STMICROELECTRONICS STGF8NC60KD

STGF8NC60KD
N-channel 600V - 4A - TO-220FP
Short circuit rated PowerMESH™ IGBT
Features
Type
VCES
VCE(sat)Typ
@25°C
IC
@100°C
STGF8NC60KD
600V
2.2V
4A
■
Lower on voltage drop (Vcesat)
■
Lower CRES / CIES ratio (no cross-conduction
susceptibility)
■
Very soft ultra fast recovery antiparallel diode
■
Short circuit withstand time 10µs
3
1
2
TO-220FP
Applications
■
High frequency motor controls
■
SMPS and PFC in both hard switch and
resonant topologies
■
Motor drivers
Figure 1.
Internal schematic diagram
Description
Using the latest high voltage technology based on
a patented strip layout, STMicroelectronics has
designed an advanced family of IGBTs, the
PowerMESH™ IGBTs, with outstanding
performances. The suffix “K” identifies a family
optimized for high frequency motor control
applications with short circuit withstand capability.
Table 1.
Device summary
Order code
Marking
Package
Packaging
STGF8NC60KD
GF8NC60KD
TO-220FP
Tube
September 2007
Rev 1
1/14
www.st.com
14
Contents
STGF8NC60KD
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................. 7
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STGF8NC60KD
1
Electrical ratings
Electrical ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
600
V
VCES
Collector-emitter voltage (VGS = 0)
IC(1)
Collector current (continuous) at TC = 25°C
7
A
IC(1)
Collector current (continuous) at TC = 100°C
4
A
ICP(2)
Pulsed collector current
30
A
VGE
Gate-emitter voltage
±20
V
Diode RMS forward current at Tc=25°C
7
A
IFSM
Surge not repetitive forward current tp = 10ms sinusoidal
20
A
VISO
Insulation withstand voltage (RMS) from all three leads
to external heat sink (t=1s;TC=25°C)
2500
V
PTOT
Total dissipation at TC = 25°C
24
W
– 55 to 150
°C
10
µs
Value
Unit
IF
Tj
Tscw
Operating junction temperature
Short circuit withstand time
1. Calculated according to the iterative formula:
T
–T
JMAX
C
I ( T ) = ----------------------------------------------------------------------------------------------------C C
R
× V
(T , I )
THJ – C
CESAT ( MAX ) C C
2. Pulse width limited by max junction temperature
Table 3.
Symbol
Thermal resistance
Parameter
Rthj-case
Thermal resistance junction-case max IGBT
5.1
°C/W
Rthj-case
Thermal resistance junction-case max diode
7
°C/W
Rthj-amb
Thermal resistance junction-ambient Max
62.5
°C/W
3/14
Electrical characteristics
2
STGF8NC60KD
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 4.
Symbol
Parameter
VBR(CES)
Collector-emitter
breakdown voltage
VCE(sat)
Collector-emitter saturation VGE= 15V, IC=3A
voltage
VGE= 15V, IC= 3A, Tc= 125°C
VGE(th)
Gate threshold voltage
VCE= VGE, IC= 250 µA
ICES
Collector cut-off current
(VGE = 0)
VCE= Max rating,TC= 25°C
IGES
gfs
Table 5.
Symbol
Cies
Coes
Cres
Qg
Qge
Qgc
4/14
Static
Test conditions
IC= 1mA, VGE= 0
Min.
Typ.
Max.
600
Unit
V
2.2
1.8
2.75
V
V
6.5
V
VCE=Max rating,TC= 125°C
150
1
µA
mA
Gate-emitter leakage
current (VCE = 0)
VGE= ±20V, VCE= 0
±100
nA
Forward transconductance
VCE = 15V, IC= 3A
4.5
15
S
Dynamic
Parameter
Input capacitance
Output capacitance
Reverse transfer
capacitance
Total gate charge
Gate-emitter charge
Gate-collector charge
Test conditions
VCE = 25V, f = 1MHz,
VGE = 0
VCE = 390V, IC = 3A,
VGE = 15V,
(see Figure 18)
Min.
Typ. Max.
Unit
380
46
8.5
pF
pF
pF
19
5
9
nC
nC
nC
STGF8NC60KD
Electrical characteristics
Table 6.
Symbol
td(on)
tr
(di/dt)on
td(on)
tr
(di/dt)on
tr(Voff)
td(off)
tf
tr(Voff)
td(off)
tf
Table 7.
Symbol
Eon(1)
Eoff(2)
Ets
Eon(1)
Eoff(2)
Ets
Switching on/off (inductive load)
Parameter
Turn-on delay time
Current rise time
Turn-on current slope
Turn-on delay time
Current rise time
Turn-on current slope
Off voltage rise time
Turn-off delay time
Current fall time
Off voltage rise time
Turn-off delay time
Current fall time
Test conditions
Min.
VCC = 390V, IC = 3A
RG= 10Ω, VGE= 15V,
Tj= 25°C
(see Figure 19)
VCC = 390V, IC =3A
RG= 10Ω, VGE= 15V,
Tj=125°C
(see Figure 19)
Vcc = 390V, IC = 3A,
RGE = 10Ω, VGE =15V,
TJ=25°C
(see Figure 19)
Vcc = 390V, IC = 3A,
RGE=10Ω, VGE =15V,
Tj=125°C
(see Figure 19)
Typ.
Max.
Unit
17
6
655
ns
ns
A/µs
16.5
6.5
575
ns
ns
A/µs
33
72
82
ns
ns
ns
60
106
136
ns
ns
ns
Switching energy (inductive load)
Parameter
Turn-on switching losses
Turn-off switching losses
Total switching losses
Turn-on switching losses
Turn-off switching losses
Total switching losses
Test conditions
VCC = 390V, IC = 3A
RG= 10Ω, VGE=15V, Tj=25°C
(see Figure 19)
VCC = 390V, IC = 3A
RG= 10Ω, VGE= 15V,
Tj= 125°C
(see Figure 19)
Min.
Typ.
Max.
Unit
55
85
140
µJ
µJ
µJ
87
162
249
µJ
µJ
µJ
1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current
5/14
Electrical characteristics
Table 8.
Symbol
Collector-emitter diode
Parameter
Test conditions
If = 3A
Vf
Forward on-voltage
trr
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Tj = 25°C, di/dt = 100 A/µs
(see Figure 20)
Reverse recovery time
Reverse recovery charge
Reverse recovery current
Tj =125°C, di/dt = 100A/µs
(see Figure 20)
Qrr
Irrm
trr
Qrr
Irrm
6/14
STGF8NC60KD
If = 3A, Tj = 125°C
If = 3A,VR = 30V,
If = 3A,VR = 30V,
Min.
Typ.
Max.
Unit
1.6
1.3
2.1
V
V
23.5
16.5
1.4
ns
nC
A
39
39
2
ns
nC
A
STGF8NC60KD
Electrical characteristics
2.1
Electrical characteristics (curves)
Figure 2.
Output characteristics
Figure 3.
Transfer characteristics
Figure 4.
Transconductance
Figure 5.
Collector-emitter on voltage vs
temperature
Figure 6.
Gate charge vs gate-source voltage Figure 7.
Capacitance variations
7/14
Electrical characteristics
Figure 8.
Normalized gate threshold voltage
vs temperature
Figure 10. Normalized breakdown voltage vs
temperature
STGF8NC60KD
Figure 9.
Collector-emitter on voltage vs
collector current
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
8/14
STGF8NC60KD
Figure 14. Thermal impedance
Electrical characteristics
Figure 15. Turn-off SOA
Figure 16. Forward voltage drop versus
forward current
9/14
Test circuit
3
STGF8NC60KD
Test circuit
Figure 17. Test circuit for inductive load
switching
Figure 18. Gate charge test circuit
Figure 19. Switching waveform
Figure 20. Diode recovery time waveform
10/14
STGF8NC60KD
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category
of second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
11/14
Package mechanical data
STGF8NC60KD
TO-220FP MECHANICAL DATA
mm.
DIM.
MIN.
A
4.4
inch
TYP
MAX.
MIN.
TYP.
4.6
0.173
0.181
MAX.
0.106
B
2.5
2.7
0.098
D
2.5
2.75
0.098
0.108
E
0.45
0.7
0.017
0.027
F
0.75
1
0.030
0.039
F1
1.15
1.7
0.045
0.067
F2
1.15
1.7
0.045
0.067
G
4.95
5.2
0.195
0.204
G1
2.4
2.7
0.094
0.106
H
10
10.4
0.393
0.409
L2
16
0.630
L3
28.6
30.6
1.126
1.204
L4
9.8
10.6
.0385
0.417
L5
2.9
3.6
0.114
0.141
L6
15.9
16.4
0.626
0.645
9
9.3
0.354
0.366
Ø
3
3.2
0.118
0.126
B
D
A
E
L7
L3
L6
F2
H
G
G1
F
F1
L7
L2
12/14
L5
1 2 3
L4
STGF8NC60KD
5
Revision history
Revision history
Table 9.
Document revision history
Date
Revision
20-Sep-2007
1
Changes
First release
13/14
STGF8NC60KD
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14