STA210N Sirius Satellite Digital audio radio service Heterodyne tuner Data Brief Features ■ 2.3 GHz to 76.5 MHz down-converter ■ High-performance single signal path for satellite and terrestrial signals ■ Operation in the 2320 to 2345 MHz band ■ Low-power consumption, 3.3V operation ■ On-chip PLL with lock flag ■ Fractional synthesizer including integrated VCO ■ Direct Xtal connection ■ High-Performance Linear RF/IF AGC ■ Low cost external components ■ IIC-bus slave control interface VFQFPN68 The STA210N is assembled in a VFQFPN68 package. The front-end architecture is a down converter (see Figure 1), with one RF down conversion path, with an on chip image frequency suppression, on chip AGC system, and one IF variable gain path. The IF output is usable for IF sampling architecture. The front-end processes both satellite and terrestrial signals. Description The IC is able to split the three Sirius broadcast component signals into their respective subbands via three different SAW filters. The STA210N includes all the RF functions up to IF, and it manages the signals going to and coming from the base-band. The STA210N is an RF IC using STMicroelectronics BiCMOS6G SiGe Technology, for a one chip solution for digital satellite and terrestrial radio receiver. Table 1. Device summary Part number Temp range, °C Package Packing STA210N -40 to +85°C VFQFPN68 Tray June 2007 Rev 1 For further information contact your local STMicroelectronics sales office. 1/6 www.st.com 6 Application block diagram 1 STA210N Application block diagram Figure 1. Application block diagram FLASH 1M x 16 STA210N IF Tuner FE I2C IFAGC STA240 STA240 Baseband Baseband Processor Processor SDRAM 8Mbx8 or 16Mx8 2/6 Audio/I 2S Data AC00142 STA210N Electrical specifications 2 Electrical specifications 2.1 Thermal data Table 2. Thermal data Symbol Rth j-amb Parameter Thermal resistance junction-ambient (1): Typ. Max. Value Unit 20 25 °C/W 1. on multi-layer JEDEC test board 2.2 Absolute maximum ratings Table 3. Absolute maximum ratings Symbol Parameter Min. Typ. Max. Unit 125 °C Tstg Storage temperature -40 Tfunc Functional ambient temperature -40 25 100 °C Top Operating ambient temperature -40 25 85 °C Tj-max Maximum junction temperature 125 °C Tlead Lead temperature (soldering,10s) 260 °C Tslope Temperature slope 10 °C/min Humid Humidity 85 % VMax Maximum voltage on each pin 3.6 V VMin Minimum voltage on each pin VESD Electrostatic discharge voltage HBM (ESD) PRFmax Max RF input power -10 GND-0.3 V 2 +15 kV dBm 3/6 Package information 3 STA210N Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: http://www.st.com. Figure 2. VFQFPN68 mechanical data and package dimensions mm inch DIM. MIN. TYP. MAX. MIN. TYP. MAX. A1 0.02 0.05 0.0008 0.0020 A2 0.65 1.00 0.0256 0.0394 A3 0.20 0.0079 b 0.18 0.25 0.30 0.0071 0.0098 0.0118 D 9.85 10.00 10.15 0.3878 0.3937 0.3996 D1 9.75 D2 7.55 7.7 E 9.85 10.00 E1 E2 7.7 0.45 0.55 e L 0.3839 7.85 0.2972 0.3031 0.3091 10.15 0.3878 0.3937 0.3996 9.75 7.55 OUTLINE AND MECHANICAL DATA 0.3839 7.85 0.50 0.2972 0.3031 0.3091 0.0197 0.65 0.0177 0.0217 0.0256 P 0.60 0.0236 ddd 0.08 0.0031 VFQFPN68 (10x10x1.0mm, pitch 0.50) Very Fine Quad Flat Package No lead 7479590_C 4/6 STA210N 4 Revision history Revision history Table 4. Document revision history Date Revision 6-Jun-2007 1 Changes Initial release. 5/6 STA210N Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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