STMICROELECTRONICS EMIF01

EMIF01-TV02F3
Single line IPAD™, EMI filter and ESD protection
Features
■
user-customizable filtering solution
(recommended use of 2.2 µH external inductor)
■
8 MHz bandwidth
■
provides very high attenuation at 27 MHz
■
ultralow stand-by power consumption
compared to active filters, ideal for portable
applications
■
accurate 75 Ω ± 5% impedance matching
■
high efficiency in ESD protection
(IEC standards)
■
high reliability offered by monolithic integration
Flip-Chip package
(4 bumps)
Figure 1.
Pin configuration (bump side)
GND
GND
IN
OUT
Complies with the following standards
■
IEC 61000-4-2 level 4 on internal and external
pins:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Figure 2.
Application
Configuration
ESD ±2 kV
IEC 61000-4-2
Level 1
Portable applications with analog TV output
IN
B2
Description
The EMIF01-TV02F3 chip is a highly integrated
device designed to suppress EMI and RFI noise
in all systems with a TV analog output signal
subjected to electromagnetic interferences.
330pF
75Ω
75?
75O
This filter includes ESD protection circuitry, which
prevents damage to the protected device when
subjected to ESD surges up 15 kV.
B1
C1
R1
A2
ESD ±15 kV
IEC 61000-4-2
Level 4
C2
330pF
A1
The EMIF01-TV02F3 provides high anti-aliasing
filtering performances to reject frequencies above
8 MHz, with high attenuation at 27 MHz when an
external inductor of 2.2 µH is connected between
pins B2 and B1.
TM: IPAD is a trademark of STMicroelectronics.
October 2010
Doc ID 15320 Rev 3
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www.st.com
7
Characteristics
1
EMIF01-TV02F3
Characteristics
Table 1.
Absolute maximum ratings
Symbol
VPP
Tj
Parameter
Value
Unit
Internal pins (B1) and external pin (B2):
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
15
15
kV
Maximum junction temperature
150
°C
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Figure 3.
Electrical characteristics (definitions, Tamb = 25 °C)
I
IF
Symbol
VBR =
IRM =
VRM =
VCL =
IPP =
Parameter
Breakdown voltage
Leakage current @ VRM
Stand-off voltage
Clamping voltage
Peak pulse current
VF
VCL VBR
VRM
Slope: 1/Rd
Table 2.
IPP
Electrical characteristics (values, Tamb = 25 °C)
Symbol
Test conditions
Min.
Typ.
Max.
Unit
7.9
V
200
nA
VBR
IR = 1 mA
IRM
VR = 1 mA, between bumps B1 and A1
R1
Tolerance ± 5 %
75
Ω
Vline = 0 V, Vosc = 30 mV, F = 1 MHz
(measured under zero light conditions)
Tolerance: ± 20%
330
pF
C1, C2
2/7
V
IRM
6.1
Doc ID 15320 Rev 3
EMIF01-TV02F3
Figure 4.
0.00
Characteristics
S21 attenuation measurement
Figure 5.
(typical value) in 75/75 environment
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
V(in) and on one output V(out)
APLAC 8.21 User: F:Cust# 8463:ST Microelectronics
- Tours:Applied Wave Research
S21 (dB)
L=2.2µH (TDKRef: MLF1608A2R2J)
dB
-10.00
Input-Output
-20.00
IN
5.00 V/div
C2
-30.00
-40.00
OUT
5.00 V/div
-50.00
C3
50 ns/div
F (Hz)
-60.00
100.0k
Figure 6.
1.0M
10.0M
100.0M
1.0G
ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input V(in) and on one
output V(out)
C2
IN
5.00 V/div
C3
OUT
5.00 V/div
50 ns/div
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Application information
2
EMIF01-TV02F3
Application information
An external inductor is used to provide the filtering performance required by the TV-out
application.
ST recommends one of these two references:
●
TDK: MLF1608A2R2J
●
MURATA: LQM18NN2R2J
Figure 7.
Application diagram
TV_OUT
connector
C/CVBS
IN
OUT
OUT
EMIF01-TV02F3
C1
R1
330pF
O
75?Ω
75
C2
330pF
330pF
GND
3
GND
GND
Ordering information scheme
Figure 8.
Ordering information scheme
EMIF
EMI filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: lead-free, pitch = 400 µm, bump = 255 µm
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Doc ID 15320 Rev 3
yy
-
xx zz
Fx
EMIF01-TV02F3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 9.
Package dimensions
400 µm ± 40 µm
400 µm ± 40 µm
605 µm ± 55
0.89 mm ± 30 µm
4
Package information
0.89 mm ± 30 µm
Figure 10. Footprint
255 µm ± 40
Figure 11. Marking
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
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Ordering information
EMIF01-TV02F3
Figure 12. Flip Chip tape and reel specification
Ø 1.5 ± 0.1
3.5 ± 0.1
8.0 ± 0.3
4.0 ± 0.1
1.75 ± 0.1
Dot identifying Pin A1 location
0.95
xxz
yww
0.95
xxz
yww
xxz
yww
4 ± 0.1
0.71 ± 0.05
User direction of unreeling
All dimensions in mm
5
Ordering information
Table 3.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF01-TV02F3
HZ
Flip Chip
1.1 mg
5000
Tape and reel 7”
Note:
More information is available in the application note:
AN1235:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
6
Revision history
Table 4.
6/7
Document revision history
Date
Revision
Changes
20-Jan-2009
1
Initial release.
18-Sep-2009
2
Updated Figure 5 and Figure 6.
06-Oct-2010
3
Added text above Figure 7.
Doc ID 15320 Rev 3
EMIF01-TV02F3
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