STMICROELECTRONICS ST13009

ST13009
High voltage fast-switching
NPN power transistor
Features
■
Low spread of dynamic parameters
■
High voltage capability
■
Minimum lot-to-lot spread for reliable operation
■
Very high switching speed
Applications
3
1
■
2
Switch mode power supplies
TO-220
Description
The device is manufactured using high voltage
multi-epitaxial planar technology for high
switching speeds and medium voltage capability.
It uses a Hollow emitter structure to enhance
switching speeds.
Table 1.
Figure 1.
Internal schematic diagram
Device summary
Order code
Marking (1)
Package
Packaging
ST13009
13009 L
13009 H
TO-220
Tube
1. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to ship either
groups according to production availability. Please contact your nearest STMicroelectronics sales office for delivery details.
August 2007
Rev 2
1/11
www.st.com
11
Contents
ST13009
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2/11
ST13009
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum rating
Symbol
Parameter
Value
Unit
VCEV
Collector-emitter voltage (VBE = -1.5 V)
700
V
VCEO
Collector-emitter voltage (IB = 0)
400
V
VEBO
Emitter-base voltage (IC = 0)
12
V
Collector current
12
A
Collector peak current (tP < 5ms)
24
A
Base current
6
A
IBM
Base peak current (tP < 5ms)
12
A
Ptot
Total dissipation at Tc = 25°C
100
W
Tstg
Storage temperature
-65 to 150
°C
150
°C
Value
Unit
1.25
°C/W
IC
ICM
IB
TJ
Table 3.
Symbol
Rthj-case
Max. operating junction temperature
Thermal data
Parameter
Thermal resistance junction-case
____M
__mMax
3/11
Electrical characteristics
2
ST13009
Electrical characteristics
(Tcase = 25°C unless otherwise specified)
Table 4.
Symbol
Electrical characteristics
Parameter
ICEV
Collector cut-off current
(VBE = -1.5 V)
IEBO
Emitter cut-off current
(IC = 0)
Collector-emitter
VCEO(sus) (1) sustaining voltage
(IB = 0)
VCE(sat) (1)
VBE(sat) (1)
hFE (1)(2)
Collector-emitter
saturation voltage
Base-emitter saturation
voltage
DC current gain
Test Conditions
ts
Storage time
tf
Fall time
Typ.
VCE = 700 V
VCE = 700 V
TC = 100°C
VEB = 10 V
IC = 10 mA
_
IC = 5 A
_ _
Unit
10
500
µA
µA
10
µA
V
IB = 0.8 A
IB = 1 A
IC = 8 A _ _
IB = 1.6 A
IC = 12 A _ _
IB = 3 A
IC = 5 A
_
IB = 1 A
IC = 8 A
_ _
IB = 1.6 A
IC = 5 A
_
VCE = 5 V
Group L
Group H
IC = 8 A _ _
IB1 = 1 A
Max.
400
IC = 4 A
IC = 5 A
Inductive load
Min.
VCE = 5 V
0.85
0.9
1.25
2.5
V
V
V
V
1.2
1.6
V
V
15
28
26
39
10
30
VCC = 250 V
IB2 = -2 A
L = 200 µH
1.6
2.5
µs
60
110
ns
see Figure 9
Inductive load
ts
Storage time
tf
Fall time
IC = 5 A
VCC = 125 V
IB1 = - IB2 = 1.6 A
L = 200 µH
tc = 125 °C
2.3
µs
110
ns
see Figure 9
1. Pulsed duration = 300 ms, duty cycle ≤2 %
2. Product is pre-selected in DC current gain (group L and group H). STMicroelectronics reserves the right to
ship either groups according to production availability. Please contact your nearest STMicroelectronics
sales office for delivery details.
4/11
ST13009
2.1
Electrical characteristics
Electrical characteristics (curves)
Figure 2.
Safe operating area
Figure 3.
Derating curve
Figure 4.
DC current gain
Figure 5.
DC current gain
Figure 6.
Collector-emitter saturation
voltage
Figure 7.
Base-emitter saturation
voltage
5/11
Electrical characteristics
Figure 8.
6/11
Reverse biased operating
area
ST13009
ST13009
3
Test circuit
Test circuit
Figure 9.
Inductive load switching test circuit
1) Fast electronic switch
2) Non-inductive resistor
3) Fast recovery rectifier
7/11
Package mechanical data
4
ST13009
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
8/11
ST13009
Package mechanical data
TO-220 mechanical data
mm
inch
Dim
Min
A
b
b1
c
D
D1
E
e
e1
F
H1
J1
L
L1
L20
L30
∅P
Q
Typ
4.40
0.61
1.14
0.49
15.25
Max
Min
4.60
0.88
1.70
0.70
15.75
0.173
0.024
0.044
0.019
0.6
10.40
2.70
5.15
1.32
6.60
2.72
14
3.93
0.393
0.094
0.194
0.048
0.244
0.094
0.511
0.137
1.27
10
2.40
4.95
1.23
6.20
2.40
13
3.50
Max
0.181
0.034
0.066
0.027
0.62
0.050
16.40
28.90
3.75
2.65
Typ
0.409
0.106
0.202
0.051
0.256
0.107
0.551
0.154
0.645
1.137
3.85
2.95
0.147
0.104
0.151
0.116
9/11
Revision history
5
ST13009
Revision history
Table 5.
10/11
Document revision history
Date
Revision
Changes
12-Jun-2005
1
First version
23-Aug-2007
2
Added figures: 2, and 3
ST13009
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