V
TC = 25°C
d = tw/tperiod
= 1 ms/tperiod
0.05
0
1
2
3
4
5
6
7
8
N – Number of Outputs Conducting Simultaneously
Figure 10
Figure 11
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TPIC6C595
POWER LOGIC 8-BIT SHIFT REGISTER
SLIS061A – JULY 1998 – REVISED JULY 1999
THERMAL INFORMATION
D PACKAGE†
NORMALIZED JUNCTION - TO -AMBIENT THERMAL RESISTANCE
vs
PULSE DURATION
R θJA – Normalized Junction-to-Ambient Thermal Resistance – °C/W
10
DC Conditions
1
d = 0.5
d = 0.2
d = 0.1
0.1
d = 0.05
d = 0.02
d = 0.01
0.01
Single Pulse
0.001
tc
tw
ID
0
0.0001
0.0001
0.001
0.01
0.1
tw – Pulse Duration – s
† Device mounted on FR4 printed-circuit board with no heat sink
NOTES: ZθA(t) = r(t) RθJA
tw = pulse duration
tc = cycle time
d = duty cycle = tw/tc
Figure 12
10
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10
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Copyright  2000, Texas Instruments Incorporated